CN113703081A - Method for manufacturing micro-lens array structure - Google Patents
Method for manufacturing micro-lens array structure Download PDFInfo
- Publication number
- CN113703081A CN113703081A CN202110867524.0A CN202110867524A CN113703081A CN 113703081 A CN113703081 A CN 113703081A CN 202110867524 A CN202110867524 A CN 202110867524A CN 113703081 A CN113703081 A CN 113703081A
- Authority
- CN
- China
- Prior art keywords
- photoresist
- microlens array
- substrate
- imprinting
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 81
- 239000003292 glue Substances 0.000 claims abstract description 35
- 238000001259 photo etching Methods 0.000 claims abstract description 32
- 238000002844 melting Methods 0.000 claims abstract description 22
- 230000008018 melting Effects 0.000 claims abstract description 22
- 230000008569 process Effects 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims abstract description 13
- 230000003287 optical effect Effects 0.000 claims description 27
- 238000005530 etching Methods 0.000 claims description 14
- 238000013461 design Methods 0.000 claims description 13
- 238000001312 dry etching Methods 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 8
- 239000010453 quartz Substances 0.000 claims description 8
- 239000010980 sapphire Substances 0.000 claims description 8
- 229910052594 sapphire Inorganic materials 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000010992 reflux Methods 0.000 claims description 6
- 230000008859 change Effects 0.000 claims description 5
- 238000004528 spin coating Methods 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 5
- 238000000206 photolithography Methods 0.000 claims description 2
- 230000006872 improvement Effects 0.000 description 9
- 238000011161 development Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 6
- 238000003384 imaging method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000010923 batch production Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910015844 BCl3 Inorganic materials 0.000 description 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001127 nanoimprint lithography Methods 0.000 description 1
- 239000006089 photosensitive glass Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention relates to a method for manufacturing a micro-lens array structure, which comprises the following steps: step A: uniformly coating a layer of photoresist on the surface of a substrate to form a photoresist mask layer; and B: exposing and developing the photoresist mask layer to form a photoetching mask pattern structure; and C: carrying out hot melting on the photoetching mask pattern structure to enable the cylindrical photoresist column to form a spherical microlens shape structure, and continuing high-temperature curing to form a photoresist microlens array pattern on the surface of the substrate; step D: and using the photoresist microlens array pattern for imprinting a template, transferring the microlens array pattern to imprinting glue on a target substrate through a nano-imprinting process, and curing the imprinting glue, so that the target substrate and the imprinting glue form a non-contact microlens array structure. Through the arrangement, the problem that the mass production is not facilitated due to the fact that the existing micro-lens array structure is complex in manufacturing process, high in cost, uncontrollable in precision and poor in repeatability can be solved.
Description
Technical Field
The invention relates to the technical field of micro-lens array structures, in particular to a manufacturing method of a micro-lens array structure.
Background
Nowadays, miniaturization and intellectualization are the main trends in the development of modern instruments and devices, and the traditional optical elements cannot keep up with the development requirements due to the limitation of size and volume.
The size of the lens, which is one of the most important basic elements in an optical system, has an important influence on the volume of the whole optical system. The microlens array not only has basic functions of focusing, imaging and the like of the traditional lens, but also has very wide application in the fields of optical information processing, optical calculation, optical interconnection, optical data transmission and the like due to the advantages of small volume, light weight, low power consumption and the like.
The mainstream manufacturing methods of the microlens arrays at present include a photoresist thermal reflux method, a reactive ion beam etching method, a laser direct writing technical method, a photosensitive glass thermal forming method, a micro-jet printing method and the like. Such a method has complex process, expensive equipment, higher cost, uncontrollable precision, poor repeatability and the like, and is not beneficial to implementation of mass production.
Disclosure of Invention
In order to solve the above technical problems, an object of the present invention is to provide a method for manufacturing a microlens array structure, so as to solve the problem that the mass production is not facilitated due to the complex manufacturing process, high cost, uncontrollable precision and poor repeatability of the conventional microlens array structure.
