CN215162353U - High temperature resistance cell-phone is insulating sticky tape for mainboard - Google Patents
High temperature resistance cell-phone is insulating sticky tape for mainboard Download PDFInfo
- Publication number
- CN215162353U CN215162353U CN202121642143.4U CN202121642143U CN215162353U CN 215162353 U CN215162353 U CN 215162353U CN 202121642143 U CN202121642143 U CN 202121642143U CN 215162353 U CN215162353 U CN 215162353U
- Authority
- CN
- China
- Prior art keywords
- layer
- adhesive tape
- mobile phone
- high temperature
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Adhesive Tapes (AREA)
Abstract
The utility model discloses a high temperature resistant insulating adhesive tape for a mobile phone mainboard, which comprises adhesive tape paper, wherein the adhesive tape paper is made of polyolefin; the method comprises the following steps: the adhesive tape comprises an adhesive tape body, a main board pasting layer and a pasting machine layer, wherein the adhesive tape body is adhered to the surface of the adhesive tape paper, the lower end of the adhesive tape body is fixedly connected with the main board pasting layer, and the other surface of the adhesive tape body is fixedly connected with the pasting machine layer; the adhesive tape paper is wound on the cylinder. This high temperature resistance is insulating adhesive tape for mobile phone motherboard when using, take off the sticky tape body from sticky tape, paste the adhesive linkage and mainboard with the layer and paste on mobile phone motherboard, at mobile phone motherboard during operation, the sticky tape body not only plays the fixed effect of protection, also through first bleeder vent, the second bleeder vent, third bleeder vent and ventilative layer give mobile phone motherboard heat dissipation, make mobile phone motherboard operating temperature too high, make each electronic component on the mobile phone motherboard be in normal operating temperature always, the accuracy of mobile phone motherboard at the during operation has finally been guaranteed.
Description
Technical Field
The utility model relates to a mobile phone motherboard technical field specifically is a high temperature resistant mobile phone motherboard is with insulating sticky tape.
Background
The mobile phone mainboard is a carrier, can support various electronic components, can realize electrical connection or electrical insulation between the electronic components, and the insulating tape on the mobile phone mainboard plays the role of protection and insulation, and the existing insulating tape for the mobile phone mainboard still has the following defects:
when the mobile phone mainboard is used, the temperature is high, the existing insulating adhesive tape for the mobile phone mainboard is not perfect in the aspects of heat dissipation and high temperature resistance, and when the mobile phone mainboard is used, the heat dissipation is too slow, so that the electronic elements can be damaged;
in order to solve the above problems, innovative design is urgently needed on the basis of the original insulating adhesive tape for the mobile phone motherboard.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistant cell-phone is insulating sticky tape for mainboard to solve the problem of not perfect enough of what do in the aspect of heat dissipation, high temperature resistant that provides in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high-temperature-resistant insulating tape for a mobile phone mainboard comprises adhesive tape paper, wherein the adhesive tape paper is made of polyolefin and has good insulating property;
a high temperature resistant cell-phone is insulating sticky tape for mainboard includes:
the adhesive tape comprises an adhesive tape body, a main board pasting layer and a pasting machine layer, wherein the adhesive tape body is adhered to the surface of the adhesive tape paper, the lower end of the adhesive tape body is fixedly connected with the main board pasting layer, and the other surface of the adhesive tape body is fixedly connected with the pasting machine layer;
the adhesive tape paper is wound on the cylinder.
Preferably, the sticky tape body includes ventilative layer, and the lower fixed surface on ventilative layer is connected with high temperature resistant layer, and ventilative layer has improved the gas permeability and the thermal diffusivity of device.
Preferably, the material on high temperature resistant layer is high temperature resistant glass fiber cloth, and first bleeder vent has been seted up to high temperature resistant layer's inside, and first bleeder vent is in the equidistant distribution in high temperature resistant layer's inside, the high temperature resistant layer that glass fiber cloth was made has improved the high temperature resistant of device, and the gas permeability of device has been improved to the equidistant first bleeder vent that distributes.
Preferably, the lower surface fixedly connected with insulating layer on high temperature resistant layer, and the material of insulating layer is polyvinyl chloride to the inside of insulating layer is equidistant to be seted up the second bleeder vent, and second bleeder vent and first bleeder vent are the staggered distribution, and the second bleeder vent and the first bleeder vent that the staggered distribution make the sticky tape body difficult for tearing apart, have improved the toughness of device.
Preferably, the lower surface of the insulating layer is fixedly connected with an adhesive layer, the lower surface of the adhesive layer is in adhesive connection with the adhesive tape, a third air hole is formed in the adhesive layer, and when the adhesive tape body is used, the adhesive layer is attached to a required position.
Preferably, the third air holes and the second air holes are distributed in a staggered manner, the third air holes are distributed on the surface of the bonding layer at equal intervals, and the toughness of the device is further improved through the staggered third air holes and the second air holes.
