CN112071786B - Material loading cake mechanism in semiconductor packaging equipment - Google Patents
Material loading cake mechanism in semiconductor packaging equipment Download PDFInfo
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- CN112071786B CN112071786B CN202011050426.XA CN202011050426A CN112071786B CN 112071786 B CN112071786 B CN 112071786B CN 202011050426 A CN202011050426 A CN 202011050426A CN 112071786 B CN112071786 B CN 112071786B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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Abstract
The invention discloses a cake feeding mechanism in semiconductor equipment, which comprises a frame, wherein a feeding device, a feeding device communicated with the feeding device and a feeding platform matched with the feeding device are arranged on the frame, the feeding device is slidably arranged on a first mechanical arm arranged along an X axis, the feeding device comprises a feeding pipe communicated with the feeding device and a feeding cylinder driving the feeding pipe to slide on the Z axis, the feeding platform is slidably arranged on a second mechanical arm arranged along the Y axis, the feeding platform comprises a guide plate and a bottom plate slidably arranged on the guide plate, a guide groove arranged along the sliding direction of the bottom plate is arranged on the guide plate, the guide groove comprises a straight line section and an inclined section, the straight line section is connected with the inclined section through an arc section, an installation block is arranged on the side surface of the bottom plate, a rotating part matched with the guide groove is arranged on the installation block, and the bottom plate is rotatably connected with the second mechanical arm, the bottom plate is provided with a feeding cake frame, and the rack is provided with a discharge hole corresponding to the guide plate. The automatic plastic package material placing is realized.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging equipment, in particular to a cake feeding mechanism in semiconductor equipment.
Background
In the semiconductor packaging process, the method of placing the plastic package material into the packaging equipment usually adopts the steps of manually placing the cylindrical plastic package material into the charging barrel on the material loading cake rack in order, and then placing the material loading cake rack into the packaging equipment. However, the manual feeding mode has many problems, and along with the improvement of the production efficiency of the equipment, the manual feeding is difficult to follow the production speed of the equipment, so that the overall production efficiency of semiconductor products is reduced, and the condition of leaking plastic package materials is easy to occur in the manual feeding, so that the product packaging failure is caused. Therefore, in order to improve the production efficiency of the semiconductor packaging equipment and reduce the operation errors, a high-efficiency and automatic cake feeding mechanism is required.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a high-efficiency cake feeding mechanism suitable for semiconductor packaging equipment is provided.
In order to solve the technical problems, the invention adopts the technical scheme that: a material cake feeding mechanism in semiconductor equipment comprises a rack, wherein a feeding device, a feeding device communicated with the feeding device and a material feeding platform matched with the feeding device are arranged on the rack, the feeding device is slidably arranged on a first mechanical arm arranged along an X axis, the feeding device comprises a feeding pipe communicated with the feeding device and a feeding cylinder driving the feeding pipe to slide on the Z axis, the material feeding platform is slidably arranged on a second mechanical arm arranged along the Y axis, the material feeding platform comprises a guide plate and a bottom plate slidably arranged on the guide plate, a guide groove arranged along the sliding direction of the bottom plate is arranged on the guide plate and comprises a straight line section and an inclined section, the straight line section is connected with the inclined section through an arc section, a mounting block is arranged on the side surface of the bottom plate, and a rotating part matched with the guide groove is arranged on the mounting block, the bottom plate with the second arm rotates to be connected, be equipped with the material loading cake frame on the bottom plate, be equipped with in the frame with the discharge gate that the deflector corresponds.
The invention has the beneficial effects that: through setting up feed arrangement in the frame, it realizes putting into the plastic envelope material to cooperate with material loading platform to cooperate and put into in the automatic material loading cake frame of making progress, the efficiency of putting into the plastic envelope material in to the material loading cake frame has been improved greatly and the material loading cake frame that will fill with the plastic envelope material is automatic ejecting, make the material loading speed satisfy semiconductor packaging equipment's demand, the production efficiency of semiconductor packaging equipment is improved, reduce the requirement to manual operation at the material loading in-process simultaneously, avoid the hourglass that artifical material loading in-process probably appears to put, reduce the probability of the product of not encapsulating, promote product quality.
