CN214951437U

CN214951437U - Sensor housing and sensor

Info

Publication number: CN214951437U
Application number: CN202121041481.2U
Authority: CN
Inventors: 钟智
Original assignee: China Mobile Communications Group Co Ltd; China Mobile Group Henan Co Ltd
Current assignee: China Mobile Communications Group Co Ltd; China Mobile Group Henan Co Ltd
Priority date: 2021-05-14
Filing date: 2021-05-14
Publication date: 2021-11-30
Anticipated expiration: 2031-05-14

Abstract

The application discloses sensor housing and sensor, sensor housing includes shell main part, mounting panel, fin and conducting strip, and shell main part is equipped with and holds chamber and opening, holds the chamber and is used for holding sensor main part, the opening with hold the chamber intercommunication, the opening is located to the mounting panel, the conducting strip locate the mounting panel in the face of hold one side in chamber, and the conducting strip stretches into to holding the chamber, the fin is located the mounting panel deviate from the one side that holds the chamber. Adopt the sensor housing and the sensor of this application, the conducting strip stretches into and holds the intracavity, can absorb the heat that the sensor main part produced, and give the fin with the heat transfer, the fin is located and holds the chamber outside, the fin can with the heat transfer to holding the chamber outside, thereby play better radiating effect to the sensor main part that holds the intracavity, the opening part is located to the mounting panel simultaneously, the mounting panel can play sealed effect to holding the chamber, it can not get into through the opening and holds the intracavity to hold the outer dust of chamber, thereby play good guard action to the sensor main part.

Description

Sensor housing and sensor

Technical Field

The application relates to the technical field of sensors, in particular to a sensor shell and a sensor.

Background

Sensor, especially wireless sensor, in the use, sensor housing's the intracavity that holds is located to the sensor main part, sensor housing provides the effect of protection to the sensor main part, sensor main part work can produce the heat for a long time, sensor housing is equipped with the thermovent, the heat that produces to sensor main part work for a long time is arranged and is dispersed, the dust also gets into sensor housing's the intracavity that holds through the thermovent easily simultaneously, the thermovent has played radiating effect, but the leakproofness is not good, cause a large amount of dusts of sticking cover on sensor body surface easily, influence the sensing effect.

Disclosure of Invention

The application discloses sensor housing and sensor to solve prior art in the sensor housing leakproofness not good, cause the problem that a large amount of dust are pasted on sensor body surface easily.

In order to solve the above problems, the following technical solutions are adopted in the present application:

the utility model provides a sensor housing, includes shell main part, mounting panel, fin and conducting strip, the shell main part is equipped with and holds chamber and opening, it is used for holding sensor main part to hold the chamber, the opening with hold the chamber intercommunication, the mounting panel is located the opening, the conducting strip is located facing of mounting panel hold one side in chamber, just the conducting strip stretch into to hold the chamber, the fin is located deviating from of mounting panel hold one side in chamber.

A sensor comprises a sensor main body and the sensor shell, wherein the sensor main body is arranged in the accommodating cavity.

The technical scheme adopted by the application can achieve the following beneficial effects:

adopt the sensor housing and the sensor of this application, the conducting strip stretches into and holds the intracavity, can absorb the heat that the sensor main part produced, and give the fin with the heat transfer, the fin is located and holds the chamber outside, the fin can with the heat transfer to holding the chamber outside, thereby play better radiating effect to the sensor main part that holds the intracavity, the opening part is located to the mounting panel simultaneously, the mounting panel can play sealed effect to holding the chamber, it can not get into through the opening and holds the intracavity to hold the outer dust of chamber, thereby play good guard action to the sensor main part.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1 is a schematic structural diagram of a sensor housing according to an embodiment of the present application;

FIG. 2 is an exploded view of a sensor housing according to an embodiment of the present application;

fig. 3 is a connection diagram of a heat conductive sheet, a mounting board, and a heat sink in an embodiment of the present application.

