CN113380682B - Wafer transfer device and die bonder - Google Patents
Wafer transfer device and die bonder Download PDFInfo
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- CN113380682B CN113380682B CN202110734623.1A CN202110734623A CN113380682B CN 113380682 B CN113380682 B CN 113380682B CN 202110734623 A CN202110734623 A CN 202110734623A CN 113380682 B CN113380682 B CN 113380682B
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- 230000007246 mechanism Effects 0.000 claims abstract description 80
- 238000004080 punching Methods 0.000 claims abstract description 52
- 230000033001 locomotion Effects 0.000 claims abstract description 9
- 235000012431 wafers Nutrition 0.000 claims description 107
- 238000001179 sorption measurement Methods 0.000 claims description 63
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 abstract description 15
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
The application belongs to the technical field of semiconductor equipment, and relates to a wafer transfer device and a die bonder. Wherein. The wafer transfer device includes: a frame, a punch top assembly and a wafer stripping assembly; the punching top assembly and the wafer stripping assembly are both arranged on the frame; the top punching assembly comprises a top punching mechanism and a top punching driving mechanism for driving the top punching mechanism to do reciprocating motion, and the top punching mechanism is used for jacking up the wafer from the bearing film; the wafer stripping assembly is arranged at the side of the punching mechanism and is used for stripping the wafer from the bearing film; the wafer stripping assembly comprises at least one of a laser generating member for emitting laser toward a region of the carrier film corresponding to the punch assembly and a temperature heating member for heating the region of the carrier film corresponding to the punch assembly. The laser generating piece or the temperature heating piece is utilized to lose viscosity between the bearing film and the wafer, and then the wafer is jacked up by the jacking mechanism, so that the efficiency of transferring the wafer is improved.
Description
Technical Field
The application relates to the technical field of semiconductor equipment, in particular to a wafer transfer device and a die bonder.
Background
In the wafer transfer process, a carrier film is generally disposed on a tray, and a plurality of wafers are placed on the carrier film, where the carrier film is generally a blue film, i.e., a film made of a sapphire material, and the blue film has viscosity and can adhere to the wafers.
At this time, when the suction nozzle is used to adsorb the wafer, the suction nozzle is not easy to adsorb the wafer due to adhesion of the wafer and the blue film, so that the efficiency of transferring the wafer is low.
Disclosure of Invention
In order to solve the technical problem of low wafer transfer efficiency, the application provides a wafer transfer device and a die bonder.
In a first aspect, the present application provides a wafer transfer apparatus comprising: a frame, a punch top assembly and a wafer stripping assembly;
the punching top assembly and the wafer stripping assembly are both arranged on the frame;
the top punching assembly comprises a top punching mechanism and a top punching driving mechanism for driving the top punching mechanism to do reciprocating motion, and the top punching mechanism is used for jacking up the wafer from the bearing film;
the wafer stripping assembly is arranged at the side of the punching mechanism and is used for stripping the wafer from the bearing film; the wafer stripping assembly comprises at least one of a laser generating member and a temperature heating member, wherein the laser generating member is used for emitting laser towards the area corresponding to the bearing film and the punching assembly, and the temperature heating member is used for heating the area corresponding to the bearing film and the punching assembly.
Optionally, the laser generating element comprises an ultraviolet laser generating element.
Optionally, the frame includes a first driving mechanism for driving the punch assembly and the wafer lift assembly to move in a first direction, and a second driving mechanism for driving the punch assembly and the wafer lift assembly to move in a second direction, wherein the first direction is perpendicular to the second direction.
Optionally, the top punching driving mechanism comprises a cam, a transmission rod and a motor; the motor drives the cam to rotate, and the cam drives the transmission rod to do lifting motion.
Optionally, the motor includes one of a linear motor, a voice coil motor, a servo motor, and a stepper motor.
Optionally, the top punching mechanism comprises a conical structure and a base, wherein the bottom surface of the conical structure is connected with the base, and the conical structure is used for jacking the wafer from the carrier film.
Optionally, the wafer transfer device further comprises an adsorption assembly, wherein the adsorption assembly is mounted on the frame and is used for adsorbing the carrier film.
Optionally, the adsorption component comprises an adsorption head and a vacuum negative pressure adsorption piece, at least one adsorption hole is formed in the adsorption head, the adsorption hole is communicated with the vacuum negative pressure adsorption piece, and the adsorption head is used for adsorbing the bearing film.