Drawings
FIG. 1 is a front view of a material cake loading mechanism in a semiconductor apparatus according to a first embodiment of the present invention;
FIG. 2 is a side view of a material cake loading mechanism in a semiconductor apparatus according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram illustrating a movement of a feeding device in a material cake loading mechanism in a semiconductor device according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a feeding device in a material cake feeding mechanism in a semiconductor device according to a first embodiment of the present invention;
FIG. 5 is a top view of a feeding device in a material cake loading mechanism in a semiconductor device according to a first embodiment of the present invention;
fig. 6 is a schematic structural diagram of a first robot arm in a material cake loading mechanism in a semiconductor device according to a first embodiment of the present invention;
fig. 7 is a schematic structural diagram of a second robot arm in a material cake loading mechanism in the semiconductor device according to the first embodiment of the present invention;
fig. 8 is a top view of a loading platform in a loading cake mechanism in a semiconductor apparatus according to a first embodiment of the present invention;
fig. 9 is a schematic structural diagram of a feeding platform of a feeding cake mechanism in a semiconductor device according to a first embodiment of the present invention;
fig. 10 is a schematic structural diagram of a loading platform in a loading cake mechanism in a semiconductor device according to a first embodiment of the present invention when taking a loading cake rack.
Description of reference numerals:
1. a frame; 2. a feeding device; 21. a hopper; 22. a vibrating pan; 23. a transfer tube; 3. a feeding device; 31. a feeding pipe; 32. a feeding cylinder; 321. a fixed end; 322. a mobile terminal; 33. a material blocking cylinder; 34. a first sensor; 35. a second sensor; 36. a third sensor; 37. a fourth sensor; 38. mounting a bracket; 4. a feeding platform; 41. a material loading cake rack; 42. a guide plate; 43. a base plate; 44. a fixed block; 45. rotating the block; 46. a charging barrel; 47. a guide groove; 471. a straight line segment; 472. an inclined section; 473. a circular arc section; 48. mounting blocks; 49. a rotating member; 5. a first robot arm; 51. a displacement module; 52. a movable block; 6. a second mechanical arm; 61. a slide rail; 62. a slider; 63. a screw rod; 64. an electric motor.
Detailed Description
In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1 to 10, a material cake feeding mechanism in a semiconductor device includes a frame 1, a feeding device 2, a feeding device 3 connected to the feeding device 2, and a feeding platform 4 coupled to the feeding device 3 are disposed on the frame 1, the feeding device 3 is slidably disposed on a first mechanical arm 5 disposed along an X axis, the feeding device 3 includes a feeding pipe 31 connected to the feeding device 2 and a feeding cylinder 32 driving the feeding pipe 31 to slide on a Z axis, the feeding platform 4 is slidably disposed on a second mechanical arm 6 disposed along a Y axis, the feeding platform 4 includes a guide plate 42 and a bottom plate 43 slidably disposed on the guide plate 42, the guide plate 42 has a guide slot 47 disposed along a sliding direction of the bottom plate 43, the guide slot 47 includes a straight line segment 471 and an inclined segment 472, the straight line segment 471 is connected to the inclined segment 472 through an arc segment 473, the side of bottom plate 43 is equipped with installation piece 48, be equipped with on the installation piece 48 with guide way 47 matched with rotates the piece 49, bottom plate 43 with second arm 6 rotates and is connected, be equipped with material loading cake frame 41 on the bottom plate 43, be equipped with on the frame 1 with the discharge gate that the deflector 42 corresponds.
The working principle of the invention is briefly described as follows: the working personnel puts cylindrical plastic package materials into the feeding device 2, the plastic package materials sequentially enter the feeding device 3 from the feeding device 2, the first mechanical arm 5 and the second mechanical arm 6 drive the feeding device 2 and the feeding platform 4 to move respectively, the feeding pipe 31 of the feeding device 2 is aligned to the material barrel 46 on the feeding cake rack 41, the plastic package materials in the feeding pipe 31 are accurately fed into the material barrel 46, after the plastic package materials are fed into the material barrel 46 on the feeding cake rack 41, the second mechanical arm 6 drives the bottom plate 43 of the feeding platform 4 to slide along the guide groove 47, the lower end of the bottom plate 43 guided by the inclined section 472 of the guide groove 47 is tilted, the feeding cake rack 41 is conveyed to the material outlet on the rack 1, and the working personnel can take the feeding cake rack 41 out from the material outlet and place the feeding cake rack 41 into the semiconductor packaging equipment.
