CN214705862U

CN214705862U - Pitch adjusting device for micro chip transfer

Info

Publication number: CN214705862U
Application number: CN202120773557.4U
Authority: CN
Inventors: 付桂花; 马洪毅
Original assignee: Shanxi Gaoke Huaxing Electronic Technology Co ltd
Current assignee: Shanxi Gaoke Huaxing Electronic Technology Co ltd
Priority date: 2021-04-15
Filing date: 2021-04-15
Publication date: 2021-11-12
Anticipated expiration: 2031-04-15

Abstract

The utility model provides a pitch adjusting device for micro chip transfer, belonging to the technical field of micro electronic components; the pitch adjusting mechanism comprises a net-shaped telescopic arm and a plurality of pitch execution plates, the distance between every two adjacent pitch execution plates can be lengthened and contracted at equal intervals under the action of a driving device, and the pitch execution plates are used for being inserted into rows or columns of micro chips to adjust the pitch; the utility model discloses a pitch adjusting device can be simple quick realization small chip pitch adjustment, uses with multiple transfer device cooperatees, has improved the efficiency and the precision of transfer, need not complicated equipment and can accomplish, practices thrift the cost in a large number.

Description

Pitch adjusting device for micro chip transfer

Technical Field

The utility model belongs to the technical field of small electronic components, a pitch adjusting device for small chip shifts is related to.

Background

With the development of a tiny ultra-high-definition display technology, ultra-high-definition display requires ultra-high-density LED pixels, each pixel is composed of a corresponding LED chip, and therefore, the manufacture of ultra-high-definition LED display products requires the rapid matrix transfer of a large number of LED chips in batches onto corresponding substrates. The existing transfer technology is mature, and still adopts a mechanical structure 'sucking → placing' process, namely, a suction head is adopted to suck the chip from the Wafer and then transfer the chip to a corresponding position on a corresponding substrate, but in the process, the position of the chip cannot be adjusted and corrected, although the chip can be quickly transferred, a large number of chip positions have a phenomenon of irregular rows and columns after the chip is transferred, and the subsequent operation is influenced; the precision of the microchip in the rapid mass transfer process is reduced, and the manufacturing requirements of ultra-high definition and ultra-small pixel pitch display products can not be met.

SUMMERY OF THE UTILITY MODEL

The utility model overcomes prior art's is not enough, provides a pitch adjusting device for small chip shifts. The purpose is to improve the position precision of the microchip in the rapid mass transfer process.

In order to achieve the above purpose, the present invention is achieved by the following technical solutions.

A pitch adjusting device for transferring a microchip is characterized by comprising a fixed frame, wherein a pitch adjusting mechanism capable of moving left and right is arranged in the fixed frame, the pitch adjusting mechanism comprises a net-shaped telescopic arm and a plurality of pitch execution plates, one side in the fixed frame is provided with a force output plate, the force output plate is connected to a lead screw, the lead screw is connected with a driving device, and two sides of the lead screw are provided with tracks; the netted telescopic arm is connected with the track in a sliding mode and is connected with the output plate.

The netted telescopic arm comprises a driving joint, a plurality of sliding joints and a main fixed joint which are sequentially connected onto the track in a sliding mode, the netted arm is connected among the plurality of sliding joints, and the netted arm stretches through a plurality of middle joints; the driving joint is connected with the output plate, and the main fixed joint is fixedly connected with one end far away from the output plate; the active joint, the sliding joint and the main fixed joint all carry a pitch execution plate.

The distance between two adjacent pitch-executing plates for pitch adjustment inserted into the rows or columns of the microchips can be extended and contracted equidistantly by the driving means.

Furthermore, the main fixed joint is arranged on the fixed frame through a fixed plate.

The pitch adjusting device is connected with a patting and aligning movement mechanism, and the patting and aligning movement mechanism is used for driving the pitch adjusting device to integrally move left and right to patte the micro chips.

The utility model discloses produced beneficial effect does for prior art.

The utility model discloses a pitch adjusting device can be simple quick realization small chip pitch adjustment, uses with multiple transfer device cooperatees, has improved the efficiency and the precision of transfer, need not complicated equipment and can accomplish, practices thrift the cost in a large number. The utility model discloses be applicable to small wafer promptly, also be applicable to other small chips of other matrix distributions.