In order to achieve one of the above objects, an embodiment of the present invention provides a method for manufacturing a microlens array structure, including:
step A: uniformly coating a layer of photoresist on the surface of a substrate to form a photoresist mask layer;
and B: exposing and developing the photoresist mask layer to form a photoetching mask pattern structure; the photoetching mask pattern structure comprises a plurality of cylindrical photoresist columns, and all the cylindrical photoresist columns are arranged in an array mode according to an optical design;
and C: carrying out hot melting on the photoetching mask pattern structure to enable the cylindrical photoresist column to form a spherical microlens shape structure, and continuing high-temperature curing to form a photoresist microlens array pattern on the surface of the substrate;
step D: and using the photoresist microlens array pattern for imprinting a template, transferring the microlens array pattern to imprinting glue on a target substrate through a nano-imprinting process, and curing the imprinting glue, so that the target substrate and the imprinting glue form a non-contact microlens array structure.
As a further improvement of an embodiment of the present invention, in step D, the type of the imprint glue matches with the optical performance specified by the optical design requirement of the product, and the imprint glue forms an imprint glue microlens array mask after being cured;
after step D, the method further comprises:
step E: and etching the target substrate with the imprinting glue microlens array mask, and copying the microlens array pattern onto the target substrate according to a ratio of 1:1 to form a contact type microlens array structure.
As a further improvement of an embodiment of the present invention, in step B, "all the cylindrical photoresist columns are arrayed according to an optical design" specifically includes:
all the cylindrical photoresist columns are arrayed or randomly arranged according to a preset period value; wherein, the number of the cylindrical photoresist columns in the same area is the same.
As a further improvement of an embodiment of the present invention, the period value ranges from 2 to 150 μm.
As a further improvement of an embodiment of the present invention, in step C, "thermally fusing the structure of the lithography mask pattern" specifically includes:
and placing the photoetching mask pattern structure in a hot plate or a high-temperature oven, and carrying out hot melting through a photoetching hot melting method to enable the pattern to have reflux change.
As a further improvement of an embodiment of the present invention, in step E, "etching the target substrate with the imprint resist microlens array mask" specifically includes:
and placing the target substrate with the imprinting glue microlens array mask into NLD dry etching equipment for etching.
As a further improvement of an embodiment of the present invention, the target substrate is a glass substrate, a quartz substrate, or a sapphire substrate.
As a further improvement of an embodiment of the present invention, before step a, the method further comprises:
step X1: and cleaning the substrate.
As a further improvement of an embodiment of the present invention, after step X1, the method further includes:
step X2: and carrying out surface tackifying treatment on the substrate.
As a further improvement of an embodiment of the present invention, in step a, "uniformly coating a layer of a specified photoresist on a surface of a substrate to form a photoresist mask layer" specifically includes:
and uniformly coating the photoresist on the surface of the substrate by adopting a spin coating or spraying mode, so that the thickness range of the photoresist mask layer is 0.8-35 mu m.
Compared with the prior art, the invention has the beneficial effects that:
in order to prepare the micro-lens array structure, firstly, a corresponding template is manufactured;
specifically, a photoresist is coated on a substrate to form a photoresist mask layer; forming a photoetching mask pattern structure after exposure and development, wherein the photoetching mask pattern structure is formed by arranging a plurality of cylindrical photoresist columns in an array manner; then, carrying out hot melting and high-temperature curing on the photoetching mask pattern structure to enable the cylindrical photoresist column to form a fixed spherical microlens shape structure, so that a photoresist microlens array pattern is formed on the surface of the substrate;
then, arranging a layer of imprinting glue on a target substrate to be processed, transferring the micro-lens array graph to the imprinting glue through an imprinting template, and processing to form a non-contact micro-lens array structure after the imprinting glue is cured;
therefore, after a photoetching mask pattern structure according to an optical design is formed on the surface of the substrate, microlens array patterns can be transferred to a target substrate and an imprinting adhesive in batches through an imprinting template and a nano-imprinting process, so that a non-contact type microlens array structure is formed; the manufacturing process is simple, the cost is low, the precision is controllable, the method is suitable for batch production, and the production efficiency can be effectively improved;
meanwhile, after the non-contact type micro-lens array structure is prepared, the non-contact type micro-lens array structure can be continuously processed and prepared to form a contact type micro-lens array structure, so that a second micro-lens array structure can be further obtained, the non-contact type micro-lens array structure is suitable for batch production, and the production efficiency is further improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments or the description of the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a flow chart of a method for fabricating a microlens array structure according to an embodiment of the invention;
FIG. 2 is a top view of a patterned structure of a photolithographic mask in an embodiment of the present invention;
FIG. 3 is a schematic flow chart of a process for fabricating two microlens array structures according to an embodiment of the present invention;
FIG. 4 is a flow chart of an overall fabrication process in one embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail and completely with reference to the following detailed description of the invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
As shown in fig. 1, an embodiment of the present invention provides a method for manufacturing a microlens array structure, including:
step A: uniformly coating a layer of photoresist on the surface of a substrate to form a photoresist mask layer;
and B: exposing and developing the photoresist mask layer to form a photoetching mask pattern structure; the photoetching mask pattern structure comprises a plurality of cylindrical photoresist columns, and all the cylindrical photoresist columns are arranged in an array mode according to an optical design;
and C: carrying out hot melting on the photoetching mask pattern structure to enable the cylindrical photoresist column to form a spherical microlens shape structure, and continuing high-temperature curing to form a photoresist microlens array pattern on the surface of the substrate;
step D: and using the photoresist microlens array pattern for imprinting a template, transferring the microlens array pattern to imprinting glue on a target substrate through a nano-imprinting process, and curing the imprinting glue, so that the target substrate and the imprinting glue form a non-contact microlens array structure.
