CN214749249U - Sample wafer manufacturing device for material detection and analysis - Google Patents

Abstract

The utility model provides a sample wafer making device for material detection and analysis, which is applied to the technical field of material detection and analysis, and comprises a quantifying mechanism (1), a grinding mechanism (2), a tabletting mechanism (3), a punching mechanism (4), a steel ring automatic access mechanism (5), a transfer mechanism (6) and a dosing mechanism (7), wherein the quantifying mechanism (1), the grinding mechanism (2), the tabletting mechanism (3), the punching mechanism (4), the steel ring automatic access mechanism (5), the transfer mechanism (6) and the dosing mechanism (7) are all arranged on a frame (8), the sample wafer making device for material detection and analysis has simple and compact structure, high efficiency, high-quality sample preparation, high automation degree, and one sample wafer can be finished in 6-7 minutes on average, and realize that many copies of sample wafer carry out different links simultaneously and handle, improve the film-making efficiency comprehensively.

Description

Sample wafer manufacturing device for material detection and analysis

Technical Field

The utility model belongs to the technical field of material detection and analysis, more specifically say, relate to a material is sample wafer making devices for detection and analysis.

Background

In the sample wafer manufacturing device for material detection and analysis in the prior art, a motor participates in vibration during working, two large balancing weights are arranged for balancing vibration torque, the motor does more useless work, and more dust is in the machine; and the structure of the other scheme is relatively overstaffed, high in fault rate, low in vibration efficiency and more in accessories. Therefore, the prior art devices have significant technical drawbacks.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: aiming at the defects of the prior art, the sample wafer manufacturing device for material detection and analysis is simple and compact in structure, high in efficiency, capable of efficiently completing sample manufacturing with high quality, high in automation degree, capable of completing one sample wafer in 6-7 minutes on average, capable of achieving different link processing of multiple sample wafers simultaneously and capable of comprehensively improving the wafer manufacturing efficiency.

To solve the technical problem, the utility model discloses the technical scheme who takes does:

the utility model relates to a sample slice making device for material detection and analysis, which comprises a quantifying mechanism 1, a grinding mechanism 2, a sheeting mechanism 3, a sheet punching mechanism 4, a steel ring automatic access mechanism 5, a transfer mechanism 6 and a dosing mechanism 7, wherein the quantifying mechanism 1, the grinding mechanism 2, the sheeting mechanism 3, the sheet punching mechanism 4, the steel ring automatic access mechanism 5, the transfer mechanism 6 and the dosing mechanism 7 are all arranged on a frame 8, the quantifying mechanism 1 comprises a device shell 1-1, the upper part of the device shell 1-1 is provided with an opening part 1-2, one side of the device shell 1-1 is provided with a turnover cylinder 1-3, the quantifying cup 1-4 is connected with the turnover cylinder 1-3, the quantifying cup 1-4 comprises a cup holding cavity I1-5 and a cup holding cavity II 1-6, a rotary door 1-7 for opening and closing the opening 1-2 is connected to a rotary member 1-8 on the other side of the apparatus case 1-1.

The grinding mechanism 2 comprises a vibration platform 2-1, a motor 2-2 is arranged below the vibration platform 2-1, a plurality of shock absorbers 2-4 are arranged on a platform plate 2-3 above the vibration platform 2-1, a grinding part 2-5 is arranged above the shock absorbers 2-4, the grinding part 2-5 comprises a main driving shaft 2-6 which is eccentrically arranged, the lower end of the main driving shaft 2-6 is connected with the motor 2-2 through a coupler 2-7, a grinding support bracket 2-8 and a grinding bowl bracket 2-9 are fixedly connected on the main driving shaft 2-6, the upper end of the shock absorber 2-4 is connected with the grinding support bracket 2-8, the outer side surface of the grinding bowl 2-10 is abutted against the grinding bowl bracket 2-9, a grinding column 2-11 and a grinding ring 2-12 are arranged in the grinding bowl 2-10, the grinding support bracket 2-8 is also provided with a driven shaft 2-13, and the grinding bowl 2-10 is provided with a grinding bowl upper cover 2-14.

The tabletting mechanism 3 comprises a mechanism frame 3-1, an upper platform 3-2 is arranged on the mechanism frame 3-1, a plurality of upright posts 3-3 are arranged on the upper platform 3-2, an upper cover plate is arranged on the upper parts of the upright posts 3-3, an upper die 3-4 is arranged on the lower surface of the upper cover plate, a lifting part 3-5 is also arranged on the mechanism frame 3-1, a tabletting die 3-6 is positioned between the lifting part 3-5 and the upper die 3-4, and a die limiting guide part 3-7 is arranged on the upright post 3-3.

The punching mechanism 4 comprises a mechanism frame 4-1, a fixing plate 4-2 is arranged on the upper portion of the mechanism frame 4-1, a device base 4-3 is arranged on the lower portion of the mechanism frame 4-1, a punching cylinder 4-4 is mounted on the fixing plate 4-2, a punching shaft 4-5 is mounted on the punching cylinder 4-4, a sample piece positioning piece 4-6 is arranged on the device base 4-3, and a discharge hole 4-7 penetrating through the sample piece positioning piece 4-6 is formed in the sample piece positioning piece 4-6.

The automatic steel ring storing and taking mechanism 5 comprises a motor fixing seat 5-1, the lower portion of the motor fixing seat 5-1 is connected with a motor I5-2, the upper portion of the motor fixing seat 5-1 is provided with a plurality of guide rods 5-3, a supporting table 5-4 is movably sleeved on each guide rod 5-3, an upper portion platform 5-5 is arranged on each guide rod 5-3, a lead screw 5-6 penetrates through the motor fixing seat 5-1 to be connected with the motor I5-2, and a connecting block 5-7 is screwed on each lead screw 5-6.

The transfer mechanism 6 comprises a connecting support 6-1, the connecting support 6-1 is installed on a horizontal cylinder 6-2, a station swing table 6-3 is installed on the connecting support 6-1, a lifting cylinder 6-4 is installed on the station swing table 6-3, a pneumatic claw 6-5 is installed on the lifting cylinder 6-4, and a finger I6-6 and a finger II 6-7 are installed on the pneumatic claw 6-5.

The dosing mechanism 7 comprises a bin 7-1, a rotary disc 7-2 is installed in the bin 7-1, an opening at the bottom 7-3 of the bin 7-1 is communicated with a quantitative valve body 7-4, a gap portion 7-5 is arranged on the rotary disc 7-2, the rotary disc 7-2 is connected with a motor II 7-6, and a blanking pipe 7-7 is arranged at the lower end of the quantitative valve body 7-4.

Towards the structure that the axle 5 of punching a piece mechanism 4 set up to 7 directions extensions of bin outlet to sample piece setting element 6, the central axis of punching the axle 5 and the central axis of sample piece setting element 6 set up to the coincidence structure, towards the structure that the piece cylinder 4 sets up to can drive the 5 oscilaltions of punching the axle.

The tabletting mechanism 3 further comprises a mould cleaning mechanism 9, the mould cleaning mechanism 9 comprises an upper mould cover 3-17, an upper mould 3-4 is arranged on the lower surface of the upper mould cover 3-17, a movable support 9-3 is sleeved on the upper mould cover 3-17, one end of an upper mould cylinder 9-4 is connected with the upper mould cover 3-17, the other end of the upper mould cylinder 9-4 is connected with the movable support 9-3, and a cleaning brush 9-5 is arranged at the lower part of the movable support 9-3.

The die limiting and guiding part 3-7 of the tabletting mechanism 3 comprises a linear die set 3-8 and a linear bearing 3-9, wherein the linear die set 3-8 is positioned at one side of the tabletting die 3-6, and the linear bearing 3-9 is positioned at the other side of the tabletting die 3-6.

Adopt the technical scheme of the utility model, can obtain following beneficial effect:

sample wafer making devices for material detection and analysis, to being not enough among the prior art, provide a sample wafer making devices for material detection and analysis of integral type structure (grind preforming all-in-one promptly for experimental sample wafer preparation). The using process of the manufacturing device is as follows: the material of preparation sample gets into quantitative mechanism ration, the medicine mechanism adds the medicine according to the kind of material, then, send into grinding mechanism with the mixed material after material and the medicine mixture, do high-speed superfine grinding with material and tablet together, the material that grinds shifts to sheeting mechanism and carries out the preforming, the sample piece after the preforming is accomplished is sent out by transport mechanism and is given to the analysis appearance analytical data, the sample piece returns after the analysis finishes, transport mechanism transports the sample piece to sample piece processing mechanism (towards piece mechanism, towards ring mechanism) and handles, the steel ring is transported to steel ring storehouse storage after handling, wait for the use next time. When the manufacturing device works, the motor of the grinding mechanism does not participate in vibration, so that the vibration amplitude of the device during working is reduced, useless work is avoided, and the energy consumption is reduced; the tabletting mechanism adopts a linear module structure, the control precision of the tabletting mold is accurate, the structure is easier to install, debug and maintain, the transfer mechanism adopts a multi-cylinder combined mode, the feedback is stable, and the cost is reduced. Sample wafer making devices for material detection and analysis, simple structure, compactness, efficiency is high-efficient, can be high-efficient, the sample preparation is accomplished to the high quality, degree of automation is high, accomplishes a sample wafer in 6-7 minutes on average to realize that many sample wafers carry out different links simultaneously and handle, improve film-making efficiency comprehensively.

Drawings

The contents of the description and the references in the drawings are briefly described as follows:

fig. 1 is a schematic structural view of a quantifying mechanism of a sample wafer manufacturing device for material detection and analysis according to the present invention;

fig. 2a is a schematic structural diagram of a grinding mechanism of a sample wafer manufacturing device for material detection and analysis according to the present invention;

fig. 2b is a schematic cross-sectional structural view of the grinding mechanism of the sample wafer manufacturing device for material detection and analysis according to the present invention;

fig. 3 is a schematic structural view of a pressing mechanism of a sample wafer manufacturing device for material detection and analysis according to the present invention;

fig. 4 is a schematic structural diagram of a sheet punching mechanism of a sample wafer manufacturing device for material detection and analysis according to the present invention;

FIG. 5 is a schematic structural view of an automatic steel ring storing and taking mechanism of the sample wafer manufacturing device for material detection and analysis according to the present invention;

fig. 6 is a schematic structural view of a transfer mechanism of a sample wafer manufacturing apparatus for material detection and analysis according to the present invention;

FIG. 7 is a schematic structural view of a chemical adding mechanism of the sample wafer manufacturing device for material detection and analysis according to the present invention;

fig. 8 is a schematic view of the overall structure of the sample wafer manufacturing apparatus for material detection and analysis according to the present invention;

fig. 9 is a schematic front view of the sample wafer manufacturing device for material detection and analysis according to the present invention;

in the drawings, the reference numbers are respectively: 1. a dosing mechanism; 2. a grinding mechanism; 3. a tablet pressing mechanism; 4. a punching mechanism; 5. a steel ring automatic storing and taking mechanism; 6. a transfer mechanism; 7. a dosing mechanism; 8. a frame; 9. a mold cleaning mechanism.

Detailed Description

The following description of the embodiments of the present invention will be made in detail with reference to the accompanying drawings, wherein the embodiments of the present invention are described in detail with reference to the accompanying drawings, for example, the shapes, structures, mutual positions and connection relations of the components, the functions and operation principles of the components, and the like:

