CN214693313U

CN214693313U - Sensor packaging device based on MEMS chip application

Info

Publication number: CN214693313U
Application number: CN202120811990.2U
Authority: CN
Inventors: 敖雪飞
Original assignee: Dongguan Xinyuan Technology Co ltd
Current assignee: Dongguan Xinyuan Technology Co ltd
Priority date: 2021-04-20
Filing date: 2021-04-20
Publication date: 2021-11-12
Anticipated expiration: 2031-04-20

Abstract

The utility model discloses a sensor packaging hardware based on MEMS chip uses, the load simulator comprises a case, the dustless cabinet of top outside fixedly connected with of machine case, top one side of machine case is equipped with the conveyer belt subassembly, and one side that the top of machine case is close to the conveyer belt subassembly is equipped with the adhesive tape support, the inner wall of adhesive tape support rotates and is connected with the wire-wound joint dish, and the outer wall wire-wound joint of wire-wound joint dish has hot melt adhesive tape. The utility model discloses a full-automatic dustless packaging structure arranges the die cavity in with the chip through injecting glue heat-seal subassembly and transfer assembly cooperation, makes the encapsulation that the chip can be better inboard to the casing, need not artificial intervention, and chip encapsulation position error is little, makes the sensor quality after the encapsulation comparatively stable.

Description

Sensor packaging device based on MEMS chip application

Technical Field

The utility model relates to a sensor packaging technology field especially relates to a sensor packaging hardware based on MEMS chip is used.

Background

Sensor in its broadest definition, a sensor is a device, module or subsystem whose purpose is to detect events or changes in the environment and to transmit information to other electronic devices, typically computer processors. Sensors are always used with other electronic devices.

Microelectromechanical systems are an advanced manufacturing technology platform. Which was developed based on semiconductor manufacturing technology. MEMS technology employs a series of existing techniques and materials such as photolithography, etching, thin film, etc. in semiconductor technology, and thus the basic fabrication technique in MEMS is mature from the point of view of the fabrication technique itself. However, MEMS focuses more on ultra-precision machining and involves many areas of microelectronics, materials, mechanics, chemistry, and mechanics. Its disciplinary surface is also expanded to branches of physics at the micro-scale, force, electricity, light, magnetism, sound, surface, etc.

The application of MEMS has reduced the volume and the sensing precision of sensor, but when the encapsulation, traditional semi-manual encapsulation no longer is suitable for, and then the casing seal is unstable when making the encapsulation, the unable normal work of the inside main part of sensor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that exists among the prior art, and the sensor packaging hardware who proposes based on MEMS chip uses.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a sensor packaging device based on MEMS chip application comprises a case, wherein a dust-free cabinet is fixedly connected to the outer edge of the top of the case, a conveying belt assembly is arranged on one side of the top of the case, an adhesive tape support is arranged on one side, close to the conveying belt assembly, of the top of the case, the inner wall of the adhesive tape support is rotatably connected with a winding disc, a hot-melt adhesive tape is wound on the outer wall of the winding disc, an adhesive-injecting heat-sealing assembly and a transfer assembly are respectively arranged at two ends of the other side of the outer wall of the top of the case, the transfer assembly is connected with the conveying belt assembly and the adhesive-injecting heat-sealing assembly, the hot-melt adhesive tape is input to the hot-melt end of the adhesive-injecting heat-sealing assembly, a packaging cavity is arranged right below the adhesive-sealing assembly, mold motors are respectively arranged at two sides of the packaging cavity, a mold cavity clamping block is connected to an output shaft of each mold motor, and the outer walls of the mold cavity clamping blocks at two sides are slidably connected to the inner wall of the packaging cavity, and a control console is arranged on the outer wall of one side of the case close to the dust-free cabinet.

As a further scheme of the utility model, the transfer subassembly is by the pneumatic cylinder, connect the lever, rotate cover, central branch and pneumatic suction cup hydraulic stem, the output shaft of pneumatic cylinder is on rotating the bottom inner wall of cover, and the top inner wall of rotating the cover is pegged graft and is had the connecting rod, the top of connecting rod, central branch and the top of pneumatic suction cup hydraulic stem form lever structure at connection lever both ends and middle part through the hub connection.

