CN218450656U - Module packaging structure convenient to repair - Google Patents
Module packaging structure convenient to repair Download PDFInfo
- Publication number
- CN218450656U CN218450656U CN202222149712.2U CN202222149712U CN218450656U CN 218450656 U CN218450656 U CN 218450656U CN 202222149712 U CN202222149712 U CN 202222149712U CN 218450656 U CN218450656 U CN 218450656U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- repair
- structure convenient
- packaging structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
The utility model discloses a module packaging structure convenient to reprocess, including first circuit board, metal level and second circuit board, the second surface of first circuit board with the first surface face of metal level is connected, the second surface of second circuit board with the second surface face of metal level is connected, the via hole has on the second circuit board, the downthehole conducting material that sets up passes through, it is used for exposing to have on the metal level the through-hole of second circuit board via hole department, the first surface of second circuit board passes through downthehole conducting material passes the through-hole with the first surface of first circuit board flies the line connection. The utility model discloses a module packaging structure low cost and easy maintenance.
Description
Technical Field
The utility model relates to a semiconductor processing technology field especially relates to a module packaging structure convenient to reprocess.
Background
The circuit module design often adopts an H-shaped upper and lower cavity structure, wherein the upper and lower cavities are respectively used for placing circuit boards (PCB boards) with different functions, for example, the lower cavity is used for placing a direct current and a control circuit, and the upper cavity is used for placing a radio frequency board (microchip). The traditional method of electricity connection between the PCB board in the upper and lower cavity adopts the glass insulator connection of installing on cavity metal partition wall, record in patent (CN 208078224U) for example the utility model relates to an electronic product technical field specifically provides a glass insulator connector and electronic equipment, the little package assembly and the signal of telecommunication transmission of mainly used Ka millimeter wave subassembly, glass insulator is equipped with a plurality of through-holes, each inner conductor and each through-hole one-to-one wear to locate the through-hole and fix at the through-hole, and each conductor all has first, two connection end, first, two connection end all expose outside glass insulator, each first connection end part is connected with a first connecting wire respectively, each second connection end is connected with a second connecting wire respectively. The glass insulator connector is applied to electronic equipment, the other end of each first connecting wire is connected to the first circuit board, the other end of each second connecting wire is connected to the second circuit board, and the multi-link electric signals between the first circuit board and the second circuit board are jointly transmitted. However, the glass insulator connector has high installation accuracy requirements and a complex process. In addition, the cost of the glass insulator is high, so that the total cost of module assembly is further increased; and also causes problems such as reliability reduction. When the circuit board needs to be replaced, the rework process is quite complicated, and especially when a plurality of glass insulators are distributed on the cavity, the glass insulators are difficult to be removed after being welded and melted simultaneously.
Therefore, it is desired to solve the above problems.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: the utility model aims at providing a low cost's module packaging structure of being convenient for reprocess.
The technical scheme is as follows: for the purpose above, a module packaging structure convenient to reprocess, including first circuit board, metal level and second circuit board, the second surface of first circuit board with the first surface face of metal level is connected, the second surface of second circuit board with the second surface face of metal level is connected its characterized in that: the second circuit board is provided with a through hole, conductive substances are arranged in the through hole, a through hole used for exposing the through hole of the second circuit board is formed in the metal layer, and the first surface of the second circuit board is connected with the first surface of the first circuit board in a flying line mode through the conductive substances in the through hole and penetrating through the through hole.
The second circuit board is provided with a plurality of through holes, the through holes are exposed out of the through holes of the second circuit board, conductive substances are arranged in the through holes, and the first surface of the second circuit board is connected with the first surface of the first circuit board through the conductive substances in the through holes in a flying mode.
Preferably, the inner surface of the via hole is provided with a conductive coating as the conductive substance, the via hole on the second surface of the second circuit board is provided with a pad connected with the conductive coating, the pad on the second surface of the second circuit board is connected with the first surface of the second circuit board through the conductive coating, the through hole of the metal layer is exposed out of the pad on the second surface of the second circuit board, and the pad on the second surface of the second circuit board is connected with the first surface of the first circuit board by flying leads.
