CN215201009U - Electrolytic force rheology burnishing device based on conductivity regulation and control polishing solution performance - Google Patents
Electrolytic force rheology burnishing device based on conductivity regulation and control polishing solution performance Download PDFInfo
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- CN215201009U CN215201009U CN202120522803.9U CN202120522803U CN215201009U CN 215201009 U CN215201009 U CN 215201009U CN 202120522803 U CN202120522803 U CN 202120522803U CN 215201009 U CN215201009 U CN 215201009U
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- 238000005498 polishing Methods 0.000 title claims abstract description 144
- 238000000518 rheometry Methods 0.000 title description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 81
- 239000008213 purified water Substances 0.000 claims abstract description 42
- 238000001514 detection method Methods 0.000 claims abstract description 24
- 230000000694 effects Effects 0.000 claims description 19
- 239000000523 sample Substances 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 9
- 238000003487 electrochemical reaction Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 230000001276 controlling effect Effects 0.000 claims description 3
- 238000007517 polishing process Methods 0.000 abstract description 15
- 238000003754 machining Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 11
- 238000010008 shearing Methods 0.000 description 9
- 230000008719 thickening Effects 0.000 description 9
- 239000003792 electrolyte Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- OQJGZGAYSCWFCK-UHFFFAOYSA-N 2-[4-(furan-2-ylmethyl)-5-[[4-methyl-3-(trifluoromethyl)phenyl]methylsulfanyl]-1,2,4-triazol-3-yl]pyridine Chemical compound C1=C(C(F)(F)F)C(C)=CC=C1CSC(N1CC=2OC=CC=2)=NN=C1C1=CC=CC=N1 OQJGZGAYSCWFCK-UHFFFAOYSA-N 0.000 description 5
- 230000009471 action Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005868 electrolysis reaction Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 2
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052938 sodium sulfate Inorganic materials 0.000 description 2
- 235000011152 sodium sulphate Nutrition 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
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- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
An electrolytic force rheological polishing device based on conductivity regulation and control polishing solution performance comprises a conductivity detection module, a purified water filling module, a feedback control device, an electrolytic power supply, an electrolytic-force rheological polishing machine and an electrolytic-force rheological polishing solution, wherein the electrolytic-force rheological polishing solution is filled in a polishing groove of the electrolytic-force rheological polishing machine, the polishing machine rotationally drives the polishing groove and drives the polishing solution and a workpiece to move relatively, and the electrolytic power supply can electrolyze the workpiece during polishing; the detection end of the conductivity detection module is positioned in the electrolytic-mechanical rheological polishing solution, the purified water filling module is positioned at the side edge of the electrolytic-mechanical rheological polishing machine, and the conductivity detection module and the purified water filling module are both connected with the feedback control device. The utility model discloses it is stable to keep the moisture percentage of electrolysis-power rheological polishing solution in polishing process, and the rheological property and the electric conductive property of the accurate regulation and control power rheological polishing solution of initiative ensure that polishing performance is stable in the course of the work, realizes the super precision machining of complicated curved surface.
Description
Technical Field
The utility model belongs to ultra-precision machining field relates to an electrolytic force rheology burnishing device based on conductivity regulation and control polishing solution performance to the conductivity of real-time supervision electrolysis-power rheology polishing solution is the foundation, adjusts the moisture percentage of electrolysis-power rheology polishing solution, with electric conductive property and the rheology of accurate regulation and control electrolysis-power rheology polishing solution, and the effect is got rid of with machinery to the electrochemical action in the guarantee polishing process balance, realizes that complicated curved surface is green, stable, high-efficient, high quality processing.
Background
In recent years, with the rapid development of world economy, scientific technology is continuously making new progress and breakthrough, the surface shapes of various scientific and technical products are also gradually developed to curved surfaces and even complex curved surfaces, and the difficulty of ultra-precision machining is further increased. Complex curved surfaces formed by multi-curvature curved surfaces have become the working surfaces of industrial products and parts thereof in the fields of vehicle transportation, navigation, aerospace, energy, molds, medical appliances and the like. For example, the impeller of an aircraft engine usually adopts a complex variable curvature cross section design to maintain stable airflow, reduce airflow energy loss, and improve work efficiency, such as flat blades, narrow blades with circular arcs, circular blades with circular arcs, flat curved backward blades, and the like. And the defects on the surface of the blade can cause the problems of airflow disturbance, heat productivity increase, thrust reduction and the like, and the development of the aerospace technology in China is severely restricted. The ultra-precision polishing is used as the last process of the machining of the precise complex curved surface part, directly determines the geometric precision and the shape error of the part, and is the key for determining the quality and the service life of the part. Therefore, how to improve the polishing quality of the complex curved surface and realize high-precision processing of the complex curved surface becomes a problem to be solved urgently.
