CN215187988U - Heat dissipation module for mobile terminal chip and mobile terminal - Google Patents
Heat dissipation module for mobile terminal chip and mobile terminal Download PDFInfo
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- CN215187988U CN215187988U CN202120871438.2U CN202120871438U CN215187988U CN 215187988 U CN215187988 U CN 215187988U CN 202120871438 U CN202120871438 U CN 202120871438U CN 215187988 U CN215187988 U CN 215187988U
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Abstract
The utility model is suitable for a mobile phone technology field provides a heat dissipation module and mobile terminal for mobile terminal chip, the chip sets up on the mainboard, the chip periphery is provided with the shield cover, heat dissipation module includes: the heat dissipation film covers the shielding case and covers the chip, and a chip cavity is enclosed by the heat dissipation film, the shielding case and the mainboard; atomizing component, atomizing component is used for producing atomizing steam, atomizing component with be provided with first cavity component between the heat dissipation film and form first cavity, the steam that atomizing component produced can get into first cavity and attach the heat dissipation film surface, first cavity is provided with air inlet and gas vent. The heat dissipation module of the embodiment can improve the heat dissipation efficiency of the mobile terminal.
Description
Technical Field
The utility model belongs to the technical field of mobile terminal, especially, relate to a heat dissipation module and mobile terminal for mobile terminal chip.
Background
At present, mobile communication tools or handheld intelligent devices and other mobile terminals, such as mobile phones, are taken as examples, the heat dissipation technology of mobile phones mainly transfers heat generated by a chip to the surface of the shell of the mobile phone through media or media such as heat conducting gel, graphite heat dissipation fins, metal heat dissipation back plates, heat dissipation tubes and the like, and then transfers the heat to the environment around the mobile phone through natural radiation, so as to achieve the purpose of cooling the mobile phone.
However, the smart phones currently on the market generally still have the persistent problem of high temperature rise when being used by users. Especially, when a user simultaneously starts various high-power-consumption application programs, the chip runs under high load for a long time, or the mobile phone is used in summer or under the condition of high ambient temperature, so that the heat generated by the mobile phone can be increased or the rate of heat dissipation outwards can be reduced. The frequency of the processor is reduced due to the overhigh temperature, the mobile phone is jammed, the surface temperature of the touch screen or the shell is high, the use experience of a user is reduced, and sometimes even the normal work requirement of the user cannot be met. Meanwhile, the mobile phone runs at a higher temperature for a long time, the aging failure rate of parts of the mobile phone is increased, and the service life of the whole mobile phone is shortened.
Therefore, there is a need to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An embodiment of the utility model provides a heat dissipation module and mobile terminal for mobile terminal chip aims at solving above-mentioned technical problem.
The embodiment of the utility model provides a realize like this, a heat dissipation module for mobile terminal chip, the chip sets up on the mainboard, the chip periphery is provided with the shield cover, heat dissipation module includes:
the heat dissipation film covers the shielding case and covers the chip, and a chip cavity is enclosed by the heat dissipation film, the shielding case and the mainboard;
atomizing component, atomizing component is used for producing atomizing steam, atomizing component with be provided with first cavity component between the heat dissipation film and form first cavity, the steam that atomizing component produced can get into first cavity and attach the heat dissipation film surface, first cavity is provided with air inlet and gas vent.
Furthermore, the chip cavity is provided with a bidirectional air extraction opening, and when air is extracted, the heat dissipation film can be attached to the surface of the chip under the action of air pressure.
Furthermore, the atomization assembly comprises a second cavity component and is provided with a second cavity corresponding to the first cavity, an ultrasonic atomization module is arranged in the second cavity, the second cavity is provided with a water inlet and a water outlet, a waterproof breathable film is arranged between the second cavity and the first cavity, and water vapor can penetrate through the waterproof breathable film.
Furthermore, the first cavity member and the second cavity member are of an integral structure, and the first cavity member is connected to the shielding cover and sealed through a first sealing ring.
Furthermore, the second cavity is larger than the first cavity so as to be arranged in a step shape, and the waterproof breathable film is arranged on the step surface of the second cavity relative to the first cavity.
