CN218797418U

CN218797418U - IC packaging chip detection machine

Info

Publication number: CN218797418U
Application number: CN202222710365.6U
Authority: CN
Inventors: 习建平
Original assignee: New Dry Chip Microelectronics Technology Co ltd
Current assignee: New Dry Chip Microelectronics Technology Co ltd
Priority date: 2022-10-14
Filing date: 2022-10-14
Publication date: 2023-04-07
Anticipated expiration: 2032-10-14

Abstract

The utility model relates to a detect the machine field, disclose a IC encapsulation chip detects machine, include: the IC packaging device comprises a working box, a driving motor is fixedly arranged at the top of the working box, a rotating shaft is fixedly arranged at the output end of the driving motor, a tray body is fixedly arranged at the bottom end of the rotating shaft, a plurality of placing seats are fixedly arranged at the top end of the tray body, and IC packaging chips are placed at the top ends of the placing seats; the blanking detection mechanism is arranged on the working box and comprises a mounting platform, a detection camera and a detection lamp, the mounting platform is fixedly mounted on the inner wall of the top of the working box, and the detection camera and the detection lamp are fixedly mounted at the bottom of the mounting platform. The utility model has the advantages of it is following and effect: the blanking can be automatically detected for the IC packaging chip, the intensity of workers is reduced, and the detection efficiency of the IC packaging chip is improved.

Description

IC packaging chip detection machine

Technical Field

The utility model relates to a detect quick-witted technical field, in particular to IC encapsulation chip detects machine.

Background

IC packaging refers to the routing of circuit pins on a silicon die to external connections for connection to other devices. The package form refers to a housing for mounting a semiconductor integrated circuit chip. The chip is not only used for mounting, fixing, sealing, protecting the chip and enhancing the electric heating performance, but also connected to pins of the packaging shell through the contacts on the chip by leads, and the pins are connected with other devices through the leads on the printed circuit board, so that the connection of the internal chip and an external circuit is realized.

Need detect it after the IC chip encapsulates, whether every pin on the detection chip all installs on the circuit board, notice number is CN204834569U among the prior art discloses IC encapsulates chip detection device, it is in the in-service use in-process, the chip needs the manual work to carry out the unloading processing after detecting the completion, the staff carries out the unloading through the manual work to the IC chip and probably mixes qualified IC encapsulation chip and unqualified IC encapsulation chip together long-time during operation, can make staff intensity of labour great, therefore, need design an IC encapsulates chip detector and be used for solving above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a IC encapsulation chip detects machine to solve above-mentioned problem.

The above technical purpose of the present invention can be achieved by the following technical solutions: an IC package chip inspection machine, comprising:

the IC packaging box comprises a working box, a driving motor is fixedly arranged at the top of the working box, a rotating shaft is fixedly arranged at the output end of the driving motor, a tray body is fixedly arranged at the bottom end of the rotating shaft, a plurality of placing seats are fixedly arranged at the top end of the tray body, and IC packaging chips are placed at the top ends of the placing seats;

and the detection blanking mechanism is arranged on the working box.

The utility model discloses a further set up to: detect unloading mechanism and include the mount table, detect the camera and detect the lamp, mount table fixed mounting is on the top inner wall of work box, detect the camera and detect the equal fixed mounting in the bottom of mount table of lamp.

The utility model discloses a further set up to: detect unloading mechanism still includes mounting bracket, electric telescopic handle one, electric telescopic handle two, link and rubber pad, mounting bracket fixed mounting is on the top inner wall of work box, electric telescopic handle one and electric telescopic handle two respectively fixed mounting in the one side that two mounting brackets kept away from each other, two link difference fixed mounting are on electric telescopic handle one and electric telescopic handle two's flexible arm, rubber pad fixed mounting is in one side of link, the mounting hole has all been seted up to the work box both sides, the fixed work or material rest that is provided with down in the mounting hole.

By adopting the technical scheme, the detection blanking processing can be carried out on the IC packaging chip.

The utility model discloses a further set up to: the number of the placing seats is eight, and the eight placing seats are arranged at intervals at equal intervals in an annular shape.

The utility model discloses a further set up to: one side that two unloading framves are close to each other is fixed to be provided with a connection platform, connects the fixed support frame that is provided with in bench top portion, and the support frame top contacts with the disk body.

Through adopting above-mentioned technical scheme, stability when can improving the disk body and rotate.

The utility model discloses a further set up to: the controller is fixedly arranged on the inner wall of the top of the working box and is electrically connected with the driving motor, the detection camera, the electric telescopic rod I and the electric telescopic rod II.

Through adopting above-mentioned technical scheme, can control driving motor, detection camera, electric telescopic handle one and electric telescopic handle two through the controller.

