CN214953120U - Detection device for laser chip - Google Patents

Detection device for laser chip Download PDF

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Publication number
CN214953120U
CN214953120U CN202120577779.9U CN202120577779U CN214953120U CN 214953120 U CN214953120 U CN 214953120U CN 202120577779 U CN202120577779 U CN 202120577779U CN 214953120 U CN214953120 U CN 214953120U
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China
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laser
chip
detection
axis module
laser device
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CN202120577779.9U
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徐敏敏
苏文毅
闫大鹏
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Wuhan Raycus Fiber Laser Technologies Co Ltd
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Wuhan Raycus Fiber Laser Technologies Co Ltd
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Abstract

The utility model provides a detection apparatus for laser instrument chip, include: the laser device feeding device comprises a feeding mechanism, a laser device and a control device, wherein a material box is arranged on the feeding mechanism, the feeding mechanism can drive the material box to move, and a plurality of laser devices are placed in the material box; the laser device picking mechanism comprises a material taking mechanism and a detection mechanism, wherein the material taking mechanism can move in the horizontal direction and the vertical direction to clamp the laser device, each path of chip of the laser device is aligned with the detection mechanism one by one, and the detection mechanism can automatically focus to detect each path of chip of the laser device. The utility model provides a detection apparatus for laser instrument chip through setting up feeding mechanism, feeding agencies and detection mechanism, has realized the automated inspection on laser instrument chip shady face, has improved production efficiency, simultaneously, has also stopped artifical visual inspection and has missed the emergence of examining and the false positive.

