CN210465599U - Silicon wafer probe testing device - Google Patents
Silicon wafer probe testing device Download PDFInfo
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- CN210465599U CN210465599U CN201921018790.0U CN201921018790U CN210465599U CN 210465599 U CN210465599 U CN 210465599U CN 201921018790 U CN201921018790 U CN 201921018790U CN 210465599 U CN210465599 U CN 210465599U
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Abstract
The utility model belongs to the technical field of wafer test equipment, especially, a silicon wafer probe testing arrangement, comprises a workbench, the lower surface of workstation is fixed with the rotating electrical machines through the bolt, the output shaft of rotating electrical machines runs through the workstation and fixedly connected with revolving plate, the upper surface of revolving plate is installed wafer pallet, the upper end of wafer pallet has seted up the constant head tank, the top of workstation is connected with the roof through four stands, the upper surface of roof is installed hydraulic cylinder through the bolt; the wafer passes through the constant head tank and installs in the upper end of wafer pallet, changes the board simultaneously and installs in the axis of rotation of rotating electrical machines, and the board of being convenient for changes the board and takes the wafer pallet to rotate, and the clamp plate is installed on the output shaft of hydraulic cylinder simultaneously, and the output shaft of the hydraulic cylinder of being convenient for takes the clamp plate to reciprocate, and surface mounting's probe survey board under the clamp plate simultaneously is convenient for spacing arch and wafer contact, has increased the convenience of wafer test.
Description
Technical Field
The utility model belongs to the technical field of wafer test equipment, concretely relates to silicon wafer probe testing arrangement.
Background
The wafer test equipment is used for the last detection procedure before wafer packaging and is used for detecting the integrity of a wafer circuit, wherein the wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called as a wafer due to the circular shape; the silicon wafer can be processed into various circuit element structures to become an integrated circuit product with specific electrical functions, and when the traditional wafer test equipment is used for testing the wafer, the test efficiency of the wafer is low, and meanwhile, the test stability of the wafer is poor.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a silicon wafer probe testing arrangement has wafer efficiency of software testing height, the good characteristics of stability.
In order to achieve the above object, the utility model provides a following technical scheme: a silicon wafer probe testing device comprises a workbench, wherein a rotating motor is fixed on the lower surface of the workbench through a bolt, an output shaft of the rotating motor penetrates through the workbench and is fixedly connected with a rotating plate, a wafer supporting plate frame is arranged on the upper surface of the rotating plate, the upper end of the wafer supporting plate frame is provided with a positioning groove, the upper part of the workbench is connected with a top plate through four upright posts, the upper surface of the top plate is provided with a hydraulic cylinder through a bolt, the output shaft of the hydraulic cylinder penetrates through the top plate and is fixedly connected with a pressing plate, the lower surface of the pressure plate is provided with a probe measuring plate which comprises a connecting frame, an outer protective frame and a probe, the lower surface at the clamp plate is fixed to the link, the lower extreme at the link is installed to outer protective frame, the probe is located the inside of outer protective frame, just the inside of link is embedded into to the upper end of probe.
As the utility model discloses a preferred technical scheme of silicon wafer probe testing arrangement, the probe survey board still includes spacing arch, spacing groove and buffer spring, the upper end of frame is protected outside to spacing protruding welding, the side surface at the link is seted up to the spacing groove, buffer spring installs the inside at the spacing groove, buffer spring's one end is fixed on spacing bellied surface, buffer spring's the other end is connected with the lower fixed surface of clamp plate.
As the utility model discloses a preferred technical scheme of silicon wafer probe testing arrangement, spacing arch and spacing groove all are provided with four, and four spacing arch and four the impartial interval distribution of spacing groove.
As the utility model discloses a preferred technical scheme of silicon wafer probe testing arrangement, install flat bearing between workstation and the commentaries on classics board, flat bearing's upper surface and the lower fixed surface who changes the board are connected, flat bearing's lower surface and the last fixed surface of workstation are connected.
