CN215069474U - Planar metal foil high-power resistor - Google Patents
Planar metal foil high-power resistor Download PDFInfo
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- CN215069474U CN215069474U CN202120771610.7U CN202120771610U CN215069474U CN 215069474 U CN215069474 U CN 215069474U CN 202120771610 U CN202120771610 U CN 202120771610U CN 215069474 U CN215069474 U CN 215069474U
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- metal foil
- aluminum nitride
- power resistor
- nitride plate
- shell
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Abstract
The utility model discloses a high-power resistor of plane metal foil, including shell, aluminum nitride plate and metal foil, metal foil bonds on aluminum nitride plate with high heat conduction silica gel, has 95 alumina ceramics spare on the metal foil, and the shell between still have a compression spring. The utility model discloses well metal foil is with high heat conduction silica gel bonding on aluminum nitride plate, and the high-power resistor of plane metal foil adopts individual layer potsherd (aluminium nitride) structure, and the individual layer moulds the shell structure, and metal foil processing for the resistance can satisfy the low resistance, improves the pulse and tolerates the characteristic, simple structure, and the thermal conductivity is high, and heat dispersion is good, and the cost is lower.
Description
Technical Field
The utility model relates to a power electronic components field especially relates to a high-power resistor of plane metal foil.
Background
The similar resistor sold on the market at present is a thick film resistor, and the realization of low resistance value (< 1 omega) is difficult, mainly because the low resistance value adopts silver palladium alloy, the metal is particularly expensive, the cost of the product is very high, and in addition, the impulse impact performance is low, the film layer of the thick film is thin, and the impulse tolerance characteristic is low due to low quality.
In order to solve the problems, an alloy foil type high-power resistor is processed by laser, then the alloy foil is bonded on a first ceramic chip, a copper sheet is fixedly welded between the first ceramic chip and a second ceramic chip, a sandwich shape is formed by vacuum welding, deformation of a ceramic substrate and metal caused by different thermal expansion coefficients during welding is effectively compensated, the heat dissipation effect of a base plate is guaranteed, and the high-power resistor can be suitable for high-power resistors below 800W. However, the sandwich structure is too complex, alumina ceramic is used as the ceramic, and the composite heat-conducting property of the multilayer material is poor.
SUMMERY OF THE UTILITY MODEL
In order to the weak point that exists among the above-mentioned technique, the utility model provides a high-power resistor of plane metal foil, the individual layer moulds the shell, and individual layer aluminium oxide potsherd structure uses heat conduction silica gel to bond on the potsherd after metal foil laser beam machining. The aluminum nitride ceramic has strong heat-conducting property, fundamentally ensures the heat-radiating effect of the bottom plate, and can be suitable for a 1000W planar high-power resistor.
In order to achieve the above purpose, the utility model discloses the following technical scheme of accessible solves:
a high-power resistor with a planar metal foil comprises an aluminum nitride plate, a tinned copper wire, a tinned layer and a metal foil, wherein the metal foil is bonded on the aluminum nitride plate and is sequentially welded with the tinned layer and the tinned copper wire; the metal foil is bonded on the aluminum nitride plate by high-heat-conductivity silicon glue.
Further, the aluminum nitride plate is a single-layer aluminum nitride ceramic plate.
Further, a compression spring is arranged between the 95 alumina ceramic piece and the shell.
Advantageous effects
Compared with the prior art, the utility model provides a pair of high-power resistor of plane metal foil adopts individual layer potsherd structure, compares with current three layer construction (sandwich shape), and the cost is lower, and technology is simpler, and the metal foil directly bonds on aluminium nitride pottery, and back printing heat conduction silver thick liquid has compression spring in the middle of, and the individual layer moulds the shell, and heat transfer efficiency is high, has guaranteed the radiating effect of bottom plate fundamentally, and power can reach 1000W, and the pulse tolerance characteristic is good.