Compared with the prior art, the beneficial effects of the utility model are that: the high-temperature-resistant insulating adhesive tape for the mobile phone mainboard;
1. when the high-temperature-resistant insulating adhesive tape for the mobile phone mainboard is used, the adhesive tape body is taken down from the adhesive tape paper, and then the adhesive layer and the mainboard pasting layer are pasted on the mobile phone mainboard;
2. this high temperature resistant for mobile phone motherboard first bleeder vent, second bleeder vent and third bleeder vent all are each other the staggered form and distribute, when improving the device thermal diffusivity, have also guaranteed the toughness of sticky tape body, and the ventilative layer has improved the thermal diffusivity of sticky tape body simultaneously, and the high temperature resistance of sticky tape body has been improved on the resistant high temperature layer.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the connection structure between the main body and the main board adhesive layer;
FIG. 3 is a schematic view of the connection structure of the adhesive tape body and the whole adhesive tape applying machine of the present invention;
FIG. 4 is a schematic view of the connection structure of the air permeable layer and the high temperature resistant layer of the present invention;
fig. 5 is a schematic view of the structure a-a in fig. 4 according to the present invention.
In the figure: 1. adhesive tape paper; 2. a tape body; 3. a main board adhesive layer; 4. pasting a complete machine layer; 201. a breathable layer; 202. a high temperature resistant layer; 203. an insulating layer; 204. an adhesive layer; 5. a first air vent; 6. a second air hole; 7. a third air hole; 8. a cylinder.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a high-temperature-resistant insulating tape for a mobile phone mainboard comprises adhesive tape paper 1, wherein the adhesive tape paper 1 is made of polyolefin;
a high temperature resistant cell-phone is insulating sticky tape for mainboard includes:
the adhesive tape comprises an adhesive tape body 2, wherein the adhesive tape body 2 is adhered to the surface of the adhesive tape paper 1, the lower end of the adhesive tape body 2 is fixedly connected with a main board adhering layer 3, and the other side of the adhesive tape body 2 is fixedly connected with a whole adhering layer 4;
the cylinder 8 is wound with the adhesive tape 1.
The adhesive tape body 2 comprises a breathable layer 201, and a high-temperature-resistant layer 202 is fixedly connected to the lower surface of the breathable layer 201.
The high temperature resistant layer 202 is made of high temperature resistant glass fiber cloth, the first air holes 5 are formed in the high temperature resistant layer 202, and the first air holes 5 are distributed in the high temperature resistant layer 202 at equal intervals.
The insulating layer 203 is fixedly connected to the lower surface of the high temperature resistant layer 202, the insulating layer 203 is made of polyvinyl chloride, the insulating layer 203 is provided with second air holes 6 at equal intervals, and the second air holes 6 and the first air holes 5 are distributed in a staggered manner.
When the mobile phone mainboard cooling device is used, the adhesive tape body 2 is taken down from the adhesive tape paper 1, the bonding layer 204 and the mainboard pasting layer 3 are pasted on the mobile phone mainboard, when the mobile phone mainboard works, the adhesive tape body 2 not only plays a role in protecting and fixing, but also dissipates heat for the mobile phone mainboard through the first air holes 5, the second air holes 6, the third air holes 7 and the air permeable layer 201, and the working temperature of the mobile phone mainboard is not too high.
The lower surface of the insulating layer 203 is fixedly connected with an adhesive layer 204, the lower surface of the adhesive layer 204 is in adhesive connection with the adhesive tape 1, and a third vent hole 7 is formed in the adhesive layer 204.
The third air holes 7 and the second air holes 6 are distributed in a staggered manner, and the third air holes 7 are distributed on the surface of the adhesive layer 204 at equal intervals.
This high temperature resistant for mobile phone motherboard in insulating adhesive tape first bleeder vent 5, second bleeder vent 6 and third bleeder vent 7 are each other the alternating expression and distribute, when improving 2 thermal diffusivity of sticky tape body, have also guaranteed 2 toughness of sticky tape body, and ventilative layer 201 has improved the thermal diffusivity of sticky tape body 2 simultaneously, and high temperature resistant layer 202 has improved the high temperature resistance of sticky tape body 2, and insulating layer 203 has improved the insulating nature of sticky tape body 2.
The working principle is as follows: when the high-temperature-resistant insulating adhesive tape for the mobile phone motherboard is used, according to the figures 1-5, when the high-temperature-resistant insulating adhesive tape is used, the adhesive tape body 2 is taken down, and then the bonding layer 204 and the motherboard bonding layer 3 are attached to the mobile phone motherboard, when the mobile phone motherboard works, the adhesive tape body 2 not only plays a role in protecting and fixing, but also the breathable layer 201 dissipates heat for the mobile phone motherboard, so that the working temperature of the mobile phone motherboard is not too high; the first air hole 5, the second air hole 6 and the third air hole 7 in the high-temperature-resistant insulating adhesive tape for the mobile phone mainboard are distributed in a staggered mode, so that the heat dissipation performance of the adhesive tape body 2 is improved, and the toughness of the adhesive tape body 2 is also guaranteed.