Furthermore, the via hole is filled with a conductive coating.
Furthermore, the conductive substance is a metal rod, a first end of the metal rod penetrates through the via hole, is inserted into the through hole, is insulated from the metal layer and is connected with the first surface of the first circuit board through a flying wire, and a second end of the metal rod protrudes out of the first surface of the second circuit board and is connected with the first surface of the second circuit board.
Preferably, the metal rod is provided with a step surface, and the step surface is in contact with the first surface of the second circuit board.
Furthermore, the metal rod is fixed with the second circuit board through soldering tin.
Furthermore, the through hole is filled with non-conductive silica gel to fix the metal rod and seal the through hole.
Preferably, the portable electronic device further comprises a housing, the first circuit board, the metal layer and the second circuit board are arranged in the housing, the metal layer divides the housing into a first cavity and a second cavity, the first circuit board is located in the first cavity, and the second circuit board is located in the second cavity.
Furthermore, the first circuit board and the second circuit board are multilayer boards, and the first surface of the second circuit board is a surface which is covered with a circuit on any layer of the multilayer board and is not in direct contact with the metal layer.
Has the advantages that: compared with the prior art, the utility model has the advantages of it is following: the utility model discloses cancel the insulator, utilize to open the through-hole on the metal level, make the conducting material of second circuit board through-hole department expose, recycle the flying wire and connect the direct first surface with first circuit board and be connected with conducting material, realize switching on of first circuit board and second circuit board, the utility model discloses a module packaging structure low cost and easy maintenance are applicable to under direct current biasing, low frequency signal and the control signal transmission's the use scene.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is another schematic structural diagram of embodiment 1 of the present invention;
fig. 3 is a schematic structural diagram of embodiment 3 of the present invention;
fig. 4 is a schematic structural diagram of embodiment 4 of the present invention;
fig. 5 is a schematic structural diagram of embodiment 5 of the present invention;
fig. 6 is a schematic structural diagram of embodiment 6 of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example 1
As shown in fig. 1, in embodiment 1, a module packaging structure convenient for repair includes a housing 1, a first circuit board 2, a metal layer 3, and a second circuit board 4, where the first circuit board 2, the metal layer 3, and the second circuit board 4 are all disposed in the housing 1, the metal layer 3 partitions the housing 1 into a first cavity and a second cavity, the first circuit board 2 is located in the first cavity, and the second circuit board 4 is located in the second cavity. The first circuit board 2 and the second circuit board 4 are circuit boards with different functions, wherein the first circuit board 2 may be a PCB board printed with a circuit or a bare chip, and the second circuit board 4 may be a PCB board printed with a circuit. The second surface of the first circuit board 2 is connected to the first surface of the metal layer 3, the second surface of the second circuit board 4 is connected to the second surface of the metal layer 3, the first surface of the first circuit board 2 is printed with a circuit or the first surface of the first circuit board 2 is the upper surface of a bare chip, and the first surface of the second circuit board 4 is printed with a circuit.
The second circuit board 4 printed with the circuit has a via 401, a conductive material is disposed in the via 401, specifically, a conductive coating 402 is disposed on an inner surface of the via 401, the conductive coating 402 may be a metal coating, the conductive coating 402 is a conductive material, a pad 403 is disposed at the via on the second surface of the second circuit board 4, the pad 403 is connected to the conductive coating 402, and the pad 403 is connected to the printed circuit on the first surface of the second circuit board 4 through the conductive coating 202.
The metal layer 3 has a through hole 301, the through hole 301 may be directly opened at a position corresponding to the through hole 401 of the second circuit board 4, the through hole 401 is directly exposed, and at this time, the through hole 301 directly exposes the pad 403 at the through hole on the second circuit board 4, as shown in fig. 1. Meanwhile, the through hole 301 and the via hole 401 may be arranged in a staggered manner, as shown in fig. 2, a gap for extending the pad 403 is formed on the second surface of the metal layer 3, so that the pad 403 can extend to the through hole 301, and the through hole 301 exposes the pad 403 at the via hole on the second circuit board 4. Wherein the pads 403 may be part of the circuitry on the second circuit board. The circuit or bare chip on the first surface of the first circuit board is connected with the pad flying wire on the second surface of the second circuit board, wherein the flying wire used for bonding connection passes through the through hole 301, the through hole 301 is selected according to the cleaver used in the bonding process, the size of the through hole 301 can ensure that the cleaver of the bonding machine can pass through smoothly, and the aperture of the through hole is at least 1mm larger than the diameter of the cleaver.
The utility model discloses a module packaging structure low cost and easy maintenance are applicable to under direct current biasing, low frequency signal and control signal transmission's the use scene.
Example 2
The structure of example 2 is the same as that of example 1, except that: the second circuit board 4 is provided with a plurality of via holes 401, the through holes 301 expose the via holes 401 of the second circuit board 4, conductive materials are disposed in the via holes 401, and the circuit on the first surface of the second circuit board 4 is connected to the circuit flying line on the first surface of the first circuit board 2 through the conductive materials in the via holes.
Example 3
Example 3 is the same as example 1, except that: as shown in fig. 3, the conductive coating fills the vias 401.
Example 4
Example 4 is the same as example 1, except that: as shown in fig. 4, a conductive material is disposed in the via hole 401, the conductive material is a metal rod 5, the metal rod 5 penetrates through the via hole 401, and the metal rod 5 is fixedly connected to the second circuit board 4 through a solder 6. The first end of the metal rod 5 passes through the via 401 and is inserted into the through hole 301, and the metal rod 5 is insulated from the metal layer 3, i.e. it is ensured that the metal rod 5 does not touch the metal layer 3 to cause a short circuit. The first end of the metal rod 5 is connected with the circuit or the bare chip on the first surface of the first circuit board 2 through a flying wire, the second end of the metal rod 5 protrudes out of the first surface of the second circuit board 5, and the second end of the metal rod 5 is connected with the circuit on the first surface of the second circuit board 4 through soldering 6.
Example 5
Example 5 is the same as example 4, except that: as shown in fig. 5, the metal rod 5 is provided with a step surface 501, the step surface 501 is in contact with the first surface of the second circuit board 4, and the step surface 501 of the metal rod 5 can control the verticality and depth of the metal rod installation.
Example 6
Example 6 is the same as example 4, except that: as shown in fig. 6, the through hole is filled with non-conductive silica gel 7, the non-conductive silica gel 7 can fix the metal rod 5, meanwhile, the non-conductive silica gel can effectively prevent the metal rod 5 from contacting the metal layer 3 to cause short circuit, the non-conductive silica gel further seals the through hole 301, and the air tightness of the first cavity and the second cavity is guaranteed.
Example 7
Example 7 is the same as example 1, except that: the first circuit board 2 and the second circuit board 4 are both multilayer boards, and the first surface of the second circuit board 2 is a surface which is covered with a circuit on any layer of the multilayer board and is not in direct contact with the metal layer 3.
Claims (10)
1. The utility model provides a module packaging structure convenient to reprocess, includes first circuit board, metal level and second circuit board, the second surface of first circuit board with the first surface face of metal level is connected, the second surface of second circuit board with the second surface face of metal level is connected its characterized in that: the second circuit board is provided with a through hole, conductive substances are arranged in the through hole, the metal layer is provided with a through hole used for exposing the through hole of the second circuit board, and the first surface of the second circuit board passes through the conductive substances in the through hole and penetrates through the through hole to be connected with the first surface of the first circuit board in a flying line mode.
2. The modular packaging structure convenient for repair of claim 1, wherein: the second circuit board is provided with a plurality of through holes, the through holes expose the through holes of the second circuit board, conductive substances are arranged in the through holes, and the first surface of the second circuit board is connected with the first surface of the first circuit board in a flying manner through the conductive substances in the through holes.
3. The module package structure convenient for repair of claim 1 or 2, wherein: the through hole inner surface is provided with conductive coating in order to be regarded as the conducting material, the via hole department of second circuit board second surface has the pad that is connected with conductive coating, the pad of second circuit board second surface passes through conductive coating is connected with second circuit board first surface, the through-hole of metal level exposes the pad of second circuit board second surface, the pad of second circuit board second surface with first circuit board first surface fly line is connected.
