CN214757629U - High-efficient heat dissipation converter of computer network - Google Patents

High-efficient heat dissipation converter of computer network Download PDF

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Publication number
CN214757629U
CN214757629U CN202121218579.0U CN202121218579U CN214757629U CN 214757629 U CN214757629 U CN 214757629U CN 202121218579 U CN202121218579 U CN 202121218579U CN 214757629 U CN214757629 U CN 214757629U
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heat dissipation
heat
fixedly connected
outer protective
control module
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CN202121218579.0U
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章喜字
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Fujian Chuangxiang Lantu Technology Development Co ltd
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Liming Vocational University
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Abstract

The utility model discloses a high-efficiency heat dissipation converter for computer network, which belongs to the technical field of computer network, and comprises an outer protective shell, wherein the upper inner wall of the outer protective shell is fixedly connected with a control module, the lower inner wall of the outer protective shell is fixedly connected with a heat dissipation box, the heat dissipation box corresponds to the control module, the interior of the heat dissipation box is sequentially provided with a first heat dissipation cavity and a second heat dissipation cavity from top to bottom, heat dissipation fins are fixedly connected in the first heat dissipation cavity, the upper end of the heat dissipation box is provided with a plurality of first heat conduction ports, the plurality of first heat conduction ports are communicated with the first heat dissipation cavity, semiconductor refrigeration sheets are fixedly connected in the plurality of first heat conduction ports, the plurality of refrigeration sheets are all positioned at the upper ends of the heat dissipation fins, and the purpose of solving the problem that the heat dissipation performance of the network converter in the prior art is poor, and can generate higher temperature after long-time use to influence the stability of the network, the service life of the converter is reduced.

