CN214592619U

CN214592619U - Ultrathin thick copper coil type high-heat-conduction temperature-equalizing plate

Info

Publication number: CN214592619U
Application number: CN202120769764.2U
Authority: CN
Inventors: 方大正; 姜荣; 洪培豪; 曾再兴; 李光伟; 曾山一
Original assignee: Uniflex Technology Jiangsu Ltd
Current assignee: Uniflex Technology Jiangsu Ltd
Priority date: 2021-04-15
Filing date: 2021-04-15
Publication date: 2021-11-02
Anticipated expiration: 2031-04-15

Abstract

The utility model discloses an ultra-thin thick copper coil type high heat conduction uniform temperature plate in the uniform temperature plate field, which comprises a substrate, wherein the upper surface of the substrate is provided with heat conduction pipes, a space is arranged between the heat conduction pipes, and a protective layer is filled between the outer surface of the heat conduction pipes and the upper surface of the substrate; the lower surface of base plate is located the heat source, and the heat carries out heat-conduction through the heat pipe on through base plate conduction to the heat pipe, and is quick with heat transfer to protective layer to with the air contact with the heat remove fast, leave the interval between the heat pipe, improve the performance of buckling, need not be in airtight space, also need not to use liquid (the no weeping risk), shaping in advance, reduction operation flow and reduction preparation difficulty degree, heat conduction, resistant nature such as buckling are excellent, the utility model discloses can be used to integrated circuit.

Description

Ultrathin thick copper coil type high-heat-conduction temperature-equalizing plate

Technical Field

The utility model relates to a temperature-uniforming plate.

Background

With the development of the packaging technology and the manufacturing process of the integrated circuit, the density of the internal circuit is increased and the internal circuit is miniaturized, so that the operation speed and the frequency of the electronic component are rapidly increased, however, when the miniaturized electronic component operates at a high-speed frequency, the problem that the heat generated by the component is greatly increased in a unit area, so that a heat source is more concentrated on a chip, is derived. The statistical result shows that the damage ratio of all electronic products caused by overheating is as high as 55%, and research indicates that the efficiency of the operation chip can be improved by 1-3% when the temperature is reduced by about 10 ℃, so that an effective heat dissipation design is required to solve the problem of over-concentrated heat source when the electronic component is operated, and the electronic equipment can be used for a long time with the reliability, stability and service life.

Therefore, in the prior art, a two-dimensional temperature equalizing plate is adopted to improve the heat conduction effect, a vacuum closed cavity with a capillary structure is arranged in the heat equalizing plate, the working fluid is quickly vaporized after absorbing heat and moves to a condensation area, and after exchanging heat with the outside, the working fluid is condensed into liquid state to flow back, so that the cycle is repeated.

However, the thickness of the existing temperature equalizing plate is at least more than 0.1mm, the thickness cannot be thinned, the manufacturing process is complicated, the mass production difficulty is high, the size cannot be miniaturized, the forming needs to be in a closed space, the risk of liquid leakage exists, and the bending performance is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high heat conduction samming board of ultra-thin thick copper coil formula does not need not also need not to use liquid (no weeping risk) in airtight space, and shaping in advance, reduction operation flow and reduction preparation difficulty degree, heat conduction, resistant nature such as buckling are excellent.

In order to achieve the above object, the utility model provides a high heat conduction samming board of ultra-thin thick copper coil type, which comprises a substrate, the upper surface of base plate is provided with the heat pipe, be provided with the interval between the heat pipe, it is provided with the protective layer to fill between the surface of heat pipe and the base plate upper surface.

Compared with the prior art, the beneficial effects of the utility model reside in that, the lower surface of base plate is located the heat source, and the heat carries out heat-conduction through the heat pipe on through base plate conduction to heat pipe, fast with heat transfer to protective layer to with the air contact with the heat fast scattered, leave the interval between the heat pipe, improve the performance of buckling, need not in airtight space, also need not to use liquid (no weeping risk), the preforming in advance, reduce the operation flow and reduce the preparation degree of difficulty, heat conduction, resistant nature such as buckling are excellent, the utility model discloses can be used for integrated circuit.

