CN215118888U - Heat radiation leakage-proof structure with liquid metal heat-conducting fin - Google Patents
Heat radiation leakage-proof structure with liquid metal heat-conducting fin Download PDFInfo
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- CN215118888U CN215118888U CN202121080389.7U CN202121080389U CN215118888U CN 215118888 U CN215118888 U CN 215118888U CN 202121080389 U CN202121080389 U CN 202121080389U CN 215118888 U CN215118888 U CN 215118888U
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Abstract
The utility model provides a heat dissipation leak protection structure with liquid metal conducting strip includes first gum layer, insulating paster, insulating layer and liquid metal conducting strip. The middle area of the first back glue layer is a first opening, the first back glue layer is attached to the wafer body, and the heat source penetrates through the first opening. The middle area of the insulating patch is a second hole opening, the insulating patch is attached on the first back glue layer, and the heat source penetrates through the hole opening. The middle area of the insulating layer is a second hole opening, the insulating layer is attached to the insulating patch, and the heat source is located in the second hole opening. And the liquid metal heat-conducting strip is arranged in the second hole opening, the middle area of the lower surface of the liquid metal heat-conducting strip is attached to and covers the heat source, and the upper surface of the liquid metal heat-conducting strip is parallel to the upper surface of the insulating layer.
Description
Technical Field
The utility model relates to a heat radiation structure especially indicates a heat dissipation leak protection structure with liquid metal conducting strip.
Background
Currently, various common electronic components are developed and designed in a miniaturization direction, and the overall operation performance of the electronic components is affected due to various factors such as miniaturization and greatly improved performance, along with easy generation of high heat in the actual operation process. Therefore, heat dissipation must be performed using the existing micro vapor chamber.
In the heat dissipation structure of the conventional electronic device, the heat dissipation fins are disposed on the electronic component, and then the fan unit is used to guide the airflow to the outside of the housing. However, because the components inside the casing are arranged closely, the heat emitted from the heat source cannot be effectively discharged to the outside, which causes a temperature rise effect inside the casing, and in addition, under the vicious cycle of continuous heat accumulation, if the temperature inside the casing cannot be kept within a normal range, the reliability and the service life of the whole electronic device can be affected, and the problems of electric leakage and over-high temperature during over-frequency can be caused.
Therefore, how to solve the above problems and deficiencies of the prior art is the subject of the urgent research and development of the related art.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat dissipation leak protection structure with liquid metal conducting strip can anticreep and heat dissipation.
The utility model provides a heat dissipation leak protection structure with liquid metal conducting strip for a heat source to wafer body on dispels the heat, the heat dissipation leak protection structure with liquid metal conducting strip includes first gum layer, insulating paster, insulating layer and liquid metal conducting strip. The middle area of the first back glue layer is a first opening, the first back glue layer is attached to the wafer body, and the heat source penetrates through the first opening. The middle area of the insulating patch is a second hole opening, the insulating patch is attached on the first back glue layer, and the heat source penetrates through the first hole opening. The middle area of the insulating layer is a second hole opening, the insulating layer is attached to the insulating patch, and the heat source is located in the second hole opening. And the liquid metal heat-conducting strip is arranged in the second hole opening, the middle area of the lower surface of the liquid metal heat-conducting strip is attached to and covers the heat source, and the upper surface of the liquid metal heat-conducting strip is parallel to the upper surface of the insulating layer.
In an embodiment of the present invention, the heat dissipation and leakage prevention structure with the liquid metal heat conduction sheet further includes a second adhesive layer, wherein the middle region is a second opening, the second adhesive layer is attached on the insulation layer, and the upper surface of the heat source is attached on the upper surface of the second opening.
In an embodiment of the present invention, the heat dissipation and leakage prevention structure with the liquid metal heat conduction sheet further includes a heat sink, the heat sink is attached to the second adhesive layer, and a part of the lower surface of the heat sink contacts with the upper surface of the liquid metal heat conduction sheet.