The above is the operation of the whole device, and the details which are not described in detail in this specification are well known to those skilled in the art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A high-temperature-resistant insulating adhesive tape for a mobile phone mainboard comprises adhesive tape paper, wherein the adhesive tape paper is made of polyolefin;
the method is characterized in that: the method comprises the following steps:
the adhesive tape comprises an adhesive tape body, a main board pasting layer and a pasting machine layer, wherein the adhesive tape body is adhered to the surface of the adhesive tape paper, the lower end of the adhesive tape body is fixedly connected with the main board pasting layer, and the other surface of the adhesive tape body is fixedly connected with the pasting machine layer;
the adhesive tape paper is wound on the cylinder.
2. The high-temperature-resistant insulating tape for the mobile phone motherboard as claimed in claim 1, wherein: the adhesive tape body comprises a breathable layer, and a high-temperature-resistant layer is fixedly connected to the lower surface of the breathable layer.
3. The high-temperature-resistant insulating tape for the mobile phone motherboard as claimed in claim 2, wherein: the material of high temperature resistant layer is high temperature resistant glass fiber cloth, and first bleeder vent has been seted up to the inside on high temperature resistant layer to first bleeder vent is in the equidistant distribution of inside on high temperature resistant layer.
4. The high-temperature-resistant insulating tape for the mobile phone motherboard as claimed in claim 2, wherein: the lower surface fixedly connected with insulating layer on high temperature resistant layer, and the material of insulating layer is polyvinyl chloride to the inside of insulating layer is equidistant to be seted up the second bleeder vent, and second bleeder vent and first bleeder vent are the staggered form and distribute.
5. The high-temperature-resistant insulating tape for the mobile phone motherboard as claimed in claim 4, wherein: the lower surface of the insulating layer is fixedly connected with an adhesive layer, the lower surface of the adhesive layer is in adhesive connection with the adhesive tape, and a third air hole is formed in the adhesive layer.
6. The high-temperature-resistant insulating tape for the mobile phone motherboard as recited in claim 5, wherein: the third air holes and the second air holes are distributed in a staggered mode, and the third air holes are distributed on the surface of the bonding layer at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121642143.4U CN215162353U (en) | 2021-07-19 | 2021-07-19 | High temperature resistance cell-phone is insulating sticky tape for mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121642143.4U CN215162353U (en) | 2021-07-19 | 2021-07-19 | High temperature resistance cell-phone is insulating sticky tape for mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215162353U true CN215162353U (en) | 2021-12-14 |
Family
ID=79392386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121642143.4U Active CN215162353U (en) | 2021-07-19 | 2021-07-19 | High temperature resistance cell-phone is insulating sticky tape for mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215162353U (en) |
-
2021
- 2021-07-19 CN CN202121642143.4U patent/CN215162353U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206242623U (en) | A kind of heat conduction wave absorbing patch | |
| CN209702645U (en) | Minor insulation just mounted conductive tape | |
| CN207011206U (en) | A kind of conducting foam | |
| CN215162353U (en) | High temperature resistance cell-phone is insulating sticky tape for mainboard | |
| CN104602448B (en) | Flexible circuit board and preparation method thereof | |
| CN102933042A (en) | Anti-gluing method for flexible board in groove region of rigid-flexible board | |
| CN204104223U (en) | A kind of pasting board instrument for pcb board surface mounting technology | |
| CN207305272U (en) | A kind of conducting foam | |
| CN207891292U (en) | A kind of conduction distributing double-sided adhesive tape | |
| CN215683097U (en) | Edge-wrapped graphene heat-conducting gasket | |
| CN210574774U (en) | Flexible substrate for display | |
| CN213618832U (en) | High-temperature-resistant and high-breathability OLED (organic light emitting diode) protective film | |
| CN107911939A (en) | A kind of flexible printed circuit board | |
| CN207573699U (en) | A kind of flexible printed circuit board | |
| CN211942401U (en) | Low-dielectric-constant double-sided flexible copper-clad plate | |
| CN209816024U (en) | Double-sided adhesive tape convenient for heat dissipation | |
| CN104461140A (en) | Production method of bonding area silver paste protection structure | |
| CN215288630U (en) | Polyester film PET release film with good air permeability | |
| CN210016685U (en) | HDI high density laminated plate | |
| CN207294667U (en) | High intensity aluminum foil and adhesive tape | |
| CN216786703U (en) | Adhesive sticker paper with good ventilation effect | |
| CN205286332U (en) | Adhesion formula body temperature measuring device based on winding displacement interface | |
| CN214335622U (en) | Scratch-proof insulating sheet for notebook computer | |
| CN211843461U (en) | A insulating silica gel gasket for table surface | |
| CN220788444U (en) | Heat dissipation type breathable back adhesive |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |