CN214705885U - Feeding system of die bonder - Google Patents
Feeding system of die bonder Download PDFInfo
- Publication number
- CN214705885U CN214705885U CN202121141492.8U CN202121141492U CN214705885U CN 214705885 U CN214705885 U CN 214705885U CN 202121141492 U CN202121141492 U CN 202121141492U CN 214705885 U CN214705885 U CN 214705885U
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- China
- Prior art keywords
- feeding
- rotating
- discharging
- rotating mechanism
- die bonder
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- Expired - Fee Related
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- 230000007246 mechanism Effects 0.000 claims abstract description 167
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000007599 discharging Methods 0.000 claims abstract description 39
- 238000003860 storage Methods 0.000 claims abstract description 13
- 230000001174 ascending effect Effects 0.000 claims abstract description 3
- 210000000078 claw Anatomy 0.000 claims description 20
- 239000003292 glue Substances 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 9
- 239000007787 solid Substances 0.000 abstract description 8
- 230000010354 integration Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 210000000056 organ Anatomy 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- Die Bonding (AREA)
Abstract
The utility model provides a feed system of solid brilliant machine, include: the substrate storage device comprises a storage mechanism for storing substrates, a feeding mechanism for driving the substrates to move, a rotating mechanism and a discharging mechanism; the material storage mechanism, the feeding mechanism, the rotating mechanism and the discharging mechanism are sequentially connected, the feeding mechanism is in an ascending trend from one end of the material storage mechanism to one end of the rotating mechanism, the discharging mechanism is in a descending trend from one end of the rotating mechanism to the opposite end of the rotating mechanism, the feeding mechanism, the rotating mechanism and the discharging mechanism form a trapezoidal structure together, the feeding mechanism and the discharging mechanism are rotatably connected with the rotating mechanism in a hinged mode, and the rotating mechanism is driven to ascend and descend synchronously through the feeding mechanism and the discharging mechanism. The utility model discloses a feed system of solid brilliant machine, its automatic integration degree is high, has reduced the labour, can accomplish adaptability multiple spot site simultaneously and glue, has reduced the point and has glued the process.
Description
Technical Field
The utility model relates to a semiconductor paster encapsulation technical field, more specifically relate to a feed system of solid brilliant machine.
Background
The die bonder is a key device in an LED assembly line, and the die bonding process comprises the following steps: the glue dispensing mechanism firstly dispenses glue on a die bonding station of the substrate, then the LED crystal grains are taken out from the wafer by the crystal taking arm, and then the LED crystal grains are transferred to the die bonding station dispensed with the glue. After all die bonding point positions on the substrate are die bonded, the substrate is taken out from the workbench, an empty substrate is placed again, die bonding is started again, the placement of the substrate is manually operated, time and labor are consumed, and the method specifically comprises the following steps: before die bonding, the substrates are stacked in the material boxes, when die bonding is needed, the substrates are manually taken out of the material boxes one by one and placed on the workbench and fixed through the clamp, after die bonding is completed, the substrates on the workbench are manually taken out to be replaced by the next substrate, and after all the substrates in one material box are die bonded, the next material box is replaced. The prior art provides a new solution to solve the above problems, but the feeding system of the die bonder disclosed in the prior art has a complicated structure, as disclosed in chinese patent application No. 2012102905659, including: the feeding box device comprises a left conveying module, a right conveying module, an upper conveying module and a lower conveying module, is complex in structure and cannot perform multipoint dispensing on the substrate.
In view of the above, there is a need for an improved feeding system of a die bonder in the prior art to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an automatic integration degree is high, and the feeding efficiency is high, can accomplish simultaneously that the solid brilliant machine's of adaptability multiple spot point glues charge-in system.
In order to achieve the above object, the utility model provides a solid brilliant machine's charge-in system, include: the substrate storage device comprises a storage mechanism for storing substrates, a feeding mechanism for driving the substrates to move, a rotating mechanism and a discharging mechanism;
the feeding mechanism, the rotating mechanism and the discharging mechanism are connected in sequence, the feeding mechanism is in an ascending trend from one end of the feeding mechanism to one end of the rotating mechanism, the discharging mechanism is in a descending trend from one end of the rotating mechanism to the opposite end of the rotating mechanism, the feeding mechanism, the rotating mechanism and the discharging mechanism form a ladder-shaped structure together, the feeding mechanism and the discharging mechanism are rotatably connected with the rotating mechanism in a hinged mode, and the rotating mechanism is driven to ascend and descend synchronously through the feeding mechanism and the discharging mechanism;
a rotary base is arranged at the center of the rotary mechanism and embedded into the upper surface of the rotary mechanism, and one end of the rotary mechanism, which is close to the feeding mechanism and one end of the discharging mechanism, are respectively provided with a moving claw;
the feeding mechanism is provided with a push rod and an annular slide rail for the push rod to work circularly, and after the push rod pushes the substrate to move to one end of the rotating mechanism, the moving claw drives the substrate to move above the rotating base.
