CN215118838U - Micro chip pitch adjusting device - Google Patents

Abstract

The utility model provides a micro chip pitch adjusting device, belonging to the technical field of micro electronic components; the device comprises a fixed frame, wherein a pitch adjusting mechanism capable of moving left and right is arranged in the fixed frame, the pitch adjusting mechanism comprises a plurality of parallel pitch execution plates, the distance between every two adjacent pitch execution plates can be lengthened and contracted at equal intervals under a pushing mechanism, a limiting mechanism is arranged in the fixed frame, the limiting mechanism is used for positioning the pitch execution plates after being lengthened or contracted, and the pitch execution plates are used for being inserted into rows or columns of micro chips on a sucker to adjust the pitch; the utility model discloses a pitch adjusting device can be simple quick realization small chip pitch adjustment, uses with multiple transfer device cooperatees, has improved the efficiency and the precision of transfer, need not complicated equipment and can accomplish, practices thrift the cost in a large number.

Description

Micro chip pitch adjusting device

Technical Field

The utility model belongs to the technical field of small electronic components, a small chip pitch adjusting device is related to.

Background

With the development of a tiny ultra-high-definition display technology, ultra-high-definition display requires ultra-high-density LED pixels, each pixel is composed of a corresponding LED chip, and therefore, the manufacture of ultra-high-definition LED display products requires the rapid matrix transfer of a large number of LED chips in batches onto corresponding substrates. The existing transfer technology is mature, and still adopts a mechanical structure 'sucking → placing' process, namely, a suction head is adopted to suck the chip from the Wafer and then transfer the chip to a corresponding position on a corresponding substrate, but in the process, the position of the chip cannot be adjusted and corrected, although the chip can be quickly transferred, a large number of chip positions have a phenomenon of irregular rows and columns after the chip is transferred, and the subsequent operation is influenced; the precision of the microchip in the rapid mass transfer process is reduced, and the manufacturing requirements of ultra-high definition and ultra-small pixel pitch display products can not be met.

SUMMERY OF THE UTILITY MODEL

The utility model overcomes prior art's is not enough, provides a small chip pitch adjusting device. The purpose is to improve the position precision of the microchip in the rapid mass transfer process.

In order to achieve the above purpose, the present invention is achieved by the following technical solutions.

The pitch adjusting device comprises a fixed frame, a pitch adjusting mechanism capable of moving left and right is arranged in the fixed frame, the pitch adjusting mechanism comprises a plurality of parallel pitch execution plates, the distance between every two adjacent pitch execution plates can be lengthened and contracted at equal intervals under a pushing mechanism, a limiting mechanism is arranged in the fixed frame, the limiting mechanism is used for positioning the pitch execution plates after being lengthened or contracted, and the pitch execution plates are used for being inserted into rows or columns of micro chips on the suckers to adjust the pitch.

Furthermore, a movement abdicating hole is arranged in the middle of the pitch executing plate, a force output plate, a movable pitch adjusting plate and a plurality of pitch executing plates are sequentially connected to the screw rod, the movable pitch adjusting plate is connected with the force output plate, one end of the screw rod, which is connected with the force output plate, is connected with a driving device, the force output plate drives the movable pitch adjusting plate to enter the movement abdicating hole along the screw rod under the action of the driving device, and the movable pitch adjusting plate pushes the plurality of pitch executing plates step by step for enabling the pitch executing plates to be stretched to the same distance; the pitch execution plate far away from the output plate is connected with a pitch execution return sleeve, and the pitch execution return sleeve is driven by the lead screw to push the pitch execution plates to retract towards the output plate.

Furthermore, the upper edge and the lower edge of the movable pitch adjusting plate are symmetrically provided with first steps, the first steps are gradually retracted inwards towards the direction of the screw rod from the direction from the output plate to the pitch executing plate, the upper wall and the lower wall in the fixed frame are symmetrically provided with fixed pitch adjusting plates, and the edge of each fixed pitch adjusting plate is provided with a second step meshed with the first step; the height of the pitch execution plate is sequentially matched with the distance between the upper second step and the lower second step.