From the above description, the beneficial effects of the present invention are: the efficiency of putting in the plastic envelope material to the material cake frame 41 has been improved greatly, makes the speed of going up the plastic envelope material satisfy semiconductor packaging equipment's demand, improves semiconductor packaging equipment's production efficiency, reduces the material loading in-process simultaneously and to artificial demand, avoids the hourglass that artifical material loading in-process probably appears to put, reduces the probability that the product was not packaged to the appearance, promotes product quality.
Further, the second mechanical arm 6 includes a slide rail 61 arranged along the Y-axis direction, a slidable slide block 62 is arranged on the slide rail 61, and the slide block 62 is rotatably connected with the bottom plate 43.
Further, the second mechanical arm 6 further comprises a screw 63 matched with the sliding block 62 and a motor 64 driving the screw 63 to rotate, and the screw 63 and the sliding rail 61 are arranged in parallel.
As can be seen from the above description, the second mechanical arm 6 drives the screw 63 to rotate through the motor 64 to drive the sliding block 62 to move on the sliding rail 61, and further drives the feeding platform 4 connected to the sliding block 62 to move along the Y-axis direction, so that the position accuracy of the feeding platform 4 is high, and the feeding pipe 31 is favorably aligned to the material cylinder 46 on the feeding cake rack 41.
Furthermore, a fixed block 44 and a rotating block 45 which are connected in a rotating mode are arranged on one side, close to the sliding block 62, of the bottom plate 43, the fixed block 44 is fixedly connected with the sliding block 62, and the rotating block 45 is fixedly connected with the bottom plate 43.
As can be seen from the above description, the bottom plate 43 is connected with the sliding block 62 through the fixed block 44 and the rotating block 45 which are connected in a rotating manner, the fixed block 44 is fixedly connected with the sliding block 62, and the rotating block 45 is fixedly connected with the bottom plate 43, so that when the bottom plate 43 slides along with the sliding block 62, the bottom plate 43 and the sliding block 62 rotate relatively under the action of the guide plate 42 to tilt the bottom plate 43, thereby facilitating the worker to take out the cake loading frame 41 from the bottom plate 43.
Further, the feeding device 2 comprises a hopper 21 and a vibration disc 22 matched with the hopper 21, the vibration disc 22 is communicated with the feeding pipe 31, the hopper 21 is fixed on the outer side of the rack 1, the mounting position of the hopper 21 is higher than that of the vibration disc 22, and the mounting position of the vibration disc 22 is higher than that of the feeding device 3.
Further, the vibration plate 22 is communicated with the feeding pipe 31 through a conveying pipe 23, and one end of the feeding pipe 31 close to the conveying pipe 23 is conical.
From the above description, the hopper 21, the vibration tray 22 and the feeding device 3 are sequentially arranged from high to low, so that the plastic package material in the hopper 21 sequentially falls into the vibration tray 22 and the feeding device 3 under the action of gravity, and the end of the feeding pipe 31 is tapered, so that the plastic package material can enter the feeding pipe 31, and the plastic package materials are prevented from being blocked due to the accumulation at the end of the feeding pipe 31.
Furthermore, at least two material blocking cylinders 33 are arranged on the side surface of the feeding pipe 31 at intervals, the output ends of the material blocking cylinders 33 extend into the feeding pipe 31, and one material blocking cylinder 33 is arranged at the end part of the feeding pipe 31 close to the feeding cake rack 41.
As can be seen from the above description, the plastic packages are separated inside the feeding pipe 31 by the blocking cylinders 33 disposed at the sides of the feeding pipe 31, and the lowermost plastic package is fed into the charging barrel 46 by the contraction of the lowermost blocking cylinder 33, while the other plastic packages remain in the feeding pipe 31, ensuring that only one plastic package is fed into each charging barrel 46.