as shown in attached drawings 1-9, the utility model relates to a sample slice manufacturing device for material detection and analysis, which comprises a quantifying mechanism 1, a grinding mechanism 2, a sheet pressing mechanism 3, a sheet punching mechanism 4, a steel ring automatic access mechanism 5, a transfer mechanism 6 and a dosing mechanism 7, wherein the quantifying mechanism 1, the grinding mechanism 2, the sheet pressing mechanism 3, the sheet punching mechanism 4, the steel ring automatic access mechanism 5, the transfer mechanism 6 and the dosing mechanism 7 are all arranged on a frame 8, the quantifying mechanism 1 comprises a device shell 1-1, the upper part of the device shell 1-1 is provided with an opening part 1-2, one side of the device shell 1-1 is provided with an overturning cylinder 1-3, the quantifying cup 1-4 is connected with the overturning cylinder 1-3, the quantifying cup 1-4 comprises a material cup holding cavity I1-5 and a material cup holding cavity II 1-6, a rotary door 1-7 for opening and closing the opening 1-2 is connected to a rotary member 1-8 on the other side of the apparatus case 1-1. Above-mentioned structure provides the material testing analysis of integral type structure and uses sample wafer making devices (grind preforming all-in-one promptly for the preparation of experimental sample wafer). The using process of the manufacturing device is as follows: the material of preparation sample gets into quantitative mechanism ration, the medicine mechanism adds the medicine according to the kind of material, then, send into grinding mechanism with the mixed material after material and the medicine mixture, do high-speed superfine grinding with material and tablet together, the material that grinds shifts to sheeting mechanism and carries out the preforming, the sample piece after the preforming is accomplished is sent out by transport mechanism and is given to the analysis appearance analytical data, the sample piece returns after the analysis finishes, transport mechanism transports the sample piece to sample piece processing mechanism (towards piece mechanism, towards ring mechanism) and handles, the steel ring is transported to steel ring storehouse storage after handling, wait for the use next time. When the manufacturing device works, the motor of the grinding mechanism does not participate in vibration, so that the vibration amplitude of the device during working is reduced, useless work is avoided, and the energy consumption is reduced; the tabletting mechanism adopts a linear module structure, the control precision of the tabletting mold is accurate, the structure is easier to install, debug and maintain, the transfer mechanism adopts a multi-cylinder combined mode, the feedback is stable, and the cost is reduced. Sample wafer making devices for material detection and analysis, simple structure, compactness, efficiency is high-efficient, can be high-efficient, the sample preparation is accomplished to the high quality, degree of automation is high, accomplishes a sample wafer in 6-7 minutes on average to realize that many sample wafers carry out different links simultaneously and handle, improve film-making efficiency comprehensively.

The grinding mechanism 2 comprises a vibration platform 2-1, a motor III 2-2 is arranged below the vibration platform 2-1, a plurality of shock absorbers 2-4 are arranged on a platform plate 2-3 above the vibration platform 2-1, a grinding part 2-5 is arranged above the shock absorbers 2-4, the grinding part 2-5 comprises a main driving shaft 2-6 which is eccentrically arranged, the lower end of the main driving shaft 2-6 is connected with the motor III 2-2 through a coupler 2-7, a grinding support bracket 2-8 and a grinding bowl bracket 2-9 are fixedly connected on the main driving shaft 2-6, the upper end of the shock absorber 2-4 is connected with the grinding support bracket 2-8, the outer side surface of the grinding bowl 2-10 is abutted against the grinding bowl bracket 2-9, a grinding column 2-11 and a grinding ring 2-12 are arranged in the grinding bowl 2-10, the grinding support bracket 2-8 is also provided with a driven shaft 2-13, and the grinding bowl 2-10 is provided with a grinding bowl upper cover 2-14. The device consists of a grinding component (grinding unit), a vibration driver and a vibration platform. The vibration driver consists of a motor (a driving motor) and a coupling (preferably a telescopic coupling), and the motor is connected to the lower end of the vibration platform through a check bolt and provides vibration power for the grinding part; the vibration generated in the vibration process of the grinding part is filtered by a damper (preferably a spring damper) connected with the grinding part and the vibration platform, so that the vibration influence and the noise of the grinding part on the whole machine are reduced. The vibration of the grinding part is powered by the main driving shaft, and the motion of the grinding bowl is restrained by the two driven shafts; the main driving shaft and the driven shaft are eccentric shafts with equal eccentricity, so that the grinding part can swing regularly under the excitation of the vibration driver. The vibratory power of the main drive shaft is derived from the input of the vibratory drive. The main driving shaft is connected above the coupler and is sequentially connected with the balancing weight, the grinding support bracket and the grinding bowl bracket in series, the top is limited by the pressing plate and the locknut, the main driving shaft can drive the whole grinding bowl bracket to eccentrically swing after receiving power transmitted by the coupler, the grinding bowl bracket drives the grinding bowl and the grinding bowl upper cover (including the grinding wall and the grinding upper cover, and the grinding ring and the grinding center pillar which are positioned in a cavity formed by the grinding wall and the grinding upper cover are influenced by impact and friction to generate displacement, so that multiple impact among each other is formed, the grinding effect of impacting and grinding the particle materials falling from the material pipe is achieved, the particle materials are crushed into usable tiny powder, meanwhile, the coupler is used for connecting between the motor (driving motor) and the main driving shaft, and the displacement generated when the grinding part vibrates does not cause impact on the driving motor, the service life of the driving motor is prolonged. Vibration mill structure, effectively improve vibration grinding efficiency and quality, make the reliable crushing formation of material satisfy the small powder of sample wafer preparation shaping requirement, the outside whole swing of grinding part is reduced under guaranteeing the normal condition of grinding simultaneously, the guarantee motor does not participate in the vibration, reduces the useless work of motor, avoids causing the impact to the motor, reduces whole size, improves wholeness ability.

The discharge port at the lower end of the grinding bowl 2-10 of the grinding mechanism 2 is communicated with an extension pipeline 2-15, a discharge pipe 2-16 is arranged on the extension pipeline 2-15, and a feeding pipe 2-17 is arranged on the upper cover 2-14 of the grinding bowl. Above-mentioned structure, when needing the grinding material, wait to grind the material and get into from the inlet pipe and grind the alms bowl in, grind through the vibration that grinds alms bowl and grinding column, grinding ring. After grinding is finished, the material discharging cylinder contracts to drive the push rod to move downwards for a certain distance, so that the materials slide to a material discharging pipe from a material outlet at the lower end of the grinding bowl 2-10 through the extension pipeline 2-15, and other equipment is introduced for the next link treatment. The lower end of the extension pipeline 2-15 is provided with a material discharge cylinder 2-18, the extension pipeline 2-1 is internally provided with a push rod 2-19, the lower end of the push rod 2-19 is connected with the material discharge cylinder 2-18, and a plugging piece 2-20 at the upper end of the push rod 2-19 is provided with a structure with the same shape and size as a material outlet at the lower end of the grinding bowl 2-10. According to the structure, after the discharging cylinder extends out to drive the push rod to move upwards, the sealing piece can seal the discharge hole at the lower end of the grinding bowl 2-10 to realize sealing, and at the moment, materials can lean against the grinding bowl to be ground and cannot fall outside.