Furthermore, the limiting mechanism comprises an in-situ fixing plate, an in-situ pitch limiting sleeve and a fixing elastic sheet; the in-situ fixing plate is arranged on the upper wall and the lower wall of the fixing frame, is positioned between the movable pitch adjusting plate and the pitch execution plate adjacent to the movable pitch adjusting plate and is used for integral limiting when the pitch execution plate retracts; the in-situ pitch limiting sleeve is arranged on a guide rod connected with the pitch execution plates, is positioned between two adjacent pitch execution plates and is used for limiting the position between the two adjacent pitch execution plates; the fixed elastic sheet is arranged on the second step.

The pitch adjusting device is connected with a patting and aligning movement mechanism, and the patting and aligning movement mechanism is used for driving the pitch adjusting device to integrally move left and right to patte the micro chips.

The utility model discloses produced beneficial effect does for prior art.

The utility model discloses a pitch adjusting device can be simple quick realization small chip pitch adjustment, uses with multiple transfer device cooperatees, has improved the efficiency and the precision of transfer, need not complicated equipment and can accomplish, practices thrift the cost in a large number. The utility model discloses be applicable to small wafer promptly, also be applicable to other small chips of other matrix distributions.

Drawings

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly understood, the following drawings are combined for illustration:

fig. 1 is a side view of a pitch adjusting apparatus according to an embodiment in a state where a pitch execution plate is contracted.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a side view of the pitch adjusting apparatus according to the embodiment in a state where the pitch execution plate is elongated.

Fig. 4 is a top view of fig. 3.

Fig. 5 is the wafer before the beat-up.

Fig. 6 is the wafer after the beat-up.

In the figure, 1 is a servo motor, 2 is a motor mounting plate, 3 is an output plate, 4 is a lower baffle, 5 is an upper baffle, 6 is a guide rod, 7 is a screw rod, 8 is a fixed pitch adjusting plate, 9 is a fixed elastic sheet, 10 is an in-situ fixing plate, 11 is a pitch executing plate, 12 is a moving pitch plate moving abdicating hole, 13 is a fixed pitch plate step, 14 is a moving pitch adjusting plate, 15 is a moving pitch adjusting plate step, 16 is a right baffle, 17 is an in-situ pitch limiting sleeve, 18 is a pitch executing return sleeve, 19 is a wafer aligning servo motor, 20 is a wafer aligning moving mechanism, and 21 is a wafer.

Detailed Description

In order to make the technical problem, technical scheme and beneficial effect that the utility model will solve more clearly understand, combine embodiment and attached drawing, it is right to go on further detailed description the utility model discloses. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. The technical solution of the present invention is described in detail below with reference to the embodiments and the drawings, but the scope of protection is not limited thereto.

The embodiment is a method for transferring micro LED chips in batch based on a micro vacuum and UV dissociation mode. The LED chips form a whole piece of Wafer of GaN or GaAs after epitaxial growth and electrode manufacturing, the Wafer is attached with a blue glue film, and then single LED chips arranged in a matrix form are formed after laser cutting or blade cutting and are uniformly distributed on the bonding surface of the blue UV glue film. After the LED chips are screened out as defective products through point measurement, the rest of the defective products are Wafer sheets to be transferred, or Wafer sheets which are tested, sorted and rearranged by a chip factory can be used as the LED chips. The outer layer of the Wafer electrode is made of tin, the thickness of the outer layer is about 5-30 mu m, the Wafer is uniformly distributed on the UV adhesive film, and the electrode faces upwards.

The entire Wafer then needs to be transferred to the corresponding substrate pad.

The first step is as follows: and (3) uniformly pulling the rows and columns of the single Wafer on the Wafer by a certain distance through a controllable and accurate-expansion Wafer expanding machine, so as to facilitate subsequent pitch adjustment.

The second step is that: the micro vacuum sucker is made of alloy metals such as superhard tungsten steel and the like, the required smoothness and flatness of the surface of the sucker reach 0.5-5 mu m, and the ideal condition is that the smoothness and flatness are controlled within 2 mu m; huge micropores are densely distributed on the sucker, the aperture is 1-20 mu m, the hole-to-hole distance is controlled to be 5-20 mu m, and the proper aperture and hole distance are selected according to the size of the wafer to ensure that each wafer can correspond to about 20 micropores so as to ensure that the wafer can be effectively adsorbed on the disk surface and the position is kept fixed; the chuck is vacuumized to above-70 Kpa to ensure each wafer to be firmly adsorbed at the corresponding position.

