200937552 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種半導體製程，且特別是有關於一 種太陽能晶片製程的檢測模組。 【先前技術】 近年來’環保意識抬頭’科技產業逐步朝向高效益、 低污染的方向邁進’例如替代性能源的相關產業，其中特 別是太陽能電池產業最為熱門。太陽能電池，也稱為太陽 Ο 能板’主要是藉由一種光電半導體薄片將太陽供給的光能 轉換成電能。簡單來說，當太陽能板接收太陽光照射時， 因其結構特性會產生大量的自由電子，再由電子的移動而 產生電流。 然而，就目前太陽能產業而言，在太陽能板的製作過 程中’相當多的步驟無法由自動化設備取代，仍需仰賴人 工逐一執行及檢測。如此一來，不僅製程耗時較長，且容 易因為人員疲倦或疏失等因素而造成製品出現瑕疵，降低 〇 生產良率。有鑑於此，太陽能產業無不極力研發各種改良 或替代方案，以提高生產良率。 【發明内容】 本發明一方面在於提供一種晶片位置檢測裝置，用以 檢測晶片是否正確地裝載在晶片盒的插槽之中。晶片位置 檢測裝置有一檢測台，用以置放晶片盒。其中，晶片盒内 有數個互相平行的插槽，每一個插槽均承載一個晶片。在 5 200937552 檢測台之一侧有一個屏幕，檢測台之另一側則有數個光發 射器。其中，每一個光發射器均對齊於各個插槽之間隔。 當晶片正確地插入插槽中時，光發射器所發出的光線 平行穿過插槽之間隔而照射於屏幕上。然而，當晶片斜插 而跨越兩個以上的插槽時，光發射器的光線便會被晶片所 遮蔽，而無法照射於屏幕上。藉由屏幕上有無光發射器照 射的光點來判斷晶片位置是否正碟，取代人工目視檢查的 方法，不僅可提高檢查的正確率，避免人為誤差，也加快 檢查速度。 Ο 本發明另一方面在於提供一種晶片位置檢測裝置，利 用光感應器來檢查晶片是正確地插入晶片盒的插槽中。其 中，晶片盒内有數個互相平行的插槽，每一個插槽均承載 一個晶片。晶片位置檢測裝置有一檢測台、一光發射器和 一光感應器。光發射器和光感應器分別固定於檢測台的兩 侧，且彼此對齊。晶片盒置放於檢測台上，並且插槽之邊 緣對齊於光感應器，且平行於光發射器和光感應器之連 線，以使得光發射器發出之光線沿著插槽之邊緣而傳送至 〇 光感應器上’進而檢測插槽中所承載的晶片的位置。 因此，當光發射器所發出的光線平行穿過插槽乏間隔 而傳送至光感應器時，表示晶片正確地插入插槽中。反之， 當光發射器的光線無法傳送至光感應器時，則表示晶片斜 插。因此可透過光感應器的反應而得知晶片位置的正確與 否，提高晶片斜插的發現率，同時也可加快製程的速度。 本發明另一方面在於提供一種晶片位置之檢測方法， 用以檢測晶片盒所承載的晶片的位置是否正確。晶片盒有 200937552 數個互相平行的插槽，每個插槽用以承載一個晶片制 . 力法的第—個㈣為將晶片规置於-光發射器和一屏幕 之間。接著，將插槽之間隔平行且對齊於光發射器。最後， 根據光發射器之光線是否照射於屏幕上，判斷晶片的位置 是否正確。其中，當光發射器之光線無法照射於屏幕上時， 表不晶片跨越了兩個以上的插槽，故判斷晶片的位置為不 正確。反之，當光發射器之光線照射於屏幕上時，判斷晶 片的位置為正確。 Βθ 由於插槽之間隔小，當晶片密密麻麻地排列其中時， 〇 容易使人眼花撩亂而誤判。本實施例利用屏幕上有無光發 射器發出的光點來得知晶片位置的正確與否，可減少檢善 人員因視覺疲勞而造成的疏失’提高晶片斜插的發現率。 本發明另一方現在於提供一種晶片位置之檢測方法， 取代傳統以人工檢查的方法’檢測晶片放置於晶片盒中的 位置。其中，晶片盒具有數個互相平行的插槽，每個插槽 用以承載一個晶片。首先’放置晶片盒介於一光發射器和 一光感應器之間，並且將插槽之間隔的兩端分別對齊於光 Q 發射器和光感應器。接著，根據光感應器是否接收光發射 器之光線，判斷晶片的位置是否正確。其中，當光感應器 接收光發射器之光線時，判斷晶片的位置為正確。而當光 感應器無法接收光發射器之光線時，判斷晶片的位置為不 正確。本實施例以光感應器有無接收到光發射器的光線作 為判斷依據’可減少人為誤差，提高檢查的正碟率，同時 也加快製程的速度。 200937552 【實施方式】 - 請同時參考第1圖和第2圖，其分別繪示根據本發明 一實施例的晶片位置檢測裝置100的立體圖和俯視圖。 一般在半導體製程中，為了大量生產，通常會將多個 b曰片20置放於一晶片盒1〇中以同步進行多個製程、晶 片盒10中會有多個插槽12，插槽12彼此平行，且每個插 槽12中均承載一個晶片2〇。在本實施例中，每一個插槽 12中有四個凹槽14，分別利用其兩侧的凸塊16夹持晶片 20的四角。 ❹ 然而，有時因為製作過程中的疏失而產生斜插的現 象，如晶片22跨接了兩個插槽12。斜插會導致晶片22和 鄰近的晶片20產生瑕疵，甚至使其互相擠壓而破裂。 晶片位置檢測裝置100是用來檢測晶片盒10中所裝載 的晶片20是否正確地插入於插槽12中。晶片位置檢測裝 置100主要具有一檢測台11〇，用以置放晶片盒1〇在檢 測台110的兩側各有一屏幕120和多個光發射器13〇。 進行檢測時，將晶片盒10置放於檢測台11〇上，且將 Q 插槽12的間隔分別對齊於光發射器130,使得光發射器13〇 發出的光線平行穿過插槽12的間隔。具體來說，插槽⑸ 由數個凹槽14組成，每個凹槽14兩側有凸塊16，因此‘ 個插槽12之間均有一凸塊16作為間隔。而且，同一插槽 12中的上下兩凸塊π之間有一空隙，可供光發射器13〇 的光線穿過。另外，晶片20受凹槽14夾持，會固定在凹 槽14的連線上，因此光發射器130的光線平行凹槽14的 連線’以穿過插槽12之間的間隔。 200937552 當光發射器130所發出的光線平行穿過插槽12的間隔 - 而照射於屏幕120上，表示每一個晶片20均正確地置放於 各個插槽12中。然而，當晶片22跨接多個插槽12時，晶 片22便會阻擋光發射器130的光線，使其無法照射到屏幕 120 ° 習知技術中，晶片20斜插與否是透過人工逐一目視檢 測。然而，由於插槽12間隔小，當晶片20密密麻麻地排 列其中時，容易使人眼花撩亂而誤判。本實施例利用觀察 屏幕120上有無光發射器130照射的光點122,進而得知晶 φ 片20位置的正確與否。因此，可減少檢查人員因視覺疲勞 而造成的疏失，提高晶片20斜插的發現率。 光發射器130的光線為平行光，意即各個光發射器130 所發出的光束不易發散，且彼此平行。具體而言，光發射 器130中可包含一組透鏡，用以將光線聚焦。光發射器130 也可以是一雷射光發射器，其所發出的雷射光即為平行 光。另外，本實施例是觀察屏幕120上有無光點122的出 現，因此光發射器130所發出的光是可見光。 φ 在本實施例中，為了避免光點122排列過密而使人眼 花，因此將光點122的間隔拉大，以利於人員觀察。具體 而言，將每一光發射器130和其相鄰的光發射器130的垂 直高度的相異。舉例來說，將光發射器130細分為第一光 發射器132和第二光發射器134,第一光發射器132和第二 光發射器134彼此間隔排列。其中，第一光發射器132的 垂直高度高於第二光發射器134的垂直高度。如此一來， 第一光發射器132投射於屏幕120上的光點122的垂直高 9 200937552 度便會高於第二光發射器134所投射出的光點124的垂直 高度。光點122和光點124交錯排列，使得光點122和相 鄰的光點122之間的水平距離拉大。另外，尚可將光發射 器130 —垂直高度不同而區分為三組或四組等不同組別， 以加大光點122之水平距離。 另外，晶片位置檢測裝置100還具有一感應開關140， 用來控制光發射器130的開關。具體來說，感應開關140 電性連接光發射器130,用以選擇性地開啟或關閉光發射器 130。當晶片盒10及其插槽12放置於檢測台110上，介於 光發射器130和屏幕120之間時，感應開關140便開啟光 發射器130,以進行檢測。感應開關140可以是重量感應 器，用來感應檢測台110上置放晶片盒10前後的重量差 異。