CN215337893U - Vapor chamber - Google Patents
Vapor chamber Download PDFInfo
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- CN215337893U CN215337893U CN202022859628.0U CN202022859628U CN215337893U CN 215337893 U CN215337893 U CN 215337893U CN 202022859628 U CN202022859628 U CN 202022859628U CN 215337893 U CN215337893 U CN 215337893U
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- groove
- etching
- soaking plate
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Abstract
The utility model discloses a vapor chamber, and relates to the technical field of electronic chip heat dissipation. The soaking plate comprises an upper cover and a lower cover. One side of the upper cover is provided with a first groove; a second groove is formed in one side of the lower cover, and a notch of the first groove is opposite to a notch of the second groove; the edges of the first groove and the second groove are aligned to form a liquid injection pipeline, one surface of the lower cover, which is opposite to the upper cover, is provided with a plurality of etching grooves along a first direction and a second direction in an etching mode, and the liquid injection pipeline is communicated with the etching grooves; the groove surface of the etching groove is provided with a plurality of micro-nano level particles and/or hole structures; the etching grooves in the same direction are parallel to each other; the edges of the upper and lower covers are aligned and sealed by welding. Therefore, by the etching groove and the arrangement of the micro-nano-grade particles and/or hole structures on the groove surface of the etching groove, the raw material of the liquid absorbing core does not need to be sintered into the lower cover, the time generated by sintering is saved, and the manufacturing period of the soaking plate is shortened.
Description
Technical Field
The utility model relates to the technical field of electronic chip heat dissipation, in particular to a vapor chamber.
Background
The demand of the ultrathin soaking plate for heat dissipation of the mobile phone is gradually increased. In the traditional process, metal mesh, metal powder and the like are used as raw materials of an internal liquid absorption core and are sintered in a cavity between an upper cover and a lower cover of a soaking plate through a sintering process, however, the soaking plate manufactured in the mode has a long manufacturing period.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to solving at least one of the problems of the prior art. Therefore, a soaking plate is provided, which can reduce the manufacturing period of the soaking plate.
A soaking plate according to an embodiment of the present invention includes:
the upper cover is provided with a first groove on one side;
a second groove is formed in one side of the lower cover, and a notch of the first groove is opposite to a notch of the second groove; the edges of the first groove and the second groove are aligned to form a liquid injection pipeline, one surface of the lower cover, which is opposite to the upper cover, is provided with a plurality of etching grooves along a first direction and a second direction in an etching mode, and the liquid injection pipeline is communicated with the etching grooves; the groove surface of the etching groove is provided with a plurality of nano-scale particles and/or hole structures; the etching grooves in the same direction are parallel to each other; the edges of the upper cover and the lower cover are aligned and sealed by welding.
According to the above embodiments of the present invention, at least the following beneficial effects are achieved: a plurality of etching grooves are formed by a liquid phase etching mode, and a plurality of nano-scale particles and/or hole structures are arranged on the groove surfaces of the etching grooves, so that a capillary imbibition structure is formed on the lower cover, and the groove surface of each etching groove is in a super-hydrophilic state. And a plurality of nano-scale particles and/or hole structures are directly arranged on the groove surface of the etching groove, so that the raw material of the liquid absorption core does not need to be sintered into the lower cover, the time generated by sintering is saved, and the manufacturing period of the soaking plate is shortened.
According to some embodiments of the present invention, an angle between the etch bath in the first direction and the second direction ranges from 20 ° to 90 °. The etching grooves in the staggered directions are arranged, so that the flowing speed of liquid in the soaking plate can be increased, and the heat dissipation efficiency is improved.
According to some embodiments of the present invention, the interval between two adjacent etch grooves in the same direction is in the range of 30 μm to 200 μm, the depth of each etch groove is set in the range of 30 μm to 400 μm, the width of each etch groove is set in the range of 30 μm to 400 μm, and the depth of the etch groove has a value greater than the width of the etch groove.
According to some embodiments of the utility model, the nano-scale particles and/or the pore structures are formed by etching, the etching including one of liquid phase etching, gas phase etching and laser etching. By adopting the etching mode, abundant nano-scale particles and/or hole structures can be obtained more conveniently, and the hydrophilicity of the etching tank is improved.
According to some embodiments of the utility model, the welding comprises at least one of high temperature brazing, laser welding, diffusion welding, ultrasonic welding, resistance welding.
According to some embodiments of the present invention, a third groove is disposed on a surface of the upper cover opposite to the etching bath, and a plurality of support pillars are disposed in the third groove and abut against the etching bath to form a sealed cavity between the upper cover and the lower cover. The space of the closed cavity between the upper cover and the lower cover can be increased by arranging the third groove, and meanwhile, the supporting force is provided for the upper cover through the supporting column so as to protect the upper cover.
According to some embodiments of the utility model, the third groove and the support pillar are processed by etching or punching.
According to some embodiments of the utility model, the depth of the third groove and the height of the support column are both set at 0.08-0.3 mm.
According to some embodiments of the utility model, the upper cover and the lower cover are made of one of pure copper, copper alloy, stainless steel or carbon steel, pure titanium, titanium alloy, pure aluminum, and aluminum alloy.
According to some embodiments of the present invention, the soaking plate further comprises a liquid injection pipe disposed in the liquid injection pipe, the liquid injection pipe communicating with the etching bath. Through setting up and annotating the liquid pipe, can make things convenient for leading-in of heat dissipation working medium.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is an exploded view of a vapor chamber according to an embodiment of the present invention;
fig. 2 is a structural view of an upper cover of the soaking plate according to the embodiment of the present invention.
Reference numerals:
an upper cover 100, a first groove 110, a third groove 120, a supporting column 130,
A lower cover 200, a second groove 210, an etching bath 220,
A pour spout 300.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. If several are described, several means one or more than one; if the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated. The recitation of numerical ranges includes the endpoints of the ranges.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
The soaking plate of the present invention is described below with reference to fig. 1 and 2.
As shown in fig. 1, the soaking plate includes an upper cover 100 and a lower cover 200.
One side of the upper cover 100 is provided with a first groove 110; a second groove 210 is formed in one side of the lower cover 200, and a notch of the first groove 110 is opposite to a notch of the second groove 210; the edges of the first groove 110 and the second groove 210 are aligned to form a liquid injection pipe 300, one surface of the lower cover 200 opposite to the upper cover 100 is provided with a plurality of etching grooves 220 along the first direction and the second direction by adopting an etching mode, and the liquid injection pipe 300 is communicated with the etching grooves 220; the groove surface of the etching groove 220 is provided with a plurality of nano-scale particles and/or hole structures; the etch baths 220 located in the same direction are parallel to each other; the edges of the upper and lower covers 100 and 200 are aligned and sealed by welding.
Therefore, a plurality of etching grooves 220 are formed by a liquid phase etching method, and a plurality of nano-scale particles and/or hole structures are arranged on the groove surface of the etching grooves 220, so that a capillary imbibition structure is formed on the lower cover 200, and the groove surface of each etching groove 220 is in a super-hydrophilic state. The groove surface of the etching groove 220 is directly provided with a plurality of nano-scale particles and/or hole structures, so that the raw material of the liquid absorbing core does not need to be sintered into the lower cover 200, the time generated by sintering is saved, and the manufacturing period of the soaking plate is shortened.
It can be understood that the angle between the etch grooves 220 in the first and second directions ranges from 20 ° to 90 °. The etching grooves 220 in the staggered directions are arranged, so that the flowing speed of the liquid in the soaking plate can be increased, and the heat dissipation efficiency is improved.