Drawings

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly understood, the following drawings are combined for illustration:

fig. 1 is a side view of a pitch adjusting apparatus according to an embodiment in a state where a pitch execution plate is elongated.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a plan view of a state of the pitch adjusting apparatus according to the embodiment in a process of shrinking the pitch performing plate.

Fig. 4 is a plan view of the pitch adjusting apparatus according to the embodiment in a state where the pitch execution plate is contracted.

Fig. 5 is the wafer before the beat-up.

Fig. 6 is the wafer after the beat-up.

In the figure, 1 is a servomotor, 2 is a motor mounting plate, 4 is a lower baffle, 5 is an upper baffle, 7 is a lead screw, 16 is a right baffle, 19 is a wafer aligning servomotor, 20 is a wafer aligning movement mechanism, and 21 is a wafer.

06 is a track plate, 07 is a motor output plate, 09 is a track groove, 100 is a driving joint, 110 is a sliding joint, 120 is a middle joint, 130 is a main fixed joint, 140 is a fixed plate, and 150 is a mesh mechanical arm.

Detailed Description

In order to make the technical problem, technical scheme and beneficial effect that the utility model will solve more clearly understand, combine embodiment and attached drawing, it is right to go on further detailed description the utility model discloses. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. The technical solution of the present invention is described in detail below with reference to the embodiments and the drawings, but the scope of protection is not limited thereto.

The embodiment is a method for transferring micro LED chips in batch based on a micro vacuum and UV dissociation mode. The LED chips form a whole piece of Wafer of GaN or GaAs after epitaxial growth and electrode manufacturing, the Wafer is attached with a blue glue film, and then single LED chips arranged in a matrix form are formed after laser cutting or blade cutting and are uniformly distributed on the bonding surface of the blue UV glue film. After the LED chips are screened out as defective products through point measurement, the rest of the defective products are Wafer sheets to be transferred, or Wafer sheets which are tested, sorted and rearranged by a chip factory can be used as the LED chips. The outer layer of the Wafer electrode is made of tin, the thickness of the outer layer is about 5-30 mu m, the Wafer is uniformly distributed on the UV adhesive film, and the electrode faces upwards.

The entire Wafer then needs to be transferred to the corresponding substrate pad.

The first step is as follows: and (3) uniformly pulling the rows and columns of the single Wafer on the Wafer by a certain distance through a controllable and accurate-expansion Wafer expanding machine, so as to facilitate subsequent pitch adjustment.

The second step is that: the micro vacuum sucker is made of alloy metals such as superhard tungsten steel and the like, the required smoothness and flatness of the surface of the sucker reach 0.5-5 mu m, and the ideal condition is that the smoothness and flatness are controlled within 2 mu m; huge micropores are densely distributed on the sucker, the aperture is 1-20 mu m, the hole-to-hole distance is controlled to be 5-20 mu m, and the proper aperture and hole distance are selected according to the size of the wafer to ensure that each wafer can correspond to about 20 micropores so as to ensure that the wafer can be effectively adsorbed on the disk surface and the position is kept fixed; the chuck is vacuumized to above-70 Kpa to ensure each wafer to be firmly adsorbed at the corresponding position.

The third step: and fixing the expanded UV Wafer on a UV frame, vertically downwards aligning to a micro vacuum chuck (the surface of the micro vacuum chuck is upward), slowly enabling the UV adhesive film Wafer to be close to the surface of the micro vacuum chuck, and opening the vacuum.

The fourth step: and irradiating UV light from the back of the UV adhesive film, adjusting the power of the UV light to ensure that the UV adhesive force is reduced enough to release a single wafer, absorbing the wafer onto the surface of the sucking disc by micro vacuum after the wafer adhesive force is reduced, and separating the wafer from the UV adhesive film. The wafer electrode faces upwards to avoid scratching the electrode when the pitch is adjusted in the next step; the electrode faces the suction disc surface.

The fifth step: and adjusting the row and column pitch of the chips by using a pitch adjusting device to enable the chip pitch to be consistent with the matrix row and column of the substrate.