The lower end of the device shell 1-1 is provided with a material pouring port 1-9. According to the structure, the material pouring ports 1-9 are located below and are of a horn-mouth-shaped structure, so that materials can be poured out quickly and cleanly. The vibrator is arranged on the side surface of the device shell 1-1. Above-mentioned structure carries out the material when pouring out, and the control unit control electromagnetic shaker begins vibrations to do benefit to the material and discharge more fast. The rotary uncovering 1-7 comprises an uncovering body 1-13 and a gland cylinder 1-14. The cover pressing cylinder can lift and rotate, so that the cover opening body moves upwards and rotates to open the opening part. The powdered or granular material is then poured manually or mechanically into the dosing cup.

The motor III 2-2 is set to be in a structure capable of driving the main driving shaft 2-6 to eccentrically swing through the coupler 2-7, and when the motor III 2-2 drives the main driving shaft 6 to eccentrically swing through the coupler 2-7, the main driving shaft 2-6 is set to be in a structure capable of driving the grinding part 2-5 to grind materials. And a vibration driver 2-25 is arranged between the coupling 2-6 and the motor III 2-2. When the main driving shaft 6 of the grinding part 2-5 drives the grinding part 2-5 to grind materials, the grinding bowl 2-10 of the grinding part 2-5, the grinding ring 2-12 and the grinding center post 2-11 in the cavity formed by the grinding bowl upper cover 2-14 are influenced by impact and friction to generate displacement, so that mutual impact is formed, the purpose of grinding granular materials falling from the feeding pipe 2-17 by impacting and rolling is achieved, and the granular materials are crushed into usable micro powder. Above-mentioned structure, can be through the action of grinding part, the vibration grinding of material is realized to the high efficiency.

The tabletting mechanism 3 comprises a mechanism frame 3-1, an upper platform 3-2 is arranged on the mechanism frame 3-1, a plurality of upright posts 3-3 are arranged on the upper platform 3-2, an upper cover plate is arranged on the upper parts of the upright posts 3-3, an upper die 3-4 is arranged on the lower surface of the upper cover plate, a lifting part 3-5 is also arranged on the mechanism frame 3-1, a tabletting die 3-6 is positioned between the lifting part 3-5 and the upper die 3-4, and a die limiting guide part 3-7 is arranged on the upright post 3-3. The structure provides a brand-new tabletting mechanism aiming at the defects of the prior art. The tabletting pressure of the tabletting mechanism is derived from the lifting component. The mechanism frame plays a role in supporting and installing and arranging all parts. The upper portion platform is fixed to be arranged, arranges the stand on the platform of upper portion, arranges the mould on the stand, and the spacing guide part 7 of mould plays spacing and guide effect to the mould in work, ensures that the mould can only the upper and lower action, upwards realizes the preforming, and the downward movement after accomplishing the preforming then takes out the experimental sample piece of finished product. The upper die is matched with the die, and the sample wafer is pressed when the upper die and the die are contacted. Like this, can make things convenient for the high efficiency to realize the sample wafer until the shaping, efficient, the quality obtains guaranteeing to long service life, equipment precision is high, and it is simple convenient to maintain. Experimental sample wafer is sheeting mechanism for making devices, simple structure, low in manufacturing cost can convenient and fast realize experimental sample wafer preforming shaping to the installation and debugging is simple and easy, the location is accurate, compact structure, the shaping quality is high, life is high.

The tabletting mold 3-6 is vertically arranged above the upper platform 3-2, the upper end of the tabletting mold 3-6 is aligned with the upper mold 3-4, and the lower end of the tabletting mold 3-6 is aligned with the lifting component 3-5. In the structure, the upper die with high hardness and high finish is arranged on the lower surface of the upper cover plate, so that the quality of the upper surface of the pressing sheet is ensured. When the lifting part 3-5 extends out, the tabletting mold (mold) is driven to move upwards, so that the upper mold is matched to complete pressing.

The die limiting and guiding component 3-7 comprises a linear module 3-8 and a linear bearing 3-9, wherein the linear module 3-8 is positioned at one side of the tabletting die 3-6, and the linear bearing 3-9 is positioned at the other side of the tabletting die 3-6. The linear module 3-8 and the linear bearing 3-9 act on the side surface of the tabletting mold movably, so that the tabletting mold can only move up and down and is prevented from shaking left and right.

The lifting component 3-5 comprises a gas-liquid pressurizing oil cylinder 3-10 and a top head 3-11, the lower end of the top head 3-11 is connected with the gas-liquid pressurizing oil cylinder 3-10, the top head 3-11 is positioned right below the tabletting mold 3-6, and the top head 3-11 is arranged in a vertical structure. According to the structure, the tabletting pressure of the tabletting mechanism is derived from the gas-liquid pressurizing oil cylinder of the lifting component, the pressure value of the oil cylinder can be adjusted through the electric proportional valve, and the ejector head is installed on the ejector rod of the gas-liquid pressurizing oil cylinder to push the tabletting mold to realize action.

The tabletting mechanism also comprises a mould bracket 3-12, the mould bracket 3-12 is movably sleeved on the tabletting mould 3-6, and the linear module 3-8 is connected with the mould bracket 3-12. The tabletting mechanism for the test sample piece manufacturing device further comprises a leveling mechanism 3-13, the leveling mechanism 3-13 is arranged on the upright post 3-3, and the leveling mechanism 3-13 is positioned below the tabletting mold 3-6. Above-mentioned structure through levelling mechanism's setting, can effectively guarantee the horizontal motion precision of the moulding-die bracket of connecting linear bearing and sharp module to guarantee the preforming mould at the perpendicular up-and-down motion of preforming in-process, can not form the contained angle with other parts and interfere, improve whole life and preforming quality.