As a further improvement, the feeding mechanism, the discharging mechanism and the rotating mechanism are hinged out and are also provided with an organ cover, and when the feeding mechanism, the discharging mechanism and the rotating mechanism rotate relatively, the organ cover is opened and closed to change.
As a further improvement of the utility model, the feed mechanism both sides still are equipped with the opening spout, the opening spout supplies the both sides of base plate to penetrate.
As a further improvement, the rotating mechanism is further provided with a distance measuring sensor.
As a further improvement of the utility model, the rotating base is driven by the control of the electromagnetic assembly.
As a further improvement of the utility model, the discharging mechanism is arranged on the conveying belt to move the base plate.
As a further improvement of the utility model, two the movable claws are driven synchronously.
As a further improvement, two the removal claw has the telescopic shaft, places on rotating base when the base plate by removing the claw, remove the claw and shorten along the axial.
As a further improvement, the annular slide rail is disposed on the center line of the feeding mechanism and extends to any one side to form an annular structure.
As a further improvement of the present invention, the discharging mechanism deviates from the one end of the rotating mechanism is further provided with a cushion pad.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model relates to a feed system of solid brilliant machine, through feed mechanism, rotary mechanism, discharge mechanism meets in proper order, realizes automatic feed, the integration operation of automatic unloading, feed mechanism and the even rotary mechanism articulated mode of discharge mechanism can change rotary mechanism and adhesive deposite device's distance to realize the best point on the basis of corresponding point volume of gluing and glue efficiency.
(2) The rotary base is arranged at the center of the rotary mechanism, the rotary base drives the substrate to rotate, the glue dispensing positions of the glue dispensing device on the corresponding substrate are changed, the flexibility is better, the glue dispensing pause time of the same substrate between different glue dispensing positions is shortened, the glue dispensing efficiency is improved, meanwhile, the rotary mechanism is close to the feeding mechanism and one end of the discharging mechanism is respectively provided with a moving claw, the position of the substrate is flexibly adjusted by the moving claw, when the substrate is placed above the rotary base, the position is not deviated, and the glue dispensing device is prevented from being not corresponding to the glue dispensing positions on the substrate.
Drawings
Fig. 1 is a schematic structural diagram of a feeding system of a die bonder of the present invention;
fig. 2 is a schematic structural diagram of a feeding system of a die bonder at another viewing angle.
In the figure: 1. a material storage mechanism; 2. a feeding mechanism; 3. a rotation mechanism; 4. a discharging mechanism; 21. an open chute; 31. rotating the base; 32. a movable claw; 41. and (4) a conveyor belt.
Detailed Description
The present invention is described in detail with reference to the embodiments shown in the drawings, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that the functions, methods, or structural equivalents or substitutions made by these embodiments are within the scope of the present invention.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the scope of the present application. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, unless otherwise specified, "a plurality" means two or more.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art through specific situations.
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
The utility model provides a feed system of solid brilliant machine.
Fig. 1 to fig. 2 show a feeding system of a die bonder according to an embodiment of the present invention.
Referring to fig. 1, in this embodiment, a feeding system of a die bonder includes: the substrate storage device comprises a storage mechanism 1 for storing substrates, a feeding mechanism 2 for driving the substrates to move, a rotating mechanism 3 and a discharging mechanism 4; the material storage mechanism 1, the feeding mechanism 2, the rotating mechanism 3 and the discharging mechanism 4 are sequentially connected, the feeding mechanism 2 is in a rising trend from one end of the material storage mechanism 1 to one end of the rotating mechanism 3, the discharging mechanism 4 is in a falling trend from one end of the rotating mechanism 3 to the opposite end, the feeding mechanism 2, the rotating mechanism 3 and the discharging mechanism 4 form a ladder-shaped structure together, the feeding mechanism 2 and the discharging mechanism 4 are rotatably connected with the rotating mechanism 3 in a hinged mode, and the rotating mechanism 3 is lifted through synchronous driving of the feeding mechanism 2 and the discharging mechanism 4; a rotating base 31 is arranged at the center of the rotating mechanism 3, the rotating base 31 is embedded into the upper surface of the rotating mechanism 3, and one end of the rotating mechanism 3 close to the feeding mechanism 2 and one end of the discharging mechanism 4 are respectively provided with a moving claw 32; the feeding mechanism 2 is provided with a push rod and an annular slide rail for the push rod to work circularly, and after the push rod pushes the substrate to move to one end of the rotating mechanism 3, the moving claw 32 drives the substrate to move above the rotating base 31.