Furthermore, a first sensor 34 is arranged at one end of the feeding pipe 31 close to the feeding device 2, a second sensor 35 is arranged at one end of the feeding pipe 31 close to the cake feeding frame 41, and a third sensor 36 and a fourth sensor 37 are arranged on the feeding pipe 31 close to the second sensor 35 at intervals.
Further, the first sensor 34, the second sensor 35, the third sensor 36, and the fourth sensor 37 are each a correlation sensor.
As can be seen from the above description, the first sensor 34 near the feeding device 2 is used to detect whether the plastic package material in the feeding pipe 31 is full, the second sensor 35 near the feeding cake rack 41 is used to detect whether the plastic package material is thrown into the barrel 46, and the third sensor 36 and the fourth sensor 37 near the second sensor 35 are used to detect whether the plastic package material about to be thrown into the barrel 46 is intact.
Further, the first mechanical arm 5 includes a displacement module 51 disposed along the X-axis direction, a slidable movable block 52 is disposed on the displacement module 51, and the movable block 52 is connected to the fixed end 321 of the feeding cylinder 32.
As can be seen from the above description, the fixed end 321 of the feeding cylinder 32 is fixedly connected to the movable block 52, so that the movable block 52 drives the feeding device 3 to move when sliding on the displacement module 51 in the direction, and the feeding device 3 is kept stable when moving.
Example one
Referring to fig. 1 to 10, a first embodiment of the present invention is: a material loading cake mechanism in semiconductor equipment can automatically load cylindrical plastic package materials into a material barrel 46 on a material loading cake rack 41, greatly improve the material loading speed of the semiconductor packaging equipment, reduce possible errors of manual operation and reduce the labor intensity of workers.
As shown in fig. 1 and 2, the material loading mechanism in the semiconductor device includes a frame 1, wherein a feeding device 2, a material feeding device 3, and a material loading platform 4 are disposed on the frame 1, the material feeding device 3 is movably disposed on a first mechanical arm 5 disposed along an X-axis direction, the material loading platform 4 is movably disposed on a second mechanical arm 6 disposed along a Y-axis direction, and both the first mechanical arm 5 and the second mechanical arm 6 are fixed in the frame 1. The semiconductor device further comprises a controller for controlling the cake loading mechanism in the semiconductor device, and the controller is electrically connected with each component of the cake loading mechanism in the semiconductor device. The feeding device 3 comprises a feeding cylinder 32 for driving the feeding device 3 to move horizontally in the Z-axis direction, the feeding cake rack 41 is placed on the feeding platform 4, a plurality of material cylinders 46 which are arranged in a matrix mode are arranged on the feeding cake rack 41, and plastic package materials are automatically fed into the material cylinders 46 through the mutual matching of the feeding device 2, the feeding device 3 and the feeding platform 4.
Specifically, feed arrangement 2 includes matched with hopper 21 and vibration dish 22, vibration dish 22 with throw material device 3 and pass through conveying pipe 23 intercommunication, hopper 21 is fixed the frame 1 outside just the mounted position of hopper 21 is higher than the mounted position of vibration dish 22, the mounted position of vibration dish 22 is higher than throw material device 3's mounted position, the staff puts into the plastic envelope material and is located outside the frame 1 in the hopper 21, the plastic envelope material falls into under the effect of gravity vibration dish 22 and along with the vibration of vibration dish 22 the plastic envelope material gets into in proper order is transported to throwing material device 3 in the conveying pipe 23.
