CN214583670U - Novel SMD pyroelectric infrared sensor - Google Patents

Abstract

A novel patch type pyroelectric infrared sensor relates to the technical field of infrared sensors. Wherein it comprises: the infrared filter comprises a tube cap and a substrate, wherein a window is arranged on the upper surface of the tube cap, and an infrared filter is embedded in the window; the substrate is assembled with the pipe cap, the pipe cap is provided with an accommodating space, and an infrared sensitive element and a signal processing part are packaged in the accommodating space; the infrared sensitive element and the signal processing part are both directly fixed on the substrate; be provided with the BGA ball on the base plate, BGA ball protrusion in base plate, and be connected with the base plate electricity, the BGA ball is used for realizing the external electrical connection of sensor and SMT paster automated production. The pyroelectric infrared sensor adopting the technical scheme has the advantages of simple structure, simple manufacturing and testing process equipment, SMT (surface mount technology) paster and reflow soldering automatic production process adopted in application and production, high efficiency, high cost and low cost, and can conveniently realize the performance characteristics of high integration level, high thermal stability and strong anti-electromagnetic interference capability.

Description

Novel SMD pyroelectric infrared sensor

Technical Field

The utility model relates to an infrared sensor technical field, concretely relates to novel SMD pyroelectric infrared sensor.

Background

A pyroelectric infrared sensor is a sensor for detecting infrared thermal radiation, which is made by using a material with good pyroelectric property as a core, and is mainly applied to detecting infrared rays of people and animals or other objects with thermal radiation so as to judge whether people or other animals exist in a certain space. The method is widely applied to the fields of induction type lighting, intrusion type alarming, security protection, intelligent home and the like.

The packaging type of the pyroelectric infrared sensor with mature technology on the market at present is mainly a direct-insertion type, the manufacturing and testing equipment of the direct-insertion type sensor is complex, the process is complex, the sensor is not beneficial to automatic operation during application, and the production efficiency is low and the cost is high. In the existing surface mount type infrared sensor with a small number of unique devices in the market, a sensor substrate is directly subjected to surface mount welding on an external control circuit board, and the heat of reflow soldering in the welding process is difficult to reach the central position of the surface mount, so that reflow soldering and insufficient soldering are easily caused; pipe

The single conductive adhesive is adopted for fixing, and the pipe cap is easy to loosen and even fall off after reflow soldering in a furnace, so that the air tightness and the quality of the sensor are seriously influenced; meanwhile, the existing patch type sensor substrate is directly exposed in a space electromagnetic environment and is easily subjected to electromagnetic interference so as to influence the performance of the sensor; in addition, the prior patch type sensor adopts the substrate directly and closely attached to the application plate, the heat on the application plate is easily conducted to the substrate of the sensor, and the pyroelectric infrared sensor is a sensing device which is extremely sensitive to the heat receiving quantity or temperature change, so the design easily influences the thermal stability of the sensor.

In summary, in order to overcome various disadvantages of the direct-insertion type sensor, the patch type sensor is an important direction, however, the above disadvantages of the very few patch type pyroelectric infrared sensors currently on the market also exist, and there is a need in the industry for a pyroelectric infrared sensor that can stably realize the SMT reflow soldering process for automatic production without loss or influence of inherent performance required by the pyroelectric infrared sensor.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects and shortcomings of the prior art, the first purpose of the utility model is to provide a novel patch type pyroelectric infrared sensor, which is beneficial to simplifying the sensor manufacturing and testing equipment procedures to reduce the sensor manufacturing cost, is beneficial to realizing the SMT patch automatic production to improve the efficiency and reduce the cost when the sensor is applied, simultaneously ensures the welding quality of the patch reflow soldering, and ensures that the air tightness performance of the sensor is not influenced after the reflow soldering; meanwhile, the material has obvious advantages in the aspects of thermal stability and anti-electromagnetic interference performance.