Description

Detection device for laser chip
Technical Field
The utility model relates to a laser chip detects technical field, especially relates to a detection device of laser chip.
Background
During fiber laser manufacturing, the end faces of the laser chips may fail due to dirt, scratches, breakage. Because the end face of the laser chip is small in size and can be seen clearly only by enlarging under a microscope, the end face of the chip is usually inspected by manual eyes at present. The microscope is placed at a fixed position, the rear end of the microscope is connected with a Charge Coupled Device (CCD) camera, an image after visual inspection can be checked and stored on a computer, a laser is placed in a fixed jig during detection, a two-dimensional adjusting frame is manufactured below the jig, the end face of each path of chip of the laser is aligned with the microscope in a manual adjusting mode, and manual visual inspection is carried out.
At present, the visual inspection of the backlight surface is only applied to 120W laser products, the 120W laser devices are placed on a tool, an operator transversely moves a sliding table, and a microscope is used for observing whether the backlight surface of a chip in the laser is damaged, dirty or scratched. The material is placed in this process section by the manual work, and manual detection, and this detection station can only be suitable for 120W laser instrument product, can not compatible 250W laser instrument product.
At present, the manual detection method mainly has the problems that the manual detection efficiency is low, the visual fatigue is easy to generate when human eyes stare at a microscope for a long time, and the missing detection or the error detection can occur in the long-time visual detection.
SUMMERY OF THE UTILITY MODEL
The utility model provides a detection apparatus for laser instrument chip for it is low to solve artifical detection efficiency among the prior art, appears leaking the defect of examining or the false positive easily.
The utility model provides a detection apparatus for laser instrument chip, include: the laser device feeding device comprises a feeding mechanism, a laser device and a control device, wherein a material box is arranged on the feeding mechanism, the feeding mechanism can drive the material box to move, and a plurality of laser devices are placed in the material box; the laser device picking mechanism comprises a material taking mechanism and a detection mechanism, wherein the material taking mechanism can move in the horizontal direction and the vertical direction to clamp the laser device, each path of chip of the laser device is aligned with the detection mechanism one by one, and the detection mechanism can automatically focus to detect each path of chip of the laser device.
According to the utility model provides a pair of detection device of laser chip, feeding mechanism includes X axle module, be provided with on the X axle module the material box, X axle module can drive the material box removes in X axle direction.
According to the utility model provides a pair of detection device of laser instrument chip, be provided with the tool in the material box, it is a plurality of to have placed in the tool the laser instrument device.
According to the utility model provides a pair of detection device of laser instrument chip, be provided with on the tool the sign of the chip backlight surface orientation of laser instrument device.
According to the utility model provides a pair of detection device of laser instrument chip, feeding agencies includes: the Z-axis module is perpendicular to the Y-axis module and can move along the Y-axis module; and the clamping jaw is arranged on the Z-axis module and can move up and down along the vertical direction under the driving of the Z-axis module.
According to the utility model provides a pair of detection device of laser chip, the clamping jaw includes a pair of relative clamping piece that sets up, every the clamping piece is including the first body, second body and the third body that connect gradually, the second body respectively with first body with the third body sets up perpendicularly, wherein, two distance between the third body is greater than two distance between the first body, every the lower part of third body is provided with first boss, two perpendicularly first boss is located two between the third body.
According to the utility model provides a pair of detection device of laser chip, the clamping jaw includes the clamping piece of a pair of relative setting, every the clamping piece includes fourth body and the fifth body that mutually perpendicular set up, every the lower part of fifth body is provided with the second boss, two perpendicularly the second boss is located two between the fifth body.
According to the utility model provides a pair of detection device of laser instrument chip, detection mechanism includes: the microscope is arranged on the sliding table; a CCD camera mounted on the microscope; the laser device can be aligned with the microscope under the driving of the material taking mechanism.
According to the utility model provides a pair of detection device of laser instrument chip still includes the platform, feeding mechanism extracting mechanism and detection mechanism all sets up on the platform.
The utility model provides a detection apparatus for laser instrument chip through setting up feeding mechanism, feeding agencies and detection mechanism, has realized the automated inspection on laser instrument chip shady face, has improved production efficiency, simultaneously, has also stopped artifical visual inspection and has missed the emergence of examining and the false positive.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the following briefly introduces the drawings required for the embodiments or the prior art descriptions, and obviously, the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a detection apparatus for a laser chip provided in the present invention;
FIG. 2 is one of the schematic structural views of the jaws shown in FIG. 1;
FIG. 3 is a second schematic view of the jaw shown in FIG. 1;
reference numerals:
10: an X-axis module; 20: a Y-axis module; 30: a Z-axis module;
31: a clamping jaw; 40: a material box; 41: a jig;
42: a laser device; 51: a sliding table; 52: a microscope;
60: a switch box; 100: a platform; 311: a first body;
312: a second body; 313: a third body; 314: a first boss;
315: a fourth body; 316: a fifth body; 317: a second boss.
Detailed Description
To make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The detection device of the laser chip of the present invention is described below with reference to fig. 1 to 3.
As shown in fig. 1, in an embodiment of the present invention, a detection apparatus for a laser chip includes: feeding mechanism, feeding agencies, detection mechanism and material box 40. The feeding mechanism is provided with a material box 40, the feeding mechanism can drive the material box 40 to move, and a plurality of laser devices 42 are placed in the material box 40. The material taking mechanism can move in the horizontal direction and the vertical direction to clamp the laser device 42, and each chip of the laser device 42 is aligned with the detection mechanism, and the detection mechanism can automatically focus to detect each chip of the laser device 42.