Referring to fig. 3 to 5, the feeding cylinder 32 includes a fixed end 321 fixedly connected to the first robot arm 5 and a movable end 322 slidably disposed on the fixed end 321, a mounting bracket 38 is disposed on the movable end 322, a feeding pipe 31 is disposed on the mounting bracket 38, the feeding pipe 31 is disposed along a Z-axis direction in a length direction, an upper end of the feeding pipe 31 is communicated with the conveying pipe 23, at least two blocking cylinders 33 are disposed at intervals on a side surface of the mounting bracket 38, an output end of each blocking cylinder 33 extends into the feeding pipe 31 and blocks a plastic package material from falling down, one of the blocking cylinders 33 is disposed near a lower end of the feeding pipe 31, when the blocking cylinder 33 located at a lower end of the feeding pipe 31 contracts to enable the plastic package material in the feeding pipe 31 to fall into the cake loading frame 41, the other blocking cylinders 33 extend to block other plastic package materials from falling down, the feeding device 3 feeds a molding compound into one of the material cylinders 46 of the feeding cake rack 41. Preferably, the end of the feeding pipe 31 communicating with the conveying pipe 23 is tapered to guide the molding compound into the feeding pipe 31, so as to avoid the blocking caused by the accumulation of a plurality of molding compounds at the end of the feeding pipe 31.
Further, a plurality of sensors are arranged on the side surface of the mounting bracket 38, a first sensor 34 is arranged at one end of the feeding pipe 31 close to the vibrating tray 22, a second sensor 35 is arranged at one end of the feeding pipe 31 close to the feeding cake rack 41, a third sensor 36 and a fourth sensor 37 are arranged at intervals close to the second sensor 35, wherein the first sensor 34 is used for detecting whether the plastic package material in the feeding pipe 31 is full, the second sensor 35 is used for detecting whether the plastic package material at the lowest position of the feeding pipe 31 is thrown into the charging barrel 46, the third sensor 36 and the fourth sensor 37 are used for detecting whether the plastic package material about to be thrown into the charging barrel 46 is complete or not, when the plastic package material is incomplete, the third sensor 36 or the fourth sensor 37 sends a signal to the controller, and the controller prompts a worker that the plastic package material is incomplete and needs to be replaced, to ensure the packaging quality of the semiconductor product. Optionally, the first sensor 34, the second sensor 35, the third sensor 36 and the fourth sensor 37 are correlation sensors, respectively.
As shown in fig. 6 and 7, the first robot 5 includes a displacement module 51 fixed to the frame 1, the displacement module 51 is disposed along the X-axis direction, a movable block 52 slidable on the displacement module 51 is disposed on the displacement module 51, and the fixed end 321 of the feeding cylinder 32 is disposed on the movable block 52, so that the movable block 52 drives the feeding device 3 to move when sliding on the displacement module 51 along the X-axis direction. The second mechanical arm 6 comprises a sliding rail 61 fixed on the rack 1, the sliding rail 61 is arranged along the Y-axis direction, a slidable sliding block 62 is arranged on the sliding rail 61, and the sliding block 62 is connected with the feeding platform 4, so that the sliding block 62 drives the feeding platform 4 to move when sliding along the Y-axis on the sliding rail 61. And then the first mechanical arm 5 and the second mechanical arm 6 are matched to align the feeding pipe 31 with the material cylinder 46, so that the plastic package material is ensured to accurately fall into the material cylinder 46.
Optionally, a screw 63 matched with the sliding block 62 is arranged on the sliding rail 61, the screw 63 is arranged in parallel with the sliding rail 61, a motor 64 for driving the screw 63 to rotate is arranged on the side surface of the sliding rail 61, the screw 63 is connected with the motor 64 through a conveyor belt, when the motor 64 drives the screw 63 to rotate, the screw 63 drives the sliding block 62 to move on the sliding rail 61 along the Y axis, the positioning accuracy of the sliding block 62 can be improved by driving the sliding rail 61 to move through the screw 63, and the feeding pipe 31 and the charging barrel 46 are favorably aligned quickly.
As shown in fig. 8 to 10, the feeding platform 4 includes a guide plate 42 and a bottom plate 43 slidably disposed on the guide plate 42, the bottom plate 43 is provided with the feeding cake frame 41, one surface of the bottom plate 43 close to the slider 62 is provided with a fixed block 44 and a rotating block 45 which are rotatably connected, the fixed block 44 is fixedly connected with the slider 62, the rotating block 45 is fixedly connected with the bottom plate 43, the guide plate 42 is provided with an inclined surface, the top end of the inclined surface faces the outside of the rack 1 and corresponds to a discharge port on the rack 1, when the slider 62 drives the bottom plate 43 to slide, one end of the bottom plate 43 tilts upwards under the guide of the guide plate 42, so that a worker can conveniently take the feeding cake frame 41 out of the bottom plate 43 from the discharge port. Optionally, the fixed block 44 and the rotating block 45 are connected by a hinge pin.