In order to prepare the micro-lens array structure, firstly, a corresponding template is manufactured;
specifically, a photoresist is coated on a substrate to form a photoresist mask layer; forming a photoetching mask pattern structure after exposure and development, wherein the photoetching mask pattern structure is formed by arranging a plurality of cylindrical photoresist columns in an array manner (as shown in figure 2); then, carrying out hot melting and high-temperature curing on the photoetching mask pattern structure to enable the cylindrical photoresist column to form a fixed spherical microlens shape structure, so that a photoresist microlens array pattern is formed on the surface of the substrate;
then, arranging a layer of imprinting glue on a target substrate to be processed, transferring the micro-lens array graph to the imprinting glue through an imprinting template, and processing to form a non-contact micro-lens array structure after the imprinting glue is cured;
therefore, after a photoetching mask pattern structure according to an optical design is formed on the surface of the substrate, microlens array patterns can be transferred to a target substrate and an imprinting adhesive in batches through an imprinting template and a nano-imprinting process, so that a non-contact type microlens array structure is formed; the manufacturing process is simple, the cost is low, the precision is controllable, the method is suitable for batch production, and the production efficiency can be effectively improved;
meanwhile, after the non-contact type micro-lens array structure is prepared, the non-contact type micro-lens array structure can be continuously processed and prepared to form a contact type micro-lens array structure, so that a second micro-lens array structure can be further obtained, the non-contact type micro-lens array structure is suitable for batch production, and the production efficiency is further improved.
In the embodiment of the invention, the surface of the material is provided with a specific micro-lens structure pattern by special treatment (such as a photoresist hot melting method and plasma etching of glass, quartz, sapphire and the like). When the patterns of the structural units of the microlens array are different, such as cylindrical, square column, polygonal and the like, and the sizes of the structural units are different from hundred nanometers to micron, the optical effect and the application field can be changed along with the variation.
The micro-lens array with unit type structures of different sizes can be designed and prepared according to different optical application requirements.
In addition, in the step B, the photoetching hot melting method process can realize the preparation of micro-lens array structures in micron, submicron and even nanometer levels, and has wide technical resources and high application flexibility; of course, the microlens patterned mask can also be realized by laser direct writing or electron beam direct writing.
Furthermore, in the step D, the type of the stamping glue is matched with the optical performance specified by the optical design requirement of the product, and the stamping glue is solidified to form a stamping glue microlens array mask;
after step D, the method further comprises:
step E: and etching the target substrate with the imprinting glue microlens array mask, and copying the microlens array pattern onto the target substrate according to the ratio of 1:1 to form the contact type microlens array structure.
Further, in the step E, "etching the target substrate with the imprint resist microlens array mask" specifically includes:
and placing the target substrate with the imprinting glue microlens array mask into NLD dry etching equipment for etching.
In an actual process, after the non-contact type microlens array structure is prepared, the contact type microlens array structure can be formed by continuous processing.
Specifically, the substrate with the microlens array mask after nanoimprint lithography is placed into NLD dry etching equipment for etching, and the microlens array pattern can be realized by 1: 1-ratio is copied on a target substrate, and the preparation of the contact type micro-lens array structure can be completed after the step is finished.
Therefore, in the embodiment of the invention, the preparation of the non-contact type microlens array structure is realized by utilizing the photoetching hot melting method to prepare the microlens template and matching with the nanoimprint technology, and the nanoimprint microlens array structure can be copied to target substrates such as glass, quartz, sapphire and the like by matching with plasma etching, so that the advantages of simple process flow, high resolution, and controllable precision and cost can be realized.