In an embodiment of the present invention, the insulating layer is a high temperature resistant foam or an insulating film.
To sum up, the embodiment of the present invention provides a heat dissipation and leakage prevention structure with liquid metal heat conducting fins, which has the following functions:
1. the risk of electric leakage caused by the electric conduction of the part circuit when the metal heat conducting sheet is assembled is reduced;
2. the problem of frequency reduction of a high-power wafer during operation is solved;
3. the problem of temperature is too high when overclocking is solved.
Hereinafter, the purpose, technical content, features and effects of the present invention will be more easily understood by describing the embodiments in detail.
Drawings
Fig. 1 is a schematic perspective view of the heat dissipation and leakage prevention structure with liquid metal heat-conducting fins of the present invention.
Fig. 2 is a three-dimensional exploded view of the heat dissipation and leakage prevention structure with liquid metal heat-conducting fins of the present invention.
Fig. 3 is a cross-sectional view of the heat dissipation and leakage prevention structure with liquid metal heat-conducting fins of the present invention.
Description of reference numerals: 100-a heat dissipation and leakage prevention structure with liquid metal heat conducting fins; 110-a wafer body; 120-a heat source; 130-a first gum layer; 140-an insulating patch; 150-an insulating layer; 160-liquid metal heat conducting fins; 170-a second back glue layer; 180-a heat sink; h1 — first opening; h2 — second opening; w1 — first hole opening; w2-second hole opening.
Detailed Description
For solving the current problem of heat radiation structure electric leakage and heat dissipation not enough, utility model designer through many years's research and development to improve the problem of the current product of scaling, follow-up will introduce in detail the utility model discloses how reaches the most efficient function appeal with a heat dissipation leak protection structure that has liquid metal conducting strip.
As the microprocessor functions are increased, the processing speed is increased, and the heat generated by the device is increased as the device size is reduced to effectively reduce the host size. Therefore, various heat dissipation structures are continuously evolving to expect to exert better heat dissipation effect.
Referring to fig. 1 to 3, fig. 1 is a perspective view of a heat dissipation and leakage prevention structure with liquid metal heat-conducting fins according to the present invention. Fig. 2 is a three-dimensional exploded view of the heat dissipation and leakage prevention structure with liquid metal heat-conducting fins of the present invention. Fig. 3 is a cross-sectional view of the heat dissipation and leakage prevention structure with liquid metal heat-conducting fins of the present invention. As shown in fig. 1 to 3, the present invention provides a heat dissipation and leakage prevention structure 100 with liquid metal heat-conducting fins, for dissipating heat from a heat source 120 on a wafer body 110. In one embodiment of the present invention, the heat source is a wafer pellet (Die). However, there may be some leakage conditions on the surface of the wafer body 110 due to the internal electronic components, and the embodiment of the present invention provides a solution to effectively solve the leakage problem. As will be further described below, the heat dissipation and leakage prevention structure 100 with liquid metal heat conduction sheet includes a first backside adhesive layer 130, an insulation patch 140, an insulation layer 150, and a liquid metal heat conduction sheet 160. The first backside adhesive layer 130 has a first opening H1 in the middle region, the first backside adhesive layer 130 is attached to the wafer body 110, and the heat source 120 penetrates through the first opening H1.