As the utility model discloses a preferred technical scheme of silicon wafer probe testing arrangement, the commentaries on classics board is circular structure, the clamp plate is half circle structure, just wafer plate supporting frame and probe survey board are corresponding.
As the utility model discloses a preferred technical scheme of silicon wafer probe testing arrangement, wafer pallet comprises two third ring structures, just wafer pallet equidistant distribution is on the surface of commentaries on classics board.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the wafer passes through the constant head tank and installs in the upper end of wafer pallet, changes the board simultaneously and installs in the axis of rotation of rotating electrical machines, and the board of being convenient for changes the board and takes the wafer pallet to rotate, and the clamp plate is installed on the output shaft of hydraulic cylinder simultaneously, and the output shaft of the hydraulic cylinder of being convenient for takes the clamp plate to reciprocate, and surface mounting's probe survey board under the clamp plate simultaneously is convenient for spacing arch and wafer contact, has increased the convenience of wafer test.
2. When the probe detecting plate is contacted with the wafer supporting plate frame, the outer protective frame positioned at the lower end of the connecting frame is firstly contacted with the upper end of the wafer supporting plate frame, and when the outer protective frame is extruded by the wafer supporting plate frame, the limiting protrusions welded at the upper end of the outer protective frame slide in the limiting grooves, and the buffer springs deform under the action of the limiting protrusions and the limiting grooves, so that the probe is contacted with the wafer after the probe detecting plate is pre-contacted with the wafer supporting plate frame, and the contact stability of the probe and the wafer is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic top view of the wafer carrier and the rotary plate according to the present invention;
fig. 3 is a schematic bottom view of the pressing plate and the probe measuring plate of the present invention;
fig. 4 is a schematic view of a connection structure between the wafer supporting plate frame and the probe testing plate according to the present invention;
FIG. 5 is an enlarged schematic view of the structure at A in FIG. 1;
in the figure: 1. a work table; 2. a rotating electric machine; 3. rotating the plate; 4. a wafer pallet; 5. positioning a groove; 6. a top plate; 7. a hydraulic cylinder; 8. pressing a plate; 9. a probe detection plate; 10. a connecting frame; 11. an outer protective frame; 12. a probe; 13. a limiting bulge; 14. a limiting groove; 15. a buffer spring; 16. and a plane bearing.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
Referring to fig. 1-5, the present invention provides a technical solution: a silicon wafer probe testing device comprises a workbench 1, a rotary motor 2 is fixed on the lower surface of the workbench 1 through bolts, an output shaft of the rotary motor 2 penetrates through the workbench 1 and is fixedly connected with a rotary plate 3, a wafer supporting plate frame 4 is installed on the upper surface of the rotary plate 3, a positioning groove 5 is formed in the upper end of the wafer supporting plate frame 4, a top plate 6 is connected above the workbench 1 through four upright posts, a hydraulic cylinder 7 is installed on the upper surface of the top plate 6 through bolts, an output shaft of the hydraulic cylinder 7 penetrates through the top plate 6 and is fixedly connected with a pressing plate 8, a probe testing plate 9 is installed on the lower surface of the pressing plate 8, the probe testing plate 9 comprises a connecting frame 10, the probe comprises an outer protective frame 11 and a probe 12, wherein a connecting frame 10 is fixed on the lower surface of the pressure plate 8, the outer protective frame 11 is arranged at the lower end of the connecting frame 10, the probe 12 is positioned in the outer protective frame 11, and the upper end of the probe 12 is embedded in the connecting frame 10.
In this embodiment, the wafer passes through constant head tank 5 to be installed in the upper end of wafer pallet 4, change the board 3 simultaneously and install in rotating motor 2's axis of rotation, it takes wafer pallet 4 to rotate to be convenient for change board 3, clamp plate 8 installs simultaneously on the output shaft of hydraulic cylinder 7, the output shaft of the hydraulic cylinder 7 of being convenient for takes clamp plate 8 to reciprocate, clamp plate 8 surface mounting's under the probe survey board 9 simultaneously, be convenient for spacing arch 13 and wafer contact, the convenience of wafer test has been increased.
