CN215220682U - Wafer transfer mechanism - Google Patents
Wafer transfer mechanism Download PDFInfo
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- CN215220682U CN215220682U CN202023311349.7U CN202023311349U CN215220682U CN 215220682 U CN215220682 U CN 215220682U CN 202023311349 U CN202023311349 U CN 202023311349U CN 215220682 U CN215220682 U CN 215220682U
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Abstract
The utility model provides a wafer transfer mechanism, include: transport supporting beam, transport supporting beam one end and fix on the left branch vaulting pole, the other end is fixed on the right branch vaulting pole, the left branch vaulting pole lower extreme is equipped with left back-and-forth movement device, right branch vaulting pole lower extreme is equipped with right back-and-forth movement device, left side back-and-forth movement device, right back-and-forth movement device slidable mounting are in removing the spout, transport supporting beam middle part and be equipped with snatchs adjusting device, it is equipped with the grabbing device fixing base to snatch the adjusting device lower extreme, be equipped with a plurality of wafer grabbing device on the grabbing device fixing base, the utility model discloses not only can realize snatching the transportation fast of wafer, moreover, can realize space transportation on a large scale, make things convenient for the use of combining of different process equipment.
Description
Technical Field
The utility model relates to a wafer production facility technical field specifically is a wafer transfer mechanism.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. Silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polycrystalline silicon, and a silicon crystal rod is ground, polished and sliced to form a silicon wafer, namely a wafer, which is widely applied to various electronic devices. The wafer material has undergone the technical evolution and industrial development for over 60 years, and forms the industrial situation which is mainly silicon and is supplemented by novel semiconductor materials.
However, in the current production and processing of wafers, the transfer range of the equipment for transferring the wafers is small, and the grabbing efficiency is low.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a wafer transfer mechanism to solve the problem that proposes among the above-mentioned background art.
The utility model provides a technical problem adopt following technical scheme to realize: a wafer transfer mechanism comprising: a transferring supporting beam, wherein one end of the transferring supporting beam is fixed on the left supporting rod, the other end of the transferring supporting beam is fixed on the right supporting rod, the lower end of the left supporting rod is provided with a left front-back moving device, the lower end of the right supporting rod is provided with a right front-back moving device, the left front-back moving device and the right front-back moving device are slidably mounted in a moving chute, the middle part of the transferring supporting beam is provided with a grabbing adjusting device, the lower end of the grabbing adjusting device is provided with a grabbing device fixing seat, the grabbing device fixing seat is provided with a plurality of wafer grabbing devices, the left front-back moving device and the right front-back moving device comprise moving supporting plates, walking wheels are arranged at the lower sides of the two ends of each moving supporting plate, the walking wheels are arranged in the moving chute in a rolling manner, the walking wheels are mounted on walking wheel fixing shafts, and the two ends of the walking wheel fixing shafts are mounted on the moving supporting plates through fixing shaft mounting bearings, the walking wheel fixing shaft is connected to the output end of the walking driving motor through a shaft coupling, and the shell of the walking driving motor is installed on the movable supporting plate through a motor fixing seat.
Wafer grabbing device is including snatching the sucking disc, it is equipped with the rubber suction cup to snatch the sucking disc lower extreme, it is equipped with the negative pressure straw to snatch sucking disc upper end one side, it is equipped with the sucking disc fixing base to snatch sucking disc upper end middle part, the sucking disc fixing base passes through the sucking disc installing support and installs on grabbing device fixing base.
The sucking disc installing support comprises an adjusting support screw, the lower end of the adjusting support screw is installed in a threaded hole in the sucking disc fixing seat through threads, an installing support sleeve is arranged in the middle of the adjusting support screw, an upper reset spring is arranged on the outer side of the adjusting support screw on the installing support sleeve, a lower reset spring is arranged on the outer side of the adjusting support screw on the installing support sleeve, and the installing support sleeve is installed on the grabbing device fixing seat.
The grabbing adjusting device comprises an adjusting device fixing plate, a left adjusting cylinder and a right adjusting cylinder are arranged on the adjusting device fixing plate, a cylinder body of the left adjusting cylinder and the right adjusting cylinder is installed on the adjusting device fixing plate through a cylinder fixing seat, a left adjusting driving head and a right adjusting driving head are arranged on the output end of the left adjusting cylinder and the right adjusting cylinder, the left adjusting driving head and the right adjusting driving head are fixed on an upper adjusting supporting plate and a lower adjusting supporting plate, an upper adjusting supporting plate and a lower adjusting supporting plate are arranged with an adjusting device fixing support, the upper adjusting supporting plate and the lower adjusting supporting plate comprise upper adjusting cylinders and lower adjusting cylinders, the cylinder body of the upper adjusting cylinder and the lower adjusting cylinder are installed on the upper adjusting supporting plate and the lower adjusting supporting plate through the cylinder fixing seat, a grabbing device mounting plate is arranged on the output end of the upper adjusting cylinder and the lower adjusting cylinder, and an upper adjusting guiding device is arranged between the grabbing device mounting plate and the upper adjusting supporting plate and the lower adjusting supporting plate.