The utility model discloses a further set up to: the rear side of the working box is fixedly connected with a box door through a hinge.

By adopting the technical scheme, the box door can be conveniently opened for operation.

The utility model discloses a further set up to: the rotating shaft is located between the two mounting racks.

Through adopting above-mentioned technical scheme, can not influence the rotation of pivot.

The utility model has the advantages that:

1. the utility model detects the IC packaging chip through the detection camera by the arranged detection blanking mechanism, the electric telescopic rod is not started after the detection is qualified, and the electric telescopic rod is started after the detection is unqualified, so that the unqualified IC packaging chip is pushed down, and the unqualified IC packaging chip falls down from the blanking frame at the right side;

2. the utility model discloses a detection unloading mechanism that sets up detects the during operation at the detection camera, and electric telescopic handle two can work, pushes away qualified IC encapsulation chip down for qualified IC encapsulation chip falls from the unloading frame on the left side, so can detect the unloading to IC encapsulation chip automatically, reduces staff's intensity, and improves IC encapsulation chip detection efficiency.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be understood that the drawings in the following description are illustrative only, and that the structures, proportions, sizes, and other elements shown in the drawings are incorporated herein by reference in their entirety for all purposes in the present disclosure, which are not intended to limit the scope of the invention, but rather are to be construed as being within the spirit and scope of the invention.

Fig. 1 is a schematic structural diagram of an IC package chip inspection machine according to the present invention.

Fig. 2 is a schematic diagram of a cross-sectional structure of an IC package chip inspection machine according to the present invention.

Fig. 3 is a schematic view of a portion a of fig. 2.

In the figure, 1, a work box; 2. a drive motor; 3. a rotating shaft; 4. a tray body; 5. a placing seat; 6. an IC package chip; 7. an installation table; 8. detecting a camera; 9. detecting a light; 10. a mounting frame; 11. a first electric telescopic rod; 12. a second electric telescopic rod; 13. a connecting frame; 14. a rubber pad; 15. a blanking frame; 16. a connecting table; 17. a support frame; 18. a controller; 19. and (4) a box door.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", and the like, indicate the orientation or positional relationship indicated based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to imply that the indicated technical features are in number, whereby features defined as "first" and "second" may or may not include one or more of those features either explicitly or implicitly, in the description of the invention "plurality" means two or more than two unless explicitly and explicitly limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, 2 and 3, the utility model provides a chip testing machine is packaged to IC, include:

work box 1 and detection unloading mechanism, wherein:

the fixed driving motor 2 that is provided with in 1 top of work box, the fixed pivot 3 that is provided with of output of driving

motor

2, 3 bottom mounting in pivot is provided with

disk body

4, 4 fixed a plurality of seats 5 of placing that are provided with in top of disk body, place 5 tops of seat and placed IC package chip 6, it needs to explain, driving motor 2 starts, can be so that disk body 4 rotates, make and place 5 rotations of seat, detect a plurality of IC package chip 6 of placing on the seat 5 in proper order, detect the setting of unloading mechanism on work box 1.

Specifically, detect unloading mechanism and include mount table 7, detect camera 8 and detection lamp 9, mount table 7 fixed mounting is on the top inner wall of work box 1, detects camera 8 and the equal fixed mounting in the bottom of mount table 7 of detection lamp 9.

Through above-mentioned structure, when detecting IC package chip 6 to the below, detect lamp 9 and illuminate IC package chip 6, detect camera 8 and shoot and detect the pin of IC package chip 6 installation, detect whether defect such as rosin joint influences the problem of IC package chip 6's follow-up use.

Specifically, detect unloading mechanism and still include mounting bracket 10, electric telescopic handle 11, electric telescopic handle two 12, link 13 and rubber pad 14, mounting bracket 10 fixed mounting is on the top inner wall of work box 1, electric telescopic handle 11 and electric telescopic handle two 12 respectively fixed mounting in the one side that two mounting brackets 10 kept away from each other, two link 13 respectively fixed mounting on electric telescopic handle 11 and electric telescopic handle two 12's flexible arm, rubber pad 14 fixed mounting is in one side of link 13, the mounting hole has all been seted up to 1 both sides of work box, the fixed work or material rest 15 that is provided with down in the mounting hole.

Through the structure, when detecting that camera 8 detects IC package chip 6's pin is problematic, feed back information to controller 18, controller 18 starts electric telescopic handle 11, electric telescopic handle 11 drives corresponding link 13 and rubber pad 14 and removes, and then can push down the IC package chip 6 that detects the problem, the IC package chip 6 that pushes down falls through the unloading frame 15 of right side, controller 18 starts driving motor 2, make pivot 3 drive disk body 4 rotate, so can make next IC package chip 6 that awaits measuring move into under detecting camera 8, in detecting IC package chip 6 testing process of camera 8 to the below, controller 18 can start electric telescopic handle two 12 simultaneously, electric two 12 drive corresponding link 13 and rubber pad 14 and move, push down qualified IC package chip 6, make qualified IC package chip 6 fall through the unloading frame 15 of left side, so can carry out the unloading to IC package chip 6 automatically, and IC package chip 6 after the unloading is categorised, effectively reduce staff's intensity of labour.