At present, technologies for complex curved surface processing and development mainly comprise magnetorheological polishing, electrolytic polishing, shearing thickening polishing and the like, and various polishing technologies are briefly introduced as follows:
1) and (6) magnetorheological polishing. The magnetorheological polishing is one of magnetic field assisted polishing, and the workpieces are polished by utilizing the rheological property of the magnetorheological fluid in a magnetic field. When the magnetorheological fluid on the polishing wheel is conveyed to the vicinity of a small gap formed between the workpiece and the polishing wheel, the polishing fluid forms a flexible fixed abrasive tool, and a large shearing force is generated on the contact area of the surface of the workpiece, so that the surface material of the workpiece is removed. However, magnetorheological polishing cannot process magnetic metals, and magnetorheological polishing equipment and processing liquid are expensive and not suitable for large-scale processing.
2) And (4) electrolytic polishing. The metal workpiece is used as an anode, electrolysis is carried out in a proper electrolyte, and the current density of burrs and raised parts on the surface of the workpiece is high and the corresponding dissolution speed is high due to the spike effect of the current, so that the effect of flattening and polishing is achieved. But the electrolytic polishing completely depends on electrolytic dissolution, and the removal efficiency is low. Meanwhile, the surface form precision in the polishing process cannot be guaranteed.
3) And (5) shearing, thickening and polishing. In the shearing thickening polishing process, a workpiece and the shearing thickening liquid move relatively, the contact part of the shearing thickening liquid and the workpiece is sheared to generate a shearing thickening phenomenon, the viscosity of the shearing thickening liquid in the contact area is increased, the intermolecular structure is changed to present a solid-like property, the holding effect of solid particles on abrasive particles is enhanced, a shearing layer is formed, and the abrasive material generates a micro-cutting effect on the micro-protrusions on the surface of the workpiece to remove the workpiece material so as to achieve the polishing effect. At present, the processing efficiency and surface integrity of shear thickening polishing need to be improved.
The applicant filed a team for utility model patent 1: the publication No. CN104191340A discloses a common two-electrode electrolytic mechanical polishing method, which uses a novel device to realize workpiece processing through the synergistic effect of electrolysis and shear thickening effect, but has the inevitable defects: 1) the device can not judge the rheological property and the conductivity of the electrolytic-mechanical rheological polishing solution in real time. 2) During the polishing process, a large amount of heat is generated along with the continuous friction action of the polishing solution and a workpiece, so that a large amount of purified water in the polishing solution is evaporated, the conductivity of the polishing solution is reduced, and the electrolytic action is weakened. 3) Along with the evaporation of the purified water, the rheological property of the polishing solution is improved, the mechanical removal effect is enhanced, the electrochemical reaction rate and the mechanical removal effect are not cooperated, and the surface quality of a polished workpiece is low.
Therefore, it is urgently needed to develop a new electro-rheological polishing liquid-controlled ultra-precision machining technology to realize green, high-stability and high-efficiency polishing of complex curved surfaces.
Disclosure of Invention
In order to overcome the wayward problem of rheological property and electric conductive property of present electrolysis-power rheological polishing in-process polishing solution, the utility model provides an electrolysis-power rheological polishing device based on conductivity regulation and control polishing solution performance has introduced polishing solution conductivity detection technique, judges the pure water percentage that contains in the polishing solution through the conductivity to adjust the water percentage of electrolysis-power rheological polishing solution through the automatic filling device of pure water, thereby realize polishing the accurate regulation and control of electric conductive property and rheological property of electrolysis-power rheological polishing solution in the process, the guarantee device polishing performance is stable in the course of the work.