4. The modular packaging structure convenient to repair of claim 3, wherein: the conductive coating fills the via hole.
5. The module packaging structure convenient for repair according to claim 1 or 2, wherein: the conductive material is a metal rod, a first end of the metal rod penetrates through the via hole, is inserted into the through hole, is insulated with the metal layer and is connected with the first surface of the first circuit board through a flying wire, and a second end of the metal rod protrudes out of the first surface of the second circuit board and is connected with the first surface of the second circuit board.
6. The modular packaging structure convenient to repair of claim 5, wherein: the metal rod is provided with a step surface, and the step surface is in contact with the first surface of the second circuit board.
7. The modular packaging structure convenient to repair of claim 5, wherein: the metal rod is fixed with the second circuit board through soldering tin.
8. The modular packaging structure convenient to repair of claim 5, wherein: and non-conductive silica gel is filled in the through hole to fix the metal rod and seal the through hole.
9. The module packaging structure convenient for repair of claim 1 or 2, further comprising a housing, wherein the first circuit board, the metal layer and the second circuit board are all disposed in the housing, the metal layer divides the housing into a first cavity and a second cavity, the first circuit board is located in the first cavity, and the second circuit board is located in the second cavity.
10. The module package structure convenient for repair of claim 1 or 2, wherein: the first circuit board and the second circuit board are multilayer boards, and the first surface of the second circuit board is a surface which is covered with a circuit on any layer of the multilayer boards and is not in direct contact with the metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222149712.2U CN218450656U (en) | 2022-08-16 | 2022-08-16 | Module packaging structure convenient to repair |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222149712.2U CN218450656U (en) | 2022-08-16 | 2022-08-16 | Module packaging structure convenient to repair |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218450656U true CN218450656U (en) | 2023-02-03 |
Family
ID=85095482
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222149712.2U Active CN218450656U (en) | 2022-08-16 | 2022-08-16 | Module packaging structure convenient to repair |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218450656U (en) |
-
2022
- 2022-08-16 CN CN202222149712.2U patent/CN218450656U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100511814B1 (en) | Low cost, large scale rf hybrid package for simple assembly onto mixed signal printed wiring boards | |
| CN101416567B (en) | Relay substrate, method for manufacturing the relay substrate and three-dimensional circuit device using the relay substrate | |
| US7875811B2 (en) | High speed interposer | |
| US4851614A (en) | Non-occluding mounting hole with solder pad for printed circuit boards | |
| KR850008605A (en) | Printed Circuit Boards and Circuit Assemblies for Wireless Devices | |
| KR19990029348A (en) | Semiconductor devices | |
| KR100763059B1 (en) | Power delivery apparatus, systems, and methods | |
| CN109755781A (en) | Float RF electric connector between coplanar template | |
| US4743710A (en) | Coaxial interconnection boards | |
| US5378857A (en) | Directly bondable termination for a fixed discrete wire | |
| CN218450656U (en) | Module packaging structure convenient to repair | |
| US4908939A (en) | Method of making coaxial interconnection boards | |
| CN221531747U (en) | Circuit board | |
| CN214338207U (en) | Improved circuit board structure | |
| CN219107799U (en) | Circuit board structure and electronic equipment | |
| CN114496808B (en) | Flip-chip plastic package assembly method, shielding system, heat dissipation system and application | |
| KR100584142B1 (en) | Apparatus of Wall PCB and chipset in Mobile Station | |
| CN210118709U (en) | Electroplax structure suitable for car light fills copper heat dissipation | |
| CN215345240U (en) | Compact structure's circuit board structure | |
| CN201018144Y (en) | Coaxial connector | |
| CN211630480U (en) | PCB structure capable of reducing crosstalk of via hole | |
| JP2001274530A (en) | Printed wiring board | |
| JPS63187685A (en) | Metal base printed wiring board | |
| CN117835524A (en) | Circuit board module, line card and computing device | |
| JPS63254799A (en) | Surface mount component shielding package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |