CN214878450U

CN214878450U - Silicon chip disconnect-type adsorbs transmission device

Info

Publication number: CN214878450U
Application number: CN202120943429.XU
Authority: CN
Inventors: 沈晓
Original assignee: Jiangsu Green Power Pv Co ltd
Current assignee: Jiangsu Green Power Pv Co ltd
Priority date: 2021-04-30
Filing date: 2021-04-30
Publication date: 2021-11-26
Anticipated expiration: 2031-04-30

Abstract

The utility model belongs to the technical field of silicon chip production facility technique and specifically relates to a silicon chip disconnect-type adsorbs transmission device, including first conveyer belt and second conveyer belt, both set up relatively, and first conveyer belt both ends are equipped with the spacing mechanism of blowing up in a left side and the spacing mechanism of blowing up in the right side respectively, have placed the silicon chip on the first conveyer belt and have piled up the bracket, and the spacing mechanism upper end of blowing up in the right side is equipped with adsorbs transmission device. The utility model discloses a silicon chip disconnect-type adsorbs transmission device, the silicon chip that will pile up full silicon chip piles up the bracket and places on first conveyer belt, convey it to adsorbing the transmission device below, control it adsorb the transmission device to its below silicon chip on absorption transmission to the second conveyer belt one by one, this transmission device can be effectively swift realize the separation transmission of silicon chip, labor intensity is reduced, and production efficiency has been improved, the improper problem of polluting the silicon chip of manual operation has been avoided simultaneously.

Description

Silicon chip disconnect-type adsorbs transmission device

Technical Field

The utility model belongs to the technical field of silicon chip production facility technique and specifically relates to a transmission device is adsorbed to silicon chip disconnect-type is related to.

Background

In the processing production of silicon chips, in order to meet different application requirements, the silicon chips often need to be subjected to various chemical treatments, along with the popularization of automatic production, the silicon chips are generally conveyed to each processing station through a production line, in order to improve the production efficiency, some processing working sections need to separate stacked silicon chips one by one, and the subsequent processing of the silicon chips is carried out. Therefore, a new silicon wafer transferring apparatus is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is: in order to overcome the problems that manual separation of stacked silicon wafers in the prior art is time-consuming and labor-consuming, is not beneficial to industrialization and is high in cost, a silicon wafer separation type adsorption and transmission device is provided, a silicon wafer stacking bracket which is fully stacked with silicon wafers is placed on a first conveying belt and is conveyed to the lower part of an adsorption and transmission mechanism, the adsorption and transmission mechanism is controlled to adsorb and transmit the silicon wafers below the adsorption and transmission mechanism one by one onto a second conveying belt, and in the process, a left limiting blowing-up mechanism and a right limiting blowing-up mechanism on two sides of the first conveying belt blow up the silicon wafers on the silicon wafer stacking bracket one by one.

The utility model provides a technical scheme that its technical problem adopted is: a silicon wafer separation type adsorption conveying device comprises a first conveying belt and a second conveying belt which are oppositely arranged, wherein a left limiting blowing-up mechanism and a right limiting blowing-up mechanism are respectively arranged at two ends of the first conveying belt, a silicon wafer stacking bracket is placed on the first conveying belt, and an adsorption conveying mechanism is arranged at the upper end of the right limiting blowing-up mechanism; the adsorption and transmission mechanism comprises a horizontal moving unit and a vertical moving unit, the vertical moving unit is connected to the horizontal moving unit, the horizontal moving unit is connected to the upper end of the right limiting and blowing mechanism, the lower end of the vertical moving unit is connected with an adsorption plate through a cross rod, and a plurality of suction nozzle trays are arranged on the lower plate surface of the adsorption plate; the left limiting blowing mechanism and the right limiting blowing mechanism are identical in structure and are composed of an outer shell, a lifting unit, a support, an air faucet and an air pipe, the lifting unit is connected to the bottom of a cavity in the outer shell, the output end of the lifting unit is connected with the support, the front end of the support is connected with the air faucet, the air faucet is arranged at an opening on the side of the outer shell, and the end part of the air faucet is communicated with the air pipe; the silicon wafer stacking bracket comprises a bottom plate, a plurality of separation blades are fixed on the peripheral side face of the bottom plate, and protective layers are arranged on the inner side faces of the separation blades.