The utility model provides a technical scheme that its technical problem adopted is:
an electrolytic force rheological polishing device for regulating and controlling the performance of polishing solution based on conductivity comprises a conductivity detection module, a purified water filling module, a feedback control device, an electrolytic power supply, an electrolytic-force rheological polishing machine and an electrolytic-force rheological polishing solution, wherein the electrolytic-force rheological polishing solution is filled in a polishing tank of the electrolytic-force rheological polishing machine, the polishing machine rotationally drives the polishing tank and drives the polishing solution and a workpiece to move relatively, the electrolytic power supply can electrolyze the workpiece during polishing, and an electrochemical reaction layer easy to remove is generated on the surface of the workpiece; the electrolytic-mechanical rheological polishing solution can generate a mechanical removal effect on an electrochemical reaction layer on the surface of a workpiece;
the detection end of the conductivity detection module is positioned in the electrolytic-mechanical rheological polishing solution, the purified water filling module is positioned on the side edge of the electrolytic-mechanical rheological polishing machine, and the conductivity detection module and the purified water filling module are both connected with the feedback control device.
Further, the conductivity detection module comprises a conductivity electrode probe, a conductivity parameter analyzer and a conductivity transmission data line; the conductivity meter electrode probe is installed on the electrolytic-mechanical rheological polishing machine, the conductivity meter electrode probe is inserted into the electrolytic-mechanical rheological polishing liquid, the conductivity meter electrode probe is connected with the conductivity parameter meter through a conductivity transmission data line, and the conductivity parameter analyzer can convert an electric signal generated by the conductivity electrode probe into conductivity data in real time.
Furthermore, the feedback control device is connected with a conductivity parameter analyzer in the conductivity detection module through a conductivity transmission data line, the feedback control device can set the target conductivity according to the self-determination, and meanwhile, the feedback control device compares the real-time conductivity with the target conductivity and generates different current or voltage signals.
The pure water filling module comprises a pure water storage device, a water pipe, a water pump, an electromagnetic valve, a pure water nozzle and a stirrer, wherein the electromagnetic valve is connected with an electric signal input port on the feedback control device through a wire, a water inlet of the pure water nozzle is connected with the pure water storage device through the water pipe, the electromagnetic valve realizes the switching of the water pump according to different current or voltage signals of the feedback control device, the filling operation of the pure water to the electrolysis-force rheological polishing solution is realized, and the water content percentage in the electrolysis-force rheological polishing solution is adjusted. Specifically, when the conductivity is too low, the electromagnetic valve controls the water pump to be opened, the water pump carries out one-time purified water filling operation, the filling amount of the purified water is 0.1-10 ml each time, and the purified water and the electrolytic-mechanical rheological polishing solution are uniformly stirred by the stirrer.
The utility model discloses in, to the material characteristic of different polishing work pieces, according to the electrolysis-power rheological polishing solution water content percentage that the conductivity initiative regulation and control is applicable to this work piece material characteristic, make the electrolysis in the polishing process and the balance of material machinery removal effect to the rheological property and the electric conductive property of the electrolysis-power rheological polishing solution in the guarantee polishing process are stable, realize that polishing process parameters are stable controllable.
The beneficial effects of the utility model are that:
1. and a conductivity detection module is introduced, the water content percentage of the electrolytic-mechanical rheological polishing solution is judged in real time through the conductivity, and the rheological property and the conductivity of the electrolytic-mechanical rheological polishing solution are actively regulated and controlled by utilizing a feedback control device and a purified water filling module.
2. Aiming at the characteristics of materials of different polishing workpieces, the water content percentage of the polishing solution suitable for the characteristics of the materials of the workpieces is actively regulated and controlled according to the conductivity, so that the electrolysis effect and the material mechanical removal effect are balanced in the polishing process.
3. Purified water is supplemented in time through the purified water filling module, and the change of the performance of the electrolytic-mechanical rheological polishing solution caused by the evaporation of the purified water in the polishing process is avoided, so that the stability and controllability of polishing technological parameters in the polishing process are guaranteed.
4. The addition of purified water can lower the temperature of the electro-rheological polishing solution and weaken the influence of temperature rise on the reduction of the rheological property of the electro-rheological polishing solution.
Drawings
FIG. 1 is a schematic view of a polishing apparatus according to the present invention;
fig. 2 is a schematic diagram of a conductivity module of the present invention;
fig. 3 is a schematic view of the purified water filling module of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings.