Furthermore, a through hole is formed in the bottom wall of the second cavity member opposite to the waterproof breathable film, the ultrasonic atomization module comprises an ultrasonic tool head arranged in the second cavity and attached to the bottom wall, an ultrasonic horn arranged on the through hole and connected with the ultrasonic tool head, and an ultrasonic transducer arranged on the ultrasonic horn, and the ultrasonic transducer is provided with an interface connected with an ultrasonic sound generator.
Furthermore, the inner surface of the bottom wall is provided with a waterproof groove, a second sealing ring is arranged in the waterproof groove, and the ultrasonic tool head and the bottom wall are sealed through the second sealing ring.
Furthermore, the air inlet and/or the air outlet are obliquely arranged towards the direction of the heat dissipation film adjacent to the hole axis of the first cavity part.
Further, the air inlet and/or the air outlet are arranged at an angle of 40-50 degrees.
The utility model discloses still provide a mobile terminal simultaneously, include: the mainboard, set up chip on the mainboard, set up in the shield cover of chip periphery and set up in cover on the shield cover the heat dissipation module of chip, wherein, the heat dissipation module be above-mentioned arbitrary heat dissipation module.
Compared with the prior art, the embodiment of the utility model provides an in, when the chip on the mainboard is in high-power consumption running state and leads to giving out heat when increasing, accessible atomizing component atomizing produces steam to attach the surface of heat dissipation film and near formation cold fog droplet, the heat on the heat dissipation film can be absorbed to cold fog droplet, the steam content of first cavity also increases simultaneously, gas flow through air inlet and gas vent can be with on the heat dissipation film and near the fog droplet discharge outside the heat dissipation module, thereby realize the cooling of chip. Compared with the traditional heat conduction heat dissipation or water cooling heat dissipation mode, the heat dissipation efficiency of the embodiment is higher, and meanwhile, the requirement on space is lower.
In another embodiment, when the heat productivity of the chip on the main board is not large, the heat dissipation can be performed by air flowing to the chip cavity and/or the first cavity, so as to reduce the energy consumption of the terminal.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic view illustrating a structure and an operating state of a heat dissipation module according to an embodiment of the present invention;
fig. 2 is a schematic view illustrating a structure and a non-operating state of a heat dissipation module according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of gas extraction from the chip chamber according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating a heat dissipation module in a mobile terminal according to an embodiment of the present invention.
The reference numbers illustrate:
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-4, the utility model provides a heat dissipation module for mobile terminal chip, chip 112 sets up on mainboard 111, chip 112 periphery is provided with shield 108, heat dissipation module includes: a heat sink film 110 and an atomizing assembly 16.
The heat dissipation film 110 covers the shielding case 108 and covers the chip 112, and the heat dissipation film 110, the shielding case 108 and the motherboard 111 enclose a chip cavity 120; the atomization assembly 16 is used for generating atomized water vapor, a first cavity member 131 is arranged between the atomization assembly 16 and the heat dissipation film 110 to form a first cavity 130, the water vapor generated by the atomization assembly 16 can enter the first cavity 130 and attach to the surface of the heat dissipation film 110, and the first cavity 130 is provided with an air inlet and an air outlet.
In one embodiment, when the chip 112 on the motherboard 111 is in a high power consumption operating state and the heat generation amount is increased, the atomizing assembly atomizes the generated water vapor and attaches the generated water vapor to the surface of the heat dissipation film 110 and the vicinity thereof to form cold mist droplets, the cold mist droplets can absorb the heat on the heat dissipation film 110, the water vapor content of the first cavity 130 is increased, and the air flowing through the air inlet and the air outlet can discharge the mist droplets on the heat dissipation film 110 and the vicinity thereof to the outside of the heat dissipation module, thereby reducing the temperature of the chip 112. Compared with the traditional heat conduction heat dissipation or water cooling heat dissipation mode, the heat dissipation efficiency of the embodiment is higher, and meanwhile, the requirement on space is lower.