感應開關140也可以是位置感應器，如紅外線感應器， 當晶片盒10置放於檢測台110上時，遮斷紅外線感應器的 光線，進而啟動感應開關140而開啟光發射器130。事實上 感應開關140的形式可為許多種，在此僅提出數個範例作 為說明，並非限定其種類。 本實施例是讓檢測人員觀察屏幕120上光點122的有 無來判斷晶片20的位置。在本發明另一實施例中，則以自 動化的設備取代目視檢測。 請參考第3圖，其繪示根據本發明另一實施例的一種 晶片位置檢測裝置100。檢測台110的一側為光發射器 130，而位於檢測台110另一侧的屏幕120則取代成為光感 應器150,且光發射器130和光感應器150互相對齊排列。 當晶片盒10置放於檢測台110上時，插槽12的邊緣對齊 200937552 檢測台110兩側的光發射器130和光感應器150’意即插槽 12的邊緣平行於光發射器130和光感應器150的連線。如 此一來，便可使光發射器130所發出的光線沿著插槽12的 邊緣而傳送到光感應器150上。 換句話說，當晶片20正確地位於插槽12之内時，光 感應器150可接收到光發射器130所發出的光線。然而， 當晶片22斜插時，晶片22的一部分位於插槽12之外，阻 擋了光發射器130所發出的光線，光感應器15〇則接收不 到光線。因此可透過光感應器150的反應而得知晶片2〇位 ❹ 置的正確與否’提尚晶片22斜插的發現率，同時也可加快 製程的速度。 如前所述，光發射器130所發出的光線為平行光，例 如雷射光，或者透過透鏡組合以收斂光發射器13〇的光線。 另一方面’在本實施例中是利用光感應器15〇感應光線， 因此光發射器130所發出的光線不必然為可見光，也可以 是非可見光’如紅外線或紫外線等非可見光波段的光。 請參考第4圖，其繪示根據本發明另一實施例的一種 〇 晶片位置的檢測方法400的流程圖。晶片位置的檢測方法 400用以檢測置放於晶片盒的插槽中的晶片的位置其具有 三個步驟。第一個步驟410為放置晶片盒介於光發射器和 屏幕之間，其中晶片盒有數個互相平行的插槽，每一插槽 中均用以承載一晶片。接著，步称420為將插槽的間隔對200937552 IX. INSTRUCTIONS: TECHNICAL FIELD OF THE INVENTION The present invention relates to a semiconductor process, and more particularly to a solar wafer process inspection module. [Prior Art] In recent years, the 'environmental awareness-raising' technology industry has gradually moved toward high-efficiency and low-pollution industries, such as alternative energy-related industries, among which the solar cell industry is the most popular. Solar cells, also known as solar panels, primarily convert light energy supplied by the sun into electrical energy by means of an optoelectronic semiconductor wafer. Simply put, when a solar panel receives sunlight, a large amount of free electrons are generated due to its structural characteristics, and current is generated by the movement of electrons. However, as far as the solar industry is concerned, in the production process of solar panels, a considerable number of steps cannot be replaced by automated equipment, and it is still necessary to rely on manual implementation and testing. In this way, not only does the process take a long time, but it is also easy to cause defects in the product due to factors such as fatigue or loss of personnel, and lower the production yield. In view of this, the solar industry has been working hard to develop various improvements or alternatives to increase production yield. SUMMARY OF THE INVENTION An aspect of the present invention provides a wafer position detecting device for detecting whether a wafer is correctly loaded in a slot of a wafer cassette. The wafer position detecting device has a detecting station for placing the wafer cassette. There are several parallel slots in the wafer cassette, each carrying one wafer. On 5 200937552 there is a screen on one side of the test bench, and on the other side of the test stand there are several light emitters. Each of the light emitters is aligned with the spacing of the slots. When the wafer is properly inserted into the slot, the light emitted by the light emitter illuminates the screen in parallel across the slot. However, when the wafer is inserted obliquely across more than two slots, the light from the light emitter is obscured by the wafer and cannot be illuminated on the screen. By using the spot on the screen with the light emitter to determine whether the wafer position is a positive disc, instead of the manual visual inspection method, not only the correct rate of inspection can be improved, human error is avoided, and the inspection speed is also accelerated. Another