Specifically, a plurality of laser devices 42 can be placed in the material box 40, the backlight surface of each laser device 42 faces the same direction, the material box 40 is placed on the feeding mechanism, and the material box 40 can move in the horizontal plane under the driving of the feeding mechanism. The material taking mechanism can move in the horizontal direction and the vertical direction, and when the material box 40 is driven by the material feeding mechanism to move to a specified position, the material taking mechanism moves to the specified position in the horizontal direction and then moves in the vertical direction to grab the laser device 42. The take-off mechanism is movable left and right relative to the detection mechanism to align each die of each laser device 42 with the detection mechanism. A plurality of chips are disposed in each laser device 42, and the detection mechanism can finely adjust the position of the detection mechanism to focus on each chip, thereby providing a clear field of view to detect the backlight surface of each chip.
Further, in an embodiment of the utility model, the feeding mechanism can be for the structure of servo motor and lead screw, and servo motor rotates, drives the lead screw and rotates, and material box 40 sets up on the lead screw, and under the drive of lead screw, material box 40 removes at the horizontal direction. Assuming that the material box 40 moves along the X-axis direction, correspondingly, the material taking mechanism may also be a structure composed of a servo motor and a screw rod and capable of moving along the Y-axis direction and the Z-axis direction. A clamping jaw 31 is provided on the screw rod disposed in the Z-axis direction to grasp the laser device 42.
Further, in an embodiment of the present invention, the detecting mechanism may be a microscope with a CCD camera, which is disposed on the sliding table, and under the driving of the sliding table, the detecting mechanism can move back and forth relative to the chip to realize focusing and obtain a clear visual field.
In the prior art, when a chip of the laser device 42 is detected, manual feeding and blanking are generally adopted, the risk that the laser device falls and is damaged may occur in the feeding and blanking processes, and the laser device belongs to a valuable instrument, so that certain economic loss is caused by damage. And adopt the embodiment of the utility model provides a detection device of laser instrument chip, its snatch the process and operate by extracting mechanism, extracting mechanism snatchs laser instrument device 42 back, directly detects, need not place laser instrument device 42 on testing platform, has saved the process of putting, has improved production efficiency, simultaneously, the risk that drops laser instrument device 42 when also can not taking place artifical material loading and unloading.
According to practical statistics, taking four laser devices 42 as an example, which can be placed in one material box 40, calculating according to the limit condition, that is, 2min is needed for manually detecting a single laser device 42, and 240 laser devices 42 can be detected by a single person working in a single shift, i.e., by one person working for 8 h. The detection device needs 3min for detecting one laser device 42 by a single device, needs 12min for detecting four laser devices 42, can operate two detection devices by one person, works for 8h by one person, can detect 320 laser devices 42 by using the detection device, and can save the production cost by about 19 ten thousand yuan.
In addition, data is inconvenient to record after manual detection, pictures need to be stored manually, invalid devices need to be marked, direct storage of the data can be achieved by adopting a detection mechanism, and the defective pictures have traceability.
The embodiment of the utility model provides a detection device of laser instrument chip through setting up feeding mechanism, feeding agencies and detection mechanism, has realized the automated inspection on laser instrument chip shady face, has improved production efficiency, simultaneously, has also stopped artifical visual inspection hourglass to examine and the emergence of false positive.
As shown in fig. 1, in an embodiment of the present invention, the feeding mechanism includes an X-axis module 10, a material box 40 is disposed on the X-axis module 10, and the X-axis module 10 can drive the material box 40 to move in the X-axis direction.
Particularly, X axle module 10 is used for removing material box 40 to the assigned position, presss from both sides promptly and gets the position the utility model discloses an in the embodiment, X axle module 10 includes servo motor, lead screw and slider, and servo motor drives the lead screw and rotates, and the lead screw drives the slider and removes, and material box 40 sets up on the slider, and the lead screw can drive material box 40 and remove in X axle direction, adopts the servo motor module can guarantee the speed that material box 40 removed to and the control accuracy when material box 40 removes. Further, in an embodiment of the present invention, optionally, the stroke of the X-axis module 10 is 400 mm.
As shown in fig. 1, in an embodiment of the present invention, a jig 41 is disposed in the material box 40, and a plurality of laser devices 42 are disposed in the jig 41.
Specifically, the popular jig 41 means: a tool that assists in the control or location, which is not the same concept as a mold. For example, when a duplicate key is required, the original key is usually fixed on the fixture 41 to duplicate a new key. The jig 41 is arranged in the material box 40, so that the laser devices 42 can be customized and placed, the placing positions of all the laser devices 42 are the same, the material taking mechanism can conveniently grab the laser devices according to the preset positions, and the laser devices 42 cannot be damaged in the grabbing process.
Further, in an embodiment of the present invention, the jig 41 is provided with an identifier of the backlight surface orientation of the chip of the laser device 42. Specifically, the jig 41 is provided with an identifier indicating the orientation of the backlight surface of the chip, and an arrow of the identifier points to the backlight surface of the chip of the laser device 42, so that the situation that the laser device 42 is placed in the material box 40 in a wrong direction is avoided, and after the laser device 42 is grabbed by the material fetching mechanism, the backlight surface of the chip cannot be aligned with the detection mechanism, so that the laser device 42 cannot be detected.
Further, for laser devices 42 with different powers, corresponding jigs 41 can be manufactured for placing the laser devices 42, so as to improve the applicability of the detection apparatus.