Specifically, probe survey board 9 still includes spacing arch 13, spacing groove 14 and buffer spring 15, spacing arch 13 welds the upper end of protecting frame 11 outward, spacing groove 14 is seted up at the side surface of link 10, buffer spring 15 installs in spacing groove 14's inside, buffer spring 15's one end is fixed on spacing arch 13's surface, buffer spring 15's the other end and clamp plate 8's lower fixed surface are connected, spacing arch 13 and spacing groove 14 all are provided with four, and the impartial interval distribution of four spacing arch 13 and four spacing groove 14.
In this embodiment, when probe survey board 9 and wafer plate holder 4 contact, the outer fender bracket 11 that is located the link 10 lower extreme at first contacts with the upper end of wafer plate holder 4, and when outer fender bracket 11 received the extrusion of wafer plate holder 4 simultaneously, the spacing arch 13 of outer fender bracket 11 upper end welded slides in the inside of spacing groove 14, buffer spring 15 is out of shape under spacing arch 13 and spacing groove 14's effect simultaneously, make probe survey board 9 and wafer plate holder 4 carry out pre-contact back probe 12 and wafer contact, the stability of probe 12 with the wafer contact has been increased.
Specifically, a plane bearing 16 is installed between the workbench 1 and the rotating plate 3, the upper surface of the plane bearing 16 is fixedly connected with the lower surface of the rotating plate 3, and the lower surface of the plane bearing 16 is fixedly connected with the upper surface of the workbench 1.
In this embodiment, the planar bearing 16 installed between the table 1 and the rotating plate 3 improves the stability of the rotating plate 3 rotating above the table 1.
Specifically, the rotating plate 3 is a circular structure, the pressing plate 8 is a half-circular structure, and the wafer supporting plate frame 4 corresponds to the probe measuring plate 9.
In this embodiment, the rotary plate 3 having a circular structure and the pressing plate 8 having a half-circular structure are provided, and the wafer supporting plate frame 4 corresponds to the probe testing plate 9, so that one half of the wafers above the rotary plate 3 can be conveniently used for testing, and the other half of the wafers above the rotary plate 3 can be conveniently used for mounting and dismounting, thereby improving the efficiency of wafer testing.
Specifically, the wafer supporting plate frame 4 is composed of two one-third circular ring structures, and the wafer supporting plate frame 4 is distributed on the surface of the rotating plate 3 at equal intervals.
In this embodiment, through the wafer supporting plate frame 4 composed of two one-third circular ring structures, the wafer supporting plate frame 4 is distributed on the surface of the rotating plate 3 at equal intervals, so that the wafer can be conveniently installed at the upper end of the wafer supporting plate frame 4
The utility model discloses a theory of operation and use flow: during the use, install the wafer inside the constant head tank 5 that the wafer plate holder 4 upper end was seted up, rotating electrical machines 2 takes and changes board 3 rotatory 180, and plane bearing 16 rotates between workstation 1 and commentaries on classics board 3 simultaneously, make the wafer plate holder 4 of installing the wafer rotate under probe survey board 9, and the output shaft of hydraulic cylinder 7 takes clamp plate 8 to move down simultaneously, make outer protective frame 11 at first contact with wafer plate holder 4, when outer protective frame 11 received the extrusion of wafer plate holder 4, spacing arch 13 of outer protective frame 11 upper end welded slides in the inside of spacing groove 14, buffer spring 15 compresses under spacing arch 13 and spacing groove 14's effect simultaneously, probe survey board 9 continues to move down to contact with the wafer.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A silicon wafer probe testing device comprises a workbench (1), and is characterized in that: the lower surface of the workbench (1) is fixed with a rotating motor (2) through bolts, the output shaft of the rotating motor (2) penetrates through the workbench (1) and is fixedly connected with a rotating plate (3), the upper surface of the rotating plate (3) is provided with a wafer supporting plate frame (4), the upper end of the wafer supporting plate frame (4) is provided with a positioning groove (5), the upper part of the workbench (1) is connected with a top plate (6) through four upright posts, the upper surface of the top plate (6) is provided with a hydraulic cylinder (7) through bolts, the output shaft of the hydraulic cylinder (7) penetrates through the top plate (6) and is fixedly connected with a pressing plate (8), the lower surface of the pressing plate (8) is provided with a probe measuring plate (9), the probe measuring plate (9) comprises a connecting frame (10), an outer protecting frame (11) and a probe (12), and the connecting frame (10) is fixed on the lower, the outer protective frame (11) is arranged at the lower end of the connecting frame (10), the probe (12) is positioned in the outer protective frame (11), and the upper end of the probe (12) is embedded into the connecting frame (10).