Description

High-efficient heat dissipation converter of computer network
Technical Field
The utility model relates to a computer network technical field, more specifically say, relate to a high-efficient heat dissipation converter of computer network.
Background
The network switch (also called network switch) is used for switching between wide area network and internal local area network, i.e. the servers and lines of internal and external networks are separated to realize complete physical isolation. The existing network converter has poor heat dissipation performance, and can generate higher temperature after being used for a long time, thereby influencing the stability of the network and reducing the service life of the converter.
SUMMERY OF THE UTILITY MODEL
To the problem that exists among the prior art, the utility model aims at providing a high-efficient heat dissipation converter of computer network aims at solving the heat dispersion of the network converter among the prior art not good, uses the back for a long time, can produce higher temperature, influences the stability of network, reduces the life's of converter problem.
In order to solve the above problem, the utility model adopts the following technical scheme:
a high-efficiency heat dissipation converter for a computer network comprises an outer protective shell, wherein a control module is fixedly connected to the upper inner wall of the outer protective shell, a heat dissipation box is fixedly connected to the lower inner wall of the outer protective shell, the heat dissipation box corresponds to the control module, a first heat dissipation cavity and a second heat dissipation cavity are sequentially arranged in the heat dissipation box from top to bottom, heat dissipation fins are fixedly connected in the first heat dissipation cavity, a plurality of first heat conduction ports are formed in the upper end of the heat dissipation box and communicated with the first heat dissipation cavity, a plurality of semiconductor refrigeration pieces are fixedly connected in the first heat conduction ports and are respectively located at the upper ends of the heat dissipation fins, a plurality of second heat conduction ports are formed between the first heat dissipation cavity and the second heat dissipation cavity, and heat dissipation fans are fixedly connected in the second heat conduction ports, the heat dissipation fans correspond to the heat dissipation fins, a group of first heat dissipation holes are formed in the lower inner wall of the second heat dissipation cavity, a group of second heat dissipation holes are formed in the lower end of the outer protection shell, and the group of second heat dissipation holes correspond to the group of first heat dissipation holes.
As a preferred scheme of the utility model, the inner wall all cuts a set of first heat dissipation hole about first heat dissipation chamber, a set of second heat dissipation hole has all been cut at both ends about the outer protective housing, and two sets of second heat dissipation holes are corresponding with two sets of first heat dissipation holes respectively.
As an optimized scheme of the utility model, the upper end fixedly connected with heat conduction silica gel piece of heat dissipation box, the heat conduction silica gel piece is located between control module and a plurality of semiconductor refrigeration piece.
As a preferred scheme of the utility model, four supporting legss of lower extreme fixedly connected with of outer protective housing, and four supporting legs evenly distributed are in the four corners department of outer protective housing lower extreme.
As a preferred scheme of the utility model, control module's front end is provided with a plurality of adjust knob, and a plurality of adjust knob's front end all runs through to the front side of outer protective housing.
As a preferred scheme of the utility model, a plurality of connectors of right-hand member fixedly connected with of outer protective housing, it is a plurality of the connector is corresponding with control module.
Compared with the prior art, the utility model has the advantages of:
(1) in the utility model, the control module is electrically connected with an external power supply, the control module is electrically connected with a plurality of semiconductor refrigeration sheets and a plurality of cooling fans, the control module is used as a main part of the converter, when the converter starts to work, the control module can be started by the external power supply, the control module can simultaneously start the plurality of semiconductor refrigeration sheets and the plurality of cooling fans, after the plurality of semiconductor refrigeration sheets in the first heat conduction ports are started, the plurality of semiconductor refrigeration sheets can transfer heat generated by the control module in operation to the cooling fins in the first cooling cavity, the plurality of semiconductor refrigeration sheets are equally divided into two surfaces, one surface absorbs heat and the other surface dissipates heat, one end of the plurality of semiconductor refrigeration sheets corresponding to the control module is a heat dissipation surface, one end of the plurality of semiconductor refrigeration sheets corresponding to the cooling fins is a heat dissipation surface, the plurality of semiconductor refrigeration sheets transfer heat to the inside of the cooling fins, a plurality of radiator fan then can be through a plurality of second heat conduction mouths with heat transfer to the second heat dissipation intracavity, the heat that gets into the second heat dissipation intracavity discharges through a set of first louvre and a set of second louvre, this is novel through the internal layout of transferring the network switch, improves the radiating unit structure and reaches high-efficient heat dissipation and reduce the inside temperature of casing to the life that increases the switch has also realized the stability of network.
(2) The utility model discloses in, when a plurality of semiconductor refrigeration pieces give heat radiation fins with heat conduction, heat radiation fins can discharge certain heat through two sets of second heat dissipation holes and two sets of first heat dissipation holes, improve the radiating effect to the converter, the heat conduction silica gel piece can make the heat that control module produced carry out quick derivation, improve the endothermic effect of a plurality of semiconductor refrigeration piece heat-absorbing surfaces simultaneously, four supporting legss can support whole converter, guarantee the stability when converter uses.
Drawings
Fig. 1 is a front view of the present invention;
fig. 2 is an elevation view of the present invention;
FIG. 3 is an exploded view of the present invention;
fig. 4 is a front sectional view of the present invention.
The reference numbers in the figures illustrate:
1. an outer protective shell; 2. a control module; 3. a heat dissipation box; 4. a first heat dissipation chamber; 5. a second heat dissipation chamber; 6. heat dissipation fins; 7. a first heat conduction port; 8. a semiconductor refrigeration sheet; 9. a second heat conduction port; 10. a heat radiation fan; 11. a first heat dissipation hole; 12. a second heat dissipation hole; 13. a first heat removal hole; 14. a second heat discharge hole; 15. a heat-conducting silica gel sheet; 16. supporting legs; 17. adjusting a knob; 18. and (7) connecting ports.
Detailed Description
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example (b):