Further, in step B, "all the cylindrical photoresist columns are arrayed according to an optical design" specifically includes:
all the cylindrical photoresist columns are arrayed or randomly arranged according to a preset period value; wherein, the number of the cylindrical photoresist columns in the same area is the same.
Furthermore, the period value range is 2-150 μm.
In actual process, the structure of the pattern of the lithography mask is formed by a certain number of repeated small units (cylindrical photoresist columns with diameter D and height H) which are distributed in a Pitch array or at random according to a certain period value.
The Random pattern and the Array pattern of the same Pitch have the same number of repeating small units in the same area. Pitch (post-abbreviated as P) is one of the main factors affecting the focusing and imaging of the microlens; preferably, the period value range disclosed by the embodiment of the invention is 2-150 μm.
Further, in the step C, "thermally fusing the pattern structure of the photomask" specifically includes:
and placing the photoetching mask pattern structure in a hot plate or a high-temperature oven, and carrying out hot melting through a photoetching hot melting method to enable the pattern to have reflux change.
In the actual process, after exposure and development of the photoresist mask layer, the photoresist mask layer can be placed in a hot plate or a high-temperature oven for hot melting, so that the pattern of the photoresist mask layer is subjected to reflux change to form a spherical micro-lens shape, and then the spherical micro-lens shape is cured at high temperature.
Further, the target substrate is a glass substrate or a quartz substrate or a sapphire substrate.
In the actual process, when the target substrate is made of glass or quartz, CF input into the NLD dry etching equipment4The gas flow range is 20-60 sccm, C4F8The gas flow is 10-40 sccm, O2The gas flow rate is 0-20 sccm, CF4/C4F8The gas input flow rate ratio is 30-75%, O2/C4F8The gas input flow rate ratio ranges from 0 to 15%.
The power of an upper electrode in the etching equipment is 300-1200W, the power of a lower electrode is 50-600W, the regulation and control range of internal pressure is 0.3-1 Pa, the regulation and control range of cooling temperature is 20-40 ℃, and the emphasis and control range of He gas pressure is 3T-5T.
When the target substrate is made of sapphire, the BCl input into the NLD dry etching equipment3The gas flow range is 50 sccm-120 sccm, CHF3The gas flow is 25 sccm-80 sccm, O2The gas flow is 0 sccm-20 sccm, CHF3/BCl3The gas input flow rate ratio is 30-75%, O2/CHF3The gas input flow rate ratio ranges from 0 to 15%.
The power of an upper electrode in the NLD dry etching equipment is 600-1300W, the power of a lower electrode is 200-600W, the regulation and control range of internal pressure is 0.3-1 Pa, the regulation and control range of cooling temperature is 30-40 ℃, and the emphasis and control range of He gas pressure is 3T-5T.
Further, before step a, the method further comprises:
step X1: and cleaning the substrate.
Further, after step X1, the method further includes:
step X2: and carrying out surface tackifying treatment on the substrate.
In an actual process, a substrate material is Schottky 263T optical glass, surface tackifying treatment (HMDS) is carried out after cleaning, then a layer of EPG562 type positive photoresist with the thickness of 3-10 microns is coated on the surface of the substrate, after a target pattern size is obtained through exposure and development, the substrate with the photoresist mask is placed on a hot plate with the temperature of 150-190 ℃ for hot melting for 3-10 min, after an ideal lens shape is formed, structural curing is carried out at the temperature of 200-230 ℃ for 20-40 min.
Further, in the step a, "uniformly coating a layer of specified photoresist on the surface of the substrate to form a photoresist mask layer" specifically includes:
and uniformly coating photoresist on the surface of the substrate by adopting a spin coating or spray coating mode, so that the thickness range of the photoresist mask layer is 0.8-35 mu m.
In the actual process, firstly, a photoresist mask layer is coated on the surface of a substrate, the coating is carried out by adopting a spin coating or spray coating mode, the thickness H of the photoresist mask layer is 0.8-35 mu m, the diameter D range of the cylindrical photoresist of the photoetching pattern after exposure and development is 0.75-60 mu m, the small unit pattern after hot melting is in a spherical lens shape, and the curvature radius R value of the microlens unit structure is one of main influence factors influencing focusing and imaging.
The formula for the radius of curvature R is R ═ ((D/2)2+H2) The curvature radius R ranges from 0.55 um to 30 um.