In one embodiment, the heat dissipation film 110 may be made of a material with high heat conduction efficiency, such as a graphene heat dissipation film, or may be a copper heat dissipation film.
In one embodiment, as a further improvement, the chip chamber 120 is provided with a bidirectional pumping port, and the bidirectional pumping port is connected to a pumping pump (not shown), which may be a bidirectional quantitative air pump or other types. When the air pump is operated, the heat dissipation film 110 can be attached to the surface of the chip 112 under the action of air pressure. Specifically, when the atomizing assembly 16 operates, in order to improve the heat conduction efficiency of the heat dissipation film 110, the chip cavity 120 is evacuated through the two-way exhaust opening, so that the heat dissipation film is attached to the surface of the chip 112 under the action of air pressure. After the water vapor forms cold mist on the surface of the heat dissipation film 110, a large amount of heat on the heat dissipation film 110 can be absorbed. Thereby improving the overall heat dissipation efficiency. When the air pump does not work, the two-way air pumping port can be in a closed state.
In addition, when the heat generation amount of the chip 112 is small, the heat dissipation can be achieved by performing air flow heat dissipation on the chip cavity 120 and/or the first cavity 130, specifically, air flow is achieved by performing air intake and exhaust through the bidirectional air intake or the air intake and the air exhaust, so that the heat dissipation of the chip 112 under low power consumption is achieved, and meanwhile, the atomizing assembly 16 is not needed to work in this way, so that the energy consumption of the terminal is reduced.
In one embodiment, the atomizing assembly 16 includes a second chamber member 104 and has a second chamber 140 corresponding to the first chamber 130, the second chamber 140 has an ultrasonic atomizing module disposed therein, the second chamber has a water inlet and a water outlet, and when in use, the second chamber 140 is filled with cold water or other liquid capable of being atomized (in this embodiment, cold deionized water) through the water inlet and can discharge the liquid through the water outlet. A waterproof and breathable film 106 is disposed between the second cavity 140 and the first cavity 130, and the waterproof and breathable film 106 is permeable to water vapor but impermeable to liquid water. As an implementation, the waterproof breathable film 106 may be a waterproof highly moisture-permeable nano-film.
In one embodiment, the first cavity member 131 and the second cavity member 104 are an integral structure, and are formed by a metal material through a casting process or a sheet metal bending process, the first cavity member 131 is connected to the shield 108 and sealed by the first sealing ring 109, and a sealing groove for accommodating the first sealing ring 109 is formed on a connection surface of the first cavity member 131 and the shield 108. The first cavity member 131 and the shielding cover 108 may be connected by bonding foam 107, the shielding cover 108 and the motherboard 111 may be welded by using an smt (surface Mounting technology) process, and a welding surface between the shielding cover 108 and the motherboard 111 is in a sealed welding relationship.
In one embodiment, the second cavity 140 is larger than the first cavity 130 so as to form a step therebetween, and the waterproof and breathable film 106 is disposed on a stepped surface of the second cavity 140 opposite to the first cavity, so that the waterproof and breathable film 106 has a sufficient bonding surface.
In one embodiment, a through hole 116 is disposed on a bottom wall of the second cavity member 104 opposite to the waterproof breathable film 106, the ultrasonic atomization module includes an ultrasonic tool head 113 disposed in the second cavity 140 and attached to the bottom wall (not shown), an ultrasonic horn 103 disposed on the through hole 116 and connected to the ultrasonic tool head 113, and an ultrasonic transducer 102 disposed on the ultrasonic horn 103, and the ultrasonic transducer 102 is provided with an interface (not shown) connected to an ultrasonic generator and connected to the ultrasonic generator 115 through a lead 101.
Furthermore, a waterproof groove (not marked in the figure) is formed in the inner surface of the bottom wall, a second sealing ring 105 is arranged in the waterproof groove, the ultrasonic tool head 113 and the bottom wall are sealed through the second sealing ring 105, and the surface of the ultrasonic tool head 113, which is in contact with the bottom wall, is also provided with the waterproof groove. By providing the second sealing ring 105, leakage of the liquid in the second cavity 140 can be avoided.