referring to fig. 1-4, a computer network high-efficiency heat dissipation converter comprises an outer protective shell 1, a control module 2 is fixedly connected to the upper inner wall of the outer protective shell 1, a heat dissipation box 3 is fixedly connected to the lower inner wall of the outer protective shell 1, the heat dissipation box 3 corresponds to the control module 2, a first heat dissipation cavity 4 and a second heat dissipation cavity 5 are sequentially arranged in the heat dissipation box 3 from top to bottom, heat dissipation fins 6 are fixedly connected in the first heat dissipation cavity 4, a plurality of first heat conduction ports 7 are formed in the upper end of the heat dissipation box 3, the plurality of first heat conduction ports 7 are communicated with the first heat dissipation cavity 4, semiconductor refrigeration pieces 8 are fixedly connected in the plurality of first heat conduction ports 7, the plurality of semiconductor refrigeration pieces 8 are located at the upper ends of the heat dissipation fins 6, the plurality of semiconductor refrigeration pieces 8 correspond to the lower end of the control module 2, a plurality of second heat conduction ports 9 are formed between the first heat dissipation cavity 4 and the second heat dissipation cavity 5, the plurality of second heat conduction ports 9 are all fixedly connected with heat dissipation fans 10, the plurality of heat dissipation fans 10 correspond to the heat dissipation fins 6, a group of first heat dissipation holes 11 are drilled on the lower inner wall of the second heat dissipation cavity 5, a group of second heat dissipation holes 12 are drilled at the lower end of the outer protection shell 1, and the group of second heat dissipation holes 12 correspond to the group of first heat dissipation holes 11.
In this embodiment, the control module 2 is electrically connected to an external power source, the control module 2 is electrically connected to the plurality of semiconductor cooling fins 8 and the plurality of heat dissipation fans 10, the control module 2 is used as a main component of the converter, when the converter starts to operate, the control module 2 is started by the external power source, the control module 2 can simultaneously start the plurality of semiconductor cooling fins 8 and the plurality of heat dissipation fans 10, after the plurality of semiconductor cooling fins 8 in the plurality of first heat conduction ports 7 are started, the plurality of semiconductor cooling fins 8 can transfer heat generated by the control module 2 during operation to the heat dissipation fins 6 in the first heat dissipation chamber 4, the plurality of semiconductor cooling fins 8 are equally divided into two sides, one side absorbs heat and dissipates heat, one end of the plurality of semiconductor cooling fins 8 corresponding to the control module 2 is connected to the heat absorption surface, and one end of the plurality of semiconductor cooling fins 8 corresponding to the heat dissipation fins 6 is connected to the heat dissipation surface, after a plurality of semiconductor refrigeration pieces 8 transmitted the heat to heat radiation fins 6, a plurality of radiator fans 10 would be through a plurality of second heat conduction mouths 9 with heat transmission to the second heat dissipation chamber 5 in, the heat that gets into in the second heat dissipation chamber 5 was discharged through a set of first louvre 11 and a set of second louvre 12, this is novel through the inside overall arrangement of transferring the network switch, improves the radiating unit structure and reaches high-efficient heat dissipation and reduce the inside temperature of casing to increase the life of switch and also realized the stability of network.
Specifically, a set of first heat discharging holes 13 is drilled on the left inner wall and the right inner wall of the first heat dissipating cavity 4, a set of second heat discharging holes 14 is drilled on the left end and the right end of the outer protective shell 1, and the two sets of second heat discharging holes 14 correspond to the two sets of first heat discharging holes 13 respectively.
In this embodiment, when the plurality of semiconductor cooling fins 8 conduct heat to the heat dissipating fins 6, the heat dissipating fins 6 may discharge a certain amount of heat through the two sets of second heat discharging holes 14 and the two sets of first heat discharging holes 13, so as to improve the heat dissipating effect of the converter.
Specifically, the upper end fixedly connected with heat conduction silica gel piece 15 of heat dissipation box 3, heat conduction silica gel piece 15 are located between control module 2 and a plurality of semiconductor refrigeration piece 8.
In this embodiment, the heat conducting silica gel sheet 15 can lead out the heat generated by the control module 2 quickly, and improve the heat absorption effect of the heat absorption surfaces of the plurality of semiconductor refrigeration sheets 8.
Specifically, the lower end of the outer protective shell 1 is fixedly connected with four supporting legs 16, and the four supporting legs 16 are uniformly distributed at four corners of the lower end of the outer protective shell 1.
In this embodiment, the four support legs 16 can support the whole converter, thereby ensuring the stability of the converter during use.
Specifically, the front end of the control module 2 is provided with a plurality of adjusting knobs 17, and the front ends of the adjusting knobs 17 penetrate through the front side of the outer protective shell 1.
In this embodiment, a plurality of adjusting knobs 17 are used to control the start and stop of the control module 2.
Specifically, a plurality of connectors 18 are fixedly connected to the right end of the outer protective shell 1, and the plurality of connectors 18 correspond to the control module 2.
In the present embodiment, the plurality of connection ports 18 are used for connection of the converter to external lines.
The working principle is as follows: the control module 2 is electrically connected with an external power supply, the control module 2 is electrically connected with the plurality of semiconductor chilling plates 8 and the plurality of cooling fans 10, the control module 2 is used as a main component of the converter, when the converter starts to work, the control module 2 can be started through the external power supply, the control module 2 can enable the plurality of semiconductor chilling plates 8 and the plurality of cooling fans 10 to be started simultaneously, after the plurality of semiconductor chilling plates 8 in the plurality of first heat conducting ports 7 are started, the plurality of semiconductor chilling plates 8 can transfer heat generated when the control module 2 operates to the cooling fins 6 in the first cooling cavity 4, the plurality of semiconductor chilling plates 8 are divided into two sides, one side absorbs heat and the other side dissipates heat, one end, corresponding to the plurality of semiconductor chilling plates 8 and the control module 2, of the plurality of semiconductor chilling plates 8 and one end, corresponding to the cooling fins 6, are heat dissipation surfaces, the heat absorbing surfaces of the semiconductor cooling fins 8 transfer the heat of the control module 2 to the heat dissipation fins 6 through the heat dissipating surfaces, then the heat dissipation fans 10 transfer the heat to the second heat dissipation cavity 5 through the second heat conduction ports 9, and the heat entering the second heat dissipation cavity 5 is discharged through the first heat dissipation holes 11 and the second heat dissipation holes 12.
The above description is only the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution and the improvement concept of the present invention within the technical scope disclosed in the present invention.