aspect of the present invention is to provide a wafer position detecting device which uses a light sensor to inspect that a wafer is correctly inserted into a slot of a wafer cassette. There are several parallel slots in the wafer cassette, each carrying a wafer. The wafer position detecting device has a detecting station, a light emitter, and a light sensor. The light emitter and the light sensor are respectively fixed to both sides of the inspection table and aligned with each other. The wafer cassette is placed on the inspection table, and the edge of the slot is aligned with the light sensor and parallel to the connection between the light emitter and the light sensor, so that the light emitted by the light emitter is transmitted along the edge of the slot to On the calender sensor, the position of the wafer carried in the slot is detected. Therefore, when the light emitted by the light emitter is transmitted through the slot gap to the light sensor, it indicates that the wafer is correctly inserted into the slot. Conversely, when the light from the light emitter cannot be transmitted to the light sensor, it indicates that the wafer is obliquely inserted. Therefore, the correctness of the wafer position can be known through the reaction of the light sensor, the discovery rate of the oblique insertion of the wafer can be improved, and the speed of the process can be accelerated. Another aspect of the present invention is to provide a method of detecting the position of a wafer for detecting whether the position of the wafer carried by the wafer cassette is correct. The wafer cassette has 200937552 several parallel slots, each of which is used to carry a wafer. The first (four) of the force method is to place the wafer gauge between the light emitter and a screen. Next, the slots are spaced parallel and aligned to the light emitter. Finally, it is judged whether the position of the wafer is correct or not according to whether the light of the light emitter is irradiated on the screen. Wherein, when the light of the light emitter cannot be irradiated on the screen, the wafer is not spanned by more than two slots, so that the position of the wafer is judged to be incorrect. Conversely, when the light from the light emitter is illuminated on the screen, the position of the wafer is judged to be correct. Βθ Since the interval between the slots is small, when the wafers are densely arranged, 〇 is easily dazzled and misjudged. In this embodiment, the light spot emitted by the light emitter on the screen is used to know whether the wafer position is correct or not, and the damage caused by the visual fatigue of the inspector can be reduced to increase the discovery rate of the diagonal insertion of the wafer. Another aspect of the present invention now provides a method of detecting the position of a wafer, instead of the conventional method of manual inspection, to detect the position at which the wafer is placed in the wafer cassette. The wafer cassette has a plurality of mutually parallel slots, each of which carries a wafer. First, the wafer cassette is placed between a light emitter and a light sensor, and the two ends of the slot are aligned with the light Q emitter and the light sensor, respectively. Next, it is judged whether or not the position of the wafer is correct based on whether or not the light sensor receives the light of the light emitter. Wherein, when the light sensor receives the light of the light emitter, it is judged that the position of the wafer is correct. When the light sensor is unable to receive the light from the light emitter, the position of the wafer is judged to be incorrect. In this embodiment, whether the light sensor receives the light of the light emitter as a basis for judgment can reduce human error, improve the positive disk rate of the inspection, and also speed up the process. 