In addition, the middle area of the insulating patch 140 is a first hole opening W1, the insulating patch 140 is attached to the first backside adhesive layer 130, and the heat source 120 penetrates through the first hole opening W1, so that the risk of electric leakage caused by the electrical conduction of the component circuit during the assembly of the metal heat conductive sheet can be reduced by the insulating patch 140. The middle region of the insulating layer 150 is a second hole opening W2, the insulating layer 150 is attached on the insulating patch 140 and the heat source 120 is located inside the second hole opening W2. In the embodiment of the present invention, the insulating layer 150 may be high temperature resistant foam or insulating film. Furthermore, the liquid metal heat conduction sheet 160 is disposed inside the second hole opening W2, and a middle region of a lower surface of the liquid metal heat conduction sheet 160 is attached to and covers the heat source 120, wherein an upper surface of the liquid metal heat conduction sheet 160 is parallel or almost parallel to an upper surface of the insulation layer 150. When the temperature of the heat source 120 reaches a certain critical temperature (e.g., 60 degrees celsius), the insulating layer 150 acts as a dam to prevent the liquid metal from leaking laterally. The embodiment of the utility model provides a liquid metal conducting strip 160 settles through such structure and can solve the problem that the temperature is too high when the overfrequency is solved in heat dissipation leak protection structure 100.
Further, the heat dissipation and leakage prevention structure 100 with liquid metal heat conduction sheet further includes a second adhesive backside layer 170 and a heat sink 180. The middle region of the second backside adhesive layer 170 is a second opening H2, the second backside adhesive layer 170 is attached on the insulating layer 150, and the upper surface of the heat source 120 is attached on the upper surface of the second opening H2. The heat sink 180 is attached to the second backside adhesive layer 170 and part of the lower surface thereof contacts the upper surface of the liquid metal heat conducting fin 160, the embodiment of the present invention provides a heat sink 180 as a finned heat sink, but not limited thereto.
To sum up, the embodiment of the present invention provides a heat dissipation and leakage prevention structure with liquid metal heat conducting fins, which can have the following functions:
1. the risk of electric leakage caused by the electric conduction of the part circuit when the metal heat conducting sheet is assembled is reduced;
2. the problem of frequency reduction of a high-power wafer during operation is solved; and
3. the problem of temperature is too high when overclocking is solved.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (4)
1. A heat dissipation and leakage prevention structure with liquid metal heat-conducting fins is used for dissipating heat of a heat source on a wafer body, and is characterized by comprising the following components:
a first back glue layer, wherein the middle area of the first back glue layer is a first opening, the first back glue layer is attached to the wafer body, and the heat source penetrates through the first opening;
an insulating patch, wherein the middle area of the insulating patch is a first hole opening, the insulating patch is attached on the first back adhesive layer, and the heat source penetrates through the first hole opening;
an insulating layer, wherein the middle area is a second hole opening, the insulating layer is attached on the insulating patch, and the heat source is positioned in the second hole opening; and
and the liquid metal heat-conducting strip is arranged in the second hole opening, the middle area of the lower surface of the liquid metal heat-conducting strip is attached to and covers the heat source, and the upper surface of the liquid metal heat-conducting strip is parallel to the upper surface of the insulating layer.
2. The heat dissipating and leakage preventing structure having liquid metal heat conductive sheet as set forth in claim 1, wherein: the second back glue layer is attached to the insulating layer, and the upper surface of the heat source is attached to the upper surface of the second opening.
3. The heat dissipating and leakage preventing structure having liquid metal heat conductive sheet as set forth in claim 2, wherein: the liquid metal heat conducting sheet is attached to the second back glue layer, and the lower surface of the second back glue layer is partially contacted with the upper surface of the liquid metal heat conducting sheet.
4. The heat dissipating and leakage preventing structure having liquid metal heat conductive sheet as set forth in claim 2, wherein: the insulating layer is high temperature resistant foam or an insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121080389.7U CN215118888U (en) | 2021-05-19 | 2021-05-19 | Heat radiation leakage-proof structure with liquid metal heat-conducting fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121080389.7U CN215118888U (en) | 2021-05-19 | 2021-05-19 | Heat radiation leakage-proof structure with liquid metal heat-conducting fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215118888U true CN215118888U (en) | 2021-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121080389.7U Active CN215118888U (en) | 2021-05-19 | 2021-05-19 | Heat radiation leakage-proof structure with liquid metal heat-conducting fin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215118888U (en) |
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2021
- 2021-05-19 CN CN202121080389.7U patent/CN215118888U/en active Active
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