As a further aspect of the utility model, the bottom outer wall sliding connection who connects the lever has the arc slide rail, the output shaft of pneumatic sucking disc hydraulic stem has pneumatic sucking disc.

As a further scheme of the utility model, the conveyer belt subassembly comprises the action wheel, follows driving wheel, conveyer belt and driving motor, the action wheel passes through the conveyer belt and forms the transmission cooperation from between the driving wheel, driving motor's output shaft is on the inner wall of action wheel.

As a further scheme of the utility model, injecting glue heat-seal subassembly comprises indulging carriage, crossbeam, injecting glue ware and the heater of putting, the one end sliding connection of crossbeam is on indulging the inner wall of putting the carriage, the top sliding connection of injecting glue ware is on the bottom outer edge of crossbeam, the outer wall fixed connection of heater is in the one side that is close to the adhesive tape support of crossbeam, the one end of hot melt adhesive tape is inputed to the heater in.

As a further aspect of the present invention, the bottom outer wall of the vertical sliding rack is provided with a moving seat.

As a further scheme of the utility model, the top outer wall of indulging the carriage is equipped with step motor, and step motor's output shaft has the lead screw, the outer wall of lead screw passes through the thread engagement and connects on the tip inner wall of crossbeam.

As a further aspect of the present invention, four corners of the outer wall of the bottom end of the case are provided with support legs.

The utility model has the advantages that:

1. the sensor packaging device adopts a full-automatic dust-free packaging structure, and the chip is placed in the die cavity through the cooperation of the glue injection heat-sealing assembly and the transfer assembly, so that the chip can be better packaged to the inner side of the shell without manual intervention, the packaging position error of the chip is small, and the packaged sensor has stable quality;

2. the sensor packaging device adopts a lever structure, is matched with an arc-shaped slide rail structure, and is connected with a support rod body structure in a sliding manner, so that the operations of rotation transfer on a plane, chip suction and transfer can be realized, the precision is high, the transfer is stable, and the chip cannot be polluted;

3. the glue injection heat sealing assembly in the sensor packaging device adopts linkage between the cross beam and the glue injector, so that the adjustment operation on Y and Z directions is met, the height and glue injection position adjustment of glue injection are ensured, meanwhile, the butt-clamping structure is arranged in the die cavity, the extrusion can be carried out during packaging, the discharge of bubbles in the packaging colloid is ensured, and the packaging quality is improved.

Drawings

Fig. 1 is a schematic perspective view of a sensor package device based on MEMS chip application according to the present invention;

fig. 2 is a schematic top view of a package assembly of a sensor package device based on MEMS chip application according to the present invention;

fig. 3 is a schematic view of an adjusting structure of a glue injection heat sealing assembly of the sensor packaging device based on the application of the MEMS chip;

fig. 4 is the utility model provides a sensor packaging hardware's injecting glue heat-seal assembly axle side schematic structure based on MEMS chip is used.