In order to achieve the above object, the utility model adopts the following technical scheme: a novel SMD pyroelectric infrared sensor comprises: the infrared filter comprises a tube cap and a substrate, wherein a window is arranged on the upper surface of the tube cap, and an infrared filter is embedded in the window; the substrate is assembled with the pipe cap, the pipe cap is provided with an accommodating space, and an infrared sensitive element and a signal processing part are packaged in the accommodating space; the infrared sensitive element and the signal processing part are both directly fixed on the substrate; be provided with the BGA ball on the base plate, BGA ball protrusion in the base plate, and with the base plate electricity is connected, the BGA ball is used for realizing the external electrical connection of sensor and SMT paster automated production.

Furthermore, the pipe cap and the substrate form a closed space, and the signal processing part and the infrared sensitive element are both packaged in the closed space.

Furthermore, the pyroelectric infrared sensor also comprises a bottom plate, and the bottom plate is fixedly arranged on the lower end face of the substrate.

Furthermore, the pyroelectric infrared sensor also comprises a bottom plate, a closed space is formed by the bottom plate and the pipe cap, and the signal processing part and the infrared sensitive element are both packaged in the closed space.

Furthermore, the pyroelectric infrared sensor also comprises a base, a closed space is formed by the base and the pipe cap, and the signal processing part and the infrared sensitive element are both packaged in the closed space; a sunken mounting groove is formed in one side, close to the pipe cap, of the base, and the substrate is mounted in the sunken mounting groove.

Furthermore, the pyroelectric infrared sensor also comprises a supporting component, wherein the supporting component is arranged between the infrared sensitive element and the substrate, the infrared sensitive element is fixed on the supporting component and is electrically connected, and the supporting component is fixed on the substrate and is electrically connected.

Further, the signal processing part can be a JFET or an intelligent integrated circuit or an MCU or an amplifier or an ADC device; the substrate is an epoxy resin PCB circuit board or a ceramic substrate; the shape of the substrate is any one of a circle, a rectangle or other polygons, and the epoxy resin PCB circuit board is a double-sided board or a multilayer board; the infrared sensitive elements are units or multiple units, and the number of the infrared sensitive elements is single or multiple; the pipe cap is round or rectangular in shape, the number of the windows on the upper surface of the pipe cap can be one or more, and the windows on the upper surface of the pipe cap can be round or rectangular in shape; the infrared filter is an infrared transmission filter, the filter base material can be silicon, germanium, gallium arsenide or infrared glass, and the filter can be silicon, germanium, gallium arsenide or infrared glass with the light-gathering optical characteristic.

Further, the bottom plate is a metal plate or a non-metal plate with a metal film layer plated on the surface; the bottom plate is circular or rectangular; be provided with the opening on the bottom plate, the opening supplies BGA ball holding, opening quantity is one or more.

Further, the base is a metal plate or a non-metal plate with a metal film layer plated on the surface; the base is round or rectangular; be provided with the opening on the base, the opening is located the bottom of sunken mounting groove, the opening supplies BGA ball holding.

Furthermore, the BGA ball can be a solder ball, a copper ball, a steel ball or an aspheric block or a column, the surface of the BGA ball is a solder which is easy to be coated with tin, and the BGA ball is a metal conductor or a nonconductor of which the surface is plated with a conductive layer; the quantity of the BGA balls is two or more.

Further, peripheral parts are arranged on the substrate, the peripheral parts are positioned inside and/or outside the pipe cap, and the peripheral parts at least comprise: any one or more of a power supply voltage stabilization chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode and a passive device; the passive device at least comprises any one or more of a resistor, a capacitor and an inductor; the peripheral parts are used for forming the high-integration and multifunctional integrated pyroelectric infrared sensor.

Furthermore, the bottom plate is a metal plate and is electrically connected with the metal plate, the bottom plate is a thickened bottom plate, the thickness of the thickened bottom plate is at least more than 1mm, and the thickened metal bottom plate is used for improving the overall heat capacity of the sensor so as to improve the thermal stability of the sensor; an opening is formed in the bottom plate and used for accommodating the BGA balls; the base plate is a multilayer PCB circuit board, grounding copper clad is arranged at the top and bottom of the circuit board except for a circuit, the circuit board can also be provided with metalized edge-clad copper clad and metalized open-slot copper clad, and the edge-clad and slotted metal copper are grounded, so that the circuit board is prevented or reduced from being exposed in a space electromagnetic environment, and the anti-electromagnetic interference performance of the sensor is improved.

