CN215073121U - Novel take PCB board in leak protection gong groove - Google Patents
Novel take PCB board in leak protection gong groove Download PDFInfo
- Publication number
- CN215073121U CN215073121U CN202121203920.5U CN202121203920U CN215073121U CN 215073121 U CN215073121 U CN 215073121U CN 202121203920 U CN202121203920 U CN 202121203920U CN 215073121 U CN215073121 U CN 215073121U
- Authority
- CN
- China
- Prior art keywords
- layer
- insulating layer
- pcb board
- gong
- leak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 17
- 230000007246 mechanism Effects 0.000 claims abstract description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 6
- 239000005011 phenolic resin Substances 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 3
- 239000011368 organic material Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a novel take PCB board in leak protection gong groove, its technical scheme is: including the PCB board body, this internal portion of PCB board is equipped with constitutes the mechanism, it includes the component layer to constitute the mechanism, component layer bottom is equipped with insulating layer one, insulating layer one bottom is equipped with the power supply layer, the inside a plurality of power cords that inlay of power supply layer, power supply layer bottom is equipped with insulating layer two, two bottoms of insulating layer are equipped with the signal layer, the inside wire that inlays of signal layer is equipped with, the signal layer bottom is equipped with insulating layer three, the beneficial effects of the utility model are that: through increasing the power plane, the organic material phenolic resin material that the power plane adopted has to have good resistance to high temperature, water, still is difficult for burning, and acid resistance is also better, can long-time use, and the inside wire 8 of signal layer 7 can be with the fine output of the signal of required output, and the required information of output that inside wire can be fine, has avoided a large amount of wiring.
Description
Technical Field
The utility model relates to a PCB board technical field, concretely relates to novel take PCB board in leak protection gong groove.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole product are facilitated.
The prior art has the following defects: when the existing circuits are electrically connected, complex wiring is mostly needed, a large amount of assembly and welding are needed, the labor intensity of workers is greatly increased, meanwhile, the size of the whole machine is large, the cost of products can be increased, the quality and the reliability of motor equipment are reduced, and meanwhile, when a fault occurs, a large amount of disassembly is needed to maintain, a large amount of working time is wasted, and the working efficiency of a PCB (printed circuit board) is reduced.
Therefore, the invention is necessary to invent a novel PCB with leak-proof gong-groove.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model provides a novel take PCB board in leak protection gong groove constitutes the mechanism through increasing to solve the cost that can increase the product, reduced electrical equipment's quality and reliability, when breaking down, need carry out a large amount of demolishments simultaneously and go to maintain, wasted a large amount of operating time, reduced the problem of the work efficiency of PCB board.
In order to achieve the above object, the present invention provides the following technical solutions: a novel PCB with leak-proof gong grooves comprises a PCB body, wherein a forming mechanism is arranged inside the PCB body;
the mechanism comprises a component layer, an insulating layer I is arranged at the bottom of the component layer, a power layer is arranged at the bottom of the insulating layer, a plurality of power lines are embedded in the power layer, an insulating layer II is arranged at the bottom of the power layer, a signal layer is arranged at the bottom of the insulating layer II, a wire is embedded in the signal layer, an insulating layer III is arranged at the bottom of the signal layer, and a solder mask is arranged at the bottom of the insulating layer III.
Preferably, the element layer is made of an inorganic aluminum material.
Preferably, the first insulating layer, the second insulating layer and the third insulating layer are made of glass fiber materials.
Preferably, the power supply layer is made of organic phenolic resin material.
Preferably, the signal layer is made of an epoxy material.
Preferably, the solder mask layer is made of solder mask paint, and a pad is embedded in the solder mask layer.
Preferably, two anti-leakage gong grooves are formed in the PCB body.
Preferably, a plurality of through holes are formed in the PCB body.
The utility model has the advantages that:
1. the utility model discloses an increase the power plane, the organic material phenolic resin material that the power plane adopted has to have fine resistance to high temperature, water, still difficult burning, and acid resistance is also better, can long-time use, and wire 8 inside signal layer 7 can be with the fine output of the signal that needs to be exported, and the required information of output that the wire of inside can be fine, has avoided a large amount of wiring, has reduced artifical intensity of labour;
2. the utility model discloses a constitute the mechanism, can make the complete machine volume diminish, reduced the cost of production, improved electrical equipment's reliability and quality, and after breaking down, can be quick demolish the change, improved the work efficiency of PCB board, the emergence of the leak protection gong groove of seting up can prevent to leak the gong condition in the PCB board course of working, the efficiency that has improved PCB board processing has simple structure, convenient to use, excellent in use effect's advantage.