The left and right adjusting and guiding device comprises an adjusting and guiding sliding block and an adjusting and guiding sliding rail, the adjusting and guiding sliding block is slidably mounted on the adjusting and guiding sliding rail, the adjusting and guiding sliding rail is mounted on an adjusting device fixing plate through a fixing bolt, and the adjusting and guiding sliding block is mounted on an upper adjusting and lower adjusting supporting plate through a fixing bolt.
The upper and lower adjusting guide device comprises an adjusting guide rod, an adjusting guide sleeve is arranged on the outer side of the adjusting guide rod, the adjusting guide sleeve is installed on an upper and lower adjusting support plate through a fixing bolt, the lower end of the adjusting guide rod is fixed on the grabbing device installation plate, and a stroke limiting block is arranged at the upper end of the adjusting guide rod.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses not only can realize snatching fast the transportation of wafer, moreover, can realize that space on a large scale is transported, make things convenient for the combination of different process equipment to use.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the back-and-forth moving device of the present invention.
Fig. 3 is the structural schematic diagram of the grabbing adjusting device of the present invention.
Fig. 4 is a schematic structural view of the wafer grabbing device of the present invention.
Detailed Description
In order to make the technical means, the creative features, the purpose and the efficacy of the present invention easily understood and appreciated, the present invention will be further explained with reference to the specific drawings, and in the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "mounted", "connected" and "connected" should be understood broadly, for example, they may be fixed connection, detachable connection, or integrally connected, mechanically connected or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements.
Example 1
As shown in fig. 1 to 4, a wafer transfer mechanism includes: a transferring and supporting beam 1, wherein one end of the transferring and supporting beam 1 is fixed on a left supporting rod 3, the other end is fixed on a right supporting rod 2, the lower end of the left supporting rod 3 is provided with a left front-back moving device 9, the lower end of the right supporting rod 2 is provided with a right front-back moving device 8, the left front-back moving device 9 and the right front-back moving device 8 are slidably mounted in a moving chute 7, the middle part of the transferring and supporting beam 1 is provided with a grabbing and adjusting device 4, the lower end of the grabbing and adjusting device 4 is provided with a grabbing device fixing seat 5, the grabbing device fixing seat 5 is provided with a plurality of wafer grabbing devices 6, the left front-back moving device 9 and the right front-back moving device 8 comprise moving supporting plates 91, the lower sides of the two ends of each moving supporting plate 91 are provided with moving wheels 92, the moving wheels 92 roll in the moving chute 7, the moving wheels 92 are mounted on a moving wheel fixing shaft 93, the walking wheel fixing shaft 93 is installed on the movable supporting plate 91 through the fixing shaft mounting bearing seats 94 at two ends, one end of the walking wheel fixing shaft 93 is connected to the output end of the walking driving motor 95 through a coupler, and the shell of the walking driving motor 95 is installed on the movable supporting plate 91 through the motor fixing seats.
Example 2
As shown in fig. 1 to 4, a wafer transfer mechanism includes: a transferring supporting beam 1, one end of the transferring supporting beam 1 is fixed on the left supporting rod 3, the other end is fixed on the right supporting rod 2, the lower end of the left support rod 3 is provided with a left front-back moving device 9, the lower end of the right support rod 2 is provided with a right front-back moving device 8, the left front-back moving device 9 and the right front-back moving device 8 are arranged in the moving chute 7 in a sliding way, the middle part of the transferring supporting beam 1 is provided with a grabbing adjusting device 4, the lower end of the grabbing adjusting device 4 is provided with a grabbing device fixing seat 5, the gripping device fixing seat 5 is provided with a plurality of wafer gripping devices 6, the wafer gripping devices 6 comprise gripping suckers 61, the lower end of the grabbing sucker 61 is provided with a rubber sucker 64, one side of the upper end of the grabbing sucker 61 is provided with a negative pressure sucker 63, the middle part of the upper end of the grabbing sucker 61 is provided with a sucker fixing seat 62, and the sucker fixing seat 62 is installed on the grabbing device fixing seat 5 through a sucker mounting support. The sucking disc installing support includes adjusting support screw 65, adjusting support screw 65 lower extreme passes through the threaded hole of screw thread installation on sucking disc fixing base 62, adjusting support screw 65 middle part is equipped with installation support cover 68, the adjusting support screw 65 outside of installation support cover 68 upside is equipped with reset spring 66, the adjusting support screw 65 outside of installation support cover 68 downside is equipped with down reset spring 67, and installation support cover 68 is installed on grabbing device fixing base 5.