Specifically, the guide plate 42 is provided with a guide groove 47 arranged along the sliding direction of the bottom plate 43, the guide groove 47 includes a straight line section 471 for horizontally placing the bottom plate, an inclined section 472 for guiding the bottom plate 43 to tilt, and a circular arc section 473 for smoothly connecting the straight line section 471 and the inclined section 472, the two opposite sides of the bottom plate 43 are respectively provided with a mounting block 48, the mounting blocks 48 are respectively provided with a rotatable rotating piece 49, the rotating pieces 49 are matched with the guide grooves 47, when the sliding block 62 slides the bottom plate 43, the rotating member 49 rotates in the guide groove 47 to keep the bottom plate 43 smooth during the sliding process, at the same time, when the rotating member 49 moves to the inclined section 472 on the guide plate 42, the bottom plate 43 is jacked up to rotate the bottom plate 43, and the bottom plate 43 is prevented from being stuck with the guide plate 42 to cause mechanism damage. Alternatively, the rotating member 49 is a cam.
The working process of the cake feeding mechanism in the semiconductor device provided by the embodiment is as follows: a worker puts cylindrical plastic packages into the hopper 21, the plastic packages in the hopper 21 fall into the vibrating tray 22 under the action of gravity, the plastic packages sequentially enter the conveying pipe 23 and move into the feeding pipe 31 under the action of the vibration of the vibrating tray 22, the first mechanical arm 5 drives the feeding device 3 to move in the X-axis direction, the second mechanical arm 6 drives the feeding platform 4 to move in the Y-axis direction, so that the end of the feeding pipe 31 is aligned with the material cylinder 46 on the feeding cake rack 41, the feeding cylinder 32 drives the feeding pipe 31 to move in the Z-axis direction and close to the material cylinder 46, at the moment, the material blocking cylinder 33 acts to drop the plastic packages at the lowest part of the feeding pipe 31 into the material cylinder 46 and block other plastic packages in the feeding pipe 31, and the plastic packages automatically flow into the feeding cake rack 41, waiting all on the material loading cake frame 41 after plastic package material is all put in the feed cylinder 46, the second arm 6 drives the bottom plate 43 moves in the Y-axis direction and makes the bottom plate 43 follow the direction of guide board slides and perks, and the staff will material loading cake frame 41 is followed take out in the frame 1 and put into semiconductor packaging equipment again and can accomplish the material loading of semiconductor packaging equipment.
In conclusion, the material loading cake mechanism in the semiconductor equipment provided by the invention realizes automatic plastic package material feeding into the material loading cake frame, greatly improves the plastic package material feeding speed, meets the use requirements of the semiconductor packaging equipment, improves the production efficiency of the semiconductor packaging equipment, reduces the labor intensity of workers and reduces the possible operation errors caused by manual plastic package material feeding, and is good in reliability and convenient to use.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields, are included in the scope of the present invention.
Claims (8)
1. A material loading cake mechanism in semiconductor equipment comprises a frame and is characterized in that: the feeding device is arranged on the rack and can be slidably arranged on a first mechanical arm arranged along an X axis, the feeding device comprises a feeding pipe communicated with the feeding device and a feeding cylinder driving the feeding pipe to slide on a Z axis, the feeding platform is slidably arranged on a second mechanical arm arranged along a Y axis, the feeding platform comprises a guide plate and a bottom plate slidably arranged on the guide plate, a guide groove arranged along the sliding direction of the bottom plate is arranged on the guide plate and comprises a straight line section and an inclined section, the straight line section is connected with the inclined section through an arc section, a mounting block is arranged on the side surface of the bottom plate, a rotating piece matched with the guide groove is arranged on the mounting block, and the bottom plate is rotatably connected with the second mechanical arm, a feeding cake rack is arranged on the bottom plate, and a discharge hole corresponding to the guide plate is formed in the rack; the second mechanical arm comprises a sliding rail arranged along the Y-axis direction, a slidable sliding block is arranged on the sliding rail, the sliding block is rotatably connected with the bottom plate, the second mechanical arm further comprises a lead screw matched with the sliding block and a motor driving the lead screw to rotate, and the lead screw and the sliding rail are arranged in parallel.