And a sixth step: and pouring the UV adhesive film again, and pouring the chip electrode to the surface of the UV adhesive film. The method comprises the following steps of heating and tightly attaching a UV adhesive film to a convex point carrier plate by adopting a transparent glass convex point carrier plate, enabling the convex point carrier plate to drive the UV adhesive film to be close to a micro vacuum chuck wafer, enabling the back surface of the wafer to be tightly attached to the bonding surface of the UV adhesive film, reducing vacuum until the wafer is closed, enabling the whole wafer to be transferred to the convex point carrier plate, and enabling each wafer to correspond to a convex point; the electrodes face upward.

The seventh step: according to the tin spraying process for the surface of the fixed welding spot of the substrate wafer, the thickness of the tin layer is 5-30 mu m, the wafer is fixed with bonding glue at the middle point of the two fixed welding spots of the wafer, and the glue amount is controlled within the range of ensuring that the wafer cannot contact the welding spot after being attached.

Eighth step: the salient points on the UV adhesive film of the salient point carrier plate and the wafer are correspondingly and flatly pasted to the wafer fixing positions on the substrate, so that the wafer fixing adhesive glue dotted on the substrate at the middle position of the wafer electrode surface is adhered, two tin electrodes of the wafer correspond to the substrate wafer fixing position tin spraying welding points, and the error is +/-5 mu m; the chip electrode is contacted with each chip fixed welding point of the substrate.

The ninth step: and opening UV light and adjusting UV power to irradiate the transparent salient point carrier plate, so that the adhesive force of the UV adhesive film is reduced to be smaller than the adhesive force of the wafer adhesive glue at the fixed position of the wafer and the substrate wafer, and the whole wafer electrode faces to the welding spot and is transferred to the corresponding position of the substrate. Repeating the above steps, and continuing to transfer other wafers.

The tenth step: adjusting the space and the laser power of a plurality of parallel laser beams of a laser welding head to enable the plurality of lasers of the laser head to be aligned to a wafer electrode on a substrate, accurately driving the laser welding head by adopting a high-speed magnetic suspension motor, matching with image recognition and positioning, instantly heating the plurality of laser beams to 250-350 ℃ at the wafer electrode to enable the wafer electrode tin to be melted and then to be melted and connected with the substrate welding position tin, adjusting the welding time of each electrode for about 10-60 ms, and forming a display device finished product after welding.

In the pitch adjusting device used in the fifth step, as shown in fig. 1 to 4, the servo motor 1 is mounted on the motor mounting plate 2, and the motor mounting plate 2, the upper baffle 5, the lower baffle 4, and the right baffle 16 form a fixed frame. A motor output plate 07 is arranged on one side in the fixed frame, the motor output plate 07 is connected to a screw rod 7, the screw rod 7 is connected with a servo motor 1, two track plates 06 are arranged between an upper baffle 5 and a lower baffle 4, and the two track plates 06 are arranged on two sides of the screw rod 7; a track groove 09 is formed in the middle of the track plate 06. The servo motor 1 drives the screw rod 7 to rotate through the coupler, the motor output plate 07 is installed on the screw rod 7, and the servo motor 1 drives the motor output plate 07 to move left and right.

The pitch adjusting device further comprises a reticular telescopic arm and a plurality of pitch execution plates 11, wherein the reticular telescopic arm comprises a driving joint 100, six sliding joints 110 and a main fixed joint 130 which are sequentially connected with the track groove 09 in a sliding manner; a reticular mechanical arm 150 is connected among the driving joint 100, the six sliding joints 110 and the main fixed joint 130, and the reticular mechanical arm 150 extends and retracts through a plurality of intermediate joints 120; the driving joint 100 is connected with the motor output plate 07, and the main fixed joint 130 is arranged on the right baffle plate 05 through the fixing plate 140. The active joint 100, the sliding joint 110 and the main fixed joint 130 all carry a pitch execution plate 11. The motor output plate 07 is connected to the net-shaped telescopic arm through a driving joint 100.

The servo motor 1 outputs force to drive the transmission screw rod 7 to move, the screw rod 7 drives the motor output plate 07 to move left and right, and the motor output plate 07 further pushes the reticular telescopic arm to move left and right to drive the pitch execution plate 11 to move, so that the pitch between the pitch execution plates 11 is changed.