It is understood that the interval between two adjacent etch grooves 220 in the same direction is in the range of 30 μm to 200 μm, the depth of each etch groove 220 is set in the range of 30 μm to 400 μm, the width of each etch groove 220 is set in the range of 30 μm to 400 μm, and the depth of the etch groove 220 has a value greater than the width of the etch groove 220.
It is understood that the nano-scale particles and/or the pore structures are formed by etching, which includes one of liquid phase etching, gas phase etching and laser etching. By obtaining abundant nano-scale particles and/or pore structures by etching, the hydrophilicity of the etch bath 220 can be enhanced.
It should be noted that the groove surface metal substrate of the etching groove 220 is melted and vaporized by the laser high-temperature ablation, and the melted liquid metal is solidified under the action of surface tension in the subsequent cooling process, and forms rich nano-scale structures (i.e., nano-scale particles and/or pore structures).
It is understood that welding includes at least one of high temperature brazing, laser welding, diffusion welding, ultrasonic welding, and resistance welding.
As shown in fig. 2, it can be understood that a third groove 120 is disposed on a surface of the upper cover 100 opposite to the etching chamber 220, a plurality of support pillars 130 are disposed in the third groove 120, and the support pillars 130 abut against the etching chamber 220, so as to form a sealed cavity between the upper cover 100 and the lower cover 200. The space of the sealed chamber between the upper cover 100 and the lower cover 200 can be increased by providing the third groove 120, and at the same time, the supporting force is provided to the upper cover 100 by the supporting column 130 to protect the upper cover 100.
It should be noted that, since the upper cover 100 is provided with the third groove 120, a portion of the upper cover 100 located in the third groove 120 is thinned and easily damaged, and the supporting columns 130 can provide supporting force at various positions of the third groove 120 to improve the strength of the upper cover 100.
It is understood that the third groove 120 and the supporting pillar 130 are formed by etching or punching.
It is understood that the depth of the third groove 120 and the height of the supporting column 130 are set to 0.08-0.3 mm.
It is understood that the upper and lower covers 100 and 200 are made of one of pure copper, copper alloy, stainless steel, carbon steel, pure titanium, titanium alloy, pure aluminum, and aluminum alloy.
As shown in FIG. 1, it is understood that the soaking plate further comprises an injection pipe 300, the injection pipe 300 is disposed in the injection pipe 300, and the injection pipe 300 is communicated with the etching chamber 220. By arranging the liquid injection pipe 300, the heat dissipation working medium can be conveniently led in.
It should be noted that the soaking plate will finally seal the end of the injection pipe 300 (or the injection pipe 300) away from the etching bath 220 to ensure that the heat dissipation working medium flows in the etching bath 220 for heat dissipation.
It should be noted that the nano-scale particles and the pore structure are not shown in the figure.
It should be noted that the etching grooves 220, the nano-particles, the hole structures, the third grooves 120 and the supporting pillars 130 can be formed by one of liquid phase etching, gas phase etching and laser etching, respectively.
The soaking plate of the present invention is described in detail in one specific embodiment with reference to fig. 1 and 2. It is to be understood that the following description is illustrative only and is not intended as a specific limitation on the utility model.
As shown in fig. 1, the soaking plate includes an upper cover 100 and a lower cover 200.
One side of the upper cover 100 is provided with a first groove 110; a second groove 210 is formed in one side of the lower cover 200, and a notch of the first groove 110 is opposite to a notch of the second groove 210; the edges of the first groove 110 and the second groove 210 are aligned to form a liquid injection pipe 300, one surface of the lower cover 200 opposite to the upper cover 100 is formed with a plurality of etching grooves 220 along the first direction and the second direction by liquid phase etching, and the liquid injection pipe 300 is communicated with the etching grooves 220; the groove surface of the etching groove 220 is provided with a plurality of nano-scale particles and hole structures; the etch baths 220 located in the same direction are parallel to each other; the edges of the upper and lower covers 100 and 200 are aligned and sealed by welding.
