CN215266234U - Position calibration device for wafer detection - Google Patents
Position calibration device for wafer detection Download PDFInfo
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- CN215266234U CN215266234U CN202121260445.5U CN202121260445U CN215266234U CN 215266234 U CN215266234 U CN 215266234U CN 202121260445 U CN202121260445 U CN 202121260445U CN 215266234 U CN215266234 U CN 215266234U
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Abstract
The utility model discloses a position calibration device for wafer detection, which comprises a calibration carrier, a measuring head, a positioning detection camera, a calibration pushing component and a jacking driving component, wherein the rear part of the calibration carrier is provided with a rotary driving cylinder, the output end of the rotary driving cylinder is connected with a T-shaped support, the measuring head and the positioning detection camera are respectively arranged at the two ends of the top part of the T-shaped support, the center of the upper surface of the calibration carrier is provided with a detection groove, a detection area is arranged in the detection groove, the center of the bottom part of the detection groove is provided with a through groove, the jacking driving component comprises a jacking driving cylinder and a jacking plate, the jacking plate is fixedly connected with a telescopic shaft of the jacking driving cylinder, the calibration pushing component comprises four calibration pushing cylinders and four pushing blocks, the utility model can effectively realize position detection and position calibration of a wafer placed on the calibration carrier, thus the measurement accuracy of the measuring head can be greatly improved, compared with the prior art, the utility model discloses the practicality strengthens greatly, has higher use value.
Description
Technical Field
The utility model relates to a wafer detects technical field, especially relates to a wafer detects uses position calibration device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.
And current device can not carry out good calibration to the wafer when measuring the wafer to lead to the device to have great error to the measured data of wafer, and do not have good stability, make the wafer displacement phenomenon appear in the device inside comparatively easily, thereby be unfavorable for the device to measure the wafer, can not satisfy people's demand, so the utility model discloses a position calibrating device is used in wafer detection.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: in order to solve the not enough of existence among the background art, so the utility model discloses a wafer detects uses position calibration device.
The technical scheme is as follows: a position calibration device for wafer detection comprises a calibration carrier, a measuring head, a positioning detection camera, a calibration pushing assembly and a jacking driving assembly, wherein a rotation driving cylinder is arranged at the rear part of the calibration carrier, the output end of the rotation driving cylinder is connected with a T-shaped support, the measuring head and the positioning detection camera are respectively arranged at two ends of the top of the T-shaped support, a detection groove is arranged in the center of the upper surface of the calibration carrier, a detection area is arranged in the detection groove, a through groove is arranged at the center of the bottom of the detection groove, the jacking driving assembly comprises a jacking driving cylinder and a jacking plate, the jacking driving cylinder is arranged below the center of the calibration carrier, the jacking plate is fixedly connected with a telescopic shaft of the jacking driving cylinder, the calibration pushing assembly comprises four calibration pushing cylinders and four pushing blocks, and four mounting grooves are arranged on the upper surface of the calibration carrier in an annular array, four calibration promotion cylinders set up respectively inside four mounting grooves, every the telescopic shaft of calibration promotion cylinder all stretches into and detects the inslot and promote a piece rigid coupling.
Further, the positioning detection camera is a CCD high-definition camera.
Furthermore, protective rubber pads are attached to the upper surface of the jacking plate and the side surface of each pushing block.
Further, each pushing block is arranged in contact with the bottom surface of the detection groove.
The utility model discloses realize following beneficial effect:
the utility model discloses can effectively realize carrying out position detection and position calibration to placing the wafer on the calibration microscope carrier, will improve the measurement accuracy of measuring head greatly like this, compare in prior art, the utility model discloses the practicality strengthens greatly, has higher use value.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic diagram of the structure of the calibration carrier.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Examples
Referring to fig. 1-2, a position calibration device for wafer inspection, comprising a calibration carrier 10, a measurement head 20, a positioning detection camera 30, a calibration pushing assembly and a jacking driving assembly, wherein the rear part of the calibration carrier is provided with a rotation driving cylinder 50, the output end of the rotation driving cylinder is connected with a T-shaped support 40, the measurement head and the positioning detection camera are respectively arranged at the two ends of the top part of the T-shaped support, the positioning detection camera in the utility model specifically adopts a CCD high definition camera, the center of the upper surface of the calibration carrier is provided with a detection groove 60, a detection area 100 is arranged in the detection groove, the center of the bottom of the detection groove is provided with a through groove 130, the jacking driving assembly comprises a jacking driving cylinder 140 and a jacking plate 120, the jacking driving cylinder is arranged below the center of the calibration carrier, the jacking plate is fixedly connected with the telescopic shaft of the jacking driving cylinder, the calibration pushing assembly comprises four calibration pushing cylinders 80 and four pushing blocks 110, the upper surface of calibration microscope carrier is provided with four mounting grooves 70 for annular array, and four calibration promotion cylinders set up respectively inside four mounting grooves, and every calibration promotion cylinder's telescopic shaft all stretches into and detects the inslot and promote a piece rigid coupling.