Drawings
Fig. 1 is a schematic view of the overall structure provided by the present invention;
fig. 2 is a front sectional view provided by the present invention;
fig. 3 is an enlarged view of a point a in fig. 2 according to the present invention;
in the figure: the PCB comprises a PCB body 1, a component layer 2, an insulating layer I3, a power supply layer 4, a power line 5, an insulating layer II 6, a signal layer 7, a lead 8, an insulating layer III 9, a solder mask layer 10, a bonding pad 11, a leakage-proof routing groove 12 and a via hole 13.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention. Referring to the attached drawings 1-3, the utility model provides a pair of novel take PCB board of leak protection gong groove, including PCB board body 1, its characterized in that: a composition mechanism is arranged inside the PCB body 1;
the component mechanism comprises an element layer 2, wherein a first insulating layer 3 is arranged at the bottom of the element layer 2, a power supply layer 4 is arranged at the bottom of the first insulating layer 3, a plurality of power wires 5 are embedded in the power supply layer 4, a second insulating layer 6 is arranged at the bottom of the power supply layer 4, a signal layer 7 is arranged at the bottom of the second insulating layer 6, a lead 8 is embedded in the signal layer 7, a third insulating layer 9 is arranged at the bottom of the signal layer 7, and a solder mask 10 is arranged at the bottom of the third insulating layer 9;
further, the element layer 2 is made of an inorganic aluminum material;
further, the first insulating layer 3, the second insulating layer 6 and the third insulating layer 9 are made of glass fiber materials;
further, the power layer 4 is made of an organic phenolic resin material;
further, the solder mask layer 10 is made of a solder mask paint material, and a pad 11 is embedded in the solder mask layer 10;
further, two anti-leakage routing grooves 12 are formed in the PCB body 1.
Further, a plurality of via holes 13 are formed in the PCB body 1.
The utility model discloses a use as follows: when the utility model is used, when the PCB is put into use, the element layer 2 can well install the needed electric elements on the top of the PCB body 1, the inorganic material aluminum material has the effects of stable property, corrosion resistance and high temperature resistance, and the electric elements can well realize the needed transmission, the insulation layer one 3 can prevent the electric elements from short circuit with the power line 5 in the power layer 4, the organic material phenolic resin material adopted by the power layer has good resistance to high temperature and water, is not easy to burn, has good acid resistance, the insulation layer two 6 can well isolate the signal layer 7 and the power layer 4, the lead 8 in the signal layer 7 can well output the needed output signals, the epoxy resin material has various patterns, the effect of convenient curing, the insulation layer three 9 can well isolate the signal layer 7 and the solder mask 10, the solder resist layer 10 has the pads 11 that can effectively solder the circuit and the components, and the solder resist paint can prevent the unnecessary solder from being soldered when soldering.
The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of the claimed invention as far as possible.
Claims (8)
1. The utility model provides a novel take PCB board of leak protection gong groove, includes PCB board body (1), its characterized in that: a composition mechanism is arranged inside the PCB body (1);
constitute mechanism and include component layer (2), component layer (2) bottom is equipped with insulating layer (3), insulating layer (3) bottom is equipped with power strip (4), power strip (4) inside is inlayed and is equipped with a plurality of power cords (5), power strip (4) bottom is equipped with insulating layer two (6), insulating layer two (6) bottom is equipped with signal layer (7), signal layer (7) inside is inlayed and is equipped with wire (8), signal layer (7) bottom is equipped with insulating layer three (9), insulating layer three (9) bottom is equipped with solder mask (10).
2. The novel PCB board of claim 1 with leak-proof gong-slot is characterized in that: the element layer (2) is made of an inorganic aluminum material.
3. The novel PCB board of claim 1 with leak-proof gong-slot is characterized in that: the first insulating layer (3), the second insulating layer (6) and the third insulating layer (9) are made of glass fiber materials.
4. The novel PCB board of claim 1 with leak-proof gong-slot is characterized in that: the power supply layer (4) is made of organic phenolic resin materials.
5. The novel PCB board of claim 1 with leak-proof gong-slot is characterized in that: the signal layer (7) is made of epoxy resin material.
6. The novel PCB board of claim 1 with leak-proof gong-slot is characterized in that: the solder mask layer (10) is made of solder mask paint, and a pad (11) is embedded in the solder mask layer (10).
7. The novel PCB board of claim 1 with leak-proof gong-slot is characterized in that: two anti-leakage routing grooves (12) are formed in the PCB body (1).
8. The novel PCB board of claim 1 with leak-proof gong-slot is characterized in that: a plurality of through holes (13) are formed in the PCB body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121203920.5U CN215073121U (en) | 2021-06-01 | 2021-06-01 | Novel take PCB board in leak protection gong groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121203920.5U CN215073121U (en) | 2021-06-01 | 2021-06-01 | Novel take PCB board in leak protection gong groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073121U true CN215073121U (en) | 2021-12-07 |
Family
ID=79209284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121203920.5U Expired - Fee Related CN215073121U (en) | 2021-06-01 | 2021-06-01 | Novel take PCB board in leak protection gong groove |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073121U (en) |
-
2021
- 2021-06-01 CN CN202121203920.5U patent/CN215073121U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211207 |