CN215319763U

CN215319763U - Novel buddha's warrior attendant wire cut electrical discharge machining

Info

Publication number: CN215319763U
Application number: CN202022802078.9U
Authority: CN
Inventors: 尚天保
Original assignee: Zhongbao Xi'an Technology Group Co ltd
Current assignee: Zhongbao Xi'an Technology Group Co ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-12-28
Anticipated expiration: 2030-11-27

Abstract

The utility model belongs to the technical field of diamond wire cutting, and particularly relates to a novel diamond wire cutting machine. The device comprises a controller, a driving motor, a bearing carrier, a diamond wire transmission wheel, an up-and-down moving servo motor, a crystal support fixing frame, a crystal support and a diamond wire; the bottom of the crystal support fixing frame is provided with a clamping part; the upper part of the crystal support is provided with a clamping matching part, and the crystal support fixing frame and the crystal support are arranged at an included angle of 1-45 degrees in the horizontal direction. The technical problems that the existing diamond wire cutting machine can only realize vertical cutting of the silicon rod, the cutting area of the silicon wafer is small, and the utilization rate is low are solved.

Description

Novel buddha's warrior attendant wire cut electrical discharge machining

Technical Field

The utility model belongs to the technical field of diamond wire cutting, and particularly relates to a novel diamond wire cutting machine.

Background

As the demand for clean energy increases, solar photovoltaic power generation also increases. Reducing carbon emissions during the manufacturing process to increase conversion efficiency is a mission for many photovoltaic enterprises. The realization of large-size silicon chip is imminent in the link of slicing the diamond wire of the monocrystalline silicon rod for photovoltaic power generation. However, the conventional diamond wire cutting machine can only vertically cut the silicon rod, and in order to further increase the utilization rate of the silicon rod, the silicon wafer needs to be obliquely cut by increasing the effective area of the finished silicon wafer under the silicon rod with the same diameter, while the conventional diamond wire cutting machine cannot obliquely cut the silicon rod.

SUMMERY OF THE UTILITY MODEL

The utility model provides a novel diamond wire cutting machine, which solves the technical problems that the conventional diamond wire cutting machine can only realize the vertical cutting of a silicon rod, the cutting area of a silicon wafer is small, and the utilization rate is low.

In order to achieve the purpose, the specific technical scheme of the utility model is as follows: the novel diamond wire cutting machine comprises a controller, a driving motor, a bearing carrier, a diamond wire driving wheel, an up-and-down moving servo motor, a crystal support fixing frame, a crystal support and a diamond wire; the controller is connected with the driving motor and the up-and-down moving servo motor; a diamond wire driving wheel is fixed on the bearing carrier, and the diamond wire is wound on the diamond wire driving wheel; the upper part of the crystal support fixing frame is connected with an up-and-down moving servo motor, and the bottom of the crystal support fixing frame is provided with a clamping part; the upper part of the crystal support is provided with a clamping matching part, and the crystal support fixing frame and the crystal support are arranged at an included angle of 1-45 degrees in the horizontal direction.

Furthermore, the clamping part is a 2-strip-shaped parallel clamping convex block parallel to the long edge of the crystal support fixing frame; the clamping matching part is 2 clamping grooves which are obliquely arranged relative to the long edge of the crystal support and have the width smaller than that of the clamping convex block, and the clamping convex block can be clamped into the clamping grooves to slide relatively.

Furthermore, the clamping convex block is of a T-shaped structure, and the clamping groove is a T-shaped groove.

Furthermore, the clamping convex block and the clamping groove form a dovetail structure.

Furthermore, the clamping part is 2 clamping grooves parallel to the long edge of the crystal support fixing frame; the clamping matching part is 2 clamping convex blocks which are obliquely arranged relative to the long edge of the crystal support and have the width smaller than that of the clamping groove, and the clamping convex blocks can be clamped into the clamping groove to slide relatively.

Furthermore, a sliding groove is formed in the bearing carrier frame, a servo motor and a lead screw are arranged in the middle of the sliding groove, the output end of the servo motor is meshed with a lead screw intermediate gear, and the lead screw penetrates through the end of the diamond wire transmission wheel; the servo motor is connected with the controller; the end of the diamond wire driving wheel is clamped in the sliding groove and can slide relative to the sliding groove in the rotating process of the lead screw.