Claims (6)

1. The utility model provides a high-efficient heat dissipation converter of computer network, includes outer protective housing (1), its characterized in that: the upper inner wall of the outer protective shell (1) is fixedly connected with a control module (2), the lower inner wall of the outer protective shell (1) is fixedly connected with a heat dissipation box (3), the heat dissipation box (3) corresponds to the control module (2), a first heat dissipation cavity (4) and a second heat dissipation cavity (5) are sequentially arranged in the heat dissipation box (3) from top to bottom, heat dissipation fins (6) are fixedly connected in the first heat dissipation cavity (4), a plurality of first heat conduction ports (7) are formed in the upper end of the heat dissipation box (3), the plurality of first heat conduction ports (7) are communicated with the first heat dissipation cavity (4), semiconductor refrigeration pieces (8) are fixedly connected in the first heat conduction ports (7), the plurality of semiconductor refrigeration pieces (8) are located at the upper ends of the heat dissipation fins (6), and the plurality of semiconductor refrigeration pieces (8) correspond to the lower end of the control module (2), dig between first heat dissipation chamber (4) and second heat dissipation chamber (5) has a plurality of second heat conduction mouth (9), and is a plurality of equal fixedly connected with radiator fan (10) in second heat conduction mouth (9), and a plurality of radiator fan (10) are corresponding with heat radiation fins (6), the lower inner wall of second heat dissipation chamber (5) is dug and is had a set of first louvre (11), the lower extreme of outer protective housing (1) is dug and is had a set of second louvre (12), and a set of second louvre (12) is corresponding with a set of first louvre (11).
2. The efficient heat dissipation converter of computer network of claim 1, wherein: the inner wall all cuts a set of first heat dissipation hole (13) about first heat dissipation chamber (4), both ends all cut a set of second heat dissipation hole (14) about outer protective housing (1), and two sets of second heat dissipation holes (14) are corresponding with two sets of first heat dissipation holes (13) respectively.
3. The efficient heat dissipation converter of claim 2, wherein: the upper end fixedly connected with heat conduction silica gel piece (15) of heat dissipation box (3), heat conduction silica gel piece (15) are located between control module (2) and a plurality of semiconductor refrigeration piece (8).
4. The efficient heat dissipation converter of claim 3, wherein: the lower extreme fixedly connected with four supporting legss (16) of outer protective housing (1), and four supporting legss (16) evenly distributed are in the four corners department of outer protective housing (1) lower extreme.
5. The efficient heat dissipation converter of claim 4, wherein: the front end of the control module (2) is provided with a plurality of adjusting knobs (17), and the front ends of the adjusting knobs (17) penetrate through the front side of the outer protective shell (1).
6. The efficient heat dissipation converter of claim 5, wherein: the right end of the outer protective shell (1) is fixedly connected with a plurality of connectors (18), and the connectors (18) correspond to the control module (2).
CN202121218579.0U 2021-06-02 2021-06-02 High-efficient heat dissipation converter of computer network Active CN214757629U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121218579.0U CN214757629U (en) 2021-06-02 2021-06-02 High-efficient heat dissipation converter of computer network

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121218579.0U CN214757629U (en) 2021-06-02 2021-06-02 High-efficient heat dissipation converter of computer network

Publications (1)

Publication Number Publication Date
CN214757629U true CN214757629U (en) 2021-11-16

Family

ID=78627403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121218579.0U Active CN214757629U (en) 2021-06-02 2021-06-02 High-efficient heat dissipation converter of computer network

Country Status (1)

Country Link
CN (1) CN214757629U (en)

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Effective date of registration: 20240115

Address after: 362000, Huada Street, Fengze District, Quanzhou City, Fujian Province, China, Sports Street, Huachuang Park, Creative Space 1106

Patentee after: Fujian chuangxiang lantu Technology Development Co.,Ltd.

Address before: 362000 298 Tonggang West Street, Feng Ze District, Quanzhou, Fujian

Patentee before: LIMING VOCATIONAL University