2. The cake feeding mechanism in a semiconductor apparatus according to claim 1, wherein: the bottom plate is close to be equipped with the fixed block and the rotatory piece of rotation connection on the one side of slider, the fixed block with slider fixed connection, rotatory piece with bottom plate fixed connection.
3. The cake feeding mechanism in a semiconductor apparatus according to claim 1, wherein: the feeding device comprises a hopper and a vibration disc matched with the hopper, the vibration disc is communicated with the feeding pipe, the hopper is fixed on the outer side of the rack, the mounting position of the hopper is higher than that of the vibration disc, and the mounting position of the vibration disc is higher than that of the feeding device.
4. A material cake feeding mechanism in a semiconductor apparatus according to claim 3, wherein: the vibration plate is communicated with the feeding pipe through a conveying pipe, and one end of the feeding pipe, which is close to the conveying pipe, is conical.
5. The cake feeding mechanism in a semiconductor apparatus according to claim 1, wherein: the feeding device comprises a feeding pipe, a feeding cylinder, a material blocking cylinder, a material feeding cake rack and a material feeding device, wherein the feeding pipe is provided with at least two material blocking cylinders at intervals on the side surface, the output ends of the material blocking cylinders extend into the feeding pipe, and one material blocking cylinder is arranged at the end part, close to the material feeding cake rack, of the feeding pipe.
6. The cake feeding mechanism in a semiconductor apparatus according to claim 1, wherein: the feeding device is characterized in that a first sensor is arranged at one end, close to the feeding device, of the feeding pipe, a second sensor is arranged at one end, close to the feeding cake rack, of the feeding pipe, and a third sensor and a fourth sensor are arranged on the feeding pipe, close to the second sensor, at intervals.
7. The cake feeding mechanism in a semiconductor device according to claim 6, wherein: the first sensor, the second sensor, the third sensor and the fourth sensor are correlation sensors, respectively.
8. The cake feeding mechanism in a semiconductor apparatus according to claim 1, wherein: the first mechanical arm comprises a displacement module arranged along the X-axis direction, a slidable movable block is arranged on the displacement module, and the movable block is connected with the fixed end of the feeding cylinder.
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| CN202011050426.XA CN112071786B (en) | 2020-09-29 | 2020-09-29 | Material loading cake mechanism in semiconductor packaging equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011050426.XA CN112071786B (en) | 2020-09-29 | 2020-09-29 | Material loading cake mechanism in semiconductor packaging equipment |
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| CN112071786A CN112071786A (en) | 2020-12-11 |
| CN112071786B true CN112071786B (en) | 2021-09-07 |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210588348U (en) * | 2019-09-16 | 2020-05-22 | 苏州美德乐思精密机械有限公司 | Full-automatic feeding mechanism of machining center |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8302358A (en) * | 1983-07-01 | 1985-02-01 | Tebel Maschf Bv | LOADING DEVICE DOSING A CUSTOMIZED VOLUME OF A FLOWING MEDIUM SUPPLIED UNDER PRESSURE PRESSURE. |
| CN107452662B (en) * | 2017-09-13 | 2024-01-30 | 安徽海思达机器人有限公司 | Robot integration platform for chip packaging |
| CN108237400A (en) * | 2018-04-17 | 2018-07-03 | 深圳市广晟德科技发展有限公司 | A kind of automatic package system of four axis robots |
| CN208577150U (en) * | 2018-06-13 | 2019-03-05 | 昆山星益沅精密机械有限公司 | A kind of mechanical arm automatic charging device |
| CN209143132U (en) * | 2018-09-13 | 2019-07-23 | 安徽大华半导体科技有限公司 | A kind of oblique sliping type feeding device |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210588348U (en) * | 2019-09-16 | 2020-05-22 | 苏州美德乐思精密机械有限公司 | Full-automatic feeding mechanism of machining center |
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