Specifically, the included angle between two adjacent etching trenches 220 in the same first direction and the same second direction is 90 °.
Further, the nano-scale particle and hole structure is obtained by laser pulse ablation.
Further, the welding is laser welding.
As shown in fig. 2, a third groove 120 is disposed on one surface of the upper cover 100 opposite to the etching chamber 220, a plurality of support columns 130 are disposed in the third groove 120, and the support columns 130 abut against the etching chamber 220, so as to form a sealed cavity between the upper cover 100 and the lower cover 200.
Specifically, the third groove 120 and the supporting pillar 130 are processed by etching.
Specifically, the depth of the third groove 120 and the height of the supporting column 130 are set to 0.08 mm.
Specifically, the upper cover 100 and the lower cover 200 are made of stainless steel.
Further, as shown in FIG. 1, the soaking plate further comprises an injection pipe 300, the injection pipe 300 is disposed in the injection pipe 300, and the injection pipe 300 is communicated with the etching chamber 220.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an exemplary embodiment," or "may be understood as" or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the utility model have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A vapor chamber, comprising:
the upper cover is provided with a first groove on one side;
a second groove is formed in one side of the lower cover, and a notch of the first groove is opposite to a notch of the second groove; the edges of the first groove and the second groove are aligned to form a liquid injection pipeline, one surface of the lower cover, which is opposite to the upper cover, is provided with a plurality of etching grooves along a first direction and a second direction in an etching mode, and the liquid injection pipeline is communicated with the etching grooves; the groove surface of the etching groove is provided with a plurality of nano-scale particles and/or hole structures; the etching grooves in the same direction are parallel to each other; the edges of the upper cover and the lower cover are aligned and sealed by welding.
2. The soaking plate according to claim 1,
the angle between the etch bath in the first direction and the second direction ranges from 20 ° to 90 °.
3. The soaking plate according to claim 1,
the interval between two adjacent etching grooves in the same direction ranges from 30 μm to 200 μm, the depth of each etching groove ranges from 30 μm to 400 μm, the width of each etching groove ranges from 30 μm to 400 μm, and the depth of each etching groove is greater than the width of each etching groove.
4. The soaking plate according to claim 1,
the nano-scale particles and/or the hole structure are/is manufactured by adopting an etching mode, wherein the etching mode comprises one of liquid phase etching, gas phase etching and laser etching.
5. The soaking plate according to claim 1,
the welding comprises at least one of high-temperature brazing, laser welding, diffusion welding, ultrasonic welding and resistance welding.
6. The soaking plate according to any one of claims 1 to 5,
and a third groove is formed in one surface of the upper cover, which is opposite to the etching groove, a plurality of supporting columns are arranged in the third groove, and the supporting columns are abutted against the etching groove so as to form a closed cavity between the upper cover and the lower cover.
7. The soaking plate according to claim 6, wherein,
the third groove and the support column are processed in an etching mode or a stamping mode.
8. The soaking plate according to claim 6, wherein,
the depth of the third groove and the height of the supporting column are both set to be 0.08-0.3 mm.
9. The soaking plate according to any one of claims 1 to 5,
the upper cover and the lower cover are made of one of pure copper, copper alloy, stainless steel, carbon steel, pure titanium, titanium alloy, pure aluminum and aluminum alloy.
10. The soaking plate according to any one of claims 1 to 5, further comprising:
and the liquid injection pipe is arranged in the liquid injection pipeline and communicated with the etching groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022859628.0U CN215337893U (en) | 2020-12-02 | 2020-12-02 | Vapor chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022859628.0U CN215337893U (en) | 2020-12-02 | 2020-12-02 | Vapor chamber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215337893U true CN215337893U (en) | 2021-12-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022859628.0U Active CN215337893U (en) | 2020-12-02 | 2020-12-02 | Vapor chamber |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215337893U (en) |
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2020
- 2020-12-02 CN CN202022859628.0U patent/CN215337893U/en active Active
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