CN214815528U - Laser welding equipment for surface mounting process - Google Patents
Laser welding equipment for surface mounting process Download PDFInfo
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- CN214815528U CN214815528U CN202022674038.0U CN202022674038U CN214815528U CN 214815528 U CN214815528 U CN 214815528U CN 202022674038 U CN202022674038 U CN 202022674038U CN 214815528 U CN214815528 U CN 214815528U
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- base plate
- chip
- laser head
- laser
- laser welding
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Abstract
The utility model provides a laser welding equipment for paster technology, including laser head, chip, base plate, set up the laser head above chip and the base plate, the laser head sets up a plurality ofly, the chip sets up above the base plate, replaces whole high temperature to weld through laser, prevents that the base plate from deforming; and a reflow soldering process is cancelled, the equipment using area is reduced, and the production line layout is optimized.
Description
Technical Field
The utility model relates to a semiconductor chip packaging technology field especially relates to a laser welding equipment for paster technology.
Background
At present, some chip mounting devices and Heller reflow soldering devices can react and connect in the reflow soldering device after a chip is pasted on a substrate, the reflow soldering device generates heat through upper and lower heating blocks, constant heat is transmitted to a device working area through air blowing of upper and lower fans to generate rated temperature, however, due to the requirement of fluctuation of rated temperature of different areas in the reflow soldering device (40 ℃ → 255 → 40 ℃), an epoxy resin substrate of a product can be deformed at high and low temperatures, the chip and the substrate are warped to generate gaps, effective connection cannot be formed, and the problem is first in the rank of the defective rate of the manufacturing process at present and needs to be improved urgently.
The substrate of the product is deformed under high and low temperatures, so that the chip and the substrate are warped to generate gaps, and effective connection cannot be formed.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect of prior art, the utility model provides a laser welding equipment for paster technology, including laser head 1, chip 2, base plate 3, chip 2 and 3 tops of base plate set up laser head 1, laser head 1 sets up a plurality ofly, chip 2 sets up in 3 tops of base plate.
Preferably, the laser head 1 is a laser welding gun.
Preferably, the base plate 3 is disposed on a work platform 4.
Preferably, the laser head 1 is fixed on an adjustable support, and the adjustable support is provided with a left upper sliding rail, a right upper sliding rail and a left lower sliding rail.
The utility model has the advantages that: the laser replaces the whole high temperature for welding, so that the deformation of the substrate is prevented; and a reflow soldering process is cancelled, the equipment using area is reduced, and the production line layout is optimized.
Drawings
Fig. 1 is a structural diagram of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood and make the above features, objects, and advantages of the present invention more comprehensible, the present invention is further described with reference to the following examples. The examples are intended to illustrate the invention only and are not intended to limit the scope of the invention.
As shown in fig. 1, the present invention includes:
the utility model provides a laser welding equipment for paster technology, includes laser head 1, chip 2, base plate 3, chip 2 and 3 tops of base plate set up laser head 1, laser head 1 sets up a plurality ofly, chip 2 sets up in 3 tops of base plate.
In this embodiment, the laser head 1 is preferably a laser welding gun.
In this embodiment, the substrate 3 is preferably disposed on the work platform 4.
In this implementation, preferably, the laser head 1 is fixed on an adjustable support, and the adjustable support is provided with a left upper slide rail, a right upper slide rail and a left lower slide rail.
The laser head 1 is fixed on the upper part of the equipment; the operation platform 4 is fixed in the operation area of the equipment, and the chip 2 and the substrate 3 are welded by a laser head. The welding state is adjusted and changed by adjusting the position and energy of the laser head 1.
The above-described embodiments are merely illustrative of the principles and utilities of the present patent application and are not intended to limit the present patent application. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of this patent application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of this patent application.
Claims (4)
1. The utility model provides a laser welding equipment for paster technology, its characterized in that, includes laser head (1), chip (2), base plate (3), chip (2) and base plate (3) top set up laser head (1), laser head (1) sets up a plurality ofly, chip (2) set up in base plate (3) top.
2. The laser welding apparatus for the die bonding process according to claim 1, wherein: the laser head (1) is a laser welding gun.
3. The laser welding apparatus for the die bonding process according to claim 2, wherein: the base plate (3) is arranged on the operation platform (4).
4. The laser welding apparatus for the die bonding process according to claim 3, wherein: the laser head (1) is fixed on an adjustable support, and the adjustable support is provided with a left upper sliding rail, a right upper sliding rail and a lower sliding rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022674038.0U CN214815528U (en) | 2020-11-18 | 2020-11-18 | Laser welding equipment for surface mounting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022674038.0U CN214815528U (en) | 2020-11-18 | 2020-11-18 | Laser welding equipment for surface mounting process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214815528U true CN214815528U (en) | 2021-11-23 |
Family
ID=78758136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022674038.0U Active CN214815528U (en) | 2020-11-18 | 2020-11-18 | Laser welding equipment for surface mounting process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214815528U (en) |
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2020
- 2020-11-18 CN CN202022674038.0U patent/CN214815528U/en active Active
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