In order to avoid the problem that the silicon wafer is placed on the silicon wafer stacking bracket and damaged by impact, a protective layer is arranged on a baffle sheet of the silicon wafer stacking bracket and made of soft silica gel. Improve the buffering and elasticity of the silicon wafer and play a role in protecting the silicon wafer

The side surface of the upper end of the protective layer is provided with a limiting bulge. The left limiting and blowing-up mechanism and the right limiting and blowing-up mechanism on two sides of the first conveying belt blow up the silicon wafers on the silicon wafer stacking bracket one by one, in the process, the uppermost end of a protective layer of the silicon wafer stacking bracket needs a limiting part for the silicon wafers, the upper end of the protective layer is set to be a limiting bulge, the effect of limiting and blowing up the silicon wafers is achieved, and the silicon wafers are prevented from being blown away from the silicon wafer stacking bracket through blowing force transition.

The horizontal moving unit and the vertical moving unit are both driving cylinders. Which acts to drive the displacement.

The suction nozzle disc is arranged on the lower surface of the adsorption plate, and the end part of the suction nozzle disc is fixed on the adsorption plate and is communicated with the air pipe.

The lifting unit is a cylinder, and the output end of the cylinder is connected with the end part of the bracket.

The utility model has the advantages that: the utility model discloses a silicon chip disconnect-type adsorbs transmission device, the silicon chip that will pile up full silicon chip piles up the bracket and places on first conveyer belt, convey it to adsorbing the transmission mechanism below, it adsorbs the transmission mechanism to the silicon chip of its below piece one by one adsorb to the second conveyer belt on, the silicon chip that this in-process first conveyer belt both sides is piled up the bracket to the silicon chip of mechanism and is blown one by one to the right spacing mechanism of blowing up in a left side, the silicon chip below its holding down force damage when having solved and adsorbing transmission mechanism and adsorbing the silicon chip, the separation transmission of realization silicon chip that this transmission device can be effectively swift, the labor intensity is reduced, and the production efficiency is improved, the problem of manual operation improper pollution silicon chip has been avoided simultaneously.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a schematic structural diagram of the present invention;

FIG. 2 is a bottom view of FIG. 1;

fig. 3 is a schematic view of the internal structure of the left limit blow-up mechanism in fig. 1.

In the figure: 1. the silicon wafer stacking device comprises a first conveyor belt, 2, a second conveyor belt, 3, a left limit blowing-up mechanism, 4, a right limit blowing-up mechanism, 5, a silicon wafer stacking bracket, 51, a bottom plate, 52, a blocking piece, 53, a protective layer, 6, an adsorption transmission mechanism, 61, a horizontal moving unit, 62, a vertical moving unit, 63, a cross rod, 64, an adsorption plate, 65, a suction nozzle disc, 7, an outer shell, 8, a lifting unit, 9, a support, 10, an air nozzle and 11, and is characterized in that the air pipe is arranged on the outer shell.

Detailed Description

The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the present invention only in a schematic manner, and thus show only the components related to the present invention.

As shown in fig. 1, the utility model is a schematic structural diagram of the present invention, which relates to a silicon wafer separation type adsorption conveying device, comprising a first conveying belt 1 and a second conveying belt 2, wherein the first conveying belt 1 and the second conveying belt 2 are arranged oppositely, a left limit blowing-up mechanism 3 and a right limit blowing-up mechanism 4 are respectively arranged at two ends of the first conveying belt 1, a silicon wafer stacking bracket 5 is placed on the first conveying belt 1, and an adsorption conveying mechanism 6 is arranged at the upper end of the right limit blowing-up mechanism 4;

the adsorption transmission mechanism 6 comprises a horizontal moving unit 61 and a vertical moving unit 62, the vertical moving unit 62 is connected to the horizontal moving unit 61, the horizontal moving unit 61 is connected to the upper end of the right limit blowing mechanism 4, the lower end of the vertical moving unit 62 is connected with an adsorption plate 64 through a cross rod 63, and the lower plate surface of the adsorption plate 64 is provided with a plurality of suction nozzle discs 65;

referring to fig. 1 and 3, the left limit blowing mechanism 3 and the right limit blowing mechanism 4 have the same structure and are each composed of an outer shell 7, a lifting unit 8, a support 9, an air faucet 10 and an air pipe 11, the lifting unit 8 is connected to the bottom of a cavity inside the outer shell 7, the output end of the lifting unit 8 is connected to the support 9, the front end of the support 9 is connected to the air faucet 10, the air faucet 10 is arranged at an opening on the side of the outer shell 7, and the end of the air faucet 10 is communicated with the air pipe 11;

the silicon wafer stacking bracket 5 comprises a bottom plate 51, wherein a plurality of baffle plates 52 are fixed on the peripheral side surfaces of the bottom plate 51, and protective layers 53 are arranged on the inner side surfaces of the baffle plates 52.