After the technical scheme is adopted, the utility model discloses beneficial effect does:

1. the BGA balls are arranged on the mounting side of the sensor substrate, so that SMT (surface mount technology) chip automatic production is realized when the sensor is applied, the efficiency is improved, the cost is reduced, and the chip reflow soldering welding quality is ensured; meanwhile, due to the existence of the BGA balls, a gap exists between the sensor substrate and the application board where the sensor substrate is located, the contact area is small, the thermal resistance between the application board and the sensor substrate is greatly increased, heat on the application board is reduced to be conducted to the sensor substrate, the capacity of the sensor for resisting the temperature change of the space environment where the sensor is located is improved, and the thermal stability of the sensor is improved.

2. The metal bottom plate or the base is arranged on the substrate, so that the overall heat capacity of the sensor can be further improved, and the thermal stability of the sensor can be further improved; meanwhile, the sensor with the closed space formed by the metal bottom plate or the base almost achieves all-metal packaging, so that the sensor substrate is prevented from being exposed to the space electromagnetic environment, and the anti-electromagnetic interference performance of the sensor is improved.

3. The substrate adopts the metallization edge covering and metallization groove opening process, and further adopts the four-layer plate design, so that the size of the closed space where the sensitive element is positioned exposed in the space electromagnetic environment is reduced, the space electromagnetic wave is prevented from entering the closed space where the sensitive element is positioned, and the anti-electromagnetic interference performance of the sensor is improved.

4. The pyroelectric infrared sensor has the advantages that peripheral parts are arranged on the sensor substrate, and mainly comprise a power supply voltage stabilizing chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode, a passive device and the like, so that a specific function or a more systematic and complete function required by a customer can be conveniently formed, and the pyroelectric infrared sensor with high integration and multiple functions is integrated, for example, the pyroelectric infrared sensor with power supply voltage stabilization, light control, output signal drive control and analog or digital signal processing chip can be formed to form more intelligent functions, various functional systems and complete high integration integrated pyroelectric infrared sensors.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic view of the overall structure of embodiment 1;

FIG. 2 is a first exploded view of example 1;

FIG. 3 is a second exploded view of example 1;

FIG. 4 is a first structural view of a cap in example 1;

FIG. 5 is a second constitutional view of the cap of example 1;

FIG. 6 is an exploded view of example 2;

FIG. 7 is an exploded view of example 3;

FIG. 8 is a schematic view of the entire structure of embodiment 4;

FIG. 9 is an exploded view of example 5;

FIG. 10 is an exploded view of example 6;

FIG. 11 is an exploded view of a thermopile structure.

Description of reference numerals: 101. a window; 102. a recess mounting groove; 103. an installation port; 110. a pipe cap; 111. an annular encapsulation portion; 112. a raised portion; 120. a substrate; 130. an infrared filter; 140. An infrared-sensitive element; 150. a support member; 160. signal processing components; 170. a base; 180. A base plate; 190. BGA balls; 200. peripheral components; 210. a thermopile chip; 220. a thermistor; 230. copper plating is carried out on the ground; 240. metallization groove copper coating; 250. and (6) coating copper on the metalized edge.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment as required without making a contribution, but all the embodiments are protected by the patent law within the scope of the claims of the present invention.

Example 1:

the embodiment relates to a patch type pyroelectric infrared sensor, as shown in fig. 1 to 3, including: a cap 110 and a base plate 120. The upper surface of the cap 110 is provided with a window 101, and an infrared filter 130 is embedded on the window 101. The substrate 120 is assembled with the cap 110, and the cap 110 has a receiving space. The housing space encloses the infrared sensor 140 and the signal processing components 160. The infrared sensitive element 140 and the signal processing component 160 are both directly fixed on the substrate 120. The substrate 120 is provided with BGA balls 190, and the BGA balls 190 protrude from the substrate 120 and are electrically connected to the substrate 120. In this embodiment, the pyroelectric infrared sensor further includes a supporting member 150, the supporting member 150 is disposed between the infrared sensitive element 140 and the substrate 120, and the infrared sensitive element 140 is fixed on the substrate 120 by the supporting member 150.

