CN214685000U

CN214685000U - Multilayer assembling and welding device for high-power device

Info

Publication number: CN214685000U
Application number: CN202120811656.7U
Authority: CN
Inventors: 许小兵; 李应明; 杨晓东
Original assignee: China Zhenhua Group Yongguang Electronics Coltd
Current assignee: China Zhenhua Group Yongguang Electronics Coltd
Priority date: 2021-04-20
Filing date: 2021-04-20
Publication date: 2021-11-12
Anticipated expiration: 2031-04-20

Abstract

The utility model discloses a high-power device multilayer equipment welding set, including first mould, the second mould, the core group hole, the pin hole, the locating pin hole, screw and screw, first mould and second mould are assembled through the assembly and assemble the surface, and be provided with the core group hole on this assembly and assembly surface, the pin hole, the locating pin hole, wherein core group hole and pin hole are assembled and are assembled the cylindrical notch combination on the surface by distributing at first mould and second mould and form, locating pin hole and core group hole, the pin hole is all inequality, first mould and second mould pass through the locating pin location, through locking screw and screw locking. The utility model discloses a welding set can be with multilayer core group material accurate positioning in the mould to guarantee the concentricity between the multilayer material, and take out core group from the mould very easily after accomplishing core group burn-in, the utility model discloses a face concatenation mode equipment is difficult for hindering the chip.

Description

Multilayer assembling and welding device for high-power device

Technical Field

The utility model belongs to the technical field of welding mould or frock, specifically a be used for high-power device multilayer equipment welding set.

Background

When the structure of some extra-high voltage and extra-high power devices is designed, because the voltage or power of a single chip cannot meet the requirement of high voltage or high power, a plurality of chips are required to be connected in series to realize the parameter performance of high voltage or high power. One of the most important designs in power devices is thermal design, and in order to withstand higher pulse power, it is necessary to increase the thermal capacity across the chip. A common approach is to solder a metal sheet that "absorbs heat" well across the chip to increase the thermal capacity of the entire core pack (chip + solder + metal sheet). In the ultra-high power device, the number of the chips connected in series is few, more chips are dozens, and metal sheets are added, so that the number of welding layers of the whole core group is more, the assembly welding difficulty is higher, and the concentricity requirement of the product on multilayer materials is difficult to meet. If still adopt traditional mould, assemble multilayer core group in the downthehole welding that burns of mould, will bring the unable problem of taking out of core group. When the welding flux is melted, the core groups can slide in the die holes randomly, the core groups are abutted against the inner wall of the die and are difficult to take out of the die, and the chips are scratched easily to cause the failure of the whole core group due to the scratch between the chips and the inner wall of the die. Therefore, a mold is required for the welding of the multi-layer core pack material, in which the concentricity between the multi-layer materials of the multi-layer core pack material is ensured, and the core pack is easily taken out from the mold after the welding is completed, and the chip is not easily damaged.

Disclosure of Invention

The utility model aims at providing a high-power device multilayer equipment welding set, as novel equipment welding mould, the deviation between the size of mould hole (core group hole) and the size of core group can be put very little to guarantee the concentricity of multilayer core group material, simultaneously in the completion back of welding, come out the core group through the method of separation mould, accomplish at the in-process of taking out the core group and do not have any damage to the core group.

The utility model discloses a realize through following technical scheme:

a multi-layer assembling and welding device for high-power devices comprises,

a first mold including a first surface for core pack insertion, and a second surface for assembly with a second mold;

a second mold including a third surface for core pack insertion, and a fourth surface for assembly with the first mold;

the core group hole comprises a first cylindrical notch positioned on the second surface and a second cylindrical notch positioned on the fourth surface, the first cylindrical notch penetrates through the first surface, the axis of the first cylindrical notch is parallel to the second surface, the second cylindrical notch penetrates through the third surface, the axis of the second cylindrical notch is parallel to the fourth surface, and the first cylindrical notch and the second cylindrical notch form a complete cylindrical hole;