The punching mechanism 4 comprises a mechanism frame 4-1, a fixing plate 4-2 is arranged on the upper portion of the mechanism frame 4-1, a device base 4-3 is arranged on the lower portion of the mechanism frame 4-1, a punching cylinder 4-4 is mounted on the fixing plate 4-2, a punching shaft 4-5 is mounted on the punching cylinder 4-4, a sample piece positioning piece 4-6 is arranged on the device base 4-3, and a discharge hole 4-7 penetrating through the sample piece positioning piece 4-6 is formed in the sample piece positioning piece 4-6. According to the structure, the punching sheet cylinder is fixedly connected with the fixed plate through a screw or a connecting bolt, the telescopic rod of the punching sheet cylinder is fixedly connected with the punching shaft through threads, the limit sleeve and the return spring are movably sleeved on the punching shaft and can reciprocate up and down, the lower end of the punching shaft is provided with a limit part for preventing the limit sleeve from falling off, and the device base is fixedly connected with the fixed plate through a screw or a connecting bolt; a sample wafer (steel ring sample wafer) to be punched is placed on the sample wafer positioning piece 4-6, is coaxial with the discharge port and is coaxial with the punching shaft. Therefore, after the punching sheet cylinder is ventilated, the punching shaft is driven to move downwards linearly, the position of the steel ring sample piece is limited by the limiting sleeve, the return spring is compressed to the working height, the punching shaft continues to downwards punch the sample piece, the punched part is discharged through the discharge hole, after the work is finished, the punching sheet cylinder is cut off, the punching sheet cylinder contracts to drive the punching shaft to return, meanwhile, the return spring rebounds, and the pushing limiting sleeve returns to the original position. Thus, the punching sheet is conveniently and efficiently realized. Sample wafer towards piece device, simple structure, reasonable, low in manufacturing cost, small, the simple and reliable of operation use can effectively improve towards piece efficiency, effectively ensures towards piece quality simultaneously. The lower end of the punching shaft 4-5 is provided with a limiting sleeve 4-8, and the punching shaft 4-5 is sleeved with a return spring 4-9. One end of the return spring 4-9 is abutted against the limiting sleeve 4-8, the other end of the return spring 4-9 is abutted against the punching sheet cylinder 4-4, and the return spring 4-9 is a spiral spring. According to the structure, the return spring is contracted under the action of the limiting sleeve in the punching process, and the limiting sleeve is controlled to return after impact is finished.

The automatic steel ring storing and taking mechanism 5 comprises a motor fixing seat 5-1, the lower portion of the motor fixing seat 5-1 is connected with a motor 5-2, the upper portion of the motor fixing seat 5-1 is provided with a plurality of guide rods 5-3, a supporting table 5-4 is movably sleeved on each guide rod 5-3, the upper portion of each guide rod 5-3 is provided with an upper platform 5-5, a lead screw 5-6 penetrates through the motor fixing seat 5-1 to be connected with the motor 5-2, and a connecting block 5-7 is screwed on the lead screw 5-6. The motor 5-2 is fixed on the motor fixing seat 5-1, one end of the screw rod 5-6 is connected with the motor 5-2, the other end of the screw rod 5-6 penetrates through the connecting block 5-7, the motor 2 rotates in different directions to drive the connecting block 7 to move upwards or downwards, the connecting block 5-7 applies force on the steel ring, the steel ring is placed in the steel ring 5-16 in a downwards moving mode, and the steel ring 5-16 is supplied upwards. The guide bar sets up many, has an accessible motor to drive the connecting block that the lead screw rotated and freely moved from top to bottom in the middle of many guide bars, and a supporting bench is connected to the connecting block, is used for placing the steel ring on the supporting bench, and many guide bars are from the spacing steel ring in different positions. Above-mentioned structure, rotate to the equidirectional rotation through control unit control motor, drive the connecting block from top to bottom, realize packing into and the supply of steel ring. Automatic access mechanism of steel ring, simple structure controls reliably, can conveniently realize depositing and supplying of steel ring, realizes automatic accurate control, satisfies the whole demand of grinding film clamp. The motor fixing seat 5-1 comprises a lower plate 5-8 and an upper plate 5-9, and the lower plate 5-8 and the upper plate 5-9 are connected through a plurality of supporting columns 5-10. In the structure, the lower surfaces of the lower plate parts 5-8 are fixedly connected with the motor, and the upper plate part is used for arranging the guide rod and the sensor.

The upper surface of the upper plate 5-9 is provided with a proximity sensor I5-11, the upper platform 5-5 is provided with a steel ring through hole 5-12, the inner wall of the steel ring through hole 5-12 is provided with a proximity sensor II 13, and the upper surface of the upper platform 5-5 is provided with a proximity sensor III 5-14. Three proximity sensors are provided for controlling the automatic storage of the steel ring. When no steel ring exists in the automatic steel ring storing and taking mechanism (steel ring warehouse), the support table is propped against the upper platform; the proximity sensor III 14 has no signal, the proximity sensor II 13 has no signal, when the proximity sensor III 14 has a signal when the proximity sensor II 13 has no signal, the motor starts to rotate, the supporting table moves downwards to drive the steel ring to descend, when the proximity sensor I11 has no signal and the proximity sensor II 13 has a signal, the motor stops rotating, the steel ring stops descending, and the next steel ring is waited to be placed; and (5) sequentially putting the steel rings until the proximity sensor III 14 has a signal, and prompting that the steel ring storeroom is full. Like this, realize a plurality of steel ring from the top down and place in order to realize automatic accurate control when the steel ring is stored.

The lead screw 5-6 is connected with a driving shaft of the motor 5-2 through a coupler 5-15. The lower plate 5-8 and the upper plate 5-9 are respectively provided with an opening, the upper part of the coupler 5-15 is connected with a screw 5-6 penetrating through the upper plate 5-9, and the lower end of the coupler 5-15 is connected with a driving shaft of a motor 5-2 penetrating through the lower plate 5-8. Above-mentioned structure, motor and lead screw flexonics weaken the impact force.

And the motor 5-2, the proximity sensor I5-11, the proximity sensor II 5-13 and the proximity sensor III 5-14 are respectively connected with the control part. The control component realizes the independent control of the motor 5-2, the proximity sensor I5-11, the proximity sensor II 5-13 and the proximity sensor III 5-14, and simultaneously controls the components to be matched with each other, thereby effectively finishing the automatic storage and supply.

The transfer mechanism 6 comprises a connecting support 6-1, the connecting support 6-1 is installed on a horizontal cylinder 6-2, a station swing table 6-3 is installed on the connecting support 6-1, a lifting cylinder 6-4 is installed on the station swing table 6-3, a pneumatic claw 6-5 is installed on the lifting cylinder 6-4, and a finger I6-6 and a finger II 6-7 are installed on the pneumatic claw 6-5. Above-mentioned structure, when carrying out test sample piece and transporting, under control unit's control, each part realizes the cooperation operation each other. The gas claw drives that finger I6 and finger II 7 (the finger is according to test sample size design) open and closed, can clip the test sample piece, and the height of lift cylinder lift adjustment gas claw and finger, and three station pendulum platforms drive the swing of lift cylinder for the gas claw is transported test sample piece with a plurality of operating position of finger swing, and the finger is straight reciprocating motion with the gas claw. And the horizontal cylinder drives the connecting bracket to move horizontally. Through adopting above-mentioned structure, when carrying out test sample piece and transporting, easy operation is convenient, automated operation can improve and transport efficiency, and transfer device structural layout is compact reasonable. Experimental sample wafer transfer device, simple structure is compact, can realize multi-direction removal transportation by accurate, easy to use is convenient in the operation simultaneously, degree of automation is high, improves the transfer efficiency.