Referring to fig. 1 to 3, an electrolytic rheological polishing device for regulating and controlling the performance of a polishing solution based on conductivity comprises a conductivity detection module 1, a purified water filling module 2, a feedback control device 3, an electrolytic power supply 4, an electrolytic-mechanical rheological polishing machine 5 and an electrolytic-mechanical rheological polishing solution 6, wherein the electrolytic-mechanical rheological polishing solution 6 is filled in a polishing tank 5.1 of the electrolytic-mechanical rheological polishing machine 5, and the polishing tank 5 rotationally drives the polishing tank 5.1 and drives the polishing solution 6 and a workpiece 7 to generate relative motion; the electrolytic power supply 4 can electrolyze the workpiece 7 during polishing, and an electrochemical reaction layer which is easy to remove is generated on the surface of the workpiece 7; the electrolytic-mechanical rheological polishing solution 6 can generate a mechanical removal effect on an electrochemical reaction layer on the surface of the workpiece 7;
the detection end of the conductivity detection module 1 is positioned in the electrolysis-mechanical rheological polishing solution 6, the purified water filling module 2 is positioned at the side edge of the electrolysis-mechanical rheological polishing machine 5, and the conductivity detection module 1 and the purified water filling module 2 are both connected with the feedback control device 3.
The electrolytic-force rheological polishing solution 6 comprises a non-Newtonian fluid with force rheological effect, purified water, abrasive particles and an electrolyte, and the electrolytic-force rheological polishing solution comprises the non-Newtonian fluid with force rheological effect, the purified water, the abrasive particles and the electrolyte, and the components in percentage by mass are as follows: 20-90% of non-Newtonian fluid, 1-50% of purified water, 2-30% of abrasive particles and 0.1-10% of electrolyte.
The non-Newtonian fluid having a force rheological effect includes, but is not limited to, a solution of a polyhydroxy polymer.
The abrasive particles include, but are not limited to, one or a combination of more than one of diamond, ceria, silica, and alumina.
The electrolyte comprises one or more of sodium sulfate, potassium chloride, sodium bicarbonate and the like, and the content of the electrolyte is 0.1-10%.
The percentage of water in the electrorheological polishing solution 6 directly affects the rheological properties of the electrorheological polishing solution. Specifically, during the polishing process, due to the evaporation and dissipation of water in the electrolytic-mechanical rheological polishing solution 6, the percentage of water contained in the electrolytic-mechanical rheological polishing solution 6 is reduced, and the rheological property and the conductivity of the electrolytic-mechanical rheological polishing solution 6 are affected. The lower the water content of the electrolytic-mechanical rheological polishing solution 6 is, the worse the rheological property and the electrical conductivity are.
Example (c): selecting a polyhydroxy polymer solution as a non-Newtonian fluid with a force rheological effect, wherein the content is 79%; the content of purified water is 10%; the abrasive particles are selected to have 10 percent of silicon dioxide content; electrolytes include, but are not limited to, sodium sulfate, at a 1% level.
Further, the conductivity detection module 1 comprises a conductivity electrode probe 1.1, a conductivity parameter analyzer 1.2 and a conductivity transmission data line 1.3; the conductivity meter electrode probe 1.1 is arranged on the electrolysis-force rheological polishing machine 5, and the conductivity meter electrode probe 1.1 is inserted into the electrolysis-force rheological polishing solution 6. The conductivity meter electrode probe 1.1 is connected with the conductivity parameter meter 1.2 through a conductivity transmission data line 1.3. The conductivity parameter analyzer 1.2 can convert the electric signals generated by the conductivity electrode probe 1.1 into conductivity data in real time.
Further, the feedback control device 3 is connected with a conductivity 1.2 parameter analyzer in the conductivity detection module 1 through a conductivity transmission data line 1.4. The feedback control device 3 can set the target conductivity according to the self-determination, and meanwhile, the feedback control device 3 compares the real-time conductivity with the target conductivity and generates different current or voltage signals.
Furthermore, the purified water filling module 2 comprises a purified water storage 2.1, a water pipe 2.2, a water pump 2.3, an electromagnetic valve 2.4, a purified water nozzle 2.5 and a stirrer 2.6. The electromagnetic valve 2.4 is connected with an electric signal input port on the feedback control device through a lead 1.5, and a water inlet of the purified water nozzle 2.5 is connected with a purified water storage 2.1 through a water pipe 2.2. The electromagnetic valve 2.4 realizes the switching on and off of the water pump 2.3 according to different current or voltage signals of the feedback control device, realizes the filling operation of purified water to the electrolysis-mechanical rheological polishing solution 6, and adjusts the water content percentage in the electrolysis-mechanical rheological polishing solution. Specifically, when the conductivity is too low, the electromagnetic valve 2.4 controls the water pump 2.3 to be opened, the water pump 2.3 carries out the operation of filling purified water once, the filling amount of the purified water is 0.1-10 ml each time, and the purified water and the electrolytic-mechanical rheological polishing solution 6 are uniformly stirred by the stirrer 2.6.