Description of reference numerals:

100-a housing body, 120-an opening, 130-a first side wall, 131-a threaded hole,

200-mounting plate, 220-second groove, 230-mounting hole,

300-heat conducting fins, 400-heat radiating fins, 500-threaded fasteners and 600-heat conducting silicone grease layers.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

As shown in fig. 1-3, the present application provides a sensor housing that includes a housing body 100, a mounting plate 200, a heat conductive fin 300, and a heat sink 400.

The shell main part 100 provides the installation basis for the sensor main part, plays the effect of protection to the sensor main part, and the shell main part 100 is equipped with and holds the chamber, holds the chamber and is used for holding the sensor main part. The sensor body may be installed in the receiving cavity and coupled to the housing body 100. The sensor body and the housing body 100 may be connected by any means of clamping connection, screw connection, or adhesive connection, and the present application does not limit the manner in which the sensor body and the housing body 100 are connected.

The housing body 100 is further provided with an opening 120, the opening 120 is in communication with the receiving cavity, and the opening 120 can be used to put the sensor body into the housing body 100 or take it out of the housing body 100. The opening 120 is also used for heat dissipation, and the sensor body generates heat in long-term operation, and the generated heat can be discharged out of the accommodating cavity through the opening 120.

Conducting strip 300 and fin 400 are the heat radiation component of sensor housing, and conducting strip 300 stretches into and holds the chamber, can absorb the heat that holds the intracavity, will hold the heat transfer of intracavity for fin 400, and fin 400 is used for diffusing the heat to holding the intracavity outside, thereby conducting strip 300 and fin 400 cooperate and play better radiating effect to holding the sensor main part of intracavity.

Opening 120 department is located to mounting panel 200, and mounting panel 200 can play the effect of sheltering from to opening 120 to play sealed effect to holding the chamber, make and hold the dust outside the chamber and can not get into through opening 120 and hold the intracavity, thereby play good guard action to the sensor main part.

The heat-conducting strip 300 is arranged on one side, facing the accommodating cavity, of the mounting plate 200, the heat-conducting strip 300 extends into the accommodating cavity, heat generated by the sensor body is absorbed, the heat absorbed by the heat-conducting strip 300 is transferred to the mounting plate 200, and the heat radiating sheet 400 is arranged on one side, deviating from the accommodating cavity, of the mounting plate 200, so that the heat is transferred to the heat radiating sheet 400 again and is diffused to the outside of the accommodating cavity through the heat radiating sheet 400.

Mounting plate 200 may, on the one hand, block opening 120, providing a seal for the cavity, and on the other hand, mounting plate 200 may provide a mounting base for heat sink 300 and heat sink 400.

In the embodiment of the present application, the housing main body 100 may be a square housing main body, or may also be a circular housing main body or a housing main body with other shapes, and the present application does not limit the shape of the housing main body 100.

The housing main body 100 comprises a first side wall 130, an opening 120 is formed in the first side wall 130, a mounting plate 200 covers the opening 120, and the mounting plate 200 covers the opening 120, so that the opening 120 can be better shielded, and a sealing effect is achieved on the accommodating cavity. Mounting plate 200 is disposed outside of the receiving cavity, which facilitates mounting of mounting plate 200. The heat conduction sheet 300 extends into the accommodating cavity through the opening 120, so that heat in the accommodating cavity is absorbed, the mounting plate 200 is attached to the first side wall 130, and dust can be prevented from entering the accommodating cavity due to a gap between the mounting plate 200 and the first side wall 130.

To further achieve the sealing effect, the sensor housing may further comprise a sealing gasket. A sealing gasket is disposed between mounting plate 200 and first sidewall 130, and the sealing gasket is disposed around opening 120. The sealing ring, which may be an elastic gasket, can perform a better sealing effect, and the mounting plate 200 is compressed between the mounting plate 200 and the first sidewall 130 when being connected with the housing body 100, and the sealing gasket surrounds the opening 120, thereby performing a sealing function on the opening 120.

In the embodiment of the present application, the mounting plate 200 is coupled to the first sidewall 130 by a threaded fastener 500. Through the connection of threaded fastener 500, firm in connection, easy operation, and can dismantle, can also separate mounting panel 200 and first lateral wall 130 when needing. Specifically, the first side wall 130 of the housing main body 100 is provided with a screw hole 131, the mounting plate 200 is provided with a mounting hole 230, and the screw hole 131 is opposite to the mounting hole 230 and then fastened by a screw fastener 500 such as a screw or a bolt. The mounting hole 230 may be a light hole, and the mounting hole 230 may also be provided with a screw thread.