Example 3
As shown in fig. 1 to 4, a wafer transfer mechanism includes: a transferring and supporting beam 1, wherein one end of the transferring and supporting beam 1 is fixed on a left supporting rod 3, the other end is fixed on a right supporting rod 2, the lower end of the left supporting rod 3 is provided with a left front-back moving device 9, the lower end of the right supporting rod 2 is provided with a right front-back moving device 8, the left front-back moving device 9 and the right front-back moving device 8 are slidably mounted in a moving chute 7, the middle part of the transferring and supporting beam 1 is provided with a grabbing and adjusting device 4, the lower end of the grabbing and adjusting device 4 is provided with a grabbing device fixing seat 5, the grabbing device fixing seat 5 is provided with a plurality of wafer grabbing devices 6, the grabbing and adjusting device 4 comprises an adjusting device fixing plate 41, the adjusting device fixing plate 41 is provided with a left and right adjusting cylinder 42, the cylinder body of the left and right adjusting cylinder 42 is mounted on the adjusting device fixing plate 41 through a cylinder fixing seat 43, and the output end of the left and right adjusting cylinder 42 is provided with a left and right adjusting driving head 44, the left-right adjusting driving head 44 is fixed on the up-down adjusting supporting plate 45, the up-down adjusting supporting plate 45 and the adjusting device fixing plate 41 are supported by a left-right adjusting guide device, the up-down adjusting supporting plate 45 comprises an up-down adjusting cylinder 46, the cylinder body of the up-down adjusting cylinder 46 is installed on the up-down adjusting supporting plate 45 through a cylinder fixing seat, the output end of the up-down adjusting cylinder 46 is provided with a gripping device installing plate 47, an up-down adjusting guide device is arranged between the gripping device installing plate 47 and the up-down adjusting supporting plate 45, the left-right adjusting guide device comprises an adjusting guide sliding block 49 and an adjusting guide sliding rail 48, the adjusting guide sliding block 49 is slidably installed on the adjusting guide sliding rail 48, the adjusting guide sliding rail 48 is installed on the adjusting device fixing plate 41 through a fixing bolt, the adjusting guide sliding block 49 is installed on the up-down adjusting supporting plate 45 through a fixing bolt, the up-down adjusting guide device comprises an adjusting guide rod 410, an adjusting guide sleeve 412 is arranged on the outer side of the adjusting guide rod 410, the adjusting guide sleeve 412 is installed on the up-down adjusting support plate 45 through a fixing bolt, the lower end of the adjusting guide rod 410 is fixed on the grabbing device installation plate 47, and a stroke limiting block 411 is arranged at the upper end of the adjusting guide rod 410.
The utility model discloses fix on left branch vaulting pole 3, the other end is fixed on right branch vaulting pole 2 transporting 1 one end of supporting beam, 3 lower extremes of left branch vaulting pole are equipped with left back-and-forth movement device 9, 2 lower extremes of right branch vaulting pole are equipped with right back-and-forth movement device 8, left side back-and-forth movement device 9, 8 slidable mounting of right back-and-forth movement device are in removing spout 7, transport 1 middle part of supporting beam and be equipped with and snatch adjusting device 4, it is equipped with grabbing device fixing base 5 to snatch adjusting device 4 lower extreme, be equipped with a plurality of wafer grabbing device 6 on the grabbing device fixing base 5, not only can realize snatching fast the transportation of wafer, moreover, can realize space transportation on a large scale, the convenient use of combining of different process equipment.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. A wafer transfer mechanism comprising: transport supporting beam (1), transport supporting beam (1) one end and fix on left branch vaulting pole (3), the other end is fixed on right branch vaulting pole (2), left branch vaulting pole (3) lower extreme is equipped with left back-and-forth movement device (9), right branch vaulting pole (2) lower extreme is equipped with right back-and-forth movement device (8), left back-and-forth movement device (9), right back-and-forth movement device (8) slidable mounting are in removing spout (7), its characterized in that: the middle part of the transferring supporting beam (1) is provided with a grabbing adjusting device (4), the lower end of the grabbing adjusting device (4) is provided with a grabbing device fixing seat (5), a plurality of wafer grabbing devices (6) are arranged on the grabbing device fixing seat (5), the left front-back moving device (9) and the right front-back moving device (8) comprise moving support plates (91), the lower sides of the two ends of the movable supporting plate (91) are provided with walking wheels (92), the walking wheels (92) are arranged in the movable sliding chute (7) in a rolling way, the walking wheel (92) is arranged on a walking wheel fixing shaft (93), two ends of the walking wheel fixing shaft (93) are arranged on the movable supporting plate (91) through a fixing shaft mounting bearing seat (94), one end of the walking wheel fixing shaft (93) is connected to the output end of the walking drive motor (95) through a coupling, the shell of the walking driving motor (95) is arranged on the movable supporting plate (91) through a motor fixing seat; wafer grabbing device (6) are including snatching sucking disc (61), it is equipped with rubber suction cup (64) to snatch sucking disc (61) lower extreme, it is equipped with negative pressure straw (63) to snatch sucking disc (61) upper end one side, it is equipped with sucking disc fixing base (62) to snatch sucking disc (61) upper end middle part, sucking disc fixing base (62) are installed on grabbing device fixing base (5) through the sucking disc installing support.
