CN215091441U - Titanium alloy drilling system utilizing infrared picosecond ultrafast laser - Google Patents
Titanium alloy drilling system utilizing infrared picosecond ultrafast laser Download PDFInfo
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- CN215091441U CN215091441U CN202120613625.0U CN202120613625U CN215091441U CN 215091441 U CN215091441 U CN 215091441U CN 202120613625 U CN202120613625 U CN 202120613625U CN 215091441 U CN215091441 U CN 215091441U
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Abstract
The utility model provides an utilize titanium alloy drilling system of infrared picosecond ultrafast laser, it includes: a laser light source configured to emit infrared picosecond ultrafast laser light; a first laser mirror configured to reflect laser light emitted from the laser light source; a second laser mirror configured to reflect the laser light reflected by the first laser mirror so that the laser light reflected by the second laser mirror is parallel to the incident laser light of the first laser mirror; a laser conversion unit configured to change a polarization state, beam circularity, spot size, energy distribution, and divergence angle of the laser light reflected by the second laser mirror; and a multi-axis galvanometer and focus unit configured to: and changing the incidence angle of the laser passing through the laser conversion unit at the titanium alloy membrane to be processed, and focusing the laser to perform drilling processing.
Description
Technical Field
The utility model relates to an utilize processing of ultrafast laser, specifically, relate to the titanium alloy drilling system that utilizes infrared picosecond ultrafast laser.
Background
At present, in a processing technology using ultrafast laser, a nanosecond laser is generally used for processing a material, and the nanosecond laser means that the action time of a single pulse of the laser is in a nanosecond range. The processing method using the nanosecond laser is to irradiate the surface of a material with a high-energy laser beam after being focused so as to generate a physical or chemical reaction, and essentially, the processing method using the nanosecond laser is a thermal processing method, but the action time is short and is usually within a range of several nanoseconds, so that the area of the material affected by heat is not very large, and the processing effect and the processing speed can be ensured.
Besides nanosecond laser, picosecond laser also has ultrashort pulse time, the action time of single pulse of the picosecond laser is in a picosecond range, and the processing mode of the picosecond laser has smaller thermal influence on materials and even can be ignored. Compared with the processing by using nanosecond laser, no recasting material is used in the whole processing process, the processing process is clean, and the dependence of the absorption of laser energy on the material or wavelength is smaller, so that the method is more suitable for the field of micro-precision laser processing.
Because titanium alloy has the characteristic of high strength, at present, nanosecond laser is generally used for drilling aiming at the drilling processing of the titanium alloy membrane, however, the drilling processing of the titanium alloy membrane by using nanosecond laser has the following problems: 1) the diameter of the processed hole is more than 0.15mm, and the micro-hole processing requirement that the diameter of the hole is less than 0.1mm cannot be met; 2) the problem of relatively large thermal influence on the material is that the material has a black burning phenomenon; 3) the use of nanosecond laser machining affects the performance of the product and there are machining residues.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem that exists in the titanium alloy drilling processing, the utility model provides an utilize titanium alloy drilling processing system of infrared picosecond ultrafast laser, it includes: a laser light source configured to emit infrared picosecond ultrafast laser light; a first laser mirror configured to reflect laser light emitted from the laser light source; a second laser mirror configured to reflect the laser light reflected by the first laser mirror so that the laser light reflected by the second laser mirror is parallel to the incident laser light of the first laser mirror; a laser conversion unit configured to change a polarization state, beam circularity, spot size, energy distribution, and divergence angle of the laser light reflected by the second laser mirror; and a multi-axis galvanometer and focus unit configured to: and changing the incidence angle of the laser passing through the laser conversion unit at the titanium alloy membrane to be processed, and focusing the laser to perform drilling processing.
Optionally, the laser conversion unit includes: a first conversion device configured to change a spot size, beam circularity, and polarization state of the laser light reflected by the second laser mirror; and a second conversion device configured to change an energy distribution and a divergence angle of the laser light output by the first conversion device.
Optionally, the system further comprises: a third laser mirror configured to reflect the laser light output from the first conversion device; and a fourth laser mirror configured to reflect the laser light reflected by the third laser mirror so that the laser light reflected by the fourth laser mirror is parallel to the incident laser light of the third laser mirror.
Optionally, the first transformation device includes: a beam expander configured to change a spot size of the laser light reflected by the second laser mirror; and a polarizer configured to change a beam roundness and a polarization state of the laser light passing through the beam expander.
