CN215008145U

CN215008145U - Full-detection tool for wafer disc

Info

Publication number: CN215008145U
Application number: CN202120635668.9U
Authority: CN
Inventors: 司南
Original assignee: Dongguan Lingyi Precision Manufacturing Technology Co ltd
Current assignee: Dongguan Lingyi Precision Manufacturing Technology Co ltd
Priority date: 2021-03-29
Filing date: 2021-03-29
Publication date: 2021-12-03
Anticipated expiration: 2031-03-29

Abstract

The utility model discloses a tool is examined entirely to crystal disc, it includes: the base plate is used for placing a wafer plate to be detected; the detection sliding block is slidably arranged on the chassis and is provided with a detection port, and the detection port is used for assisting a worker to detect a product on a wafer disc to be detected; the wafer detecting device can assist workers in detecting products in a wafer disc, the conditions of skipping, missing detection and repeated detection of the workers are reduced, and the detection efficiency of the workers is improved.

Description

Full-detection tool for wafer disc

Technical Field

The utility model relates to a wafer dish detection area technique, in particular to tool is examined entirely to crystal disc.

Background

Wafers refer to silicon chips used in the fabrication of silicon semiconductor integrated circuits and are carriers used in the production of integrated circuits, and therefore, the quality of wafers directly affects the yield and manufacturing cost of chips. In the process of manufacturing the wafer, defects of partial wafer exist inevitably, for example, the defects of focusing light spots, chromatic aberration and the like are caused due to the fact that the surface of the wafer is not flat in the photoetching process. Therefore, the wafer needs to be inspected to obtain a wafer meeting the standard.

In the prior art, after a wafer disc is mounted by using SMT, the number in a single disc can reach 4096PCS, the full inspection mode is manual CCD full inspection, appearance inspection is carried out row by row and column by column, due to the fact that the number of products in a single wafer disc is large (4096PCS), the conditions of line skipping, missed inspection and repeated inspection sometimes occur under the traditional manual CCD inspection, and after the full inspection time is too long, the condition of wrong inspection easily occurs to workers, and the detection efficiency of the workers is seriously influenced.

Disclosure of Invention

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a tool is examined entirely to brilliant disc can assist the staff to detect the product in the brilliant disc, reduces the staff and appears jumping the condition of missing examining and repeated detection, improves staff's detection efficiency.

The utility model discloses tool is examined entirely to brilliant disc, include: the base plate is used for placing a wafer plate to be detected; the detection sliding block is slidably arranged on the chassis and is provided with a detection port, and the detection port is used for assisting workers in detecting products on the wafer disc to be detected.

According to the utility model discloses tool is examined entirely to brilliant disc has following beneficial effect at least:

through be equipped with slidable ground on the chassis and detect the slider, it sets up in the top of waiting to detect the brilliant disc to detect the slider, it is used for assisting the staff to detect the detection mouth of waiting to detect the product on the brilliant disc to detect to be equipped with on the detection slider, along with the slip detection mouth that detects the piece can orderly demonstration wait to detect the product on the brilliant disc, let the staff can fall into a plurality of parts with waiting to detect the product on the brilliant disc and carry out orderly demonstration in staff's detection visual field, reduce the staff and appear the condition of skipping missing of examining and repeated detection, improve staff's detection efficiency.

According to the utility model discloses a some embodiments, be equipped with the slide rail on the chassis, it can set up on the chassis with sliding along the extending direction of slide rail to detect the slider.

According to some embodiments of the utility model, the detection port is the rectangle structure.

According to the utility model discloses a some embodiments, the width of detection mouth is A, A is greater than 3mm and is less than 5 mm.

According to the utility model discloses a some embodiments, the concave first detection recess that is equipped with on the chassis, first detection recess is used for placing the brilliant disc that waits to detect.

According to some embodiments of the present invention, the cross section of the first detection groove is a rectangular structure.

According to some embodiments of the utility model, be equipped with magnet on the chassis, magnet is used for the supplementary wafer dish that detects to fix on the chassis.

According to the utility model discloses a some embodiments, the quantity of magnet is 4, 4 magnet all sets up the bottom surface at first detection recess.

According to some embodiments of the utility model, the concave second that is equipped with detects the recess on the chassis, the second detects the recess and is used for waiting to detect the wafer dish when detecting to detect the wafer dish back and steps down.

According to some embodiments of the utility model, the second detects the transversal circular structure of personally submitting of recess.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The invention will be further described with reference to the following drawings and examples, in which:

fig. 1 is a schematic perspective view of the full-inspection jig for wafer disks of the present invention;

fig. 2 is an exploded view of the wafer disk full inspection jig shown in fig. 1;

fig. 3 is a top view of the wafer full-inspection jig shown in fig. 1.