The third step: and fixing the expanded UV Wafer on a UV frame, vertically downwards aligning to a micro vacuum chuck (the surface of the micro vacuum chuck is upward), slowly enabling the UV adhesive film Wafer to be close to the surface of the micro vacuum chuck, and opening the vacuum.

The fourth step: and irradiating UV light from the back of the UV adhesive film, adjusting the power of the UV light to ensure that the UV adhesive force is reduced enough to release a single wafer, absorbing the wafer onto the surface of the sucking disc by micro vacuum after the wafer adhesive force is reduced, and separating the wafer from the UV adhesive film. The wafer electrode faces upwards to avoid scratching the electrode when the pitch is adjusted in the next step; the electrode faces the suction disc surface.

The fifth step: and adjusting the row and column pitch of the chips by using a pitch adjusting device to enable the chip pitch to be consistent with the matrix row and column of the substrate.

And a sixth step: and pouring the UV adhesive film again, and pouring the chip electrode to the surface of the UV adhesive film. The method comprises the following steps of heating and tightly attaching a UV adhesive film to a convex point carrier plate by adopting a transparent glass convex point carrier plate, enabling the convex point carrier plate to drive the UV adhesive film to be close to a micro vacuum chuck wafer, enabling the back surface of the wafer to be tightly attached to the bonding surface of the UV adhesive film, reducing vacuum until the wafer is closed, enabling the whole wafer to be transferred to the convex point carrier plate, and enabling each wafer to correspond to a convex point; the electrodes face upward.

The seventh step: according to the tin spraying process for the surface of the fixed welding spot of the substrate wafer, the thickness of the tin layer is 5-30 mu m, the wafer is fixed with bonding glue at the middle point of the two fixed welding spots of the wafer, and the glue amount is controlled within the range of ensuring that the wafer cannot contact the welding spot after being attached.

Eighth step: the salient points on the UV adhesive film of the salient point carrier plate and the wafer are correspondingly and flatly pasted to the wafer fixing positions on the substrate, so that the wafer fixing adhesive glue dotted on the substrate at the middle position of the wafer electrode surface is adhered, two tin electrodes of the wafer correspond to the substrate wafer fixing position tin spraying welding points, and the error is +/-5 mu m; the chip electrode is contacted with each chip fixed welding point of the substrate.

The ninth step: and opening UV light and adjusting UV power to irradiate the transparent salient point carrier plate, so that the adhesive force of the UV adhesive film is reduced to be smaller than the adhesive force of the wafer adhesive glue at the fixed position of the wafer and the substrate wafer, and the whole wafer electrode faces to the welding spot and is transferred to the corresponding position of the substrate. Repeating the above steps, and continuing to transfer other wafers.

The tenth step: adjusting the space and the laser power of a plurality of parallel laser beams of a laser welding head to enable the plurality of lasers of the laser head to be aligned to a wafer electrode on a substrate, accurately driving the laser welding head by adopting a high-speed magnetic suspension motor, matching with image recognition and positioning, instantly heating the plurality of laser beams to 250-350 ℃ at the wafer electrode to enable the wafer electrode tin to be melted and then to be melted and connected with the substrate welding position tin, adjusting the welding time of each electrode for about 10-60 ms, and forming a display device finished product after welding.