200937552 [Embodiment] - Please refer to FIG. 1 and FIG. 2 simultaneously, which are respectively a perspective view and a plan view of a wafer position detecting device 100 according to an embodiment of the present invention. Generally, in the semiconductor process, for mass production, a plurality of b-chips 20 are usually placed in a wafer cassette 1 to perform a plurality of processes simultaneously, and the wafer cassette 10 has a plurality of slots 12, slots 12 Parallel to each other, and each of the slots 12 carries a wafer 2 〇. In the present embodiment, there are four recesses 14 in each of the slots 12, and the four corners of the wafer 20 are held by the bumps 16 on both sides thereof. ❹ However, sometimes oblique insertion occurs due to omissions in the manufacturing process, such as wafer 22 spanning two slots 12. The oblique insertion causes the wafer 22 and adjacent wafers 20 to create defects, even causing them to squash and rupture. The wafer position detecting device 100 is for detecting whether or not the wafer 20 loaded in the wafer cassette 10 is correctly inserted into the slot 12. The wafer position detecting device 100 mainly has a detecting stage 11 for placing the wafer cassette 1 and having a screen 120 and a plurality of light emitters 13 on both sides of the detecting stage 110. When the detection is performed, the wafer cassette 10 is placed on the inspection table 11A, and the intervals of the Q slots 12 are respectively aligned with the light emitters 130, so that the light emitted by the light emitters 13 passes through the slots 12 in parallel. . Specifically, the slot (5) is composed of a plurality of grooves 14, each of which has a bump 16 on both sides thereof, so that there is a bump 16 between the slots 12 as a space. Moreover, there is a gap between the upper and lower bumps π in the same slot 12 for the light of the light emitter 13 to pass through. In addition, the wafer 20 is held by the recess 14 and is fixed to the line of the recess 14 so that the light of the light emitter 130 is parallel to the line ' of the groove 14 to pass through the space between the slots 12. 200937552 When the light emitted by the light emitter 130 passes through the slot 12 in parallel - and illuminates the screen 120, it indicates that each wafer 20 is properly placed in each of the slots 12. However, when the wafer 22 is spanned across the plurality of slots 12, the wafer 22 blocks the light from the light emitter 130, making it impossible to illuminate the screen 120 °. In the prior art, the wafer 20 is obliquely inserted or manually. Detection. However, since the gaps of the slots 12 are small, when the wafers 20 are densely arranged, it is easy to be dazzled and misjudged. In this embodiment, the presence or absence of the spot 122 illuminated by the light emitter 130 on the viewing screen 120 is used to determine whether the position of the crystal φ piece 20 is correct or not. Therefore, the