In one embodiment, as shown in fig. 1 and 2, the air inlet and/or the air outlet are disposed in an inclined manner toward the heat dissipation film 110 adjacent to the hole axis of the first cavity 130. This prevents moisture generated by the atomizing assembly 16 from directly entering the inlet or the outlet, and reduces the chance of the moisture contacting the heat dissipation film 110. Further, the angle at which the air inlet and/or the air outlet are obliquely arranged is 40 to 50 °, and the preferred embodiment is 45 °.
In one embodiment, the height of the shielding can 108 is lower than the height of the chip 112, the first cavity member 131 is adhered to the shielding can 108 through the adhesive foam 107 and sealed by the first sealing ring 109, and the heat dissipation film 110 is disposed on the first cavity member 131 at a position lower than the height of the chip 112. Since the chip cavity 120 is surrounded by the heat dissipation film 110, the shield can 108 and the main board 111, the opening of the chip cavity 120 and the bi-directional pumping hole are located on the surface opposite to the shield can 108, and thus, there is a gap between the connection surface of the shield can 108 and the first cavity member 131. Meanwhile, the bidirectional pumping ports are arranged in an L shape, so that the processing at the first cavity member 131 is easier.
In one embodiment, the working process of the heat dissipation module is as follows:
fig. 1 is a schematic diagram illustrating a working state of the heat dissipation module in this embodiment, and fig. 2 is a schematic diagram illustrating a state of the heat dissipation module in this embodiment when the heat dissipation module is not in operation. As shown in fig. 2, when the mobile phone is not in the working state, due to the different placement directions of the mobile phone and the weight of the mobile phone, the graphene heat dissipation film 110 may not be completely in contact with the chip 112, and may be partially or at a certain distance from the chip 112. As shown in fig. 1, in an operating state, air in the chip cavity 120 is pumped out by a suction pump (not shown) connected to the bidirectional suction port, so that the graphene heat dissipation film 110 can be tightly attached to the wall surface of the chip 112. The heat generated by the chip 112 during operation is thus effectively conducted to the heat dissipation film 110.
As shown in fig. 3, the gas is exhausted from the chip chamber 120 through a bidirectional pumping port by a pumping pump, as indicated by the chain of arrows.
As shown in fig. 1, when the chip 112 needs to dissipate heat, that is, the chip 112 starts to operate or the chip 112 is in a working condition requiring heat dissipation due to an excessively high operating temperature, the ultrasonic generator 115 transmits a set electrical signal to the ultrasonic transducer 102, and the ultrasonic transducer 102 converts the electrical signal into high-frequency micro-amplitude mechanical vibration. Then, the ultrasonic horn 2 amplifies the amplitude of the ultrasonic transducer 5. The amplified amplitude atomizes the cold deionized water 114 in the second cavity 140 by ultrasonic cavitation, and the water vapor enters the first cavity 130 through the waterproof breathable film 106, so that a large amount of fine cold mist drops are densely sprayed on and near the graphene heat dissipation film 110. The cold fog absorbs heat in the graphene heat dissipation film 110, so that heat of the chip 112 can be dissipated quickly.
By means of an external steam exhaust device (not shown in the figure), the fine mist droplets on the heat dissipation film 110 and the vicinity thereof are exhausted outside the device through the steam exhaust port formed on the first cavity member 131 of the first cavity 130, thereby achieving the purpose of circulating heat dissipation.
As described above, the fine cold droplets generated in the second cavity 140 are continuously sprayed onto the graphene heat dissipation film 110 and the vicinity thereof, and continuously absorb the heat conducted from the chip 112 to the heat dissipation film 110, and then the droplets on the heat dissipation film 110 and the vicinity thereof are discharged out of the heat dissipation module through the steam discharge hole. The heat dissipation module continuously operates, and heat generated by the chip 112 of the main board 111 is continuously discharged, so that the chip 112 is finally cooled, and the problem that the operation speed of the chip 112 is not weakened due to the fact that the temperature is greatly increased is avoided.