In the figure: 1. a support leg; 2. a chassis; 3. a dust-free cabinet; 4. a heater; 5. a cross beam; 6. a glue injector; 7. a mold motor; 8. a pneumatic sucker hydraulic rod; 9. a connecting lever; 10. a central strut; 11. rotating the sleeve; 12. an arc-shaped slide rail; 13. a conveyor belt assembly; 14. a drive motor; 15. a console; 16. a pneumatic suction cup; 17. a packaging cavity; 18. hot melting adhesive tapes; 19. a hydraulic cylinder; 20. a stepping motor; 21. longitudinally arranging a slide rail frame; 22. a movable seat; 23. and (5) clamping blocks of the mold cavity.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-4, a sensor packaging device based on MEMS chip application comprises a case 2, a dust-free cabinet 3 is fixedly connected to the outer edge of the top of the case 2, a conveyor belt assembly 13 is disposed on one side of the top of the case 2, a rubber strip support is disposed on one side of the top of the case 2 close to the conveyor belt assembly 13, a winding disc is rotatably connected to the inner wall of the rubber strip support, a hot-melt rubber strip 18 is wound around the outer wall of the winding disc, a glue injection heat-sealing assembly and a transfer assembly are respectively disposed at two ends of the other side of the top outer wall of the case 2, the transfer assembly connects the conveyor belt assembly 13 and the glue injection heat-sealing assembly, the hot-melt rubber strip 18 is input to the hot-melt end of the glue injection heat-sealing assembly, a packaging cavity 17 is disposed right below the glue injection heat-sealing assembly, mold motors 7 are disposed on two sides of the packaging cavity 17, an output shaft of the mold motor 7 is connected with mold cavity clamping blocks 23, outer walls of the mold cavity clamping blocks 23 on two sides are slidably connected to the inner wall of the packaging cavity 17, the outer wall of one side of the case 2 close to the dust-free cabinet 3 is provided with a control console 15, a transfer component comprises a hydraulic cylinder 19, a connecting lever 9, a rotating sleeve 11, a central supporting rod 10 and a pneumatic sucker hydraulic rod 8, an output shaft of the hydraulic cylinder 19 is connected to the inner wall of the bottom end of the rotating sleeve 11, a connecting rod is inserted into the inner wall of the top end of the rotating sleeve 11, the top end of the connecting rod, the top end of the central supporting rod 10 and the top end of the pneumatic sucker hydraulic rod 8 are connected to the two ends and the middle part of the connecting lever 9 through shafts to form a lever structure, the lever structure is adopted and simultaneously matched with an arc-shaped sliding rail structure, the arc-shaped sliding rail is in sliding connection with a supporting rod body structure, the operations of rotation transfer and chip suction and transfer on a plane can be realized, the accuracy is high, the transfer is stable, the chips cannot be polluted, the outer wall of the bottom end of the connecting lever 9 is in sliding connection with the arc-shaped sliding rail 12, and the output shaft of the pneumatic sucker hydraulic rod 8 is connected with a pneumatic sucker 16, the conveying belt assembly 13 is composed of a driving wheel, a driven wheel, a conveying belt and a driving motor 14, the driving wheel is in transmission fit with the driven wheel through the conveying belt, an output shaft of the driving motor 14 is connected to the inner wall of the driving wheel, the glue injection heat sealing assembly is composed of a longitudinally-arranged sliding frame 21, a cross beam 5, a glue injector 6 and a heater 4, linkage between the cross beam and the glue injector is adopted, adjustment operation in Y and Z directions is met, adjustment of glue injection height and glue injection position is guaranteed, meanwhile, a butt-clamp structure is arranged in a die cavity and can be extruded during packaging, bubble in packaging glue is guaranteed to be discharged, packaging quality is improved, one end of the cross beam 5 is in sliding connection with the inner wall of the longitudinally-arranged sliding frame 21, the top end of the glue injector 6 is in sliding connection with the outer edge of the bottom end of the cross beam 5, the outer wall of the heater 4 is fixedly connected to one side, close to a glue strip support, one end of the hot-melting glue strip 18 is input into the heater 4, indulge the bottom outer wall of putting carriage 21 and be equipped with removal seat 22, indulge the top outer wall of putting carriage 21 and be equipped with step motor 20, and step motor 20's output shaft has the lead screw, and the outer wall of lead screw passes through thread engagement and connects on the tip inner wall of crossbeam 5, and the bottom outer wall four corners department of quick-witted case 2 all is equipped with stabilizer blade 1.

The working principle of the sensor packaging device based on the MEMS chip application is as follows:

firstly, inputting an MEMS chip into a dust-free cabinet 3 through a conveyer belt assembly 13, adsorbing a chip structure by using a pneumatic suction disc 16 in a transfer assembly, tilting the end of the suction disc by using a hydraulic cylinder 19, and sliding to one side of a packaging cavity 17 by using an arc-shaped sliding rail 12;

secondly, after the glue solution in the half mould cavity is injected into the semi-solidification state by the glue injector 6, the chip is placed, the clamping blocks 23 of the mould cavities at two sides are driven by the mould motor 7 to slide and extrude, then the glue injection in the other half mould cavity is encapsulated, and air bubbles are extruded, wherein the glue solution is injected into the encapsulation cavity 17 after the heater 4 melts the hot-melt adhesive tape 18 to form a fluid structure;