inspector's loss due to visual fatigue can be reduced, and the discovery rate of the oblique insertion of the wafer 20 can be improved. The light of the light emitter 130 is parallel light, meaning that the light beams emitted by the respective light emitters 130 are not easily diverged and are parallel to each other. In particular, light emitter 130 can include a set of lenses for focusing light. The light emitter 130 can also be a laser light emitter that emits laser light that is parallel light. In addition, in this embodiment, the presence or absence of the spot 122 on the screen 120 is observed, so that the light emitted by the light emitter 130 is visible light. φ In the present embodiment, in order to prevent the light spots 122 from being arranged too densely to make a human eye, the interval of the light spots 122 is widened to facilitate human observation. In particular, the vertical height of each of the light emitters 130 and their adjacent light emitters 130 is different. For example, the light emitter 130 is subdivided into a first light emitter 132 and a second light emitter 134, the first light emitter 132 and the second light emitter 134 being spaced apart from one another. Wherein, the vertical height of the first light emitter 132 is higher than the vertical height of the second light emitter 134. As a result, the vertical height 9 200937552 of the spot 122 projected by the first light emitter 132 on the screen 120 is higher than the vertical height of the spot 124 projected by the second light emitter 134. The spot 122 and the spot 124 are staggered such that the horizontal distance between the spot 122 and the adjacent spot 122 is enlarged. In addition, the light emitters 130 may be divided into three groups or four groups or the like in different vertical heights to increase the horizontal distance of the light spots 122. In addition, the wafer position detecting device 100 further has an inductive switch 140 for controlling the switch of the light emitter 130. Specifically, the inductive switch 140 is electrically coupled to the light emitter 130 for selectively turning the light emitter 130 on or off. When the wafer cassette 10 and its slot 12 are placed on the inspection station 110 between the light emitter 130 and the screen 120, the inductive switch 140 turns on the light emitter 130 for detection. The inductive switch 140 can be a weight sensor for sensing the difference in weight between the front and rear of the wafer cassette 10 on the inspection station 110. The sensor switch 140 can also be a position sensor, such as an infrared sensor. When the wafer cassette 10 is placed on the detection stage 110, the light of the infrared sensor is blocked, and the sensor switch 140 is activated to activate the light emitter 130. In fact, the form of the inductive switch 140 can be many, and only a few examples are presented herein for illustration and not limitation. This embodiment allows the inspector to observe the presence or absence of the spot 122 on the screen 120 to determine the position of the wafer 20. In another embodiment of the invention, the visual inspection is replaced by an automated device. Please refer to FIG. 3, which illustrates a wafer position detecting apparatus 100 according to another embodiment of the present invention. One side of the detecting stage 110 is the light emitter 130, and the screen 120 on the