In this embodiment, one side of the mounting plate 200 facing the accommodating cavity is provided with a first groove, and the heat-conducting fins 300 are inserted into the first groove and connected to the mounting plate 200 in a clamping manner. This kind of mode is connected conveniently, only needs to insert the conducting strip 300 into first recess can realize mounting panel 200 and conducting strip 300's connection.

One side of mounting plate 200 that deviates from and holds the chamber is equipped with second recess 220, and fin 400 inserts second recess 220, and is connected with mounting plate 200 joint. This way is convenient for connection, and the connection of the mounting plate 200 and the heat sink 400 can be realized only by inserting the heat sink 400 into the first groove. Wherein, the first groove is disposed in the same manner as the second groove 220.

Preferably, the first and second grooves 220 are distributed on two sides of the mounting plate 200, and the first and second grooves 220 are opposite to each other, the first groove is used for connecting with the heat-conducting fin 300, and the second groove 220 is used for connecting with the heat-radiating fin 400.

In the embodiment of the present application, the first groove may be communicated with the second groove 220, so that the heat absorbed by the heat conducting plate 300 may enter the second groove 220 through the first groove and then be transferred to the heat dissipating fin 400, thereby achieving better heat exchange between the heat conducting plate 300 and the heat dissipating fin 400, and further achieving higher heat dissipating efficiency.

Alternatively, the first groove may be communicated with the second groove 220 to form a through hole, that is, the mounting plate 200 is provided with a through hole, the through hole has two sections, one section of the through hole close to the accommodating cavity is the first groove for connecting with the heat conducting fin 300, and one section of the through hole far from the accommodating cavity is the second groove 220 for connecting with the heat radiating fin 400. Thus, the heat conductive sheet 300 and the heat dissipation sheet 400 can be in contact in the through-hole, thereby performing heat transfer in direct contact, resulting in higher heat dissipation efficiency.

In the embodiment of the present application, the sensor housing includes a plurality of heat dissipation fins 400 and a plurality of heat conduction fins 300, and the plurality of heat dissipation fins 400 and the plurality of heat conduction fins 300 correspond to each other one to one. Providing a plurality of heat radiating fins 300 and a plurality of heat radiating fins 400 can increase the area where heat exchange occurs, thereby better performing heat transfer, resulting in higher heat absorption, heat conduction, and heat radiation efficiency. The plurality of heat radiating fins 400 and the plurality of heat conductive fins 300 correspond to each other one by one, so that the heat transfer efficiency between the heat conductive fins 300 and the heat radiating fins 400 can be improved.

In the embodiment of the present application, the opening 120 and the heat conducting sheet 300 are in guiding fit in the direction of the cavity of the opening 120, so that the heat conducting sheet 300 can be guided when being installed, and the opening 120 and the heat conducting sheet 300 are in spacing fit in the length direction of the heat conducting sheet 300, so that the heat conducting sheet 300 can be prevented from shaking in the length direction.

Specifically, the length of the opening 120 and the length of the heat conductive sheet 300 may be set to be the same. Thus, the two ends of the heat-conducting plate 300 respectively abut against the two ends of the opening 120, so that the opening 120 is guided and matched towards the accommodating cavity, and the heat-conducting plate 300 is guided to extend into the accommodating cavity when being installed; the heat conducting fin 300 is in limited fit in the length direction, so that after the heat conducting fin 300 extends into the accommodating cavity, the threaded hole 131 in the first side wall 130 is just aligned with the mounting hole 230 in the mounting plate 200, and the mounting plate 200 is conveniently connected with the first side wall 130.

In the embodiment of the present application, the heat sink 400 and the heat conducting plate 300 are both provided with the heat conducting silicone layer 600, and the heat conducting silicone layer 600 can improve heat absorption and heat dissipation efficiency, so that the heat dissipation efficiency is higher.