The pitch adjusting device is integrally mounted on the wafer-patting-aligning movement mechanism 20, and is driven by the wafer-patting-aligning servomotor 19, and the pitch adjusting device is driven by the wafer-patting-aligning movement mechanism 20 to reciprocate left and right. Thereby driving the pitch adjusting device to beat the wafer at the proper pitch. The wafer-aligning motion mechanism 20 is a conventional mechanical device that can vibrate or rock left and right.

The servo motor 1 drives the motor output plate 07 to move through the screw rod 7, the motor output plate 07 drives the driving joint 100 to move along the track groove 09 of the track plate 06, the mesh-shaped mechanical arm 150 and the sliding joint 110 are driven to move along the track groove 09, the main fixed joint 130 is fixed by the fixing plate 140 and is fixed, the servo motor 1 drives the mesh-shaped mechanical arm 150 to move in a stretching mode, and the mesh-shaped mechanical arm 150 drives the pitch execution plate 11 to change different pitches. When the servo motor 1 pulls the mesh robot arm 150 to move left, the pitch execution plate 11 becomes larger in pitch, which is shown as a in fig. 2; when the servo motor 1 pushes the pitch execution plate 11 to move right, the pitch of the pitch execution plate 11 becomes smaller step by step, and when the pitch execution plate moves to the middle, as shown in fig. 3, the distance is b; when the servo motor 1 pushes the motor output plate 07 to drive the mesh robot 150 to move to the rightmost side, the pitch of the pitch execution plate 11 is the smallest, as shown in fig. 4, c, and the pitch is a > b > c in sequence.

When the precise wafer aligning mechanism is used, when the wafer is precisely expanded to a required distance, after the wafer is sucked by the micro vacuum chuck, the motor drives the output plate 07 to drive the mesh-shaped mechanical arm 150 and the pitch execution plate 11 to adjust to a proper distance, so that the pitch execution plate 11 can be inserted into the row or column interval of the wafer on the micro vacuum chuck, and then the wafer aligning servo motor 19 drives the wafer aligning motion mechanism 20 to drive the pitch adjustment device to move integrally to align the rows or columns of the wafer. And then the servo motor 1 of the pitch adjusting device drives the pitch executing plate 11 to adjust to the required pitch.

The above description is for further details of the present invention with reference to specific preferred embodiments, and it should not be understood that the embodiments of the present invention are limited thereto, and it will be apparent to those skilled in the art that the present invention can be implemented in a plurality of simple deductions or replacements without departing from the scope of the present invention, and all should be considered as belonging to the present invention, which is determined by the appended claims.

Claims

1. A pitch adjusting device for transferring a microchip is characterized by comprising a fixed frame, wherein a pitch adjusting mechanism capable of moving left and right is arranged in the fixed frame, the pitch adjusting mechanism comprises a net-shaped telescopic arm and a plurality of pitch execution plates, one side in the fixed frame is provided with a force output plate, the force output plate is connected to a lead screw, the lead screw is connected with a driving device, and two sides of the lead screw are provided with tracks; the reticular telescopic arm is connected with the track in a sliding manner and the output plate;

the netted telescopic arm comprises a driving joint, a plurality of sliding joints and a main fixed joint which are sequentially connected onto the track in a sliding mode, the netted arm is connected among the plurality of sliding joints, and the netted arm stretches through a plurality of middle joints; the driving joint is connected with the output plate, and the main fixed joint is fixedly connected with one end far away from the output plate; the active joint, the sliding joint and the main fixed joint all carry a pitch execution plate; the distance between two adjacent pitch-executing plates for pitch adjustment inserted into the rows or columns of the microchips can be extended and contracted equidistantly by the driving means.

2. The pitch adjusting apparatus for microchip transfer as set forth in claim 1, wherein the main fixing joint is provided on the fixing frame through a fixing plate.

3. The pitch adjusting device for microchip transfer according to claim 1 or 2, wherein the pitch adjusting device is connected with a patting and aligning mechanism, and the patting and aligning mechanism is used for driving the pitch adjusting device to move left and right integrally to patte the microchip.