As shown in fig. 1, in an embodiment of the present invention, the material taking mechanism includes a Y-axis module 20, a Z-axis module 30 and a clamping jaw 31, the Z-axis module 30 is disposed perpendicular to the Y-axis module 20, and the Z-axis module 30 can move along the Y-axis module 20; the clamping jaw 31 is arranged on the Z-axis module 30 and can move up and down along the vertical direction under the driving of the Z-axis module 30.
Specifically, the clamping jaw 31 is arranged on the Z-axis module 30, and can move in a horizontal plane along the Y-axis module 20 and can also move in a vertical direction along the Z-axis module 30. When the material box 40 moves to a designated position along the X-axis module 10, the clamping jaw 31 moves to the position of the material box 40 along the Y-axis module 20, and then moves downwards along the Z-axis module 30 to grab the laser device 42.
Further, in an embodiment of the present invention, optionally, the Y-axis module 20 may be a structure of a servo motor, a lead screw and a slider, the Z-axis module 30 may be a structure of a stepping motor, a lead screw and a slider, the Z-axis module 30 is disposed on the slider of the Y-axis module 20, and the clamping jaw 31 is disposed on the slider of the Z-axis module 30. In one embodiment of the present invention, the stroke of the Y-axis module 20 is 400mm, and the stroke of the Z-axis module 30 is 75 mm. The clamping jaw 31 is electrically controlled, the clamping precision can be accurately controlled by the electric clamping jaw 31, the laser device 42 can be effectively protected relative to the pneumatic clamping jaw 31 in the clamping process, and meanwhile, the electric clamping jaw 31 can guarantee that the center of the laser device 42 is used as a reference for clamping.
Further, in one embodiment of the present invention, the unilateral travel of the clamping jaw 31 is 10.5mm to clamp the laser device 42.
As shown in fig. 2, in an embodiment of the present invention, optionally, the clamping jaw 31 includes a pair of clamping pieces, each clamping piece includes a first body 311, a second body 312 and a third body 313 connected in sequence, the second body 312 is respectively disposed perpendicular to the first body 311 and the third body 313, a distance between the two third bodies 313 is greater than a distance between the two first bodies 311, wherein a first boss 314 is vertically disposed at a lower portion of each third body 313.
Specifically, in the present embodiment, when the clamping jaw 31 grips the laser device 42, the laser device is clamped along the length direction thereof, so that the distance between the two third bodies 313 is greater than the distance between the two first bodies 311. The first boss 314 is disposed at the lower part of the third body 313, so that the bottom surface of the laser device 42 can be placed on the first boss 314, thereby ensuring stable grasping and preventing the laser device from falling off.
As shown in fig. 3, in an embodiment of the present invention, the clamping jaw 31 optionally includes a pair of clamping pieces, each clamping piece includes a fourth body 315 and a fifth body 316, which are vertically disposed, and a second boss 317 is vertically disposed at a lower portion of the fifth body 316.
As shown in fig. 1, in an embodiment of the present invention, the detecting mechanism includes: a slide stage 51, a microscope 52 and a ccd camera. A CCD camera, hereinafter simply referred to as a CCD camera, is provided on the slide table 51, and a microscope 52 is provided on the microscope 52. The sliding table 51 can automatically adjust the distance between the CCD camera and the backlight surface of the chip of the laser device 42 according to the size of the field of view of the microscope 52, so that each chip can be automatically focused quickly and accurately, the field of view of the high-definition microscope 52 becomes clearer and more recognizable, and the problems of damage, dirt, scratch and the like of the chip can be accurately judged. Further, in an embodiment of the present invention, the sliding table 51 may include a sliding table plate and a stepping motor, and the sliding table plate may move back and forth relative to the new product under the driving of the stepping motor to adjust the distance between the backlight surface of the chip and the microscope 52.
Specifically, each laser device 42 is composed of multiple chips, each path is detected by the method, after the detection is finished, the laser device 42 is placed back to the original position of the material box 40, the second laser device 42 is detected, and by repeating the steps, the detection device can automatically detect all the chips on the four laser devices 42 in the material box 40 by one-time feeding.
The detection device for the laser chip provided by the embodiment of the utility model has the advantages that the material feeding and discharging are simple, the operation complexity is reduced, the detection process is automatically completed, an operator only needs to operate the detection device, and the labor intensity of the operator is reduced; in the test process, the detection mechanism automatically focuses on the clearest position of each chip, so that the detection quality is improved, and meanwhile, the detection result is automatically stored, so that traceability is provided for ensuring the product quality.
As shown in fig. 1, in an embodiment of the present invention, the present invention further includes a platform 100, and the feeding mechanism, the material taking mechanism and the detecting mechanism are all disposed on the platform 100. Further, a switch box 60 is further disposed on the platform 100, and is used for controlling starting and stopping of the X-axis module 10, the Y-axis module 20, and the Z-axis module 30.
The working process of the detection device for a laser chip according to the present invention is described in detail below by taking the embodiment shown in fig. 1 as an example.
A jig 41 is arranged in the material box 40, a plurality of laser devices 42 are arranged in the jig 41, and the backlight surfaces of the chips of the laser devices 42 face the same direction. The material box 40 is arranged on the X-axis module 10, and under the driving of the X-axis module 10, the material box 40 can move to a specified position, namely, the material taking position of the clamping jaw 31. The clamping jaw 31 is driven by the Y-axis module 20 to move along the Y-axis direction, and when the clamping jaw 31 moves to the material taking position, the clamping jaw 31 is driven by the Z-axis module 30 to grab the laser device 42 and move to the position opposite to the microscope 52. Because each laser device 42 is internally provided with a plurality of chips, each chip can be aligned with the microscope 52 one by one under the drive of the Y-axis module 20, the slide table 51 arranged below the microscope 52 is adjusted, each chip can be focused with the microscope 52 one by one, so as to detect the backlight surface of the laser device 42 chip, the detection result is automatically uploaded to the server, and an operator can perform quality discrimination on each laser device 42 according to the detection result.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (9)