2. The silicon wafer probe testing apparatus of claim 1, wherein: probe survey board (9) still include spacing arch (13), spacing groove (14) and buffer spring (15), spacing arch (13) welding is in the upper end of outer protective frame (11), the side surface at link (10) is seted up in spacing groove (14), buffer spring (15) are installed in the inside of spacing groove (14), the surface at spacing arch (13) is fixed to the one end of buffer spring (15), the other end of buffer spring (15) and the lower fixed surface of clamp plate (8) are connected.
3. The silicon wafer probe testing apparatus of claim 2, wherein: the four limiting protrusions (13) and the four limiting grooves (14) are arranged, and the four limiting protrusions (13) and the four limiting grooves (14) are distributed at equal intervals.
4. The silicon wafer probe testing apparatus of claim 1, wherein: install flat bearing (16) between workstation (1) and commentaries on classics board (3), the upper surface of flat bearing (16) and the lower fixed surface who changes board (3) are connected, the lower surface of flat bearing (16) and the upper fixed surface of workstation (1) are connected.
5. The silicon wafer probe testing apparatus of claim 1, wherein: the rotary plate (3) is of a circular structure, the pressing plate (8) is of a half-circle structure, and the wafer supporting plate frame (4) corresponds to the probe measuring plate (9).
6. The silicon wafer probe testing apparatus of claim 1, wherein: the wafer supporting plate frame (4) is composed of two one-third circular ring structures, and the wafer supporting plate frame (4) is distributed on the surface of the rotating plate (3) at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921018790.0U CN210465599U (en) | 2019-07-02 | 2019-07-02 | Silicon wafer probe testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921018790.0U CN210465599U (en) | 2019-07-02 | 2019-07-02 | Silicon wafer probe testing device |
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| Publication Number | Publication Date |
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| CN210465599U true CN210465599U (en) | 2020-05-05 |
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| CN201921018790.0U Active CN210465599U (en) | 2019-07-02 | 2019-07-02 | Silicon wafer probe testing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113295891A (en) * | 2021-04-15 | 2021-08-24 | 国网湖北省电力有限公司十堰供电公司 | Many insulator spindle withstand voltage test supports of electrodynamic type |
-
2019
- 2019-07-02 CN CN201921018790.0U patent/CN210465599U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113295891A (en) * | 2021-04-15 | 2021-08-24 | 国网湖北省电力有限公司十堰供电公司 | Many insulator spindle withstand voltage test supports of electrodynamic type |
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Address after: 214000 109 Gaoyun Road, Binhu District, Wuxi City, Jiangsu Province Patentee after: Wuxi Yiwen Microelectronics Technology Co.,Ltd. Address before: 214000 109 Gaoyun Road, Binhu District, Wuxi City, Jiangsu Province Patentee before: WUXI YIWEN ELECTRONIC TECHNOLOGY Co.,Ltd. |