CN210928448U - High thermal conductivity and high thermal shock resistance water cooling plate - Google Patents

High thermal conductivity and high thermal shock resistance water cooling plate Download PDF

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Publication number
CN210928448U
CN210928448U CN201921979453.8U CN201921979453U CN210928448U CN 210928448 U CN210928448 U CN 210928448U CN 201921979453 U CN201921979453 U CN 201921979453U CN 210928448 U CN210928448 U CN 210928448U
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hole
high thermal
plate body
plate
shock resistance
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CN201921979453.8U
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Chinese (zh)
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李福生
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Taizhou Baiquxing Aluminum Technology Co ltd
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Taizhou Baiquxing Aluminum Technology Co ltd
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Abstract

The utility model discloses a high thermal conductivity high thermal shock resistance water-cooling board, which comprises a plate body, the inside of plate body is opened there is the chase, the inside welding of chase has the copper pipe, the both ends of copper pipe all are located the outside of chase, the one end of copper pipe is provided with the water inlet, the other end of copper pipe is provided with the delivery port, open the both sides of plate body has through-hole one, the inside of through-hole one is equipped with the block rubber, open the inside of through-hole one has the spacing groove, the block rubber is close to spacing groove department fixedly connected with spacing collar, the apron has been placed at the top of plate body, the apron is close to through-hole one department is opened there is through-hole two, the top fixedly connected with lug of block rubber, the lug runs through-hole two and extend to the opposite side of. Has the advantages that: the plate body and the cover plate are made of aluminum nitride materials, have good thermal conductivity and small thermal expansion coefficient, have good thermal shock resistance, and are connected with each other in a clamping manner.

Description

High thermal conductivity and high thermal shock resistance water cooling plate
Technical Field
The utility model relates to a water-cooling board technical field particularly, relates to a high thermal conductivity high thermal shock resistance water-cooling board.
Background
Along with the continuous development of scientific and technological, nowadays the kind of electronic instrument is more and more, the volume also is reducing continuously, internals is also more and more compact, but the gap between the electron device is littleer and more, the heat that its produced also is difficult for giving off, consequently need corresponding heat abstractor to dispel the heat to these instruments, the radiating mode has two kinds of water-cooling and forced air cooling usually, the water-cooling board just adopts water-cooled heat abstractor, the water-cooling board has smallly, light in weight, characteristics such as radiating efficiency height, but adopt the welding between present water-cooling board apron and the plate body usually, not only inconvenient subsequent dismantlement, also can cause great pollution.
An effective solution to the problems in the related art has not been proposed yet.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat conduction high heat resistance impact water-cooling board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-thermal-conductivity high-thermal-shock-resistance water-cooling plate comprises a plate body, wherein a pipe groove is formed in the plate body, a copper pipe is welded in the pipe groove, two ends of the copper pipe are positioned outside the pipe groove, one end of the copper pipe is provided with a water inlet, the other end of the copper pipe is provided with a water outlet, two sides of the plate body are provided with a first through hole, a rubber block is arranged in the first through hole, a limit groove is formed in the inner wall of the first through hole, a limit ring is fixedly connected to the position, close to the limit groove, of the rubber block, the limiting ring is positioned in the limiting groove and matched with the limiting groove, a cover plate is arranged at the top of the plate body, a second through hole is formed at the position, close to the first through hole, of the cover plate, a convex block is fixedly connected to the top of the rubber block, the top of the lug penetrates through the second through hole and extends to the other side of the cover plate, and a plurality of heat dissipation holes are formed in the outer surface of the cover plate and close to the copper pipe.
Furthermore, the top of the plate body is close to two sides of the first through hole, grooves are formed in the two sides of the first through hole, and silica gel pads are clamped inside the grooves.
Furthermore, the outer surface of the cover plate is provided with a dustproof and breathable film close to the radiating hole.
Furthermore, both ends fixedly connected with connecting strip of dustproof ventilated membrane, the connecting strip pass through the viscose with the apron bonds.
Furthermore, two sides of the plate body, which are far away from the first through hole, are provided with a first mounting hole, two sides of the cover plate, which are far away from the second through hole, are provided with a second mounting hole, and the first mounting hole is matched with the second mounting hole.
Furthermore, one side of the convex block, which is far away from the rubber block, is provided with an arc surface.
Further, the outer surface of the rubber block is coated with high-temperature resistant paint.
Compared with the prior art, the utility model discloses following beneficial effect has:
□ 1 □, this plate body and apron adopt the aluminium nitride material, have good heat conductivity, and coefficient of thermal expansion is little, has good thermal shock resistance, and is connected through the mode of joint between apron and the plate body, reduces the welding step, reduces harmful gas's production to reduce the pollution to the environment, the subsequent dismantlement of being convenient for simultaneously.
□ 2 □, the silica gel pad in the recess plays the effect that reduces the rocking nature between apron and the plate body, and dustproof ventilated membrane has dirt-proof effect, avoids outside dust to enter into the plate body through the louvre inside, and the connecting strip is convenient for with dustproof ventilated membrane and cover connection.
□ 3 □, mounting hole one and mounting hole two are convenient for the bolt to pass, conveniently install the water-cooling board on corresponding apparatus, and the cambered surface is convenient for the lug to pass through hole two, and high temperature resistant coating can improve the high temperature resistance of block rubber, reduces the influence of high temperature to the block rubber.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a high thermal conductivity and high thermal shock resistance water-cooling plate according to an embodiment of the present invention;
fig. 2 is a schematic side view of a high thermal conductivity and high thermal shock resistance water-cooling plate according to an embodiment of the present invention;
FIG. 3 is an enlarged view at A in FIG. 2;
fig. 4 is a schematic structural diagram of a silica gel pad in a high thermal conductivity and high thermal shock resistance water-cooling plate according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a cover plate in a high thermal conductivity and high thermal shock resistance water-cooling plate according to an embodiment of the present invention.
Reference numerals:
1. a plate body; 2. a pipe groove; 3. a copper pipe; 4. a water inlet; 5. a water outlet; 6. a first through hole; 7. a rubber block; 8. a limiting groove; 9. a limiting ring; 10. a cover plate; 11. a second through hole; 12. a bump; 13. heat dissipation holes; 14. a groove; 15. a silica gel pad; 16. a dustproof and breathable film; 17. a connecting strip; 18. a first mounting hole; 19. and a second mounting hole.
Detailed Description
The following, with reference to the drawings and the detailed description, further description of the present invention is made:
in an embodiment, referring to fig. 1-5, a high thermal conductivity and high thermal shock resistance water-cooling plate according to an embodiment of the present invention includes a plate body 1, a pipe groove 2 is formed inside the plate body 1, a copper pipe 3 is welded inside the pipe groove 2, two ends of the copper pipe 3 are both located outside the pipe groove 2, one end of the copper pipe 3 is provided with a water inlet 4, and the other end of the copper pipe 3 is provided with a water outlet 5;
the plate comprises a plate body 1 and is characterized in that through holes I6 are formed in two sides of the plate body 1, rubber blocks 7 are arranged in the through holes I6, high-temperature-resistant coating is coated on the outer surfaces of the rubber blocks 7, the high-temperature resistance of the rubber blocks 7 can be improved through the high-temperature-resistant coating, the influence of high temperature on the rubber blocks 7 is reduced, limiting grooves 8 are formed in the through holes I6, limiting rings 9 are fixedly connected to the positions, close to the limiting grooves 8, of the rubber blocks 7, the limiting rings 9 are located in the limiting grooves 8 and matched with the limiting grooves 8, and it needs to be noted that the ports of the limiting rings 9 are cambered surfaces, so that the limiting rings 9 can conveniently enter the limiting;
a cover plate 10 is arranged on the top of the plate body 1, a second through hole 11 is formed in the position, close to the first through hole 6, of the cover plate 10, the top of the rubber block 7 is fixedly connected with a convex block 12, the convex block 12 penetrates through the second through hole 11 and extends to the other side of the cover plate 10, one side of the convex block 12, which is far away from the rubber block 7, is provided with a cambered surface, the cambered surface is convenient for the convex block 12 to pass through the second through hole 11, a plurality of heat dissipation holes 13 are formed on the outer surface of the cover plate 10 near the copper tube 3, a dustproof breathable film 16 is arranged on the outer surface of the cover plate 10 near the heat dissipation holes 13, the dustproof breathable film 16 has a dustproof function and prevents external dust from entering the plate body 1 through the heat dissipation holes 13, the two ends of the dustproof breathable film 16 are fixedly connected with connecting strips 17, the connecting strips 17 are adhered to the cover plate 10 through adhesive, and the connecting strips 17 are convenient for connecting the dustproof breathable film 16 with the cover plate 10;
the top of the plate body 1 is provided with grooves 14 at two sides close to the first through hole 6, the grooves 14 are clamped with silica gel pads 15, the silica gel pads 15 have certain elasticity, the silica gel pads 15 in the grooves 14 play a role in reducing the shaking between the cover plate 10 and the plate body 1, two sides of the plate body 1 far away from the first through hole 6 are provided with mounting holes 18, two sides of the cover plate 10 far away from the second through hole 11 are provided with mounting holes 19, the mounting holes 18 are matched with the mounting holes 19, when the cover plate 10 is connected with the plate body 1, the mounting holes 18 are overlapped with the mounting holes 19, and the inner diameters of the mounting holes 18 and the mounting holes 19 are larger than that of bolts, so that the bolts can pass through the mounting holes.
For the convenience of understanding the technical solution of the present invention, the following detailed description is made on the working principle or the operation mode of the present invention in the practical process.
In practical application, aluminum nitride is sintered, the plate body 1 and the cover plate 10 are manufactured by pressing and forming, it should be noted that the plate body 1 and the cover plate 10 can be processed by adopting a CNC technology, the copper pipe 3 is placed in the pipe groove 2, the copper pipe 3 is welded on the plate body 1, then the rubber block 7 is plugged into the first through hole 6, the bottom end of the rubber block 7 and the bottom of the plate body 1 are positioned on the same horizontal plane, the limiting ring 9 on the rubber block 7 enters the limiting groove 8 of the first through hole 6, the cover plate 10 is stamped on the plate body 1 by adopting a stamping instrument, the bump 12 can penetrate through the second through hole 11, the bump 12 can limit the cover plate 10 at the moment, the cover plate 10 cannot be separated from the plate body 1, the cover plate 10 is in contact with the silica gel pad 15, the sloshing performance between the cover plate 10 and the plate body 1 is reduced, then the connecting strip 17 on the dustproof breathable film 16 is bonded on, can use the bolt to pass mounting hole one 18 and mounting hole two 19, this plate body adopts the aluminium nitride material with the apron, has good heat conductivity, and coefficient of thermal expansion is little, has good thermal shock resistance, and is connected through the mode of joint between apron 10 and the plate body 1, reduces the welding step, reduces harmful gas's production to reduce the pollution to the environment, the subsequent dismantlement of being convenient for simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The high-heat-conduction high-thermal-shock-resistance water-cooling plate is characterized by comprising a plate body (1), wherein a pipe groove (2) is formed in the plate body (1), a copper pipe (3) is welded in the pipe groove (2), the two ends of the copper pipe (3) are located outside the pipe groove (2), a water inlet (4) is formed in one end of the copper pipe (3), a water outlet (5) is formed in the other end of the copper pipe (3), through holes I (6) are formed in the two sides of the plate body (1), rubber blocks (7) are arranged in the through holes I (6), a limiting groove (8) is formed in the inner wall of the through holes I (6), a limiting ring (9) is fixedly connected to the position, close to the limiting groove (8), of the rubber blocks (7), the limiting ring (9) is located in the limiting groove (8) and matched with the limiting groove (8), and a cover plate (10) is placed at the top of the plate body (1), the cover plate (10) is provided with a second through hole (11) at a position close to the first through hole (6), the top of the rubber block (7) is fixedly connected with a lug (12), the top of the lug (12) penetrates through the second through hole (11) and extends to the other side of the cover plate (10), and a plurality of heat dissipation holes (13) are formed in the outer surface of the cover plate (10) and close to the copper pipe (3).
2. The water cooling plate with high heat conductivity and high thermal shock resistance as claimed in claim 1, wherein grooves (14) are formed in the top of the plate body (1) and on two sides close to the first through hole (6), and a silica gel pad (15) is clamped inside the grooves (14).
3. The water-cooled plate with high thermal conductivity and high thermal shock resistance as claimed in claim 2, wherein the outer surface of the cover plate (10) is provided with a dustproof and breathable film (16) near the heat dissipation holes (13).
4. The water cooling plate with high thermal conductivity and high thermal shock resistance as claimed in claim 3, wherein connecting strips (17) are fixedly connected to two ends of the dustproof and breathable film (16), and the connecting strips (17) are bonded to the cover plate (10) through adhesive.
5. The water cooling plate with high heat conductivity and high thermal shock resistance as claimed in claim 4, wherein two sides of the plate body (1) far away from the first through hole (6) are provided with first mounting holes (18), two sides of the cover plate (10) far away from the second through hole (11) are provided with second mounting holes (19), and the first mounting holes (18) are matched with the second mounting holes (19).
6. The water cooling plate with high heat conductivity and high thermal shock resistance as claimed in claim 1, wherein the side of the bump (12) far away from the rubber block (7) is provided with an arc surface.
7. The water-cooled plate with high thermal conductivity and high thermal shock resistance as claimed in claim 1, wherein the outer surface of the rubber block (7) is coated with high temperature resistant paint.
CN201921979453.8U 2019-11-16 2019-11-16 High thermal conductivity and high thermal shock resistance water cooling plate Active CN210928448U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921979453.8U CN210928448U (en) 2019-11-16 2019-11-16 High thermal conductivity and high thermal shock resistance water cooling plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921979453.8U CN210928448U (en) 2019-11-16 2019-11-16 High thermal conductivity and high thermal shock resistance water cooling plate

Publications (1)

Publication Number Publication Date
CN210928448U true CN210928448U (en) 2020-07-03

Family

ID=71344503

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921979453.8U Active CN210928448U (en) 2019-11-16 2019-11-16 High thermal conductivity and high thermal shock resistance water cooling plate

Country Status (1)

Country Link
CN (1) CN210928448U (en)

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