The horizontal cylinder 6-2 is set to be a structure capable of driving the connecting bracket 6-1 to move horizontally. The station swing table 6-3 of the test sample wafer transfer device is connected with a motor, and the motor is arranged to be a structure capable of driving the work swing table 6-3 to horizontally rotate relative to the connecting support 1. The horizontal cylinder 6-2 is set to be a structure capable of driving the gas claw 6-5 to vertically lift. The pneumatic claw 6-5 of the test sample transfer device is set to be a structure capable of controlling the opening and closing of the fingers I6-6 and the fingers II 6-7.

The horizontal cylinder 6-2 and the lifting cylinder 6-4 are respectively connected with the control part. The pneumatic claws 6-5 and the motor are respectively connected with the control part. The structure realizes the control and adjustment of the action and the action sequence of the part connected with the control part through the control part, and the operation is reliable.

The adjusting damper is connected with the connecting bracket. When the station placing table is used for transferring test sample wafers to swing, the damper is adjusted to better control the transferring device to realize stable and reliable transferring operation.

The dosing mechanism 7 comprises a bin 7-1, a rotary disc 7-2 is installed in the bin 7-1, an opening at the bottom 7-3 of the bin 7-1 is communicated with a quantitative valve body 7-4, a gap portion 7-5 is arranged on the rotary disc 7-2, the rotary disc 7-2 is connected with a motor II 7-6, and a blanking pipe 7-7 is arranged at the lower end of the quantitative valve body 7-4. The automatic tablet feeding device comprises a bin 7-1, a rotary table 7-2, a motor II 7-6, a quantitative valve body 7-4 and a feeding pipe 7-7. Above-mentioned structure, feed bin are used for storing the tablet of dress certain quantity, can drive carousel (disc) at the feed bin internal rotation during the motor is rotatory, and the tablet in the feed bin falls into the breach of carousel side because gravity and frictional force are used, and the feed bin bottom then has the opening. Therefore, when the breach of carousel rotated the opening part upper end at every turn, a tablet fell into the valve body inner chamber because gravity, and tablet quantity reaches and predetermines quantity motor and stop, and the unloading pipe is fallen to the tablet of will predetermineeing quantity, accomplishes the automatic reagent feeding. Automatic device that adds of tablet, simple structure can add according to the demand by automatic, accurate realization tablet, does benefit to the storage of tablet and adds the reliability, reduces the tablet and adds resistance and collision.

The motor II 7-6 is connected with a control part 7-8 capable of controlling the starting and stopping of the motor II 7-6. When the control component 7-8 controls the motor II 7-6 to rotate, the motor II 7-6 is set to be a structure capable of enabling the electric rotating disc 7-2 to rotate in the bin 7-1. Above-mentioned structure adds the medicine according to needs, and the rotation of control unit control carousel is with stopping, effectively satisfies the function to the internal tablet that adds of proportional valve, and it is convenient to control. The quantitative valve body 7-4 is provided with a laser sensor 7-9, and one side of the quantitative valve body 7-4 is provided with a switch cylinder 7-10. The laser sensors 7-9 and the switch cylinders 7-10 are respectively connected with the control parts 7-8. Above-mentioned structure, laser sensor count tablet quantity, when tablet quantity reaches preset quantity, the rotating electrical machines stops, and the switch cylinder is opened, and the unloading pipe is once fallen to the tablet of quantity of will presetting.

The upper part of the bin 7-1 is provided with a bin cover 7-11, and a tablet storage cavity 7-12 is formed between the bin cover 7-11 and the rotary disc 7-2. The feed bin cover seals the feed bin, and plays a dustproof function. The tablet storage cavity is formed to prevent mutual pollution between the tablet storage cavity (tablet bin) and the feeding pipe.

The motor II 7-6 is vertically arranged at the bottom 7-3 of the storage bin, and the motor II 7-6 penetrates through the bottom 7-3 of the storage bin to be fixedly connected with the bottom of the rotary disc 7-2. Above-mentioned structure, the motor can control the reliable rotation of carousel. The side surface of the other side of the quantitative valve body 7-4 is provided with an exhaust pipe 7-13. Above-mentioned structure, the sealed gas in the valve body passes through the blast pipe and discharges when cylinder switch closes, avoids internal pressure too big.

The punching mechanism 4 is characterized in that the punching shaft 4-5 of the punching mechanism 4 is arranged to be a structure extending towards the direction of the discharge port 4-7 of the sample positioning piece 4-6, the central axis of the punching shaft 4-5 and the central axis of the sample positioning piece 4-6 are arranged to be a superposition structure, and the punching cylinder 4-4 is arranged to be a structure capable of driving the punching shaft 4-5 to ascend and descend. According to the structure, in the process of extending out of the punching cylinder, the punching shaft is driven to impact the sample wafer to be punched, so that the impact position is accurate, the sample wafer positioning piece 4-6 realizes reliable positioning of the sample wafer to be punched, and the success of punching once is ensured.

The tabletting mechanism 3 further comprises a die cleaning mechanism 3-9, the die cleaning mechanism 3-9 comprises an upper die cover 3-17, an upper die 3-4 is arranged on the lower surface of the upper die cover 3-17, a movable support 9-3 is sleeved on the upper die cover 3-17, one end of an upper die cylinder 9-4 is connected with the upper die cover 3-17, the other end of the upper die cylinder 9-4 is connected with the movable support 9-3, and a cleaning brush 9-5 is arranged at the lower part of the movable support 9-3. The structure is improved by the structure. To connecting the last mould of upper cover plate below can be stained with the problem of certain particulate matter at the preforming rear surface, for avoiding the pollution that remaining particulate matter probably produced to preforming next time, set up the movable support on the upper cover plate, movable support and upper cover plate pass through the mould cylinder and connect, it is flexible to mould the cylinder through control, drive movable support horizontal motion, and the movable support is at the horizontal motion in-process, the cleaning brush on the movable support can be used in the last mould lower surface, clear up mould surface, and mould cylinder is reciprocal flexible in the control, just can be to the reciprocal clearance of last mould lower surface, thereby improve the cleanliness, ensure the preforming quality next time. Clean mechanism of mould, simple structure, it is with low costs, can be high-efficient, automatic, clean clearance go up remaining material behind the mold pressing piece, guarantee next time the mold pressing piece product can not receive the pollution, guarantee preforming quality.