Optionally, the second transformation means comprises: a binary optical conversion element configured to change an energy distribution of the laser light reflected by the fourth laser mirror from a gaussian distribution to a flat-top distribution; and a wave plate configured to change a divergence angle of the laser light passing through the binary optical conversion element.
Optionally, the system further comprises: a processing jig configured to fix a titanium alloy diaphragm to be processed; and a movement guide configured to enable the machining jig to move.
Optionally, the power of the laser emitted by the laser light source is 100W.
The utility model discloses an utilize titanium alloy drilling system of infrared picosecond ultrafast laser can satisfy the diameter of hole < 0.1 mm's processing demand to the heat influence to the material is less, and the course of working is clean, can not appear processing residue.
Drawings
Fig. 1 is a schematic diagram of a titanium alloy drilling system utilizing an infrared picosecond ultrafast laser, according to an exemplary embodiment of the present invention;
fig. 2 is a schematic diagram of a laser light path in a titanium alloy drilling processing system utilizing an infrared picosecond ultrafast laser, according to an exemplary embodiment of the present invention; and
fig. 3 is an effect diagram of a hole of a titanium alloy diaphragm processed using a titanium alloy drilling system using an infrared picosecond ultrafast laser according to an exemplary embodiment of the present invention.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Exemplary embodiments of the present invention will be described in detail below with reference to fig. 1 to 3.
According to the utility model discloses a titanium alloy drilling system 1 of utilizing infrared picosecond ultrafast laser of exemplary embodiment can include: a laser light source 10, a first laser mirror 20, a second laser mirror 30, a laser conversion unit 40, and a multi-axis galvanometer and focusing unit 50.
In this embodiment, the laser light source 10 may emit an infrared picosecond ultrafast laser, and in this embodiment, the power of the infrared picosecond ultrafast laser may be set to 100W.
In this embodiment, the first laser reflector 20 and the second laser reflector 30 may be provided, the first laser reflector 20 may reflect the laser light emitted from the laser light source 10, the reflected laser light may be set to be 90 ° to the incident laser light, that is, the first laser reflector 20 may be arranged at an incident angle of 45 °, or the first laser reflector may be arranged at an incident angle of other values according to actual needs. The second laser mirror 30 may further reflect the laser beam reflected by the first laser mirror 20, and the second laser mirror 30 may be disposed such that the reflected laser beam is parallel to the incident laser beam of the first mirror 20.
The laser conversion unit 40 may change the polarization state, beam roundness, spot size, energy distribution, and divergence angle of the laser light reflected by the second laser mirror 30. In the present embodiment, the laser conversion unit 40 may include a first conversion device 41 and a second conversion device 42, specifically, the first conversion device 41 may change the spot size of the laser light by the beam expander 411, and change the beam circularity and the polarization state of the laser light by the polarizer 412. The second conversion device 42 can change the energy distribution of the laser light output from the first conversion device 41 from a gaussian distribution to a flat-top distribution by the binary optical conversion element 421, and change the divergence angle of the laser light by the wave plate 422.
In addition, in the present embodiment, a third laser mirror 60 and a fourth laser mirror 70 may be further provided between the first conversion device 41 and the second conversion device 42. Specifically, the third laser reflector 60 may reflect the laser light (in the present embodiment, the laser light passing through the polarizer 412) output by the first conversion device 41, and, similarly to the first laser reflector 20 described above, may be arranged such that the reflected laser light is at 90 ° to the incident laser light, that is, the third laser reflector 60 is arranged at an incident angle of 45 °. The fourth laser mirror 70 may further reflect the laser light reflected by the third laser mirror 60, and the fourth laser mirror 70 may be disposed such that the reflected laser light is parallel to the incident laser light of the third mirror 60, similarly to the second laser mirror 30.
The direction of the laser light reflected by the fourth laser mirror 70 is the same as the direction of the laser light emitted by the laser light source 10 as a whole. In the present embodiment, four laser mirrors are provided to change the laser transmission path so that the layout of the hardware can be easily realized, but the present invention is not limited thereto, and a different number of laser mirrors may be provided according to actual needs to realize different laser transmission paths.
Further, the multi-axis galvanometer and focusing unit 50 in the system 1 of the present embodiment may change the incident angle of the laser light (in the present embodiment, the laser light passing through the wave plate 422) passing through the laser conversion unit 40 at the titanium alloy diaphragm to be processed, and focus the laser light to perform the drilling process. According to actual requirements, the inner wall of the hole formed after machining can be vertical or inclined to different angles by changing the incidence angle of laser.