As shown in fig. 3, in the embodiment of the present invention, the microlens template prepared by the photolithography hot melt method is matched with the nanoimprint technology to realize the preparation of the non-contact microlens array structure, and the nanoimprint microlens array structure can also be copied to the target substrate of glass, quartz, sapphire, etc. by matching with the plasma etching, the advantages of clear and concise process flow, high resolution, controllable precision and cost can be realized, and the present invention is suitable for mass production and large-scale mass production.
As shown in fig. 4, in the embodiment of the present invention, the specific steps of manufacturing the microlens array structure are as follows:
the method comprises the following steps: cleaning the substrate;
step two: forming a specific photoresist mask structure pattern obtained by optical design on the surface of a substrate;
step three: placing the exposed and developed structural pattern in a hot plate or a high-temperature oven for hot melting to enable the pattern to be subjected to reflux change to form a spherical micro-lens shape, and then curing the spherical micro-lens shape at high temperature;
step four: applying the cured photoresist microlens array structure pattern to an imprinting template, and transferring the pattern on the imprinting adhesive with specific optical characteristics in batches in a nano-imprinting mode, wherein the preparation of a non-contact microlens array structure can be completed after the step is finished;
step five: and (3) placing the substrate with the micro-lens array mask after nano imprinting into NLD dry etching equipment for etching, wherein the micro-lens array pattern can realize the following steps: 1-ratio is copied on a target substrate, and the preparation of the contact type micro-lens array structure can be completed after the step is finished.
Wherein,
a) the photo-etching mask pattern mentioned in the second step is formed by a certain number of repeated small units (cylindrical photo-etching glue columns with diameter D and height H) which are distributed randomly or in a Pitch array according to a certain period value.
The Random pattern and the Array pattern of the same Pitch have the same number of repeating small units in the same area. Pitch (post-abbreviated as P) is one of the main influence factors influencing the focusing and imaging of the micro lens, and the disclosed period value range is 2-150 μm.
b) And step two, firstly coating a photoresist mask layer on the surface of the substrate, and coating by adopting a spin coating or spray coating mode, wherein the thickness H of the photoresist mask layer is 0.8-35 mu m, the diameter D range of the cylindrical photoresist of the exposed and developed photoetching pattern is 0.75-60 mu m, the small unit pattern after hot melting is in a spherical lens shape, and the curvature radius R value of the micro-lens unit structure is one of main influence factors influencing focusing and imaging.
The formula for the radius of curvature R is R ═ ((D/2)2+H2) The curvature radius R ranges from 0.55 um to 30 um.
c) The three-purpose substrate material is Schottky 263T optical glass, surface tackifying treatment (HMDS) is carried out after cleaning, then a layer of EPG562 type positive photoresist with the thickness of 3-10 microns is coated on the surface of the substrate, after a target pattern size is obtained through exposure and development, the substrate with the photoresist mask is placed on a hot plate with the temperature of 150-190 ℃ for hot melting for 3-10 min, after an ideal lens shape is formed, structural curing is carried out at the temperature of 200-230 ℃ of the hot plate, and the curing time is 20-40 min.
d) Fourthly, carrying out batch copying on the structure of the micro-lens array by using the micro-lens array template obtained by the photoetching hot melting method after the third step in a nano-imprinting mode, wherein the nano-imprinting photoresist is debugged and selected based on the specific optical performance of the optical design of the product;
e) when the substrate material mentioned in the fifth step is glass or quartz, CF input in the NLD dry etching equipment4The gas flow range is 20-60 sccm, C4F8The gas flow is 10-40 sccm, O2The gas flow rate is 0-20 sccm, CF4/C4F8The gas input flow rate ratio is 30-75%, O2/C4F8The gas input flow rate ratio ranges from 0 to 15%.
The power of an upper electrode in the etching equipment is 300-1200W, the power of a lower electrode is 50-600W, the regulation and control range of internal pressure is 0.3-1 Pa, the regulation and control range of cooling temperature is 20-40 ℃, and the emphasis and control range of He gas pressure is 3T-5T.
f) When the substrate material mentioned in the fifth step is sapphire, the BCl input into the NLD dry etching equipment3The gas flow range is 50 sccm-120 sccm, CHF3The gas flow is 25 sccm-80 sccm, O2The gas flow is 0 sccm-20 sccm, CHF3/BCl3The gas input flow rate ratio is 30-75%, O2/CHF3The gas input flow rate ratio ranges from 0 to 15%.