The upper die cylinder 9-4 is connected with a control component capable of controlling the upper die cylinder 9-4 to stretch. With the structure, the control component realizes accurate control, and the times of the extension of the upper die cylinder can be set. Therefore, different times are set for different materials needing cleaning, and the requirement of cleanliness is met.

The movable support 9-3 is arranged to be an n-shaped structure, one end of the brush frame 9-6 is connected with one side of the movable support 9-3, and the other end of the brush frame 9-6 is connected with the other side of the movable support 9-3. Above-mentioned structure, the brush yoke can be easy to assemble and dismantle the change, satisfies different moulds to the demand of different clean brushes. Like this, the movable support commonality is high for different moulds can all use, reduce cost.

The cleaning brush 9-5 is arranged on the upper surface of the brush frame 9-6. When the control component controls the upper die cylinder 9-4 to extend and retract, the upper die cylinder 9-4 is set to be in a structure capable of horizontally moving relative to the upper die cover 9-1. With the structure, the cleaning brush finishes cleaning in the reciprocating motion process of the movable support.

The brush holder 9-6 is communicated with the dust suction pipe 9-7. Above-mentioned structure, at the in-process of the clean particulate matter of clean brush, the suction in the dust absorption pipe adsorbs the particulate matter, siphons away the particulate matter, avoids the particulate matter to fall on the ground or other places of mould, ensures the on-the-spot cleanness of operation equipment.

When the upper die cylinder 9-4 moves horizontally relative to the upper die cover 3-17, the cleaning brush 9-5 is set to be a structure capable of contacting the lower surface of the upper die so as to clean the lower surface of the upper die.

The die limiting and guiding part 3-7 of the tabletting mechanism 3 comprises a linear die set 3-8 and a linear bearing 3-9, wherein the linear die set 3-8 is positioned at one side of the tabletting die 3-6, and the linear bearing 3-9 is positioned at the other side of the tabletting die 3-6. The linear module 3-8 and the linear bearing 3-9 act on the side surface of the tabletting mold movably, so that the tabletting mold can only move up and down and is prevented from shaking left and right.

The lifting component 3-5 comprises a gas-liquid pressurizing oil cylinder 3-10 and a top head 3-11, the lower end of the top head 3-11 is connected with the gas-liquid pressurizing oil cylinder 3-10, the top head 3-11 is positioned right below the tabletting mold 3-6, and the top head 3-11 is arranged in a vertical structure. According to the structure, the tabletting pressure of the tabletting mechanism is derived from the gas-liquid pressurizing oil cylinder of the lifting component, the pressure value of the oil cylinder can be adjusted through the electric proportional valve, and the ejector head is installed on the ejector rod of the gas-liquid pressurizing oil cylinder to push the tabletting mold to realize action.

The gas-liquid pressurizing oil cylinder 3-10 of the lifting component 3-5 is connected with a control component capable of controlling the gas-liquid pressurizing oil cylinder 10 to stretch. The tabletting mechanism for the test sample piece manufacturing device further comprises sensors I3-14, a sensor II and sensors I3-15. The tabletting mechanism for the test sample piece manufacturing device further comprises a sensor reflection plate and sensors I3-16. According to the structure, in the sample wafer pressing process, after a tablet pressing die (pressing die) receives a signal sent by a control part, the tablet pressing die reaches a steel ring detection position before a material receiving connecting port receives the material, and at the moment, a sensor II detects whether the signal is in a reasonable range or not, so that the placement condition of the steel ring is confirmed; a gas-liquid pressurizing ejector rod of the lifting component is provided with a sensor reflecting plate with a limit position, and the sensor I feeds back the tabletting condition to the control component through the distance change of the reflecting plate in the tabletting process.

Sample wafer making devices for material detection and analysis, to being not enough among the prior art, provide a sample wafer making devices for material detection and analysis of integral type structure (grind preforming all-in-one promptly for experimental sample wafer preparation). The using process of the manufacturing device is as follows: the material of preparation sample gets into quantitative mechanism ration, the medicine mechanism adds the medicine according to the kind of material, then, send into grinding mechanism with the mixed material after material and the medicine mixture, do high-speed superfine grinding with material and tablet together, the material that grinds shifts to sheeting mechanism and carries out the preforming, the sample piece after the preforming is accomplished is sent out by transport mechanism and is given to the analysis appearance analytical data, the sample piece returns after the analysis finishes, transport mechanism transports the sample piece to sample piece processing mechanism (towards piece mechanism, towards ring mechanism) and handles, the steel ring is transported to steel ring storehouse storage after handling, wait for the use next time. When the manufacturing device works, the motor of the grinding mechanism does not participate in vibration, so that the vibration amplitude of the device during working is reduced, useless work is avoided, and the energy consumption is reduced; the tabletting mechanism adopts a linear module structure, the control precision of the tabletting mold is accurate, the structure is easier to install, debug and maintain, the transfer mechanism adopts a multi-cylinder combined mode, the feedback is stable, and the cost is reduced. Sample wafer making devices for material detection and analysis, simple structure, compactness, efficiency is high-efficient, can be high-efficient, the sample preparation is accomplished to the high quality, degree of automation is high, accomplishes a sample wafer in 6-7 minutes on average to realize that many sample wafers carry out different links simultaneously and handle, improve film-making efficiency comprehensively.

The present invention has been described in detail with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above embodiments, and the present invention can be implemented in various ways without modification, and the present invention is not limited by the above embodiments.