Reference numerals:

100 chassis, 110 slide rail, 120 first detection groove, 130 magnet, 140 second detection groove,

200 detecting the slide block and 210 detecting the port.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means is one or more, a plurality of means is two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

As shown in fig. 1 to fig. 3, the wafer tray full inspection jig according to the embodiment of the present invention includes a chassis 100 and an inspection slider 200.

The utility model provides a crystal disc examines tool entirely, includes: the chassis 100 is used for placing a wafer disc to be detected; the detection slide block 200 is slidably disposed on the base plate 100, a detection port 210 is disposed on the detection slide block 200, and the detection port 210 is used for assisting a worker in detecting a product on a wafer to be detected.

For example, as shown in fig. 1 to 3, the chassis 100 may be formed in a substantially plate-shaped structure, when in use, a wafer disc to be detected is fixed on the chassis 100, the detection slider 200 is slidably disposed on the chassis 100, the detection slider 200 is provided with a detection port 210, the detection slider 200 is disposed above the wafer disc to be detected, the detection port 210 is used to assist a worker in detecting a product on the wafer disc to be detected, the worker may see a part of the product on the wafer disc through the detection port 210, the rest of the product is blocked by the detection slider 200, and all the products on the wafer disc to be detected can be sequentially detected by sliding the detection slider 200.

The width of the detection slide block 200 covers half of the wafer disc to be detected, the length of the detection slide block 200 spans the whole wafer disc to be detected, the detection slide block 200 can move along the width direction of the detection slide block, and the detection port 210 displays products on the whole wafer disc to be detected in batches along with the sliding of the detection block.

Specifically, be equipped with slidable and detect slider 200 on chassis 100, it sets up in the top of waiting to detect the brilliant disc to detect slider 200, it is used for assisting staff to detect the detection mouth 210 of waiting to detect the product on the brilliant disc to detect to be equipped with on the detection slider 200, along with the slip detection mouth 210 that detects the piece can be orderly the demonstration waiting to detect the product on the wafer disc, let the staff can be with waiting to detect the product and fall into the orderly demonstration of a plurality of parts in staff's detection visual field, reduce the condition that the staff appears skipping and leak the repeated detection, improve staff's detection efficiency.

And, be equipped with detection slider 200 on chassis 100, it shelters from and waits to detect most product on the brilliant disc to detect slider 200, the staff detects slider 200 can protect all the other products except that detect the mouth 210 in the testing process, avoid the pollution of dust, simultaneously, if the staff finds the product that has problems on waiting to detect the brilliant disc need take out it, it can play the function that the hand held in the palm to detect slider 200, staff's hand can be taken on detecting slider 200 and go to take out the product that will have problems, avoid the staff when taking out the product that has problems, the hand contacts and waits to detect the wafer dish upper surface, thereby treat that the wafer dish that detects plays better protection.

In some embodiments of the present invention, the chassis 100 is provided with a slide rail 110, and the detection slider 200 is slidably disposed on the chassis 100 along an extending direction of the slide rail 110. For example, as shown in fig. 1 to 3, the slide rail 110 is disposed on the chassis 100, and the detection slider 200 is slidably disposed on the chassis 100 along the extending direction of the slide rail 110, so that the detection slider 200 can be assisted to slide linearly on the chassis 100 along the extending direction of the slide rail 110, the stability of the detection slider 200 during sliding can be improved, and the worker can detect the product on the wafer to be detected more efficiently.

In some embodiments of the present invention, the detecting opening 210 has a rectangular structure. For example, as shown in fig. 1 to 3, the inspection openings 210 are designed to have a rectangular structure, so that the products on the wafer tray to be inspected can be displayed in the inspection openings 210 in batches according to the distribution between rows.

In some embodiments of the present invention, the width of the detecting opening 210 is a, and a is greater than 3mm and less than 5 mm. For example, as shown in fig. 1 to fig. 3, in this embodiment, a is 3.6mm, and the detection port 210 with a width of 3.6mm can just display 3 rows of products on the wafer disc to be detected, so that the worker only detects the 3 rows of products at a time, thereby avoiding the occurrence of the situations of skipping, missing detection and repeated detection of the worker due to the excessive number of products detected at a single time, and improving the detection quality and the detection efficiency of the worker.

In some embodiments of the present invention, a first detecting groove 120 is concavely disposed on the chassis 100, and the first detecting groove 120 is used for placing a wafer to be detected. For example, as shown in fig. 1 to 3, a first detection groove 120 is formed on the chassis 100, and the wafer to be detected can be exactly clamped in the first detection groove 120, so that the wafer does not move during the process of detecting the product on the wafer to be detected, and the stability during the detection process is improved.

In some embodiments of the present invention, the cross section of the first detecting groove 120 is a rectangular structure. For example, as shown in fig. 1 to 3, since most of the wafer disks to be detected are designed to have a rectangular structure, the first detection groove 120 is designed to have a rectangular structure to fit most of the wafer disks to be detected.