Optionally, a through hole is formed in the adsorption head, and the punching mechanism slidably penetrates through the through hole.
In a second aspect, the present application provides a die bonder, including the wafer transfer apparatus described above.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
according to the wafer transfer device, the laser generating piece is utilized to irradiate the bearing film or the temperature heating piece is utilized to heat the bearing film, so that the bearing film loses viscosity under the irradiation of laser or loses thermosetting under high-temperature heating, and then the wafer can be jacked up through the jacking mechanism, so that the wafer is transferred from the bearing film. Therefore, when the carrying film is irradiated by laser or the temperature heating piece heats the carrying film, the periphery of the wafer still can be adhered to the carrying film, the carrying film around the wafer is difficult to peel off from the wafer by laser irradiation or temperature rise, and the wafer is jacked up by the jacking mechanism at the moment, so that the transfer of the wafer is conveniently realized. Thereby improving the efficiency of wafer transfer and the accuracy of wafer transfer.
The die bonder comprises the wafer transfer device. The wafer transfer device is applied to the die bonder, so that the efficiency of the whole wafer preparation process can be improved.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
For a clearer description of an embodiment of the invention or of the solutions of the prior art, reference will be made to the accompanying drawings, which are used in the description of the embodiment or of the prior art, it being obvious to a person skilled in the art that other drawings can be obtained from these without inventive effort;
fig. 1 is a perspective view of a wafer transfer apparatus according to an embodiment of the present disclosure;
fig. 2 to fig. 4 are schematic structural diagrams of a wafer transferring apparatus according to an embodiment of the present disclosure;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
FIG. 6 is a schematic diagram of a wafer lift-off assembly according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a capping mechanism according to an embodiment of the present disclosure;
fig. 8 is another schematic structural diagram of a capping mechanism according to an embodiment of the present disclosure.
Reference numerals:
100. a wafer transfer device; 110. a frame; 120. a ram assembly; 130. a wafer lift-off assembly; 140. an adsorption assembly;
121. a top punching mechanism; 122. a top punching driving mechanism; 1211. a conical structure; 1212. a base;
1221. a cam; 1222. a transmission rod; 1223. a motor;
141. an adsorption head; 142. a vacuum negative pressure absorbing member; 143. a through hole; 144. a groove; 145. adsorption holes;
111. a first driving mechanism; 112. a second driving mechanism.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
Referring to fig. 1 to 8, an embodiment of the present application provides a wafer transfer apparatus 100, including: a frame 110, a punch top assembly 120, and a wafer lift-off assembly 130; the punch top assembly 120 and the wafer peel assembly 130 are both mounted on the frame 110; the top punching assembly 120 comprises a top punching mechanism 121 and a top punching driving mechanism 122 for driving the top punching mechanism 121 to reciprocate, wherein the top punching mechanism 121 is used for jacking up a wafer from a bearing film; a wafer peel assembly 130 is mounted to the side of the punch-top mechanism 121 for peeling the wafer away from the carrier film; the wafer lift-off assembly 130 includes at least one of a laser generating member for emitting laser light toward a region of the carrier film corresponding to the punch assembly 120 and a temperature heating member for heating the region of the carrier film corresponding to the punch assembly 120.
In this way, the bottom surface of the wafer is peeled from the carrier film by the wafer peeling assembly 130, and then the peripheral side surfaces of the wafer are peeled from the carrier film by the top punching assembly 120, so that the wafer and the carrier film are completely peeled, and the wafer transfer efficiency is improved.
Referring to fig. 6, the laser generating member may lose adhesiveness of the carrier film by emitting laser, so that rapid peeling between the bottom surface of the wafer and the carrier film may be achieved. However, since the wafer is very small and thin, the peripheral side surfaces of the wafer still adhere to the carrier film, so that the wafer is lifted from the carrier film by the lift mechanism 121, thereby facilitating the transfer of the wafer.