As the utility model discloses a further improvement, the heat pipe still sets up the lower surface at the base plate, it is provided with the heat-conducting layer to fill between the surface of heat pipe and the base plate lower surface, and the surface and the heat source contact of heat-conducting layer like this, heat from the heat-conducting layer heat pipe on heat-conducting layer transmission to the base plate lower surface, the heat pipe with heat from its lower part transmission base plate, again by the base plate with heat conduction to the heat pipe of its upper surface to with heat transfer to the protective layer, and finally with the air contact, come out heat transfer fast for thermal giving off.

As the utility model discloses a further improvement, the heat pipe runs through the base plate setting, and the heat need not through the base plate transmission like this, directly splices the heating capacity from the heat conduction to directly reach upper portion by the lower part of heat pipe, and finally distribute the air through the protective layer, from bottom to top, heat-conduction is more direct, further promotes heat transfer efficiency.

As a further improvement, the part of the heat pipe extending out of the substrate is arc-shaped, thus increasing the heat conduction area of the heat pipe and further improving the heat conduction efficiency.

As the utility model discloses a further improvement, the protective layer is glued for insulation protection, glues through insulation protection like this and plays insulation protection's effect to the temperature-uniforming plate, improves the safety in utilization of temperature-uniforming plate to can also ensure the whole flexibility of temperature-uniforming plate and resistant bending type.

As a further improvement, the heat-conducting layer is heat-conducting glue, improves the heat-conduction efficiency of temperature-uniforming plate through heat-conducting glue like this to can also ensure the whole flexibility and the resistant shape of buckling of temperature-uniforming plate.

As the utility model discloses a further improvement, interval between the heat pipe is not more than 0.2mm, improves the quantity of heat pipe on unit area like this, promotes heat conduction efficiency.

As a further improvement of the utility model, the heat pipe is the copper product, can utilize the characteristic of copper to further promote heat conductivity and resistant bendability like this.

Drawings

Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.

Fig. 2 is a schematic structural diagram of embodiment 2 of the present invention.

Fig. 3 is a schematic structural diagram of embodiment 3 of the present invention.

Wherein, 1 base plate, 2 heat pipes, 3 protective layers, 4 heat-conducting layers.

Detailed Description

The present invention will be further explained with reference to the accompanying drawings:

example 1

As shown in fig. 1, the ultrathin and thick copper coil type high thermal conductivity vapor chamber comprises a substrate 1, wherein heat pipes 2 are arranged on the upper surface of the substrate 1, a gap is formed between the heat pipes 2, and a protective layer 3 is filled between the outer surface of each heat pipe 2 and the upper surface of the substrate 1; the protective layer 3 is insulating protective glue; the part of the heat conducting pipe 2 extending out of the substrate 1 is arc-shaped; the distance between the heat conduction pipes 2 is not more than 0.2 mm; the heat conduction pipe 2 is made of copper.

In this embodiment, lower surface and the heat source contact through base plate 1 for the heat that the heat source gived off can pass through base plate 1 and transmit the heat pipe 2 that is in the copper product of base plate 1 upper surface, make the heat can give insulating protection glue through the quick conduction of heat pipe 2, and finally carry out the heat exchange with the air, quick heat with base plate 1 receipt distributes away, the heat transfer efficiency has been improved, effectively reduce the temperature of base plate 1, make electronic equipment keep its reliability under long-term the use, stability and life.

Example 2

As shown in fig. 2, the other structures of the ultra-thin thick copper coil type high thermal conductivity temperature equalizing plate are not changed, the heat conducting pipe 2 is further disposed on the lower surface of the substrate 1, a heat conducting layer 4 is filled between the outer surface of the heat conducting pipe 2 and the lower surface of the substrate 1, and the heat conducting layer 4 is made of heat conducting glue.