In some embodiments of the present invention, the bottom plate 100 is provided with a magnet 130, and the magnet 130 is used to assist the wafer plate to be detected to be fixed on the bottom plate 100. For example, as shown in fig. 1 to 3, the magnet 130 is disposed on the chassis 100, so that when a worker engages a wafer to be detected in the first detection groove 120, the magnet 130 on the chassis 100 can also generate a magnetic attraction force on the chassis 100, and the wafer to be detected can be further fixed on the chassis 100, so that the wafer does not move during the detection of the product on the wafer to be detected, and the stability during the detection is improved.

In some embodiments of the present invention, the number of the magnets 130 is 4, and 4 magnets 130 are disposed on the bottom surface of the first detecting recess 120. For example, as shown in fig. 1 to 3, 4 magnets 130 are designed on the bottom surface of the first detection groove 120, wherein the 4 magnets 130 are respectively disposed at the edges of the first detection groove 120, and when the wafer disk is mounted on the chassis 100, the 4 magnets 130 are just distributed at the 4 edges of the lower surface of the wafer disk to be detected, so that the four directions of the wafer disk to be detected in the horizontal direction can be restrained, and the stability of the wafer disk to be detected in the detection process is improved.

In some embodiments of the present invention, the chassis 100 is concavely provided with a second detecting groove 140, the second detecting groove 140 is used for abdicating the wafer plate to be detected when detecting the back surface of the wafer plate to be detected. For example, as shown in fig. 1 to 3, when the worker needs to inspect the back surface of the wafer disc to be inspected, the detection slider 200 slides away along the slide rail 110, the wafer disc to be inspected is taken out of the first detection groove 120, the wafer disc to be inspected is turned over, and the wafer disc to be inspected is clamped into the first detection groove 120, and at this time, the chassis 100 is provided with the second detection groove 140 for avoiding the wafer disc to be inspected from being adhered to the chassis 100.

In some embodiments of the present invention, the cross section of the second detecting groove 140 has a circular structure. For example, as shown in fig. 1 to 3, since most of the wafer disks to be inspected have circular upper surfaces, the second inspection grooves 140 are designed to have circular structures to fit most of the wafer disks for flip inspection.

The utility model discloses a tool is examined entirely to crystal disc's theory of operation as follows:

firstly, a base plate 100 is flatly placed on a workbench, then a wafer plate to be detected is clamped in a first detection groove 120 in a mode that the front surface of the wafer plate is upward, then a detection sliding block 200 is arranged on the base plate 100 in a sliding mode from one end of a sliding rail 110 along the extending direction of the sliding rail 110, then workers carry out manual CCD full detection on products on the wafer plate in a detection port 210, then the sliding detection sliding block 200 carries out orderly detection on all products on the wafer plate to be detected, when unqualified products are found, the products need to be timely taken out, after the upper surface of the wafer plate is detected, the detection sliding block 200 slides along the extending direction of the sliding rail 110 to take out the detection sliding block 200, then the wafer plate to be detected is turned over and clamped in the first detection groove 120 again, the back surface of the wafer plate to be detected is detected, and meanwhile, as a second detection groove 140 for abdicating the wafer plate to be detected is arranged on the base plate 100, therefore, the upper surface of the wafer to be inspected is not adhered to the bottom plate 100, and the wafer to be inspected is taken out of the first inspection groove 120 after the inspection is completed.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

Claims

1. The utility model provides a tool is examined entirely to crystal disc which characterized in that includes:

the base plate is used for placing a wafer plate to be detected;

the detection sliding block is slidably arranged on the chassis and is provided with a detection port, and the detection port is used for assisting workers in detecting products on the wafer disc to be detected.

2. The wafer tray full-detection jig of claim 1, wherein the chassis is provided with a slide rail, and the detection slider is slidably disposed on the chassis along an extending direction of the slide rail.

3. The wafer tray full-detection jig of claim 1, wherein the detection port is rectangular.

4. The wafer tray full-detection jig according to claim 3, wherein the width of the detection port is A, and A is larger than 3mm and smaller than 5 mm.

5. The full-detection jig for the wafer disc as claimed in claim 1, wherein a first detection groove is concavely formed on the bottom disc, and the first detection groove is used for placing a wafer disc to be detected.

6. The wafer tray full-detection jig according to claim 5, wherein the cross section of the first detection groove is rectangular.

7. The wafer full-inspection jig according to claim 5, wherein a magnet is arranged on the base plate, and the magnet is used for assisting the wafer to be inspected to be fixed on the base plate.

8. The wafer tray full-detection jig according to claim 7, wherein the number of the magnets is 4, and the 4 magnets are all disposed on the bottom surface of the first detection groove.

9. The full-detection jig for the wafer disc as claimed in claim 1, wherein the chassis is concavely provided with a second detection groove, and the second detection groove is used for giving way to the wafer disc to be detected when detecting the back surface of the wafer disc to be detected.

10. The wafer tray full-detection jig of claim 9, wherein the cross section of the second detection groove is a circular structure.