In one embodiment, the laser generating element comprises an ultraviolet laser generating element. The ultraviolet laser is utilized to irradiate the bearing film, so that the bearing film loses viscosity, the ultraviolet light emitted by the ultraviolet laser generating piece is a surface light source, the irradiation range of the ultraviolet light cannot be accurately controlled, and the opposite is that the wafer on the bearing film is of a small size, so that the peripheral side surfaces of the wafer are still adhered to the bearing film. At this time, the carrier film is lifted up by the lift-off mechanism 121, so that the wafer and the carrier film are completely peeled off, and the transfer efficiency of the wafer is improved.
Specifically, the wavelength range of the ultraviolet light emitted in the ultraviolet laser generating member is 220nm to 400nm. The ultraviolet light in the wavelength range can enable the carrier film to be rapidly peeled from the wafer, and further improves the transfer efficiency of the wafer.
The temperature heating piece can heat the top punching mechanism 121, when the top punching mechanism 121 reciprocates up and down towards the direction of the carrier film, the carrier film can lose thermosetting property due to the fact that the top punching mechanism 121 has higher temperature, and therefore the wafer and the carrier film are peeled off, and the wafer transfer efficiency is improved.
The temperature heating element can also heat the region of the carrier film corresponding to the punching mechanism 121, so that the carrier film loses thermosetting property, and the wafer transfer efficiency is improved.
The frame 110 includes a first drive mechanism 111 for driving the punch top assembly 120 and the wafer lift assembly 130 to move in a first direction, and a second drive mechanism 112 for driving the punch top assembly 120 and the wafer lift assembly 130 to move in a second direction.
The first direction and the second direction are perpendicular to each other. The first direction may be an x-axis direction and the second direction may be a y-axis direction. Of course, the first direction may be the y-axis direction, and the second direction may be the x-axis direction. The first direction and the second direction are both directions moving on a plane.
The number of first driving mechanisms 111 may be two, and the two first driving mechanisms 111 are respectively mounted on the capping assembly 120 and the wafer stripping assembly 130 for respectively driving the movement of the capping assembly 120 and the wafer stripping assembly 130 in the first direction.
Of course, the first driving mechanism 111 may be provided as one, and one first driving mechanism 111 controls the movement of the punch top assembly 120 and the wafer lift-off assembly 130 in the first direction in common. Thus, the laser generating member is disposed beside the punch assembly 120, and when the laser generating member irradiates a row of wafers on the carrier film, the first driving mechanism 111 drives the laser generating member to move toward the next row of wafers, and simultaneously drives the punch assembly 120 to move toward the row of wafers irradiated by the laser generating member, so as to jack up the corresponding wafers. The temperature heating member is mounted on the topping mechanism 121, and moves following the topping mechanism 121 when the topping mechanism 121 is driven to move by the first driving mechanism 111.
When the second driving mechanism 112 drives the top punching mechanism 121 to move, the second driving mechanism 112 synchronously drives the temperature heating element to move along the second direction. The number of the second driving mechanisms 112 may be two, and the two second driving mechanisms 112 are respectively mounted on the laser generating member and the punch assembly 120, so as to respectively control the movement of the laser generating member and the punch assembly 120 in the second direction.
The ram drive mechanism 122 includes a cam 1221, a drive link 1222, and a motor 1223; the cam 1221 is connected to a drive rod 1222 and a motor 1223, respectively, the drive rod 1222 being connected to the punch press mechanism 121. The ram drive mechanism 122 includes a cam 1221, a drive link 1222, and a motor 1223; the cam 1221 is connected to a drive rod 1222 and a motor 1223, respectively, the drive rod 1222 being connected to the punch press mechanism 121. By the combination of cam 1221 and drive link 1222, the smoothness of operation of ram drive mechanism 122 is improved. The cam 1221 may drive the transmission rod 1222 to rotate at a constant speed. And the cam 1221 and the transmission lever 1222 are easy to manufacture and simple in structure. The number of the transmission levers 1222 and the cams 1221 may be plural, and the plural transmission levers 1222 and the plural cams 1221 may be combined to form a Z-shaped transmission structure. The motor 1223 may be a linear motor, a servo motor, or a cylinder or the like driving device, as long as the cam 1221 and the transmission rod 1222 can be driven to move. In particular, the motor 1223 may further include one of a voice coil motor and a stepper motor. The motor 1223 may drive the cam 1221 in motion.