Furthermore, aiming at the material characteristics of different polishing workpieces 7, the water content percentage of the electrolytic-mechanical rheological polishing solution 6 suitable for the material characteristics of the workpieces is actively regulated and controlled according to the conductivity, so that the electrolytic action and the mechanical removal action of the materials are balanced in the polishing process, the rheological property and the conductivity of the electrolytic-mechanical rheological polishing solution 6 in the polishing process are stable, and the stable and controllable polishing process parameters are realized.
It will be appreciated by those of ordinary skill in the art that the embodiments described herein are intended to assist the reader in understanding the principles of the invention, and it is to be understood that the scope of the invention is not limited to such specific statements and embodiments. Those skilled in the art can make various other specific modifications and combinations based on the teachings of the present invention without departing from the spirit of the invention, and such modifications and combinations are still within the scope of the invention.
Claims (4)
1. An electrolytic force rheological polishing device for regulating and controlling the performance of polishing solution based on conductivity is characterized by comprising a conductivity detection module, a purified water filling module, a feedback control device, an electrolytic power supply, an electrolytic-force rheological polishing machine and an electrolytic-force rheological polishing solution, wherein the electrolytic-force rheological polishing solution is filled in a polishing tank of the electrolytic-force rheological polishing machine, the polishing machine rotationally drives the polishing tank and drives the polishing solution and a workpiece to generate relative motion, the electrolytic power supply can electrolyze the workpiece during polishing, and an electrochemical reaction layer which is easy to remove is generated on the surface of the workpiece; the electrolytic-mechanical rheological polishing solution can generate a mechanical removal effect on an electrochemical reaction layer on the surface of a workpiece;
the detection end of the conductivity detection module is positioned in the electrolytic-mechanical rheological polishing solution, the purified water filling module is positioned on the side edge of the electrolytic-mechanical rheological polishing machine, and the conductivity detection module and the purified water filling module are both connected with the feedback control device.
2. The electro-hydrodynamic rheological polishing device for regulating the performance of polishing fluid based on conductivity as claimed in claim 1, wherein the conductivity detection module comprises a conductivity electrode probe, a conductivity parameter analyzer, a conductivity transmission data line; the conductivity meter electrode probe is installed on the electrolytic-mechanical rheological polishing machine, the conductivity meter electrode probe is inserted into the electrolytic-mechanical rheological polishing liquid, the conductivity meter electrode probe is connected with the conductivity parameter meter through a conductivity transmission data line, and the conductivity parameter analyzer can convert an electric signal generated by the conductivity electrode probe into conductivity data in real time.
3. The electro-hydrodynamic polishing apparatus according to claim 1 or 2, wherein the feedback control device is connected to the conductivity parameter analyzer of the conductivity detection module via a conductivity transmission data line, and the feedback control device can set a target conductivity according to its own initiative, and simultaneously, the feedback control device compares the real-time conductivity with the target conductivity and generates different current or voltage signals.
4. The electro-mechanical rheological polishing device based on conductivity-controlled polishing solution performance of claim 1 or 2, wherein the purified water filling module comprises a purified water storage, a water pipe, a water pump, an electromagnetic valve, a purified water nozzle and a stirrer, the electromagnetic valve is connected with the electric signal input port on the feedback control device through a lead, the water inlet of the purified water nozzle is connected with the purified water storage through the water pipe, the electromagnetic valve realizes the switching of the water pump according to different current or voltage signals of the feedback control device, the filling operation of purified water to the electro-mechanical rheological polishing solution is realized, and the water content percentage of the electro-mechanical rheological polishing solution is adjusted.
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| CN202120522803.9U CN215201009U (en) | 2021-03-12 | 2021-03-12 | Electrolytic force rheology burnishing device based on conductivity regulation and control polishing solution performance |
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| CN202120522803.9U CN215201009U (en) | 2021-03-12 | 2021-03-12 | Electrolytic force rheology burnishing device based on conductivity regulation and control polishing solution performance |
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