When mounting, the sensor body may be placed in the receiving cavity through the opening 120, the sensor body is fixedly attached to the housing body 100, the heat conductive sheet 300 is then mounted on the mounting plate 200 through the first recess, the heat sink 400 is mounted on the mounting plate 200 through the second recess 220, the heat conductive sheet 300 is then extended into the receiving cavity through the opening 120, and the mounting plate 200 is connected to the first sidewall 130.

The embodiment of the application further provides a sensor, the provided sensor comprises a sensor main body and a sensor housing, the sensor housing is the sensor housing described in the above embodiment, and comprises a housing main body 100, a mounting plate 200, a heat conducting fin 300 and a heat radiating fin 400, the housing main body 100 is provided with an accommodating cavity and an opening 120, the opening 120 is communicated with the accommodating cavity, and the sensor main body is arranged in the accommodating cavity. The sensor may be a wireless sensor.

The sensor main body is connected with housing main body 100 in holding the intracavity, and the sensor main body is connected with housing main body 100 through any mode in joint connection, threaded connection, adhesive bonding, and this application does not restrict the mode that the sensor main body is connected with housing main body 100.

By adopting the sensor shell and the sensor, the heat conducting fin 300 extends into the accommodating cavity, absorbs heat generated by the sensor main body and transfers the heat to the radiating fin 400, the radiating fin 400 is positioned outside the accommodating cavity, and the radiating fin 400 can transfer the heat to the outside of the accommodating cavity, so that the sensor main body in the accommodating cavity can be well radiated; meanwhile, the mounting plate 200 is arranged at the opening 120, the mounting plate 200 can play a role in sealing the accommodating cavity, and dust outside the accommodating cavity cannot enter the accommodating cavity through the opening 120, so that a good protection effect is achieved on the sensor main body.

In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. The utility model provides a sensor housing, its characterized in that, includes housing body (100), mounting panel (200), conducting strip (300) and fin (400), housing body (100) is equipped with and holds chamber and opening (120), it is used for holding sensor body to hold the chamber, opening (120) with hold the chamber intercommunication, mounting panel (200) are located the opening, conducting strip (300) are located facing of mounting panel (200) hold one side of chamber, just conducting strip (300) stretch into to hold the chamber, fin (400) are located deviating from of mounting panel (200) hold one side of chamber.

2. The sensor housing according to claim 1, wherein the housing body (100) comprises a first side wall (130), the opening (120) is formed in the first side wall (130), the mounting plate (200) is covered on the opening (120), the heat-conducting fin (300) extends into the accommodating cavity through the opening (120), and the mounting plate (200) is attached to the first side wall (130).

3. The sensor housing of claim 2, wherein the mounting plate (200) is coupled to the first sidewall (130) by a threaded fastener (500).

4. The sensor housing according to claim 1, wherein a side of the mounting plate (200) facing the receiving cavity is provided with a first groove, and the heat-conducting fin (300) is inserted into the first groove and is connected with the mounting plate (200) in a clamping manner.

5. The sensor housing according to claim 4, characterized in that a second recess (220) is provided on a side of the mounting plate (200) facing away from the receiving cavity, and the heat sink (400) is inserted into the second recess (220) and is connected to the mounting plate (200) in a snap-fit manner.

6. The sensor housing according to claim 5, wherein the first recess communicates with the second recess (220).

7. The sensor housing according to claim 1, wherein the sensor housing comprises a plurality of the heat-conducting fins (300) and a plurality of the heat-radiating fins (400), and a plurality of the heat-radiating fins (400) and a plurality of the heat-conducting fins (300) correspond one to one.

8. The sensor housing according to claim 1, wherein the opening (120) is in guiding engagement with the heat-conducting plate (300) in a direction of the opening (120) toward the receiving cavity, and the opening (120) is in restraining engagement with the heat-conducting plate (300) in a longitudinal direction of the heat-conducting plate.

9. A sensor housing according to claim 1, wherein the heat sink (400) and the heat conducting plate (300) are each provided with a layer (600) of heat conducting silicone.

10. A sensor comprising a sensor body and a sensor housing according to any one of claims 1 to 9, said sensor body being disposed in said receiving cavity.