As shown in fig. 2, in order to avoid the problem that the silicon wafer is damaged by impact when it is placed on the wafer stacking tray, a protective layer is provided on the stopper, and the protective layer is made of soft silica gel. Improve the buffering and elasticity of the silicon wafer and play a role in protecting the silicon wafer

As shown in fig. 2, the side surface of the upper end of the protective layer is provided with a limiting bulge. The left limiting and blowing-up mechanism and the right limiting and blowing-up mechanism on two sides of the first conveying belt blow up the silicon wafers on the silicon wafer stacking bracket one by one, in the process, the uppermost end of a protective layer of the silicon wafer stacking bracket needs a limiting part for the silicon wafers, the upper end of the protective layer is set to be a limiting bulge, the effect of limiting and blowing up the silicon wafers is achieved, and the silicon wafers are prevented from being blown away from the silicon wafer stacking bracket through blowing force transition.

The horizontal moving unit 61 and the vertical moving unit 62 are both driven cylinders.

The suction nozzle plate 65 is disposed on the lower surface of the adsorption plate 64, and the end portion thereof is fixed to the adsorption plate 64 and is communicated with the air pipe.

The lifting unit 8 is a cylinder, and the output end of the cylinder is connected with the end part of the support 9.

During the use, the silicon wafer stacking bracket 5 full of stacked silicon wafers is placed on the first conveying belt 1 and conveyed to the position below the adsorption and transmission mechanism, the left limiting and blowing-up mechanism and the right limiting and blowing-up mechanism on the two sides of the first conveying belt 1 blow up the silicon wafers on the silicon wafer stacking bracket one by one, the problem that when the adsorption and transmission mechanism adsorbs the silicon wafers, the silicon wafers below are damaged by downward pressure is solved, then the blown-up silicon wafers are adsorbed by controlling the suction nozzle disc 65, and the adsorbed silicon wafers are transmitted to the second conveying belt 2 by controlling the horizontal moving unit 61 and the vertical moving unit 62 on the adsorption and transmission mechanism 6.

In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims

1. A silicon chip separation type adsorption conveying device comprises a first conveying belt (1) and a second conveying belt (2), which are oppositely arranged, and is characterized in that a left limiting blowing-up mechanism (3) and a right limiting blowing-up mechanism (4) are respectively arranged at two ends of the first conveying belt (1), a silicon chip stacking bracket (5) is placed on the first conveying belt (1), and an adsorption conveying mechanism (6) is arranged at the upper end of the right limiting blowing-up mechanism (4);

the adsorption transmission mechanism (6) comprises a horizontal moving unit (61) and a vertical moving unit (62), the vertical moving unit (62) is connected to the horizontal moving unit (61), the horizontal moving unit (61) is connected to the upper end of the right limiting blowing mechanism (4), the lower end of the vertical moving unit (62) is connected with an adsorption plate (64) through a cross rod (63), and a plurality of suction nozzle discs (65) are arranged on the lower plate surface of the adsorption plate (64);

the left limiting blowing-up mechanism (3) and the right limiting blowing-up mechanism (4) are identical in structure and are composed of an outer shell (7), a lifting unit (8), a support (9), an air nozzle (10) and an air pipe (11), the lifting unit (8) is connected to the bottom of an inner cavity of the outer shell (7), the output end of the lifting unit (8) is connected with the support (9), the front end of the support (9) is connected with the air nozzle (10), the air nozzle (10) is arranged at the side opening of the outer shell (7), and the end part of the air nozzle (10) is communicated with the air pipe (11);

the silicon wafer stacking bracket (5) comprises a bottom plate (51), a plurality of baffle plates (52) are fixed on the peripheral side faces of the bottom plate (51), and protective layers (53) are arranged on the inner side faces of the baffle plates (52).

2. The silicon wafer separating adsorption conveying device according to claim 1, wherein: the protective layer (53) is made of soft silica gel.

3. The silicon wafer separating adsorption conveying device according to claim 1, wherein: and a limiting bulge (54) is arranged on the side surface of the upper end of the protective layer (53).

4. The silicon wafer separating adsorption conveying device according to claim 1, wherein: the horizontal moving unit (61) and the vertical moving unit (62) are both driving air cylinders.

5. The silicon wafer separating adsorption conveying device according to claim 1, wherein: the suction nozzle disc (65) is arranged on the lower plate surface of the adsorption plate (64), and the end part of the suction nozzle disc is fixed on the adsorption plate (64) and communicated with the air pipe.

6. The silicon wafer separating adsorption conveying device according to claim 1, wherein: the lifting unit (8) is a cylinder, and the output end of the cylinder is connected with the end part of the support (9).