In this embodiment, the protective rubber pads 90 are attached to the upper surface of the lifting plate and the side surface of each pushing block, and the wafer can be protected by the protective rubber pads so as to be prevented from being damaged.
In the present embodiment, each of the pushing blocks is disposed in contact with the bottom surface of the detection tank. Therefore, each pushing block can push the wafer, and the position of the wafer is calibrated.
The utility model discloses an operating principle: an operator firstly places a wafer to be detected in a detection groove, then a positioning detection camera arranged on the top of a T-shaped support takes a picture of the position of the wafer to detect whether the wafer is completely in the detection area, if the wafer is not completely detected in the detection area, then four calibration push cylinders simultaneously drive a push block to act to push the wafer into the detection area for position calibration, after the position calibration of the wafer is finished, (after the calibration is finished, the four calibration push cylinders all drive the push block to reset), a rotary driving cylinder drives the T-shaped support to rotate 180 degrees to exchange the positions of the positioning detection camera and a measuring head, after the step is finished, the measuring head detects the wafer (the measuring head in the utility model is the prior art, the utility model is not repeated herein), after the detection is finished, the lifting plate is driven by the driving cylinder to act to push the wafer out from the detection groove, at this moment, the material taking operation is convenient for operators or manipulators.
It is emphasized below that the present invention needs to adopt a PLC controller to perform overall control during the operation process.
The above embodiments are only for illustrating the technical conception and the features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All changes and modifications that come within the spirit of the invention are desired to be protected.
Claims (4)
1. A position calibration device for wafer detection is characterized by comprising a calibration carrier, a measuring head, a positioning detection camera, a calibration pushing assembly and a jacking driving assembly, wherein a rotary driving cylinder is arranged at the rear part of the calibration carrier, the output end of the rotary driving cylinder is connected with a T-shaped support, the measuring head and the positioning detection camera are respectively arranged at two ends of the top of the T-shaped support, a detection groove is formed in the center of the upper surface of the calibration carrier, a detection area is arranged in the detection groove, a through groove is formed in the center of the bottom of the detection groove, the jacking driving assembly comprises a jacking driving cylinder and a jacking plate, the jacking driving cylinder is arranged below the center of the calibration carrier, the jacking plate is fixedly connected with a telescopic shaft of the jacking driving cylinder, the calibration pushing assembly comprises four calibration pushing cylinders and four pushing blocks, and four mounting grooves are formed in an annular array on the upper surface of the calibration carrier, four calibration promotion cylinders set up respectively inside four mounting grooves, every the telescopic shaft of calibration promotion cylinder all stretches into and detects the inslot and promote a piece rigid coupling.
2. The apparatus of claim 1, wherein the positioning detection camera is a CCD high-definition camera.
3. The wafer detecting position calibrating device according to claim 1, wherein a protective rubber pad is attached to an upper surface of the lift plate and a side surface of each of the pushing blocks.
4. The apparatus as claimed in claim 1, wherein each of the pushing blocks is disposed in contact with a bottom surface of the test slot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121260445.5U CN215266234U (en) | 2021-06-07 | 2021-06-07 | Position calibration device for wafer detection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121260445.5U CN215266234U (en) | 2021-06-07 | 2021-06-07 | Position calibration device for wafer detection |
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| Publication Number | Publication Date |
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| CN215266234U true CN215266234U (en) | 2021-12-21 |
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| CN202121260445.5U Active CN215266234U (en) | 2021-06-07 | 2021-06-07 | Position calibration device for wafer detection |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114654394A (en) * | 2022-03-20 | 2022-06-24 | 上海图双精密装备有限公司 | Wafer detection mobile loading platform mechanism |
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2021
- 2021-06-07 CN CN202121260445.5U patent/CN215266234U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114654394A (en) * | 2022-03-20 | 2022-06-24 | 上海图双精密装备有限公司 | Wafer detection mobile loading platform mechanism |
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