Referring to fig. 7 and 8, the capping mechanism 121 includes a cone structure 1211 and a base 1212, the bottom surface of the cone structure 1211 being connected to the base 1212, the cone structure 1211 being used to lift the wafer from the carrier film. The top surface of the tapered structure 1211 may be configured as a flat surface or a protrusion, which may enhance the stability of the punch-top mechanism 121 against the wafer on the carrier film. The top surface of the tapered structure 1211 is configured to be convex, so that the wafer beside can be prevented from being touched by mistake when the tapered structure 1211 lifts up the corresponding wafer on the carrier film due to the small occupied area of the wafer.
The wafer transfer apparatus 100 further includes an adsorption assembly 140, the adsorption assembly 140 being mounted on the frame 110, the adsorption assembly 140 for adsorbing the carrier film. When the wafer on the carrier film is jacked up by the jacking component 120 through the adsorption component 140, the carrier film is adsorbed, so that other wafers on the carrier film are prevented from being shifted, and the accuracy of wafer transfer is improved.
The adsorption assembly 140 comprises an adsorption head 141 and a vacuum negative pressure adsorption piece 142, wherein the adsorption head 141 is communicated with the vacuum negative pressure adsorption piece 142, the adsorption head 141 is provided with at least one adsorption hole 145, and the adsorption hole 145 is in air communication with the vacuum negative pressure adsorption piece 142. The adsorption head 141 is used for adsorbing the carrier film. By the adsorption of the carrier film by the adsorption head 141 when the wafer on the carrier film is jacked by the jacking assembly 120, other wafer displacement on the carrier film is avoided, and the accuracy of wafer transfer is improved.
When the air pressure at the adsorption hole 145 is changed, the adsorption force of the adsorption hole 145 to the carrier film is also changed. Thereby facilitating the jacking mechanism 121 to jack up the carrier film.
The adsorption head 141 is provided with a through hole 143, and the punching mechanism 121 slidably penetrates through the through hole 143. The adsorption head 141 is provided with a through hole 143, and the punching mechanism 121 slidably penetrates through the through hole 143. The top punching mechanism 121 slidably penetrates out of the through hole 143 of the adsorption head 141, so that the interval distance between the top punching mechanism 121 and the adsorption head 141 is reduced, the adsorption assembly 140 is convenient for adsorbing the carrier film, and the top punching assembly 120 jacks up the carrier film.
The suction head 141 is provided with a groove 144, the groove 144 is arranged around the outer periphery of the through hole 143, and at least one suction hole 145 is arranged in the groove 144. The adsorption holes 145 are formed in the grooves 144, and the grooves 144 are in contact with the carrier film, so that the air flow in the adsorption holes 145 can be concentrated through the grooves 144, and the adsorption efficiency of the carrier film is improved. The cross-sectional shape of the recess 144 may be a trapezoid, with a base of the trapezoid disposed adjacent to one side of the housing 110.
Of course, the adsorption head 141 may also be provided with a avoiding groove (not shown), and the punch top mechanism 121 may slidably reciprocate in the avoiding groove. The avoidance groove is provided on a side of the adsorption head 141 and is recessed toward an axial direction of the adsorption head 141. Like this, dodge the groove through setting up and can reduce the interval between adsorption component 140 and the top subassembly 120 that dashes, and dodge the groove setting in the side of adsorption head 141, be convenient for with dashing a mechanism 121 and dismantle from dashing a actuating mechanism 122, improve the efficiency of changing a mechanism 121 that dashes. The avoidance groove has a semicircular or rectangular cross-sectional shape in a direction perpendicular to the axial direction of the adsorption head 141.