other side of the detecting stage 110 is replaced by the light sensor 150, and the light emitter 130 and the light sensor 150 are aligned with each other. When the wafer cassette 10 is placed on the inspection table 110, the edge of the slot 12 is aligned with the light emitter 130 and the light sensor 150' on both sides of the 200937552 detection station 110, that is, the edge of the slot 12 is parallel to the light emitter 130 and the light sensing The connection of the device 150. As a result, the light emitted by the light emitter 130 can be transmitted to the light sensor 150 along the edge of the slot 12. In other words, when the wafer 20 is properly positioned within the slot 12, the light sensor 150 can receive the light emitted by the light emitter 130. However, when the wafer 22 is obliquely inserted, a portion of the wafer 22 is located outside of the slot 12, blocking the light emitted by the light emitter 130, and the light sensor 15 is not receiving light. Therefore, the correctness of the wafer 2 clamping position can be known by the reaction of the light sensor 150, which increases the discovery rate of the oblique insertion of the wafer 22, and also speeds up the process. As previously mentioned, the light emitted by the light emitter 130 is parallel light, such as laser light, or combined by a lens to converge light from the light emitter 13 . On the other hand, in the present embodiment, the light is induced by the light sensor 15, so that the light emitted from the light emitter 130 is not necessarily visible light, and may be non-visible light such as infrared light or ultraviolet light. Please refer to FIG. 4, which illustrates a flow chart of a method 400 for detecting the position of a wafer according to another embodiment of the present invention. The method of detecting the position of the wafer 400 is used to detect the position of the wafer placed in the slot of the wafer cassette, which has three steps. The first step 410 is to place the wafer cassette between the light emitter and the screen, wherein the wafer cassette has a plurality of mutually parallel slots, each of which carries a wafer. Next, step 420 is to set the slot spacing
齊且平行於光發射器’使得光發射器所發出的光線可通遍 插槽的間隔D 最後，步驟430為根據光發射器之光線是否照射於屏 11 200937552 幕上’判斷晶片的位置是否企成 . 1疋令正確。在步驟43〇中，當光線 照射於屏幕上時，表示B U >> ., 衣丁曰曰片位於插槽中，故判斷晶片的位 置為正確。然而’當光線無法照射於屏幕上時表示晶片 犬出插槽之外而橫隔於插槽的間隔中故判斷晶片的位 置為不正確。 請參考第5圖，其繪示根據本發明另一實施例的一種 晶片位置的檢測方法5〇〇的流程圖。晶片位置的檢測方法 500具有三個步驟。首先’步驟51〇為放置晶片盒介於光發Parallel to the light emitter', the light emitted by the light emitter can pass through the interval D of the slot. Finally, step 430 is based on whether the light of the light emitter is illuminated on the screen 11 200937552. Cheng. 1 疋 is correct. In step 43, when the light is irradiated on the screen, it indicates that B U >>., the placket piece is located in the slot, so that the position of the wafer is judged to be correct. However, when the light cannot be irradiated on the screen, it indicates that the wafer dog is out of the slot and is spaced apart from the slot, so that the position of the wafer is judged to be incorrect. Please refer to FIG. 5, which is a flow chart of a method for detecting the position of a wafer according to another embodiment of the present invention. The wafer location detection method 500 has three steps. First, 'Step 51〇 is to place the wafer cassette between the light