As shown in fig. 1-4, the pitch adjusting device used in the fifth step includes a fixed frame surrounded by the motor mounting plate 2 on the left side, and an upper baffle 5, a lower baffle 4, and a right baffle 16; the servo motor 1 is mounted on the motor mounting plate 2, wherein the home position fixing plate 10 is mounted on the upper baffle 5 and the lower baffle 4 to be limited when the eight-pitch actuator plate 11 is returned. The middle of the fixed frame is axially provided with a screw rod 7, the screw rod 7 is provided with two circular guide rods 6 in an up-down symmetrical mode, the guide rods 6 provide motion guide for the output plate 3, the movable pitch adjusting plate 14 and the eight pitch executing plates 11, the output plate 3 is arranged on the screw rod 7 and can move left and right, and the guide rods 6 and the screw rod 7 ensure that the output plate 3 and the pitch executing plates 11 do not deviate in motion. The servo motor 1 drives the screw rod 7 to move through the coupler, the screw rod 7 drives the output plate 3 to output power, the eight parallel pitch execution plates 11 are also arranged on the screw rod 7, and the screw rod 7 drives the eight pitch execution plates 11 to horizontally move rightwards during movement. The dynamic pitch adjustment plate 14 is mounted on the output plate 3. The pitch execution plates 11 and the in-situ pitch limiting sleeves 17 are alternately assembled on the guide rods 6, and each pitch execution plate 11 and two guide rods 6 are added through the screw rod 7 to form a triangular support stable structure, so that the pitch execution plates 11 are ensured to be parallel. A movable pitch plate movement abdicating hole 12 is arranged in the middle of the pitch execution plate 11, wherein the movable pitch plate movement abdicating hole 12 in the middle of the 1 st to 7 th pitch execution plates 11 from left to right is slightly larger than the width of the step corresponding to the movable pitch adjustment plate 14, so that the movable pitch adjustment plate 14 can penetrate through the corresponding pitch execution plate 11; in addition, the moving pitch plate moving abdicating hole 12 in the middle of the eighth pitch execution plate 11 is smaller than the tail end of the moving pitch adjustment plate 14, so that when the moving pitch adjustment plate 14 moves rightwards, the eighth pitch execution plate 11 can be pushed to move rightwards until the rightmost step of the fixed pitch adjustment plate 8 is touched. The 1 st step of the movable pitch adjusting plate 14 is larger than the abdicating hole of the pitch executing plate 11 of the seventh block from left to right so as to push the seventh pitch executing plate 11 to move rightwards, and the 2 nd step of the movable pitch adjusting plate 14 pushes the sixth pitch executing plate 11 to move rightwards, and then the sixth pitch executing plate 11 moves rightwards sequentially. When the output plate 3 drives the dynamic pitch adjusting plate 14 to push the eight pitch actuating plates 11 to move rightwards, the eight pitch actuating plates sequentially contact each step on the fixed pitch adjusting plate 8 and are fixed by the fixed elastic sheet 9 on the fixed pitch adjusting plate 8, and the pitch change adjustment is completed. When the pitch needs to return to the original position, the servo motor 1 drives the output plate 3 and the screw rod 7 to return, and the output plate 3 drives the movable pitch adjusting plate 14 to move leftwards; the screw rod 7 drives the pitch execution return sleeve 18 to move leftwards, the pitch execution return sleeve 18 drives the pitch execution plate 11 to move leftwards after overcoming the resistance of the fixed elastic sheet 9 until the first pitch execution plate 11 touches the original position fixed plate 10, then the original position pitch limiting sleeve 17 touches the left pitch execution plate 11 in sequence, finally the pitch execution plates 11 of the 1 st to 8 th blocks are all returned to the original position, and the distance between every two pitch execution plates 11 is the length of the original position pitch limiting sleeve 17.

The pitch adjusting device is integrally mounted on the wafer-patting-aligning movement mechanism 20, and is driven by the wafer-patting-aligning servomotor 19, and the pitch adjusting device is driven by the wafer-patting-aligning movement mechanism 20 to reciprocate left and right. The pitch adjusting device can realize two kinds of pitch change adjustment, and the pitch execution plate 11 has one pitch in the original position at the left side and has one pitch when moving rightwards to touch each step of the fixed pitch adjusting plate 8. The wafer-aligning motion mechanism 20 is a conventional mechanical device that can vibrate or rock left and right.