Referring to fig. 2, in the present embodiment, the feeding mechanism 2, the discharging mechanism 4 and the rotating mechanism 3 are hinged to each other and further provided with an organ cover, and when the feeding mechanism 2, the discharging mechanism 4 and the rotating mechanism 3 rotate relatively, the organ cover is opened and closed. Opening chutes 21 are further formed in two sides of the feeding mechanism 2, and the two sides of the substrate are penetrated through the opening chutes 21. The rotating mechanism 3 is also provided with a distance measuring sensor. Rotating base 31 passes through the control drive of electromagnetic component, and the electromagnetic drive mode is direct, and angle control is more accurate, has avoided the turned angle tolerance. The discharging mechanism 4 moves the substrate by providing a conveyor belt 41. The two moving claws 32 are driven synchronously. The two moving claws 32 have telescopic shafts, and when the substrate is placed on the spin base 31 by the moving claws 32, the moving claws 32 are shortened in the axial direction. The annular slide rail is arranged on the central line of the feeding mechanism 2 and extends to any side to form an annular structure. The push rod can circularly slide along the annular slide rail, so that the substrate can be conveyed in a production line conveniently. The end of the discharging mechanism 4 departing from the rotating mechanism 3 is also provided with a buffer pad to prevent the substrate from sliding downwards to receive large impact force.
The utility model relates to a feed system of solid brilliant machine, through feed mechanism 2, rotary mechanism 3, discharge mechanism 4 meets in proper order, realizes automatic feed, and the integration operation of automatic unloading, feed mechanism 2 and the even 3 articulated modes of rotary mechanism of discharge mechanism 4 can change rotary mechanism 3 and adhesive deposite device's distance to realize the best point on the basis of the volume of gluing at the corresponding point and glue efficiency. Through being equipped with rotating base 31 at rotary mechanism 3's center, drive the base plate through rotating base 31 and rotate, change the some glue positions on the corresponding base plate of adhesive deposite device, the flexibility is better, has reduced same base plate and has glued the length of pausing to some glue between the position to different points, has improved some glue efficiency, and simultaneously, rotary mechanism 3 is being close to feed mechanism 2 and discharge mechanism 4's one end respectively is equipped with a removal claw 32, removes the position of claw 32 nimble adjustment base plate, makes the base plate place when rotating base 31 top, and the position is not skew, has avoided some glue positions on adhesive deposite device and the base plate to not correspond.
The above list of details is only for the practical implementation of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent implementations or modifications that do not depart from the technical spirit of the present invention should be included in the scope of the present invention.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A feed system of a die bonder is characterized by comprising: the substrate storage device comprises a storage mechanism for storing substrates, a feeding mechanism for driving the substrates to move, a rotating mechanism and a discharging mechanism;
the feeding mechanism, the rotating mechanism and the discharging mechanism are connected in sequence, the feeding mechanism is in an ascending trend from one end of the feeding mechanism to one end of the rotating mechanism, the discharging mechanism is in a descending trend from one end of the rotating mechanism to the opposite end of the rotating mechanism, the feeding mechanism, the rotating mechanism and the discharging mechanism form a ladder-shaped structure together, the feeding mechanism and the discharging mechanism are rotatably connected with the rotating mechanism in a hinged mode, and the rotating mechanism is driven to ascend and descend synchronously through the feeding mechanism and the discharging mechanism;
a rotary base is arranged at the center of the rotary mechanism and embedded into the upper surface of the rotary mechanism, and one end of the rotary mechanism, which is close to the feeding mechanism and one end of the discharging mechanism, are respectively provided with a moving claw;
the feeding mechanism is provided with a push rod and an annular slide rail for the push rod to work circularly, and after the push rod pushes the substrate to move to one end of the rotating mechanism, the moving claw drives the substrate to move above the rotating base.
2. The feeding system of the die bonder as claimed in claim 1, wherein: the two sides of the feeding mechanism are also provided with opening chutes, and the opening chutes are used for the two sides of the substrate to penetrate.
3. The feeding system of the die bonder as claimed in claim 1, wherein: and the rotating mechanism is also provided with a distance measuring sensor.
4. The feeding system of the die bonder as claimed in claim 2, wherein: the rotary base is controlled and driven by an electromagnetic assembly.
5. The feeding system of the die bonder as claimed in claim 1, wherein: the discharging mechanism is provided with a conveyor belt to move the substrate.
6. The feeding system of the die bonder as claimed in claim 1, wherein: the two moving claws are driven synchronously.
7. The feeding system of the die bonder as claimed in claim 1, wherein: the annular slide rail set up in on feed mechanism's the central line, and extend to arbitrary one side and form annular structure.
8. The feeding system of the die bonder as claimed in claim 1, wherein: and a buffer cushion is further arranged at one end of the discharging mechanism, which deviates from the rotating mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121141492.8U CN214705885U (en) | 2021-05-26 | 2021-05-26 | Feeding system of die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121141492.8U CN214705885U (en) | 2021-05-26 | 2021-05-26 | Feeding system of die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214705885U true CN214705885U (en) | 2021-11-12 |
Family
ID=78553906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121141492.8U Expired - Fee Related CN214705885U (en) | 2021-05-26 | 2021-05-26 | Feeding system of die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214705885U (en) |
-
2021
- 2021-05-26 CN CN202121141492.8U patent/CN214705885U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211112 |