Furthermore, the length direction of the crystal support fixing frame and the length direction of the crystal support form an included angle of 26 degrees

Compared with the prior art, the utility model has the beneficial effects that: the crystal support fixing frame and the crystal support are movably connected and are connected, the crystal support fixing frame and the crystal support are arranged at an included angle of 3-45 degrees in the horizontal direction, so that the crystal support is replaced and adjusted on one hand, and the crystal support is installed on the other hand, so that a silicon rod forms a certain rotary inclination in the horizontal direction relative to a diamond wire, the silicon rod is obliquely cut at a certain angle with the diamond wire in the downward cutting process of the silicon rod, the area of the cut silicon wafer is larger, and the total effective utilization area of the silicon wafer is obviously improved.

Drawings

Fig. 1 is a schematic structural view of the present invention.

Fig. 2 is a schematic structural diagram of a wafer holder.

Description of reference numerals: 1. a servo motor moves up and down; 2. a silicon rod; 3. a crystal support fixing frame; 4. crystal support; 5. clamping the groove; 6. a diamond wire; 7. a servo motor; 8. a first diamond wire transmission wheel; 9. a second diamond wire transmission wheel; 10. a bearing carrier; 11. a chute; 12. a lead screw; a: and (4) chamfering.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The utility model provides a novel diamond wire cutting machine which comprises a controller, a driving motor, a bearing carrier, a diamond wire driving wheel, an up-and-down moving servo motor, a crystal support fixing frame, a crystal support and a diamond wire, wherein the diamond wire driving wheel is arranged on the bearing carrier; the controller is connected with the driving motor and the up-and-down moving servo motor; a diamond wire driving wheel is fixed on the bearing carrier, and the diamond wire is wound on the diamond wire driving wheel; the upper part of the crystal support fixing frame is connected with an up-and-down moving servo motor, and the bottom of the crystal support fixing frame is provided with a clamping part; the upper part of the crystal support is provided with a clamping matching part, and the crystal support fixing frame and the crystal support are arranged at an included angle of 1-45 degrees in the horizontal direction.

The crystal support fixing frame and the crystal support are movably connected and are connected, the crystal support fixing frame and the crystal support are arranged in a manner that the length direction of the crystal support fixing frame and the length direction of the crystal support form an included angle of 1-45 degrees in the horizontal direction, so that the crystal support is replaced and adjusted on one hand, and the silicon rod is enabled to form a certain rotary inclination in the horizontal direction relative to the diamond wire after the crystal support is installed on the other hand. The technical problems that the existing diamond wire cutting machine can only realize vertical cutting of the silicon rod, the cutting area of the silicon wafer is small, and the utilization rate is low are solved.

Embodiment 1, as shown in fig. 1 and 2, a novel diamond wire cutting machine includes a controller (not shown in the figure), a driving motor (not shown in the figure), a bearing carrier 10, a first diamond wire driving wheel 8, a second diamond wire driving wheel 9, an up-and-down moving servo motor 1, a crystal holder fixing frame 3, a crystal holder 4 and a diamond wire 2; the controller is connected with the driving motor and the up-and-down moving servo motor 1 and controls the driving motor and the up-and-down moving servo motor to start and operate; a first diamond wire driving wheel 8 and a second diamond wire driving wheel 9 are fixed on a bearing carrier 10, and the diamond wire 2 is wound on the first diamond wire driving wheel 8 and the second diamond wire driving wheel 9; the upper part of the crystal support fixing frame 3 is welded on the output end head of the up-and-down moving servo motor 1, the bottom of the crystal support fixing frame 3 is of a rectangular structure, the short edge is parallel to the diamond wire 2, the long edge is perpendicular to the

diamond wire

2, 4 clamping blocks (not shown in the figure) which are arranged in parallel in pairs are arranged at the bottom of the crystal support fixing frame 3, and the clamping blocks are of an inverted trapezoidal structure with a large lower part and a small upper part; the upper portion of brilliant support sets up 2 spouts 5 that correspond with the card soon to the card soon can block in the spout 5, relative spout 5 slides. The sliding groove 5 is obliquely arranged at an angle of 26 degrees relative to the long edge of the crystal support fixing frame 3, and the 2 clamping blocks are arranged in parallel relative to the long edge of the crystal support fixing frame 3. So that the crystal holder 4 forms an included angle of 26 degrees with the long edge of the crystal holder fixing frame 3 after being clamped. So that during cutting the diamond wire is parallel to the short side of the wafer holder 3, thus forming a bevel with an inclination of 26 during cutting.