Drawings
FIG. 1 is an exploded view of the planar metal foil high-power resistor structure of the present invention
In the figure:
1 aluminum nitride plate 2 tinned copper wire 3 tinned layer
4 metal foil 5 compression spring 695 alumina ceramic piece
7 wiring copper column 8 shell
Detailed Description
The following description of the embodiments of the present invention is provided by way of specific examples, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein.
The invention is further described with reference to the following figures and examples.
Fig. 1 is an exploded view of the planar metal foil high-power resistor structure of the present invention.
Referring to fig. 1, the present invention provides a planar metal foil high power resistor, which includes an aluminum nitride plate 1, a tin-plated copper wire 2, a tin-plated layer 3 and a metal foil 4, wherein the metal foil 4 is bonded to the aluminum nitride plate 1 by a high thermal conductivity silicone adhesive, and the tin-plated copper wire 2 is welded after the tin-plated layer 3 is welded to the metal foil 4. And the 95 alumina ceramic piece 6 is bonded on the metal foil 4 by using silica gel, and then the whole is put into the shell and encapsulated with the silica gel to enhance the insulating property. The wiring copper column 7 and the shell 8 are molded together, and are provided with the compression spring 5 and pressed on the shell 8. The center of the wiring copper column 7 is provided with a groove, and the tinned copper wire 2 is welded on the wiring copper column 7 in the assembling process.
In this embodiment, the metal foil is bonded to the aluminum nitride plate 1 with a highly thermally conductive silicone adhesive, and the 95 alumina ceramic member 6 is bonded thereto, followed by soldering with the tinned copper wire 2.
In this embodiment, a 95 alumina ceramic 6 and a compression spring 5 are arranged between the housing 8 and the aluminum nitride plate 1 to ensure that the aluminum nitride plate 1 is tightly contacted with the mounting surface.
Compare in prior art's condition, the utility model provides a pair of high-power resistor of plane metal foil uses metal foil laser processing, can accomplish resistance less than 1 omega that relatively low, and metal foil's thickness is generally below 0.3mm, and the metal is compared with the printing thick film, and the quality is relatively big, and impact resistance can be good. The single-layer ceramic chip structure is adopted, the aluminum nitride plate 1 is made of high-performance aluminum nitride ceramic, the insulating property is good, the heat conductivity is good and is more than or equal to 190W/m.k, the heat conductivity is equivalent to that of aluminum, the aluminum oxide ceramic is adopted in the prior art, the heat conductivity of the aluminum oxide ceramic is 25W/m.k, and the copper sheets can be welded to be made into a sandwich shape to meet the requirement of high power. The utility model provides a single-layer ceramic wafer structure, porcelainous thermal conductivity is 8 times of prior art, and metal foil bonds on aluminum nitride plate with high heat conduction silica gel, has improved the radiating effect of product greatly, is applicable to the high-power resistor below 1000W.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (3)
1. A planar metal foil high-power resistor is characterized by comprising an aluminum nitride plate, a tinned copper wire, a tinned layer and a metal foil, wherein the metal foil is bonded on the aluminum nitride plate and is sequentially welded with the tinned layer and the tinned copper wire; the metal foil is bonded on the aluminum nitride plate by high-heat-conductivity silicon glue.
2. The planar metal foil high power resistor of claim 1, wherein the aluminum nitride plate is a single layer aluminum nitride ceramic plate.
3. The planar metal foil high power resistor of claim 1, wherein a compression spring is provided between the 95 alumina ceramic and the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120771610.7U CN215069474U (en) | 2021-04-15 | 2021-04-15 | Planar metal foil high-power resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120771610.7U CN215069474U (en) | 2021-04-15 | 2021-04-15 | Planar metal foil high-power resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215069474U true CN215069474U (en) | 2021-12-07 |
Family
ID=79105095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120771610.7U Active CN215069474U (en) | 2021-04-15 | 2021-04-15 | Planar metal foil high-power resistor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215069474U (en) |
-
2021
- 2021-04-15 CN CN202120771610.7U patent/CN215069474U/en active Active
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