CN214623098U

CN214623098U - Double-sided micro-lens array

Info

Publication number: CN214623098U
Application number: CN202023344040.8U
Authority: CN
Inventors: 刘晓轩; 周金运; 王博; 温坤华; 雷亮
Original assignee: Guangdong University of Technology
Current assignee: Guangdong University of Technology
Priority date: 2020-12-31
Filing date: 2020-12-31
Publication date: 2021-11-05
Anticipated expiration: 2030-12-31

Abstract

The utility model relates to a little optical technology field, concretely relates to two-sided microlens array, including the glass substrate, glass substrate's two sides all have microlens array structure. The utility model discloses a two-sided microlens array, the preparation is convenient, and the cost of manufacture is low, and numerical aperture is big, and imaging quality is good.

Description

Double-sided micro-lens array

Technical Field

The utility model relates to a little optical technology field, concretely relates to two-sided microlens array.

Background

Photolithography refers to a technique of forming a specific shape on a photoresist by light irradiation and transferring the shape to other materials such as glass or semiconductor.

The micro-lens is thin, reproducible, low in price, can be miniaturized and arrayed, can be integrated with a microelectronic device, provides a micro-photoelectric integrated device, has wide application in the aspects of optical communication, optical storage, optical interconnection and optical exchange, optical information processing and micro-optical sensors, and can realize various functions by matching with parts such as machine vision, lasers and the like.

Most of the existing micro-optical arrays are single-side micro-lenses, and in a system requiring a large numerical aperture, the single-side micro-lenses cannot meet the requirements, while the existing methods for preparing the double-sided micro-lenses comprise the following three methods:

1. chinese patent CN107193064A discloses a double-sided fly-eye lens imaging wafer and a preparation process thereof, wherein the process is to splice two single-sided microlens arrays, the double-sided microlens array manufactured by the method needs to be exposed twice, and the thickness, the precision and the imaging quality of the double-sided fly-eye lens imaging wafer are inferior to those of the double-sided microlens array formed in a single time;

2. the double-sided photoetching mode is adopted, and upper and lower photoetching imaging systems are required for double-sided photoetching, so that alignment and higher instrument cost are required;

3. the double-sided microlens array is prepared by adopting an embossing method, and the method for preparing the double-sided microlenses firstly needs to prepare a mold, so that the manufacturing cost is increased, and the precision is not high.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects in the prior art, the utility model provides a double-sided microlens array, the preparation is convenient, and the cost of manufacture is low, and numerical aperture is big, and imaging quality is good.

In order to solve the technical problem, the utility model provides a following technical scheme:

a double-sided micro-lens array comprises a glass substrate, wherein micro-lens array structures are arranged on two sides of the glass substrate.

Further, the microlens array structure is a planar hexagonal microlens array structure, the side length of the lens is 29 to 31 micrometers, about 30 micrometers, and the filling factor is 99 to 100 percent and is extremely close to 100 percent.

Furthermore, the micro lens array structure is made of photoresist after coating, exposure, development, heating and pattern transfer.

Furthermore, the photoresist is coated in a double-side coating mode.

Furthermore, a DMD photoetching machine is adopted for photoresist exposure.

Further, the photoresist is a negative photoresist.

Further, the heating tool for the photoresist is a thermostat.

Further, the photoresist is developed by using a developing solution.

Furthermore, the pattern transfer mode adopted by the photoresist is wet etching or dry etching.

The utility model discloses a preparation method of two-sided microlens array, including following step:

s1, coating photoresist on both sides of the glass substrate;

s2, placing the glass substrate coated with the photoresist on a photoetching platform;

s3, exposing by using a photoetching machine;

s4, carrying out development operation after exposure;

s5, placing the developed glass substrate into a thermostat;

and S6, transferring the photoresist pattern to the glass substrate by a pattern transfer mode.

Further, in step S1, the photoresist is a negative photoresist.

Further, in step S3, the photolithography machine is a DMD photolithography machine.

Further, in step S3, only one exposure is performed, and the photoresist on both the upper and lower sides of the transparent glass substrate is exposed, and the photoresist on both the upper and lower sides is exposed because the optical glass substrate is transparent.

Further, in step S4, the exposed glass substrate is placed in a developing solution for development, because a negative photoresist is used, the irradiated site will not be dissolved in the developing solution, and the photoresist that is not irradiated will be dissolved in the developing solution.

Further, in step S4, the exposed glass substrate is placed in a developing solution for a certain time, the developing time is different according to the manufacturing structure and the type of the photoresist, and the photoresist on both sides of the developed glass substrate forms a plurality of independent hexagonal pillar array structures.

Further, in step S5, the temperature of the oven is set to the glass transition temperature of the photoresist, the time for placing the photoresist is different according to the required structure and the type of the photoresist, the hexagonal cylinder has a certain mobility due to the temperature change to the glass state, and the hexagonal cylinder array structure is changed to the hexagonal spherical lens structure due to the tension.

Further, in step S6, the pattern formed by the photoresist is transferred to the glass substrate by wet etching or dry etching.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses use unilateral photoetching to carry out the shaping of two-sided microlens, need not to aim at from top to bottom, the preparation step is few, microlens imaging quality is high, and the two-sided microlens array of big numerical aperture of preparation can be applied to optical communication, light storage, light interconnection and light exchange, aspects such as optical information processing and little optical sensor have stronger practicality.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic structural diagram of the glass substrate and the photoresist in step S1 of the preparation method of the present invention;

fig. 2 is an operation diagram in step S3 of the preparation method of the present invention;

fig. 3 is a schematic structural diagram after step S4 of the preparation method of the present invention is completed;

FIG. 4 is a schematic diagram showing the structural change of the double-sided microlens array according to the present invention before and after the double-sided microlens array is placed in the incubator;

fig. 5 is a schematic diagram showing a change in structure before and after etching of a double-sided microlens array according to the present invention.

Wherein: 1. a glass substrate; 2. photoresist; 3. a lithography machine; 4. a hexagonal pillar array structure; 5. hexagonal spherical lens structure.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The embodiment of the utility model provides an include:

a double-sided micro-lens array comprises a glass substrate 1, wherein micro-lens array structures are arranged on two sides of the glass substrate.

In the present embodiment, the microlens array structure is a planar hexagonal microlens array structure, the side length of the lens is 29 to 31 microns, about 30 microns, and the filling factor is 99 to 100%, and is very close to 100%.

In this embodiment, the microlens array structure is made of photoresist by coating, exposing, developing, heating and pattern transferring.

In this embodiment, the photoresist coating is performed by double-side coating.

In this embodiment, a DMD lithography machine is used for the photoresist exposure.

In this embodiment, the photoresist is a negative photoresist.

In this embodiment, the heating tool for the photoresist is an oven.

In this embodiment, the photoresist is developed using a developing solution.

In this embodiment, the pattern transfer method used by the photoresist is wet etching or dry etching.

s1, coating the photoresist 2 on both sides of the glass substrate 1, as shown in fig. 1;

s2, placing the glass substrate 1 coated with the photoresist 2 on a photoetching platform;

s3, performing exposure by using the lithography machine 3, as shown in fig. 2;

s4, carrying out development operation after exposure;

s5, placing the developed glass substrate 1 into a thermostat;

s6, transferring the photoresist 2 pattern to the glass substrate 1 by pattern transfer.

In the present embodiment, in step S1, the photoresist 2 is a negative photoresist.

In this embodiment, in step S3, the lithography machine 3 is a DMD lithography machine.

In this embodiment, in step S3, only one exposure is performed, and the photoresist 2 on both the upper and lower sides of the transparent glass substrate 1 is exposed, and the photoresist 2 on both the upper and lower sides is exposed because the optical glass substrate 1 is transparent.

In this embodiment, in step S4, the exposed glass substrate 1 is placed in a developing solution for development, and since the negative photoresist 2 is used, the position irradiated with light will not be dissolved in the developing solution, and the photoresist 2 not irradiated with light will be dissolved in the developing solution.

As shown in fig. 3, in step S4, the exposed glass substrate 1 is placed in a developing solution for a certain time, the developing time varies according to the manufacturing structure and the type of the photoresist 2, and the photoresist 2 on both sides of the developed glass substrate 1 is formed with a plurality of independent hexagonal pillar array structures 4.

As shown in fig. 4, in step S5, the temperature of the oven is set to the glass transition temperature of the photoresist 2, the time of the placing is different according to the desired structure and the kind of the photoresist 2, the hexagonal cylinder becomes a glass state due to the temperature and has a certain fluidity, and the hexagonal cylinder array structure 4 becomes the hexagonal spherical lens structure 5 due to the tension.

As shown in fig. 5, in step S6, the pattern formed by the photoresist 2 is transferred onto the glass substrate 1 by wet etching or dry etching.

The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.

Claims

1. The double-sided microlens array is characterized by comprising a glass substrate, wherein microlens array structures are arranged on two sides of the glass substrate, and the microlens array structures are arranged in a plane hexagon mode.

2. The double-sided microlens array of claim 1, wherein the lenses have a side length of 29 to 31 microns.

3. The lenticular array of claim 2 wherein the lenses have a fill factor of 99% to 100%.