On the basis of the technical scheme, in order to further improve the matching precision between the clamping part and the clamping matching part and enable the crystal support 4 to be more convenient to replace, the clamping part is a 2-strip-shaped parallel clamping convex block parallel to the long edge of the crystal support fixing frame 3; the width that joint cooperation portion was set up for 4 long limit slopes of crystal relatively is slightly greater than 2 joint recesses 5 of joint lug, the joint lug can block relative slip in the joint recess 2. The clamping part is arranged at the bottom of the crystal support fixing frame 3, and the clamping groove 5 is arranged at the upper part of the crystal support 4.

Illustratively, the clamping groove 5 is arranged at the bottom of the crystal support fixing frame 3, and the clamping convex block is arranged at the upper part of the crystal support 4.

Illustratively, the clamping convex block is of a T-shaped structure, and the clamping groove 5 is of a T-shaped groove structure. In the use, the clamping lug of T type structure card is gone into the setting of joint in T type joint recess 5, and after the joint was accomplished, pushes to the inboard, realizes that brilliant support 4 takes place certain angle rotation relative brilliant support mount 3, and rotation angle can be decided by the inclination of joint recess 5, and the angle scope is 3-45, adjusts the change according to different cutting silicon chips.

Illustratively, the clamping convex block and the clamping groove 5 are in a dovetail structure and are connected in a matched mode, and the clamping convex block is clamped into the clamping groove 5 to achieve connection.

1. A servo motor moves up and down; 2. a silicon rod; 3. a crystal support fixing frame; 4. crystal support; 5. clamping the groove; 6. a diamond wire; 7. a servo motor; 8. a first diamond wire transmission wheel; 9. a second diamond wire transmission wheel; 10. a bearing carrier; 11. a chute; 12. a lead screw; a: and (4) chamfering.

Further, in order to adapt to cutting of different sizes and different beveling angles, the bearing carrier 10 is provided with a sliding chute 11, a servo motor 7 is fixed in the middle of the sliding chute 11, and the output end of the servo motor 7 is meshed with a gear (not shown in the figure) arranged in the middle of the lead screw 12. The screw rod 12 passes through the ends of the first diamond wire driving wheel 8 and the second diamond wire driving wheel 9; the servo motor 7 is connected with the controller; the ends of the first diamond wire driving wheel 8 and the second diamond wire driving wheel 9 are clamped in the sliding groove 11 and can slide relative to the sliding groove 11 in the rotating process of the lead screw 12. Thereby realizing the adjustment of the distance between the first diamond wire driving wheel 8 and the second diamond wire driving wheel 9 and being used for realizing the beveling of the silicon rods 2 with different sizes.

Table 1 below shows the length 4000 and diameter for this application

Cutting test data of the round single crystal silicon round rod of (1).

As set forth in table 1 below:

class of parameters

∠°

□h

□w

□mm²

↑⁺

v

Reference to

0

168

28224

0.0％

S1

26

190

36100

27.9％

18％

Wherein the angle degree represents a chamfer angle, □ h represents the length of the cut rectangle, □ w represents the width of the cut rectangle, □ mm2 represents the surface area of the section, ℃ + represents the percentage increase of the silicon area compared with the original plane cutting method, and v represents the effective utilization rate of the silicon rod.

The area of the cut silicon single crystal rod is increased by ↓.9% compared with the area of the original plane cut silicon slice, and the effective utilization rate of the silicon rod is improved by ↓.18%.

Through beveling the monocrystalline silicon rod according to the size requirement of the silicon wafer, the material utilization rate is obviously improved, although 2-end oblique angle materials are cut, compared with the plane cutting silicon wafer area in the prior art, the integral cutting area is increased by 27.9%, the effective utilization rate of the silicon rod is improved by 18%, the obtained silicon wafer is provided with an oblique angle edge, an adhesive surface with a larger surface area can be obtained in the utilization process, the butt joint fixation is facilitated, and meanwhile, the effective utilization area of the silicon wafer is further increased.