Claims (10)

1. The utility model provides a sample wafer making devices for material detection and analysis which characterized in that: the sample piece manufacturing device for material detection and analysis comprises a quantifying mechanism (1), a grinding mechanism (2), a tabletting mechanism (3), a punching mechanism (4), a steel ring automatic storing and taking mechanism (5), a transferring mechanism (6) and a dosing mechanism (7), wherein the quantifying mechanism (1), the grinding mechanism (2), the tabletting mechanism (3), the punching mechanism (4), the steel ring automatic storing and taking mechanism (5), the transferring mechanism (6) and the dosing mechanism (7) are all arranged on a frame (8), the quantifying mechanism (1) comprises a device shell (1-1), an opening part (1-2) is arranged at the upper part of the device shell (1-1), a turnover cylinder (1-3) is arranged at one side of the device shell (1-1), the quantifying cup (1-4) is connected with the turnover cylinder (1-3), and the quantifying cup (1-4) comprises a material cup containing cavity I (1-5) and a material cup containing cavity II (1-6) A rotary cover (1-7) for opening and closing the opening part (1-2) is connected with a rotary part (1-8) on the other side of the device shell (1-1).

2. The material testing and analyzing sample wafer manufacturing apparatus according to claim 1, characterized in that: the grinding mechanism (2) comprises a vibration platform (2-1), a motor III (2-2) is installed below the vibration platform (2-1), a plurality of shock absorbers (2-4) are arranged on a platform plate (2-3) above the vibration platform (2-1), a grinding part (2-5) is installed above the shock absorbers (2-4), the grinding part (2-5) comprises a main driving shaft (2-6) which is eccentrically arranged, the lower end of the main driving shaft (2-6) is connected with the motor III (2-2) through a coupler (2-7), a grinding support bracket (2-8) and a grinding bowl support bracket (2-9) are fixedly connected on the main driving shaft (2-6), the upper end of the shock absorber (2-4) is connected with the grinding support bracket (2-8), the outer side surface of the grinding bowl (2-10) is abutted against a grinding bowl support (2-9), a grinding column (2-11) and a grinding ring (2-12) are arranged in the grinding bowl (2-10), a driven shaft (2-13) is also arranged on the grinding support (2-8), and a grinding bowl upper cover (2-14) is arranged on the grinding bowl (2-10).

3. The material testing and analyzing sample producing apparatus according to claim 1 or 2, wherein: the tabletting mechanism (3) comprises a mechanism frame (3-1), an upper platform (3-2) is arranged on the mechanism frame (3-1), a plurality of upright columns (3-3) are arranged on the upper platform (3-2), an upper cover plate is arranged on the upper parts of the upright columns (3-3), an upper die (3-4) is arranged on the lower surface of the upper cover plate, a lifting component (3-5) is also arranged on the mechanism frame (3-1), a tabletting die (3-6) is positioned between the lifting component (3-5) and the upper die (3-4), and a die limiting guide component (3-7) is arranged on the upright column (3-3).

4. The material testing and analyzing sample producing apparatus according to claim 1 or 2, wherein: the punching mechanism (4) comprises a mechanism frame (4-1), a fixing plate (4-2) is arranged on the upper portion of the mechanism frame (4-1), a device base (4-3) is arranged on the lower portion of the mechanism frame (4-1), a punching cylinder (4-4) is installed on the fixing plate (4-2), a punching shaft (4-5) is installed on the punching cylinder (4-4), a sample piece positioning piece (4-6) is arranged on the device base (4-3), and a discharge hole (4-7) penetrating through the sample piece positioning piece (4-6) is formed in the sample piece positioning piece (4-6).

5. The material testing and analyzing sample producing apparatus according to claim 1 or 2, wherein: the automatic steel ring storing and taking mechanism (5) comprises a motor fixing seat (5-1), the lower portion of the motor fixing seat (5-1) is connected with a motor I (5-2), the upper portion of the motor fixing seat (5-1) is provided with a plurality of guide rods (5-3), a support table (5-4) is movably sleeved on each guide rod (5-3), an upper platform (5-5) is arranged on each guide rod (5-3), a lead screw (5-6) penetrates through the motor fixing seat (5-1) to be connected with the motor I (5-2), and a connecting block (5-7) is screwed on the lead screw (5-6).

6. The material testing and analyzing sample producing apparatus according to claim 1 or 2, wherein: transport mechanism (6) include linking bridge (6-1), linking bridge (6-1) install on horizontal cylinder (6-2), install station pendulum platform (6-3) on linking bridge (6-1), install lift cylinder (6-4) on station pendulum platform (6-3), install gas claw (6-5) on lift cylinder (6-4), install finger I (6-6) and finger II (6-7) on gas claw (6-5).

7. The material testing and analyzing sample producing apparatus according to claim 1 or 2, wherein: the dosing mechanism (7) comprises a bin (7-1), a rotary disc (7-2) is installed in the bin (7-1), an opening in the bottom (7-3) of the bin (7-1) is communicated with a quantitative valve body (7-4), a gap portion (7-5) is arranged on the rotary disc (7-2), the rotary disc (7-2) is connected with a motor II (7-6), and a feeding pipe (7-7) is arranged at the lower end of the quantitative valve body (7-4).

8. The material testing and analyzing sample wafer manufacturing apparatus according to claim 4, wherein: the punching mechanism is characterized in that a punching shaft (4-5) of the punching mechanism (4) is arranged to be of a structure extending towards the direction of a discharge port (4-7) of a sample positioning piece (4-6), the central axis of the punching shaft (4-5) and the central axis of the sample positioning piece (4-6) are arranged to be of a superposed structure, and a punching cylinder (4-4) is arranged to be of a structure capable of driving the punching shaft (4-5) to ascend and descend.

9. The material testing and analyzing sample producing apparatus according to claim 1 or 2, wherein: the tabletting mechanism (3) further comprises a mould cleaning mechanism (9), the mould cleaning mechanism (9) comprises an upper mould cover (3-17), an upper mould (3-4) is arranged on the lower surface of the upper mould cover (3-17), a movable support (9-3) is sleeved on the upper mould cover (3-17), one end of an upper mould cylinder (9-4) is connected with the upper mould cover (3-17), the other end of the upper mould cylinder (9-4) is connected with the movable support (9-3), and a cleaning brush (9-5) is arranged at the lower part of the movable support (9-3).

10. The material testing and analyzing sample wafer manufacturing apparatus according to claim 3, wherein: the die limiting and guiding component (3-7) of the tabletting mechanism (3) comprises a linear module (3-8) and a linear bearing (3-9), wherein the linear module (3-8) is positioned at one side of the tabletting die (3-6), and the linear bearing (3-9) is positioned at the other side of the tabletting die (3-6).

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