In this embodiment, the heat-conducting glue contacts with the heat source, and quick giving base plate 1 and heat pipe 2 with heat transfer, can be in the short time with the concentrated heat that the heat source sent spread for whole base plate 1 fast for the even being heated of base plate 1 lower surface, local high temperature's phenomenon can not appear, gives protective layer 3 with heat transfer fast by heat pipe 2 of base plate 1 upper surface again, realizes the heat exchange with the air, dispels the heat fast.

Example 3

As shown in fig. 3, the remaining structure of the ultra-thin thick copper coil type high thermal conductivity vapor chamber is not changed, the heat pipe 2 penetrates through the substrate 1, the portion of the heat pipe 2 extending out of the upper surface of the substrate 1 is covered with an insulating protective adhesive, and the portion of the heat pipe 2 extending out of the lower surface of the substrate 1 is covered with a thermal conductive adhesive.

In this embodiment, heat-conducting glue and heat source contact, quick give base plate 1 and heat pipe 2 with heat transfer, can be in the short time with the concentrated heat that the heat source sent spread for whole base plate 1 fast, make being heated of base plate 1 lower surface even, local high temperature's phenomenon can not appear, and heat pipe 2 runs through base plate 1, so the lower part of heat pipe 2 transmits the heat for upper portion fast, need not to transmit heat via base plate 1 again, heat conduction speed is faster, the heat transmits protective layer 3 via the upper portion of heat pipe 2, exchange heat with the air again, fast heat dissipation.

The utility model does not need to use liquid (without liquid leakage risk) in a closed space, and is formed in advance, thereby reducing the operation flow and the difficulty of manufacture; copper is used as a heat conduction material, has excellent properties of heat conduction, bending resistance and the like, and can be used as a heat conduction temperature equalization material; the interval of the heat conduction pipes 2 is controlled below 0.2mm, the width precision of the heat conduction pipes 2 is controlled within +/-0.05 mm, the thickness is controlled below 0.1mm, and the production efficiency is higher and more stable.

The present invention is not limited to the above embodiments, and based on the technical solutions of the present disclosure, those skilled in the art can make some substitutions and transformations to some technical features without creative labor according to the disclosed technical contents, and these substitutions and transformations are all within the protection scope of the present invention.

Claims

1. The utility model provides a high heat conduction samming board of ultra-thin thick copper coil type, includes the base plate, its characterized in that: the upper surface of base plate is provided with the heat pipe, be provided with the interval between the heat pipe, it is provided with the protective layer to fill between the surface of heat pipe and the base plate upper surface.

2. The ultra-thin thick copper coil type high thermal conductivity vapor chamber of claim 1, wherein: the heat conduction pipe is also arranged on the lower surface of the substrate, and a heat conduction layer is filled between the outer surface of the heat conduction pipe and the lower surface of the substrate.

3. The ultra-thin thick copper coil type high thermal conductivity vapor chamber of claim 2, wherein: the heat conduction pipe penetrates through the substrate.

4. The ultra-thin thick copper coil type high thermal conductivity vapor chamber of claim 3, wherein: the part of the heat conduction pipe, which extends out of the substrate, is arc-shaped.

5. The ultra-thin thick copper coil type high thermal conductivity vapor chamber of claim 4, wherein: the protective layer is made of insulating protective glue.

6. The ultra-thin thick copper coil type high thermal conductivity vapor chamber of claim 5, wherein: the heat conducting layer is made of heat conducting glue.

7. The coil type high heat-conducting uniform temperature plate of ultra-thin thick copper as claimed in any one of claims 1-6, wherein: the interval between the heat conduction pipes is not more than 0.2 mm.

8. The coil type high heat-conducting uniform temperature plate of ultra-thin thick copper as claimed in any one of claims 1-6, wherein: the heat conduction pipe is made of copper.