The working principle and the working method are as follows: in the working process, firstly, selecting a beveling angle according to the area of the pre-cut silicon wafer and the direct size of the silicon rod, and then cutting two end surfaces according to the beveling angle; next, bond the silicon rod in have the brilliant support 4 bottom that the scarf angle is A, then hold in the palm 4 installation in brilliant support mount 3 bottom with brilliant, in the installation, make the joint lug insert joint recess 5 in, because joint recess 5 has certain inclination in the horizontal direction for the long limit of brilliant support 4, consequently in the insertion process for brilliant support 4 takes place the rotation of scarf angle A in the horizontal direction for brilliant support mount 3. Because the diamond wire 6 is always parallel to the short edge of the crystal support fixing frame 3, in the starting process of the up-and-down moving servo motor 1, the crystal support fixing frame 3 moves downwards to drive the crystal support 4 and the silicon rod 2 to move downwards, so that the beveling of the obliquely arranged silicon rod 2 by the diamond wire 6 is completed. Under the condition that the silicon rod is large, the servo motor 7 can be controlled through the controller to drive the lead screw 12 to rotate, and the first diamond wire driving wheel 8 and the end head of the first diamond wire driving wheel 9 are sleeved on the lead screw 12, so that the distance between the first diamond wire driving wheel 8 and the first diamond wire driving wheel 9 is driven to be adjusted in the rotating process of the lead screw 12, and then the chamfering operation is realized after the diamond wire 6 is replaced. Compared with a common diamond wire cutting machine, the crystal support 4 is installed at a certain corner, so that beveling at a certain angle is realized, and the area of a silicon wafer is remarkably increased.

The crystal support fixing frame and the crystal support are movably connected and are connected, the crystal support fixing frame and the crystal support are arranged at an included angle of 3-45 degrees in the horizontal direction, so that the crystal support is replaced and adjusted on one hand, and the crystal support is installed on the other hand, so that a silicon rod forms a certain rotary inclination in the horizontal direction relative to a diamond wire, the silicon rod is obliquely cut at a certain angle with the diamond wire in the downward cutting process of the silicon rod, the area of the cut silicon wafer is larger, and the total effective utilization area of the silicon wafer is obviously improved. Simultaneously through the setting of two-way hydraulic stem and spout structure to realize the controllability of buddha's warrior attendant wire-electrode cutting distance, adaptability is wider, can satisfy the cutting of more angles and bigger size.

While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the utility model as defined in the appended claims.

Claims

1. The utility model provides a novel buddha's warrior attendant wire cut electrical discharge machining which characterized in that: the device comprises a controller, a driving motor, a bearing carrier, a diamond wire transmission wheel, an up-and-down moving servo motor, a crystal support fixing frame, a crystal support and a diamond wire; the controller is connected with the driving motor and the up-and-down moving servo motor; a diamond wire driving wheel is fixed on the bearing carrier, and the diamond wire is wound on the diamond wire driving wheel; the upper part of the crystal support fixing frame is connected with an up-and-down moving servo motor, and the bottom of the crystal support fixing frame is provided with a clamping part; the upper part of the crystal support is provided with a clamping matching part, and the clamping part is movably connected with the clamping matching part; the crystal support fixing frame and the crystal support are arranged at an included angle of 1-45 degrees in the horizontal direction.

2. The novel diamond wire cutting machine according to claim 1, characterized in that: the clamping part is a 2-strip-shaped parallel clamping lug parallel to the long edge of the crystal support fixing frame; the clamping matching part is 2 clamping grooves which are obliquely arranged relative to the long edge of the crystal support and have the width smaller than that of the clamping convex block, and the clamping convex block can be clamped into the clamping grooves to slide relatively.

3. The novel diamond wire cutting machine according to claim 2, characterized in that: the clamping lug is of a T-shaped structure, and the clamping groove is a T-shaped groove.

4. The novel diamond wire cutting machine according to claim 2, characterized in that: the clamping convex block and the clamping groove form a dovetail structure.

5. The novel diamond wire cutting machine according to claim 1, characterized in that: the clamping part is 2 clamping grooves parallel to the long edge of the crystal support fixing frame; the clamping matching part is 2 clamping convex blocks which are obliquely arranged relative to the long edge of the crystal support and have the width smaller than that of the clamping groove, and the clamping convex blocks can be clamped into the clamping groove to slide relatively.

6. The novel diamond wire cutting machine according to claim 1, characterized in that: the bearing carrier is provided with a chute, the middle position of the chute is provided with a servo motor and a lead screw, the output end of the servo motor is meshed with a lead screw intermediate gear, and the lead screw penetrates through the end of a diamond wire transmission wheel; the servo motor is connected with the controller; the end of the diamond wire driving wheel is clamped in the sliding groove and can slide relative to the sliding groove in the rotating process of the lead screw.

7. The novel diamond wire cutting machine according to claim 1, characterized in that: the length direction of the crystal support fixing frame and the length direction of the crystal support form an included angle of 26 degrees.