The utility model discloses still provide a mobile terminal simultaneously, include: the heat dissipation module includes a main board 111, a chip (not shown) disposed on the main board, a shielding cover 108 disposed on the periphery of the chip, and a heat dissipation module 200 disposed on the shielding cover 108 and covering the chip, wherein the heat dissipation module is the heat dissipation module according to the first embodiment.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a heat dissipation module for mobile terminal chip, the chip sets up on the mainboard, the chip periphery is provided with the shield cover, its characterized in that, heat dissipation module includes:
the heat dissipation film covers the shielding case and covers the chip, and a chip cavity is enclosed by the heat dissipation film, the shielding case and the mainboard;
atomizing component, atomizing component is used for producing atomizing steam, atomizing component with be provided with first cavity component between the heat dissipation film and form first cavity, the steam that atomizing component produced can get into first cavity and attach the heat dissipation film surface, first cavity is provided with air inlet and gas vent.
2. The heat dissipation module for a mobile terminal chip as claimed in claim 1, wherein the chip cavity is provided with a bi-directional pumping hole, so that the heat dissipation film can be attached to the chip surface under the action of air pressure when pumping air.
3. The heat dissipation module for a mobile terminal chip according to claim 2, wherein the atomizing assembly comprises a second cavity member and has a second cavity corresponding to the first cavity, the second cavity has an ultrasonic atomizing module disposed therein, the second cavity has a water inlet and a water outlet, and a waterproof and air-permeable film is disposed between the second cavity and the first cavity, and the waterproof and air-permeable film is permeable to water vapor.
4. The heat dissipation module for a mobile terminal chip as claimed in claim 3, wherein the first cavity member and the second cavity member are a unitary structure, and the first cavity member is connected to the shield case and sealed by a first sealing ring.
5. The heat dissipation module for a mobile terminal chip according to claim 4, wherein the second cavity is larger than the first cavity so as to form a step therebetween, and the waterproof and air-permeable film is disposed on a step surface of the second cavity opposite to the first cavity.
6. The heat dissipation module for a mobile terminal chip according to claim 3, wherein a through hole is formed in a bottom wall of the second cavity member opposite to the waterproof and breathable film, the ultrasonic atomization module comprises an ultrasonic tool head disposed in the second cavity and attached to the bottom wall, an ultrasonic horn disposed on the through hole and connected to the ultrasonic tool head, and an ultrasonic transducer disposed on the ultrasonic horn, and the ultrasonic transducer is provided with an interface connected to an ultrasonic sound generator.
7. The heat dissipation module for a mobile terminal chip according to claim 6, wherein the bottom wall has a waterproof groove formed on an inner surface thereof, and a second sealing ring is disposed in the waterproof groove, and the ultrasonic tool head and the bottom wall are sealed by the second sealing ring.
8. The heat dissipation module for mobile terminal chips as defined in claim 7, wherein the air inlet and/or the air outlet are disposed adjacent to the hole axis of the first cavity portion and inclined toward the heat dissipation film.
9. The heat dissipation module for a mobile terminal chip according to claim 1, wherein the air inlet and/or the air outlet are disposed at an angle of 40-50 ° in an inclined manner.
10. A mobile terminal, comprising: the heat dissipation module comprises a mainboard, a chip arranged on the mainboard, a shielding case arranged on the periphery of the chip, and a heat dissipation module arranged on the shielding case and covering the chip, wherein the heat dissipation module is the heat dissipation module in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120871438.2U CN215187988U (en) | 2021-04-26 | 2021-04-26 | Heat dissipation module for mobile terminal chip and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120871438.2U CN215187988U (en) | 2021-04-26 | 2021-04-26 | Heat dissipation module for mobile terminal chip and mobile terminal |
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| Publication Number | Publication Date |
|---|---|
| CN215187988U true CN215187988U (en) | 2021-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120871438.2U Active CN215187988U (en) | 2021-04-26 | 2021-04-26 | Heat dissipation module for mobile terminal chip and mobile terminal |
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| Country | Link |
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| CN (1) | CN215187988U (en) |
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- 2021-04-26 CN CN202120871438.2U patent/CN215187988U/en active Active
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