1. A detection apparatus for a laser chip, comprising:
the laser device feeding device comprises a feeding mechanism, a laser device and a control device, wherein a material box is arranged on the feeding mechanism, the feeding mechanism can drive the material box to move, and a plurality of laser devices are placed in the material box;
the laser device picking mechanism comprises a material taking mechanism and a detection mechanism, wherein the material taking mechanism can move in the horizontal direction and the vertical direction to clamp the laser device, each path of chip of the laser device is aligned with the detection mechanism one by one, and the detection mechanism can automatically focus to detect each path of chip of the laser device.
2. The detection device of the laser chip as claimed in claim 1, wherein the feeding mechanism includes an X-axis module, the X-axis module is provided with the material box, and the X-axis module can drive the material box to move in an X-axis direction.
3. The detection device for the laser chip according to claim 1 or 2, wherein a jig is arranged in the material box, and a plurality of laser devices are placed in the jig.
4. The apparatus for detecting a laser chip according to claim 3, wherein the jig is provided with a mark indicating a backlight surface of the laser device.
5. The apparatus for inspecting a laser chip as set forth in claim 1, wherein the material-taking mechanism comprises:
the Z-axis module is perpendicular to the Y-axis module and can move along the Y-axis module;
and the clamping jaw is arranged on the Z-axis module and can move up and down along the vertical direction under the driving of the Z-axis module.
6. The device for detecting the laser chip as claimed in claim 5, wherein the clamping jaw comprises a pair of oppositely disposed clamping pieces, each clamping piece comprises a first body, a second body and a third body which are connected in sequence, the second body is disposed perpendicular to the first body and the third body, respectively, a distance between the two third bodies is greater than a distance between the two first bodies, a first boss is vertically disposed on a lower portion of each third body, and the two first bosses are disposed between the two third bodies.
7. The detecting device for the laser chip as claimed in claim 5, wherein the clamping jaw comprises a pair of oppositely disposed clamping pieces, each clamping piece comprises a fourth body and a fifth body disposed perpendicularly to each other, a second boss is vertically disposed on a lower portion of each fifth body, and two second bosses are located between two fifth bodies.
8. The apparatus for inspecting a laser chip according to claim 1 or 5, wherein the inspection mechanism comprises:
the microscope is arranged on the sliding table;
a CCD camera mounted on the microscope;
the laser device can be aligned with the microscope under the driving of the material taking mechanism.
9. The apparatus for detecting the laser chip as claimed in claim 1, further comprising a platform, wherein the feeding mechanism, the material taking mechanism and the detecting mechanism are all disposed on the platform.
CN202120577779.9U 2021-03-22 2021-03-22 Detection device for laser chip Active CN214953120U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202120577779.9U CN214953120U (en) 2021-03-22 2021-03-22 Detection device for laser chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202120577779.9U CN214953120U (en) 2021-03-22 2021-03-22 Detection device for laser chip

Publications (1)

Publication Number Publication Date
CN214953120U true CN214953120U (en) 2021-11-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202120577779.9U Active CN214953120U (en) 2021-03-22 2021-03-22 Detection device for laser chip

Country Status (1)

Country Link
CN (1) CN214953120U (en)

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