thirdly, ejecting the packaged sensor out through the die cavity clamping block 23 on one side, and then carrying out subsequent packaging operation.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", "first", "second", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A sensor packaging device based on MEMS chip application comprises a case (2) and is characterized in that a dust-free cabinet (3) is fixedly connected to the outer edge of the top of the case (2), a conveyor belt assembly (13) is arranged on one side of the top of the case (2), an adhesive tape support is arranged on one side, close to the conveyor belt assembly (13), of the top of the case (2), the inner wall of the adhesive tape support is rotatably connected with a winding disc, a hot-melt adhesive tape (18) is wound on the outer wall of the winding disc, an adhesive-injection heat-sealing assembly and a transfer assembly are respectively arranged at two ends of the other side of the outer wall of the top of the case (2), the transfer assembly is connected with the conveyor belt assembly (13) and the adhesive-injection heat-sealing assembly, the hot-melt adhesive tape (18) is input to the hot-melting end of the adhesive-injection heat-sealing assembly, a packaging cavity (17) is arranged under the adhesive-sealing assembly, and mold motors (7) are respectively arranged on two sides of the packaging cavity (17), and the output shaft of the mould motor (7) is connected with a mould cavity clamping block (23), the outer walls of the mould cavity clamping blocks (23) at two sides are connected on the inner wall of the packaging cavity (17) in a sliding manner, and the outer wall of one side of the case (2) close to the dust-free cabinet (3) is provided with a control console (15).

2. The sensor packaging device based on MEMS chip application is characterized in that the transfer component is composed of a hydraulic cylinder (19), a connecting lever (9), a rotating sleeve (11), a central supporting rod (10) and a pneumatic sucker hydraulic rod (8), an output shaft of the hydraulic cylinder (19) is connected to the inner wall of the bottom end of the rotating sleeve (11), a connecting rod is inserted into the inner wall of the top end of the rotating sleeve (11), and the top end of the connecting rod, the top end of the central supporting rod (10) and the top end of the pneumatic sucker hydraulic rod (8) are connected to the two ends and the middle of the connecting lever (9) through shafts to form a lever structure.

3. The sensor packaging device based on MEMS chip application is characterized in that the outer wall of the bottom end of the connecting lever (9) is slidably connected with an arc-shaped sliding rail (12), and the output shaft of the pneumatic sucker hydraulic rod (8) is connected with a pneumatic sucker (16).

4. The sensor packaging device based on MEMS chip application is characterized in that the conveyor belt assembly (13) is composed of a driving wheel, a driven wheel, a conveyor belt and a driving motor (14), the driving wheel forms transmission fit with the driven wheel through the conveyor belt, and an output shaft of the driving motor (14) is connected to the inner wall of the driving wheel.

5. The sensor packaging device based on MEMS chip application is characterized in that the glue injection heat sealing assembly consists of a longitudinal sliding frame (21), a cross beam (5), a glue injector (6) and a heater (4), one end of the cross beam (5) is slidably connected to the inner wall of the longitudinal sliding frame (21), the top end of the glue injector (6) is slidably connected to the outer edge of the bottom end of the cross beam (5), the outer wall of the heater (4) is fixedly connected to one side, close to the adhesive tape support, of the cross beam (5), and one end of the hot-melt adhesive tape (18) is input into the heater (4).

6. The sensor packaging device based on MEMS chip application is characterized in that the outer wall of the bottom end of the longitudinal sliding frame (21) is provided with a moving seat (22).

7. The sensor packaging device based on MEMS chip application is characterized in that the outer wall of the top of the longitudinal sliding frame (21) is provided with a stepping motor (20), and the output shaft of the stepping motor (20) is connected with a lead screw, and the outer wall of the lead screw is connected with the inner wall of the end part of the cross beam (5) through threaded engagement.

8. The sensor packaging device based on MEMS chip application is characterized in that the four corners of the outer wall of the bottom end of the case (2) are provided with support legs (1).