In addition, in the present embodiment, the titanium alloy drilling system 1 using the infrared picosecond ultrafast laser may further include a machining jig 80 and a moving guide 90 (not shown). The processing fixture 80 can fix the titanium alloy membrane to be processed, and the motion guide rail 90 can enable the processing fixture 80 to move, so that the processing fixture can be matched with the moving laser, and the processing effect is guaranteed.
In the titanium alloy drilling system 1 using the infrared picosecond ultrafast laser according to the present embodiment, in order to optimize the overall layout of the hardware of the system 1, the respective optical elements of the first laser mirror 20, the second laser mirror 30, the third laser mirror 60, the fourth laser mirror 70, and the laser conversion unit 40 may be integrated into one module, which may be referred to as an optical path adjusting and transmitting module 120 in the present embodiment.
Likewise, the multi-axis galvanometer and focus unit 50 may be integrated into a single module, which in this embodiment may be referred to as the multi-axis galvanometer and focus module 100.
Further, the machining jig 80 and the moving rail 90 may also be integrated into one module, and in the present embodiment, the module may be referred to as a machining jig and moving platform module 110.
The titanium alloy drilling system using the infrared picosecond ultrafast laser according to the embodiment can meet the machining requirement that the diameter of the hole is less than 0.1mm, has small thermal influence on the material, and can form a hole with high dimensional accuracy without generating machining residues.
While the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and those skilled in the art can make various modifications without departing from the spirit and scope of the present invention.
Claims (7)
1. A titanium alloy drilling system using infrared picosecond ultrafast laser, comprising:
a laser light source configured to emit infrared picosecond ultrafast laser light;
a first laser mirror configured to reflect laser light emitted from the laser light source;
a second laser mirror configured to reflect the laser light reflected by the first laser mirror so that the laser light reflected by the second laser mirror is parallel to the incident laser light of the first laser mirror;
a laser conversion unit configured to change a polarization state, beam circularity, spot size, energy distribution, and divergence angle of the laser light reflected by the second laser mirror; and
a multi-axis galvanometer and focus unit configured to: and changing the incidence angle of the laser passing through the laser conversion unit at the titanium alloy membrane to be processed, and focusing the laser to perform drilling processing.
2. The titanium alloy drilling system using infrared picosecond ultrafast laser according to claim 1, wherein said laser conversion unit comprises:
a first conversion device configured to change a spot size, beam circularity, and polarization state of the laser light reflected by the second laser mirror; and
a second conversion device configured to change an energy distribution and a divergence angle of the laser light output by the first conversion device.
3. The titanium alloy drilling system using infrared picosecond ultrafast laser according to claim 2, further comprising:
a third laser mirror configured to reflect the laser light output from the first conversion device; and
and the fourth laser reflector is configured to reflect the laser light reflected by the third laser reflector so that the laser light reflected by the fourth laser reflector is parallel to the incident laser light of the third laser reflector.
4. The titanium alloy drilling system using infrared picosecond ultrafast laser according to claim 2, wherein said first transformation means comprises:
a beam expander configured to change a spot size of the laser light reflected by the second laser mirror; and
a polarizer configured to change a beam roundness and a polarization state of the laser light passing through the beam expander.
5. The titanium alloy drilling system using infrared picosecond ultrafast laser according to claim 3, wherein said second transformation means comprises:
a binary optical conversion element configured to change an energy distribution of the laser light reflected by the fourth laser mirror from a gaussian distribution to a flat-top distribution; and
a wave plate configured to change a divergence angle of the laser light passing through the binary optical conversion element.
6. The titanium alloy drilling system using infrared picosecond ultrafast laser according to claim 1, further comprising:
a processing jig configured to fix a titanium alloy diaphragm to be processed; and
a motion guide configured to enable the machining jig to move.
7. The system of claim 1, wherein the laser source emits laser light having a power of 100W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120613625.0U CN215091441U (en) | 2021-03-26 | 2021-03-26 | Titanium alloy drilling system utilizing infrared picosecond ultrafast laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120613625.0U CN215091441U (en) | 2021-03-26 | 2021-03-26 | Titanium alloy drilling system utilizing infrared picosecond ultrafast laser |
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| Publication Number | Publication Date |
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| CN215091441U true CN215091441U (en) | 2021-12-10 |
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| CN202120613625.0U Active CN215091441U (en) | 2021-03-26 | 2021-03-26 | Titanium alloy drilling system utilizing infrared picosecond ultrafast laser |
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2021
- 2021-03-26 CN CN202120613625.0U patent/CN215091441U/en active Active
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