❹ 射器和光發射器之間’其中晶片盒中有數個平行的插槽， 每一插槽之中均用以承載-晶片。接著，步驟520為將插 槽的間隔的兩端分別對齊於光發射器和光感應器，使得光 發射器所發出的光線可通過插槽的間隔而照射於光感應器 上。 最後，步称530為根據光感應器是否接收光發射器之 光線，判斷晶片的位置是否正確。在步驟53〇中，當光感 應器接收到光發射器所發出的光線時，表示晶片位於插槽 中，故判斷晶片的位置為正確。然而，當光感應器無法接 收到光線時’表示晶片突出插槽之外，而位於插槽的間隔 中’故判断晶片的位置為不正確。 如前所述’由於插槽之間隔小，當晶片密密麻麻地排 列其中時’容易使人眼花撩氣而誤判。本實施例利用屏幕 上有無光發射器照射的光點來得知晶片位置的正確與否， 可減少檢查人員因視覺疲勞而造成的疏失，提高晶片斜插 的發現率。進而提高生產良率，並且加快製程的速度。 雖然本發明已以多個較佳實施例揭露如上，然其並非 12 200937552 用以限定本發明，任何熟習此技藝者，在不脫離本發明之 精神和範圍内’當可作各種之更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖是繪示根據本發明一實施例的晶片位置檢測裝 ❹ 置的立體圖。 第2圖係繪示根據第1圖所顯示的晶片位置檢測裝置 的俯視圖。 第3圖係繪示依照本發明另一實施例的晶片位置檢測 裝置的俯視圖。 第4圖係繪示根據本發明定一實施例的晶片位置的檢 測方法的流程圖》 第5圖係繪示根據本發明定一實施例的晶片位置的檢 Q 測方法的流程圖。 【主要元件符號說明】 10 •晶片盒 12 :插槽 14 :凹槽 16 : 凸塊 20 :晶片 22 :晶片 100 :晶片位置檢測裝置 110 :檢測台 13 200937552 120 ：屏幕 122 ： 124 :光點 130 ： 132 :光發射器 134 ： 140 :感應開關 150 ： 400 :檢測方法 410-430 500 :檢測方法 510-530 光點 光發射器 光發射器 光感應器 ： 步驟 ： 步驟Between the emitter and the light emitter, wherein there are several parallel slots in the wafer cassette, each of which carries a wafer. Next, in step 520, the two ends of the interval of the slot are respectively aligned with the light emitter and the light sensor, so that the light emitted by the light emitter can be irradiated onto the light sensor through the interval of the slot. Finally, step 530 determines if the position of the wafer is correct based on whether the light sensor receives light from the light emitter. In step 53, when the light sensor receives the light emitted by the light emitter, it indicates that the wafer is in the slot, so that the position of the wafer is judged to be correct. However, when the light sensor is unable to receive the light, it indicates that the wafer is outside the protruding slot and is located in the slot of the slot, so that the position of the wafer is judged to be incorrect. As described above, "because the spacing of the slots is small, when the wafers are densely arranged", it is easy to make people stunned and misjudged. In this embodiment, the spot light irradiated by the light emitter on the screen is used to know whether the wafer position is correct or not, which can reduce the loss caused by the visual fatigue of the inspector and improve the discovery rate of the oblique insertion of the wafer. In turn, the production yield is increased and the speed of the process is accelerated. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the scope of the invention, and it is to be understood that those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A perspective view of the wafer position sensing device. Fig. 2 is a plan view showing the wafer position detecting device shown in Fig. 1. Figure 3 is a plan view showing a wafer position detecting device in accordance with another embodiment of the present invention. Fig. 4 is a flow chart showing a method of detecting a wafer position according to a preferred embodiment of the present invention. Fig. 5 is a flow chart showing a method of detecting a wafer position according to a preferred embodiment of the present invention. [Major component symbol description] 10 • Wafer cassette 12: Slot 14: Groove 16: Bump 20: Wafer 22: Wafer 100: Wafer position detecting device 110: Detection station 13 200937552 120: Screen 122: 124: Spot 130 : 132 : Light Emitter 134 : 140 : Inductive Switch 150 : 400 : Detection Method 410-430 500 : Detection Method 510-530 Spot Light Emitter Light Emitter Light Sensor : Steps : Steps
1414