the lead hole comprises a third cylindrical notch positioned on the second surface and a fourth cylindrical notch positioned on the fourth surface, one end of the third cylindrical notch is communicated with the first cylindrical notch and is coaxial with the first cylindrical notch, one end of the fourth cylindrical notch is communicated with the second cylindrical notch and is coaxial with the second cylindrical notch, and the third cylindrical notch and the fourth cylindrical notch form a complete cylindrical hole;

the positioning pin hole penetrates through the second surface and the fourth surface simultaneously, the axis of the positioning pin hole is perpendicular to the second surface and the fourth surface, and the positioning pin hole does not intersect with the first cylindrical notch, the second cylindrical notch, the third cylindrical notch and the fourth cylindrical notch;

the locking screw hole vertically penetrates through the second surface and the fourth surface, two ends of the locking screw hole are respectively located on the surfaces of the first die and the second die, and the screw is inserted into the locking screw hole.

Furthermore, clearance fit is formed between the inner diameter of the inner wall of the core group hole and the outer diameter of the core group.

Further, the first surface and the third surface are planar, and the second surface and the fourth surface are planar.

Further, the second surface and the fourth surface are T-shaped.

Further, a plurality of the first cylindrical notches are distributed on the second surface at equal intervals, and a plurality of the second cylindrical notches are distributed on the fourth surface at equal intervals.

Further, the first cylindrical notch, the second cylindrical notch, the third cylindrical notch and the fourth cylindrical notch are all 1/2 cylindrical surfaces.

The utility model discloses compare with traditional core group welding jig, have following characteristics:

(1) the welding device of the utility model can accurately position the multilayer core group material in the mould and ensure the concentricity between the multilayer materials;

(2) the welding device of the utility model can easily take out the core assembly from the die after completing the welding of the core assembly; (3) the utility model discloses a welding set adopts the equipment of face concatenation mode, is difficult for hindering the chip.

Drawings

FIG. 1 is a disassembled schematic view of a multilayer assembly welding device for high-power devices;

FIG. 2 is a side view of the first mold or the second mold;

FIG. 3 is a top view of the assembled multi-layer assembly welding device for high power devices;

in the figure: 1-a first mold; 2-a second mold; 3-positioning pins; 4-core assembly hole; 5-lead hole.

Detailed Description

The technical solution of the present invention is further described below with reference to the accompanying drawings, but the scope of protection claimed is not limited to the description.

As shown in fig. 1 to fig. 3, for the multilayer assembly welding device (mold) for high power devices designed in this embodiment, the mold is composed of two parts, namely a first mold 1 and a second mold 2, and the first mold 1 and the second mold 2 are in a symmetrical relationship, specifically, the first mold 1 and the second mold 2 are symmetrical about the splicing assembly plane of the two. The first die 1 and the second die 2 are assembled together by the positioning pins 3 to form a complete die set, and the first die 1 and the second die 2 are locked by screws for assembling the subsequent core pack. As shown in fig. 1, this view shows the surfaces of the first mold 1 and the second mold 2 for loading the core pack, corresponding to the upper surface of the first mold 1 and the upper surface of the second mold 2, respectively. As shown in fig. 2, this view shows the surfaces of the first mold 1 and the second mold 2 for assembly and makeup, corresponding to the inside surface of the first mold 1 and the inside surface of the second mold 2, respectively, both of which are plane. Alternatively, the inner side surface between the first mold 1 and the second mold 2 to be assembled and assembled is a T-shaped section.

After the first die 1 and the second die 2 are assembled and locked, the lead wires and the core group materials can be sequentially arranged in the die holes according to the structural design requirements, namely, in a plurality of core group holes 4 and a plurality of lead wire holes 5 which are distributed at equal intervals in fig. 2, the lead wire holes 5 are coaxial and communicated with the core group holes 4, and the orifice of the core group hole 4 is positioned on the upper surfaces of the first die 1 and the second die 2. The core group hole 4 is composed of 1/2 cylindrical notches distributed on the assembling and assembling surface of the

first die

1 and 1/2 cylindrical notches distributed on the assembling and assembling surface of the second die, the axis of 1/2 cylindrical notches is parallel to the assembling and assembling surfaces of the first die 1 and the second die 2, the number, the inner diameter and the position of 1/2 cylindrical notches on the first die 1 and the second die 2 are consistent, and the complete core group hole 4 is formed after the first die 1 and the second die 2 are assembled. Similarly, the lead hole 5 is also composed of 1/2 cylindrical notches distributed on the assembling and assembling surfaces of the first mold 1 and the second mold 2, and the lead hole 5 is communicated with the core pack hole 4. The aperture of core group hole 4 is clearance fit with the external diameter of core group material, because the size (external diameter) deviation of core group hole 4 and core group is very little, and the removal skew of each subassembly of core group in core group hole 4 can both be controlled very little, has guaranteed the concentricity between each subassembly of core group. As shown in fig. 2, positioning pin holes are formed in the assembled and assembled surface of the first mold 1 and the second mold 2, the axes of the positioning pin holes are perpendicular to the assembled and assembled surface of the first mold 1 and the second mold 2, the positioning pin holes do not intersect with the core group hole 4 and the lead hole 5, and the positioning pins 3 are inserted into the positioning pin holes to realize the relative positioning between the first mold 1 and the second mold 2. Threaded holes are formed in the first die 1 and the second die 2, and the first die 1 and the second die 2 are assembled and locked through screws inserted in a matched mode.

After the welding is finished, the screws are disassembled, the positioning pins 3 are pulled out, the first die 1 and the second die 2 are separated, the core group which is subjected to welding is easily taken out of the die hole, and damage caused by rubbing of the chips and the inner wall of the die, such as broken corners, broken edges and the like, is avoided.

Claims

1. A multilayer assembly welding device for a high-power device is characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,

a first mold (1), the first mold (1) comprising a first surface for core pack insertion, and a second surface for assembly with a second mold (2);

a second mold (2), the second mold (2) comprising a third surface for core pack insertion, and a fourth surface for assembly with the first mold (1);

the core group hole (4) comprises a first cylindrical notch and a second cylindrical notch, wherein the first cylindrical notch is located on the second surface, the second cylindrical notch is located on the fourth surface, the first cylindrical notch penetrates through the first surface, the axis of the first cylindrical notch is parallel to that of the second surface, the second cylindrical notch penetrates through the third surface, the axis of the second cylindrical notch is parallel to that of the fourth surface, and the first cylindrical notch and the second cylindrical notch form a complete cylindrical hole;

the lead hole (5) comprises a third cylindrical notch positioned on the second surface and a fourth cylindrical notch positioned on the fourth surface, one end of the third cylindrical notch is communicated with the first cylindrical notch and is coaxial with the first cylindrical notch, one end of the fourth cylindrical notch is communicated with the second cylindrical notch and is coaxial with the second cylindrical notch, and the third cylindrical notch and the fourth cylindrical notch form a complete cylindrical hole;

the positioning pin hole (3) penetrates through the second surface and the fourth surface simultaneously, the axis of the positioning pin hole (3) is perpendicular to the second surface and the fourth surface, and the positioning pin hole (3) does not intersect with the first cylindrical notch, the second cylindrical notch, the third cylindrical notch and the fourth cylindrical notch;

the locking screw hole vertically penetrates through the second surface and the fourth surface, two ends of the locking screw hole are respectively located on the surfaces of the first die (1) and the second die (2), and the screw is inserted into the locking screw hole.

2. The multilayer assembly welding device for high-power devices according to claim 1, wherein: the inner diameter of the inner wall of the core group hole (4) is in clearance fit with the outer diameter of the core group.

3. The multilayer assembly welding device for high-power devices according to claim 1, wherein: the first surface and the third surface are planar surfaces and the second surface and the fourth surface are planar surfaces.

4. The multilayer assembly welding device for high-power devices according to claim 1, wherein: the second surface and the fourth surface are T-shaped.

5. The multilayer assembly welding device for high-power devices according to claim 1, wherein: the first cylindrical notches are distributed on the second surface at equal intervals, and the second cylindrical notches are distributed on the fourth surface at equal intervals.

6. The multilayer assembly welding device for high-power devices according to claim 1, wherein: the first cylindrical notch, the second cylindrical notch, the third cylindrical notch and the fourth cylindrical notch are all 1/2 cylindrical surfaces.