2. The wafer transfer mechanism of claim 1, wherein: the sucking disc installing support includes adjusting support screw (65), adjusting support screw (65) lower extreme passes through the screw thread and installs in the threaded hole on sucking disc fixing base (62), adjusting support screw (65) middle part is equipped with installation support cover (68), adjusting support screw (65) outside of installation support cover (68) upside is equipped with reset spring (66), adjusting support screw (65) outside of installation support cover (68) downside is equipped with down reset spring (67), and installation support cover (68) is installed on grabbing device fixing base (5).
3. The wafer transfer mechanism of claim 1, wherein: the grabbing adjusting device (4) comprises an adjusting device fixing plate (41), a left adjusting cylinder and a right adjusting cylinder (42) are arranged on the adjusting device fixing plate (41), a cylinder body of the left adjusting cylinder and the right adjusting cylinder (42) is installed on the adjusting device fixing plate (41) through a cylinder fixing seat (43), a left adjusting driving head and a right adjusting driving head (44) are arranged on the output end of the left adjusting cylinder and the right adjusting cylinder (42), the left adjusting driving head and the right adjusting driving head (44) are fixed on an upper adjusting supporting plate and a lower adjusting supporting plate (45), a left adjusting guiding device and a right adjusting guiding device are arranged on the supports of the upper adjusting supporting plate (45) and the lower adjusting supporting plate (41), the upper adjusting supporting plate and the lower adjusting supporting plate (45) comprise an upper adjusting cylinder and a lower adjusting cylinder (46), the cylinder body of the upper adjusting cylinder and the lower adjusting cylinder (46) is installed on the upper adjusting supporting plate and the lower adjusting supporting plate (45) through the cylinder fixing seat, and a grabbing device installing plate (47) is arranged on the output end of the upper adjusting cylinder (46), an up-down adjusting guide device is arranged between the gripping device mounting plate (47) and the up-down adjusting support plate (45).
4. The wafer transfer mechanism of claim 3, wherein: the left and right adjusting guide device comprises an adjusting guide sliding block (49) and an adjusting guide sliding rail (48), wherein the adjusting guide sliding block (49) is slidably mounted on the adjusting guide sliding rail (48), the adjusting guide sliding rail (48) is mounted on an adjusting device fixing plate (41) through a fixing bolt, and the adjusting guide sliding block (49) is mounted on an up-and-down adjusting support plate (45) through a fixing bolt.
5. The wafer transfer mechanism of claim 4, wherein: the up-down adjusting guide device comprises an adjusting guide rod (410), an adjusting guide sleeve (412) is arranged on the outer side of the adjusting guide rod (410), the adjusting guide sleeve (412) is installed on an up-down adjusting support plate (45) through a fixing bolt, the lower end of the adjusting guide rod (410) is fixed on a grabbing device installation plate (47), and a stroke limiting block (411) is arranged at the upper end of the adjusting guide rod (410).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023311349.7U CN215220682U (en) | 2020-12-31 | 2020-12-31 | Wafer transfer mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023311349.7U CN215220682U (en) | 2020-12-31 | 2020-12-31 | Wafer transfer mechanism |
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| Publication Number | Publication Date |
|---|---|
| CN215220682U true CN215220682U (en) | 2021-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023311349.7U Active CN215220682U (en) | 2020-12-31 | 2020-12-31 | Wafer transfer mechanism |
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| CN (1) | CN215220682U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115122378A (en) * | 2022-07-26 | 2022-09-30 | 常熟市兆恒众力精密机械有限公司 | Titanium alloy fixed claw for wafer clamping |
-
2020
- 2020-12-31 CN CN202023311349.7U patent/CN215220682U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115122378A (en) * | 2022-07-26 | 2022-09-30 | 常熟市兆恒众力精密机械有限公司 | Titanium alloy fixed claw for wafer clamping |
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