Specifically, the number of the placing seats 5 is eight, and the eight placing seats 5 are arranged at equal intervals in a ring shape, and it should be noted that the detecting and blanking process can be performed on the IC package chips 6 on the placing seats 5 in a continuous manner.

Specifically, two work or material rest 15 are close to each other one side is fixed and is provided with a connection platform 16, connects the fixed support frame 17 that is provided with in platform 16 top, and support frame 17 top contacts with disk body 4, and it needs to explain, through the support frame 17 that sets up, can support disk body 4, so can improve disk body 4 stability when the rotation.

Specifically, a controller 18 is fixedly arranged on the inner wall of the top of the working box 1, the controller 18 is electrically connected with the driving motor 2, the detection camera 8, the first electric telescopic rod 11 and the second electric telescopic rod 12, and it should be noted that the driving motor 2, the detection camera 8, the first electric telescopic rod 11 and the second electric telescopic rod 12 are controlled through the controller 18.

Specifically, hinge fixedly connected with chamber door 19 is passed through to work box 1 rear side, and pivot 3 is located between two mounting brackets 10, and it needs to explain, and the staff can open chamber door 19, and the manual work is toward placing the IC package chip 6 that waits to detect on placing seat 5.

It is right above the utility model provides an IC encapsulation chip detects machine has introduced in detail. The principles and embodiments of the present invention have been explained herein using specific embodiments, which are merely used to help understand the method and its core ideas of the present invention. It should be noted that, for those skilled in the art, without departing from the principle of the present invention, the present invention can be further modified and modified, and such modifications and modifications also fall within the protection scope of the appended claims.

Claims

1. An IC package chip tester, comprising:

the IC packaging box comprises a working box (1), wherein a driving motor (2) is fixedly arranged at the top of the working box (1), a rotating shaft (3) is fixedly arranged at the output end of the driving motor (2), a box body (4) is fixedly arranged at the bottom end of the rotating shaft (3), a plurality of placing seats (5) are fixedly arranged at the top end of the box body (4), and IC packaging chips (6) are placed at the top ends of the placing seats (5);

the detection blanking mechanism is arranged on the working box (1).

2. The IC package chip detector as claimed in claim 1, wherein the detection blanking mechanism comprises a mounting table (7), a detection camera (8) and a detection lamp (9), the mounting table (7) is fixedly mounted on the inner wall of the top of the work box (1), and the detection camera (8) and the detection lamp (9) are both fixedly mounted on the bottom of the mounting table (7).

3. The IC package chip detector as claimed in claim 1, wherein the detection blanking mechanism further comprises a mounting frame (10), a first electric telescopic rod (11), a second electric telescopic rod (12), a connecting frame (13) and a rubber pad (14), the mounting frame (10) is fixedly mounted on the inner wall of the top of the work box (1), the first electric telescopic rod (11) and the second electric telescopic rod (12) are respectively and fixedly mounted on one side of the two mounting frames (10) away from each other, the two connecting frames (13) are respectively and fixedly mounted on the telescopic arms of the first electric telescopic rod (11) and the second electric telescopic rod (12), the rubber pad (14) is fixedly mounted on one side of the connecting frame (13), mounting holes are formed in both sides of the work box (1), and a blanking frame (15) is fixedly arranged in the mounting holes.

4. The IC package chip detection machine according to claim 1, wherein the number of the placing seats (5) is eight, and the eight placing seats (5) are annularly arranged at equal intervals.

5. The IC packaging chip detection machine according to claim 1 or 3, wherein a connecting table (16) is fixedly arranged at one side of the two blanking frames (15) close to each other, a supporting frame (17) is fixedly arranged at the top of the connecting table (16), and the top of the supporting frame (17) is in contact with the tray body (4).

6. The IC package chip detection machine according to claim 1, 2 or 3, wherein a controller (18) is fixedly arranged on the inner wall of the top of the working box (1), and the controller (18) is electrically connected with the driving motor (2), the detection camera (8), the first electric telescopic rod (11) and the second electric telescopic rod (12).

7. The IC package chip detection machine according to claim 1, wherein a box door (19) is fixedly connected to the rear side of the work box (1) through a hinge.

8. An IC package chip tester as claimed in claim 1 or 3, wherein the spindle (3) is located between two mounting brackets (10).