The power of an upper electrode in the NLD dry etching equipment is 600-1300W, the power of a lower electrode is 200-600W, the regulation and control range of internal pressure is 0.3-1 Pa, the regulation and control range of cooling temperature is 30-40 ℃, and the emphasis and control range of He gas pressure is 3T-5T.
In summary, in the present invention, the non-contact microlens array structure is obtained by using a photoresist hot-melt method with a simple process flow and easily controllable cost, and the microlens mask structure can be transferred to the contact microlens application of the target substrate by using a plasma etching method.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention and is not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are included in the scope of the present invention.
Claims (10)
1. A method for manufacturing a micro-lens array structure is characterized by comprising the following steps:
step A: uniformly coating a layer of photoresist on the surface of a substrate to form a photoresist mask layer;
and B: exposing and developing the photoresist mask layer to form a photoetching mask pattern structure; the photoetching mask pattern structure comprises a plurality of cylindrical photoresist columns, and all the cylindrical photoresist columns are arranged in an array mode according to an optical design;
and C: carrying out hot melting on the photoetching mask pattern structure to enable the cylindrical photoresist column to form a spherical microlens shape structure, and continuing high-temperature curing to form a photoresist microlens array pattern on the surface of the substrate;
step D: and using the photoresist microlens array pattern for imprinting a template, transferring the microlens array pattern to imprinting glue on a target substrate through a nano-imprinting process, and curing the imprinting glue, so that the target substrate and the imprinting glue form a non-contact microlens array structure.
2. The method for manufacturing the microlens array structure according to claim 1, wherein in step D, the type of the imprint glue is matched with the optical performance specified by the optical design requirement of the product, and the imprint glue forms an imprint glue microlens array mask after being cured;
after step D, the method further comprises:
step E: and etching the target substrate with the imprinting glue microlens array mask, and copying the microlens array pattern onto the target substrate according to a ratio of 1:1 to form a contact type microlens array structure.
3. The method for manufacturing a microlens array structure according to claim 1, wherein the step B of arranging all the cylindrical photoresist columns in an array according to an optical design specifically includes:
all the cylindrical photoresist columns are arrayed or randomly arranged according to a preset period value; wherein, the number of the cylindrical photoresist columns in the same area is the same.
4. The method of claim 3, wherein the period value is in a range of 2 to 150 μm.
5. The method for fabricating a microlens array structure according to claim 1, wherein the step C of "thermally fusing the photolithography mask pattern structure" specifically includes:
and placing the photoetching mask pattern structure in a hot plate or a high-temperature oven, and carrying out hot melting through a photoetching hot melting method to enable the pattern to have reflux change.
6. The method for manufacturing a microlens array structure according to claim 2, wherein in the step E, "etching the target substrate with the imprint glue microlens array mask" specifically includes:
and placing the target substrate with the imprinting glue microlens array mask into NLD dry etching equipment for etching.
7. The method of claim 6, wherein the target substrate is a glass substrate, a quartz substrate, or a sapphire substrate.
8. The method of claim 1, wherein before step a, the method further comprises:
step X1: and cleaning the substrate.
9. The method of claim 8, wherein after step X1, the method further comprises:
step X2: and carrying out surface tackifying treatment on the substrate.
10. The method for manufacturing a microlens array structure according to claim 1, wherein the step a of uniformly coating a layer of the specified photoresist on the surface of the substrate to form the photoresist mask layer specifically includes:
and uniformly coating the photoresist on the surface of the substrate by adopting a spin coating or spraying mode, so that the thickness range of the photoresist mask layer is 0.8-35 mu m.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110867524.0A CN113703081A (en) | 2021-07-30 | 2021-07-30 | Method for manufacturing micro-lens array structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110867524.0A CN113703081A (en) | 2021-07-30 | 2021-07-30 | Method for manufacturing micro-lens array structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN113703081A true CN113703081A (en) | 2021-11-26 |
Family
ID=78651188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110867524.0A Pending CN113703081A (en) | 2021-07-30 | 2021-07-30 | Method for manufacturing micro-lens array structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113703081A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114296161A (en) * | 2021-12-28 | 2022-04-08 | 华中科技大学 | Large-area-array three-dimensional spherical micro-lens array and preparation method thereof |
CN114879448A (en) * | 2022-04-11 | 2022-08-09 | 蓝思科技股份有限公司 | Graded frosting product and preparation method thereof |
CN115267953A (en) * | 2022-07-29 | 2022-11-01 | 深圳通感微电子有限公司 | Method for manufacturing microlens and microlens manufactured thereby |
CN115291307A (en) * | 2022-08-31 | 2022-11-04 | 广州市香港科大霍英东研究院 | Vision-based touch sensor manufacturing method and touch sensor |
CN115343788A (en) * | 2022-08-18 | 2022-11-15 | 上海交通大学 | Quartz microlens preparation method based on cyclic etching process and quartz microlens |
CN115356792A (en) * | 2022-06-27 | 2022-11-18 | 杭州海康微影传感科技有限公司 | Manufacturing method of optical lens wafer and manufacturing method of lens imaging module |
CN115421230A (en) * | 2022-09-30 | 2022-12-02 | 北京邮电大学 | Integrated micro lens with supporting structure and preparation method thereof |
CN116125570A (en) * | 2023-04-14 | 2023-05-16 | 福建福特科光电股份有限公司 | Preparation method of microlens array with gap mask |
CN116224476A (en) * | 2023-03-22 | 2023-06-06 | 苏州汉骅半导体有限公司 | Microlens array and method for manufacturing same |
CN116661240A (en) * | 2023-07-31 | 2023-08-29 | 无锡邑文电子科技有限公司 | Preparation method of super-surface lens with nano round platform polarization structure |
CN117254340A (en) * | 2022-08-30 | 2023-12-19 | 嘉兴微瑞光学有限公司 | Method for preparing laser component and laser |
CN117991420A (en) * | 2024-02-21 | 2024-05-07 | 湖北宜美特全息科技有限公司 | Projection type photoetching method of columnar micro-lens array |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103163575A (en) * | 2013-03-21 | 2013-06-19 | 广州中国科学院先进技术研究所 | Color microlens array and preparation method for same |
CN110333562A (en) * | 2019-05-30 | 2019-10-15 | 深圳通感微电子有限公司 | A method of making silicon lens |
CN111366996A (en) * | 2018-12-26 | 2020-07-03 | 江苏鲁汶仪器有限公司 | Method for preparing micro-lens array |
CN112034540A (en) * | 2020-09-24 | 2020-12-04 | 北京北方华创微电子装备有限公司 | Processing method of micro-convex lens array structure |
CN113178535A (en) * | 2021-04-23 | 2021-07-27 | 京东方科技集团股份有限公司 | Micro-lens structure, preparation method thereof and display device |
-
2021
- 2021-07-30 CN CN202110867524.0A patent/CN113703081A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103163575A (en) * | 2013-03-21 | 2013-06-19 | 广州中国科学院先进技术研究所 | Color microlens array and preparation method for same |
CN111366996A (en) * | 2018-12-26 | 2020-07-03 | 江苏鲁汶仪器有限公司 | Method for preparing micro-lens array |
CN110333562A (en) * | 2019-05-30 | 2019-10-15 | 深圳通感微电子有限公司 | A method of making silicon lens |
CN112034540A (en) * | 2020-09-24 | 2020-12-04 | 北京北方华创微电子装备有限公司 | Processing method of micro-convex lens array structure |
CN113178535A (en) * | 2021-04-23 | 2021-07-27 | 京东方科技集团股份有限公司 | Micro-lens structure, preparation method thereof and display device |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114296161A (en) * | 2021-12-28 | 2022-04-08 | 华中科技大学 | Large-area-array three-dimensional spherical micro-lens array and preparation method thereof |
CN114879448A (en) * | 2022-04-11 | 2022-08-09 | 蓝思科技股份有限公司 | Graded frosting product and preparation method thereof |
CN115356792A (en) * | 2022-06-27 | 2022-11-18 | 杭州海康微影传感科技有限公司 | Manufacturing method of optical lens wafer and manufacturing method of lens imaging module |
CN115356792B (en) * | 2022-06-27 | 2023-12-08 | 杭州海康微影传感科技有限公司 | Manufacturing method of optical lens wafer and manufacturing method of lens imaging module |
CN115267953A (en) * | 2022-07-29 | 2022-11-01 | 深圳通感微电子有限公司 | Method for manufacturing microlens and microlens manufactured thereby |
CN115343788A (en) * | 2022-08-18 | 2022-11-15 | 上海交通大学 | Quartz microlens preparation method based on cyclic etching process and quartz microlens |
CN115343788B (en) * | 2022-08-18 | 2024-03-15 | 上海交通大学 | Quartz micro-lens preparation method based on cyclic etching process and quartz micro-lens |
CN117254340A (en) * | 2022-08-30 | 2023-12-19 | 嘉兴微瑞光学有限公司 | Method for preparing laser component and laser |
CN117254340B (en) * | 2022-08-30 | 2024-04-30 | 嘉兴微瑞光学有限公司 | Method for preparing laser component and laser |
CN115291307A (en) * | 2022-08-31 | 2022-11-04 | 广州市香港科大霍英东研究院 | Vision-based touch sensor manufacturing method and touch sensor |
CN115421230A (en) * | 2022-09-30 | 2022-12-02 | 北京邮电大学 | Integrated micro lens with supporting structure and preparation method thereof |
CN115421230B (en) * | 2022-09-30 | 2023-10-27 | 北京邮电大学 | Integrated micro-lens with supporting structure and preparation method thereof |
CN116224476A (en) * | 2023-03-22 | 2023-06-06 | 苏州汉骅半导体有限公司 | Microlens array and method for manufacturing same |
CN116224476B (en) * | 2023-03-22 | 2024-03-08 | 苏州汉骅半导体有限公司 | Microlens array and method for manufacturing same |
CN116125570A (en) * | 2023-04-14 | 2023-05-16 | 福建福特科光电股份有限公司 | Preparation method of microlens array with gap mask |
CN116661240A (en) * | 2023-07-31 | 2023-08-29 | 无锡邑文电子科技有限公司 | Preparation method of super-surface lens with nano round platform polarization structure |
CN116661240B (en) * | 2023-07-31 | 2023-10-03 | 无锡邑文电子科技有限公司 | Preparation method of super-surface lens with nano round platform polarization structure |
CN117991420A (en) * | 2024-02-21 | 2024-05-07 | 湖北宜美特全息科技有限公司 | Projection type photoetching method of columnar micro-lens array |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN113703081A (en) | Method for manufacturing micro-lens array structure | |
JP3821069B2 (en) | Method for forming structure by transfer pattern | |
US20220276419A1 (en) | Manufacturing Method for Diffraction Grating Waveguide of Near-eye Display | |
CN101051184B (en) | Large-area micro-nano structure soft stamping method | |
CN110673238B (en) | Method for manufacturing micro-lens array | |
KR20040068694A (en) | Fabrication method of microlens array | |
WO2021103904A1 (en) | Micro-lens array manufacturing method | |
CN101144978A (en) | Method for forming microlens array structure | |
CN111736242A (en) | Method for preparing microlens array based on patterned hydrophobic layer | |
CN110824590A (en) | Preparation method of micro-lens array, preparation method of display device and display device | |
JP2006261265A (en) | Phase shifter optical element, manufacturing method thereof, and element obtained with the same method | |
JP3611613B2 (en) | Three-dimensional shape forming method, three-dimensional structure formed by the method, and press mold | |
JP4874496B2 (en) | Microlens manufacturing method | |
JPH06194502A (en) | Microlens and microlens array and their production | |
WO2022193107A1 (en) | Lens array and manufacturing method therefor | |
US7390531B2 (en) | Method for producing a tool which can be used to create surface structures in the sub-μm range | |
JP3726790B2 (en) | Manufacturing method of micro lens array | |
KR100561874B1 (en) | Fabrication method of microlens array | |
JPH11183706A (en) | Highly integrated optical element and its production | |
JPH1130711A (en) | Diffraction optical element and its manufacture, and optical equipment | |
CN113759451B (en) | Curved surface grating processing device and preparation method | |
CN117826286B (en) | Preparation method of array type cascade microlens group, array type exposure device and application | |
US20210373217A1 (en) | Fine pattern forming method, imprint mold manufacturing method, imprint mold, and optical device | |
JPH07104106A (en) | Production of aspherical microlens array | |
CN101598843B (en) | Mold insert and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 215000 floors 1 and 2, building 7C, Changshu advanced manufacturing science and Technology Park, No. 2 Jianye Road, Yushan high tech Zone, Changshu, Suzhou, Jiangsu Applicant after: SUZHOU GUANGDUO MICRO, NANO-DEVICE Co.,Ltd. Address before: 215000 Room 102, building 2, Kechuang Park, Changshu Economic and Technological Development Zone (No. 11, Sihai Road), Suzhou, Jiangsu Applicant before: SUZHOU GUANGDUO MICRO, NANO-DEVICE Co.,Ltd. |
|
CB02 | Change of applicant information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211126 |
|
RJ01 | Rejection of invention patent application after publication |