The principle is as follows: when the mechanism is not in action, the servo motor 1 drives the pitch execution return sleeve 18 to enable the pitch execution plate 11 to contact the original position fixing plate 10 to be limited in the original position, and the pitch execution plate 11 has a distance of m. As shown in fig. 6, when the wafer is precisely expanded to the required pitch m ± 0.02mm, the wafer is sucked by the micro vacuum chuck, and then the pitch execution plate 11 is inserted into the row or column interval of the wafer on the micro vacuum chuck, and the wafer-aligning servo motor 19 drives the wafer-aligning motion mechanism 20 to drive the above-mentioned mechanism to move left and right or move integrally, so as to align the wafer in rows or columns. The servo motor 1 is started to drive the force output plate 3 to output force, the movable pitch adjusting plate 14 is pushed to move rightwards, the movable pitch adjusting plate sequentially penetrates through the movable pitch movement yielding hole 12 in the middle of the first pitch execution plate 11 to the seventh pitch execution plate 11 from left to right, the right edge of the movable pitch adjusting plate 14 is contacted with the rightmost eighth pitch execution plate 11, the force output step 15 of the movable pitch adjusting plate 14 is contacted with the first pitch execution plate 11 to the seventh pitch execution plate 11 again, the distance between the pitch execution plates 11 is changed into n, the pitch execution plate 11 is fixed by the fixing elastic sheet 9 on the fixed pitch adjustment plate 8, and therefore the wafer row or column spacing strip is the distance n. Then, the wafer aligning servo motor 19 drives the wafer aligning motion mechanism 20 to drive the pitch adjustment device to reciprocate left and right for 2 times, so that the pitch execution plate 11 drives the wafer row or column to move integrally, thereby completing pitch change and alignment. When the next action is to be repeated, the servo motor 1 rotates to drive the pitch execution return sleeve 18 to pull the pitch execution plate 11 to overcome the resistance of the fixed elastic sheet 9, the pitch execution plate 11 moves leftwards in sequence, contacts the original position pitch limiting sleeve 17, the pitch execution plate 11 stops moving until the first pitch execution plate 11 touches the original position fixed plate 10, the pitch adjusting device stops moving, the pitch execution plate pitch is changed into m, and the next action is repeated. When different pitches need to be adjusted, only the pitch adjusting plate, the fixed pitch adjusting plate and the original pitch limiting sleeve need to be slid.

The above description is for further details of the present invention with reference to specific preferred embodiments, and it should not be understood that the embodiments of the present invention are limited thereto, and it will be apparent to those skilled in the art that the present invention can be implemented in a plurality of simple deductions or substitutions without departing from the scope of the present invention, and all such alterations and substitutions should be considered as belonging to the present invention, which is defined by the appended claims.

Claims (5)

1. The microchip pitch adjusting device is characterized by comprising a fixed frame, wherein a pitch adjusting mechanism capable of moving left and right is arranged in the fixed frame, the pitch adjusting mechanism comprises a plurality of parallel pitch execution plates, the distance between every two adjacent pitch execution plates can be lengthened and contracted at equal intervals under a pushing mechanism, a limiting mechanism is arranged in the fixed frame, the limiting mechanism is used for positioning the pitch execution plates after being lengthened or contracted, and the pitch execution plates are used for being inserted into rows or columns of microchips on a sucker to adjust the pitch.

2. The microchip pitch adjusting device according to claim 1, wherein a movement abdicating hole is arranged in the middle of the pitch executing plate, a force output plate, a dynamic pitch adjusting plate and a plurality of pitch executing plates are sequentially connected to the screw rod, the dynamic pitch adjusting plate is connected to the force output plate, a driving device is connected to one end of the screw rod connected to the force output plate, the force output plate drives the dynamic pitch adjusting plate to enter the movement abdicating hole along the screw rod under the action of the driving device, and the dynamic pitch adjusting plate pushes the plurality of pitch executing plates step by step for extending the pitch executing plates to the same distance; the pitch execution plate far away from the output plate is connected with a pitch execution return sleeve, and the pitch execution return sleeve is driven by the lead screw to push the pitch execution plates to retract towards the output plate.

3. The microchip pitch adjustment device according to claim 2, wherein the upper and lower edges of the movable pitch adjustment plate are symmetrically provided with first steps which are gradually retracted inward in the direction of the screw from the output plate to the pitch execution plate, the upper and lower walls of the fixed frame are symmetrically provided with fixed pitch adjustment plates, and the edges of the fixed pitch adjustment plates are provided with second steps which are engaged with the first steps; the height of the pitch execution plate is sequentially matched with the distance between the upper second step and the lower second step.

4. The microchip pitch adjusting device according to claim 3, wherein the limiting mechanism comprises an in-situ fixing plate, an in-situ pitch limiting sleeve and a fixing elastic sheet; the in-situ fixing plate is arranged on the upper wall and the lower wall of the fixing frame, is positioned between the movable pitch adjusting plate and the pitch execution plate adjacent to the movable pitch adjusting plate and is used for integral limiting when the pitch execution plate retracts; the in-situ pitch limiting sleeve is arranged on a guide rod connected with the pitch execution plates, is positioned between two adjacent pitch execution plates and is used for limiting the position between the two adjacent pitch execution plates; the fixed elastic sheet is arranged on the second step.

5. A microchip pitch control device according to any of claims 1-4, wherein said pitch control device is connected to a patting movement mechanism for moving the pitch control device in its entirety from side to patte the microchip.

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