The embodiment of the application also provides a die bonder, which comprises the wafer transfer device 100. The wafer transfer device 100 is applied to a die bonder, so that the efficiency of the whole wafer preparation process can be improved.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (2)
1. A wafer transfer apparatus, comprising: a frame, a punch top assembly and a wafer stripping assembly;
the punching top assembly and the wafer stripping assembly are both arranged on the frame;
the top punching assembly comprises a top punching mechanism and a top punching driving mechanism for driving the top punching mechanism to do reciprocating motion, and the top punching mechanism is used for jacking up the wafer from the bearing film;
the wafer stripping assembly is arranged at the side of the punching mechanism and is used for stripping the wafer from the bearing film;
the wafer stripping assembly comprises a laser generating piece, wherein the laser generating piece is used for emitting laser towards a region of the bearing film corresponding to the punching assembly;
the top punching driving mechanism comprises a cam, a transmission rod and a motor; the motor drives the cam to rotate, and the cam drives the transmission rod to do lifting motion;
the top punching mechanism comprises a conical structure and a base, wherein the bottom surface of the conical structure is connected with the base, and the conical structure is used for jacking the wafer from the bearing film; the top surface of the conical structure is arranged to be a plane;
the wafer transfer device also comprises an adsorption component, wherein the adsorption component is arranged on the rack and is used for adsorbing the bearing film;
the adsorption component comprises an adsorption head and a vacuum negative pressure adsorption piece, at least one adsorption hole is formed in the adsorption head, the adsorption hole is communicated with the vacuum negative pressure adsorption piece, and the adsorption head is used for adsorbing the bearing film; the adsorption head is provided with a through hole, and the punching mechanism can slidably penetrate through the through hole;
the adsorption head is provided with a groove, the groove is arranged around the outer periphery of the through hole, and at least one adsorption hole is arranged in the groove;
the laser generating piece is arranged at the side of the punching component, after the laser generating piece irradiates a row of wafers on the bearing film, the laser generating piece is driven to move towards the next row of wafers, and meanwhile, the punching component is driven to move towards the row of wafers irradiated by the laser generating piece, so that the corresponding wafers are jacked up;
the laser generating piece comprises an ultraviolet laser generating piece; the wavelength range of the ultraviolet light emitted by the ultraviolet laser generating piece is 220nm to 400nm;
the frame comprises a first driving mechanism and a second driving mechanism, wherein the first driving mechanism is used for driving the top punching assembly and the wafer stripping assembly to move along a first direction, the second driving mechanism is used for driving the top punching assembly and the wafer stripping assembly to move along a second direction, and the first direction and the second direction are mutually perpendicular; the first direction and the second direction are both directions moving on a plane;
the adsorption head is provided with an avoidance groove, the ejection mechanism can reciprocate in the avoidance groove in a sliding manner, and the avoidance groove is arranged on the side edge of the adsorption head and is recessed towards the axial direction of the adsorption head.
2. A die bonder comprising the wafer transfer apparatus of claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110734623.1A CN113380682B (en) | 2021-06-30 | 2021-06-30 | Wafer transfer device and die bonder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110734623.1A CN113380682B (en) | 2021-06-30 | 2021-06-30 | Wafer transfer device and die bonder |
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| CN113380682A CN113380682A (en) | 2021-09-10 |
| CN113380682B true CN113380682B (en) | 2024-03-26 |
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| CN202110734623.1A Active CN113380682B (en) | 2021-06-30 | 2021-06-30 | Wafer transfer device and die bonder |
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| CN114779374B (en) * | 2022-03-16 | 2024-06-04 | 苏州苏纳光电有限公司 | Automatic equipment for reflow process in optical communication chip manufacturing |
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| CN111863703A (en) * | 2020-08-26 | 2020-10-30 | 深圳市微恒自动化设备有限公司 | Impact-free ejector pin device of die bonder and working method thereof |
| CN112758680A (en) * | 2020-12-28 | 2021-05-07 | 爱丁堡（南京）光电设备有限公司 | Device and method for adsorbing and grabbing optical parts from adhesive blue film |
| CN113053812A (en) * | 2019-12-27 | 2021-06-29 | 浙江荷清柔性电子技术有限公司 | Method for manufacturing flexible display driving chip |
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2021
- 2021-06-30 CN CN202110734623.1A patent/CN113380682B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110176418A (en) * | 2019-05-29 | 2019-08-27 | 浙江荷清柔性电子技术有限公司 | A kind of flexible chip pick-up method and pick device |
| CN113053812A (en) * | 2019-12-27 | 2021-06-29 | 浙江荷清柔性电子技术有限公司 | Method for manufacturing flexible display driving chip |
| CN111863703A (en) * | 2020-08-26 | 2020-10-30 | 深圳市微恒自动化设备有限公司 | Impact-free ejector pin device of die bonder and working method thereof |
| CN112758680A (en) * | 2020-12-28 | 2021-05-07 | 爱丁堡（南京）光电设备有限公司 | Device and method for adsorbing and grabbing optical parts from adhesive blue film |
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| CN113380682A (en) | 2021-09-10 |
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