Further, as shown in fig. 1 to 3, the pyroelectric infrared sensor further comprises a base 170, and the base 170 and the cap 110 form a closed space. The signal processing component 160 and the infrared sensitive element 140 are both packaged in a closed space. The base 170 is provided with a recess mounting groove 102 at a side close to the cap 110, and the substrate 120 is mounted in the recess mounting groove 102.

Preferably, as shown in fig. 1-3, the base 170 is a metal plate or a non-metal plate with a metal film layer plated on the surface; the shape of the base 170 is circular, rectangular or polygonal; the base 170 is provided with an opening at the bottom of the recess mounting groove 102.

Preferably, the cap 110 may have a circular, rectangular or polygonal shape. The window 101 on the upper surface of the cap 110 may be one, two or more, and the shape of the window 101 may be circular, rectangular or polygonal.

Preferably, the infrared filter 130 is an infrared-transmitting filter, and the filter substrate may be silicon, germanium, gallium arsenide, or other infrared glass. The filter shape may be circular, rectangular, polygonal. The filter may have optical characteristics of condensing light.

Preferably, the infrared sensitive element 140 is a single infrared sensitive element 140 or a plurality of infrared sensitive elements 140. The number of the infrared sensitive elements 140 is single, two or more. The signal processing component 160 may be a JFET, an amplifier, a MCU or an intelligent integrated circuit or an ADC device.

Note that, as shown in fig. 1 to 3, in the present embodiment, the cap 110 has a cylindrical shape. The window 101 is provided with one and has a rectangular shape. The infrared filter 130 is a rectangular sheet, and the substrate thereof is silicon. The infrared sensor 140 is a binary infrared sensor, and the number thereof is one. The signal processing components 160 are JFETs, amplifiers, MCUs, or smart integrated circuits or ADC devices. In this embodiment, the signal processing component 160 is an intelligent integrated circuit. The base 170 is a metal plate and has a circular shape. The substrate 120 is an epoxy PCB circuit board. In addition, the BGA balls 190 are solder balls, copper balls, steel balls or non-spherical blocks, columns, and in this embodiment, the BGA balls 190 are solder balls. The mounting opening 103 is a circular opening, and six circular openings are arranged corresponding to the BGA solder balls. The substrate 120 is fixedly mounted in the recess mounting groove 102, and the BGA balls pass through the circular opening and are electrically connected to the substrate 120, wherein the BGA is called a Ball Grid Array Package in Chinese.

Preferably, the substrate 120 is provided with a peripheral component 200, and the peripheral component 200 is located inside or outside the cap 110. The peripheral component part 200 includes at least: any one or more of a power supply voltage stabilization chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip and a passive device. The output signal control component comprises one or more of a triode, a field effect transistor, a controlled silicon and a relay, and the passive component at least comprises one or more of a resistor, a capacitor and an inductor.

Based on the above scheme, the embodiment further provides a packaging method, which is used for packaging the tube cap 110 of the novel patch type pyroelectric infrared sensor, and the pyroelectric infrared sensor includes: substrate 120, bottom plate 180 or base 170, infrared filter 130, cap 110, infrared sensor 140, BGA ball 190 and signal processing component 160; as shown in fig. 4 and 5, an annular enclosing portion 111 is disposed on a lower end surface of the cap 110, and one or more protruding portions 112 protrude from the annular enclosing portion 111, and the enclosing method includes the following steps:

s1, brushing or coating a conductive solder paste on the substrate by using a solder paste steel mesh, wherein the conductive solder paste is used for fixing the BGA ball 190 by soldering, or the BGA ball 190 and the bottom plate 180, or the BGA and the base 170;

s2, selecting to execute the step according to whether the structure of the pyroelectric infrared sensor has the bottom plate 180 or the base 170, if the pyroelectric infrared sensor has the structure of the bottom plate 180 or the base 170, using a step steel mesh brush or coating a fixing adhesive for mechanically sealing and fixing the bottom plate 180 or the base 170 on the substrate, wherein the fixing adhesive comprises irreversible or high-TG adhesives such as SMT (surface mount technology) electronic red adhesive, epoxy resin adhesive and the like, otherwise, executing the step S4;

s3, according to whether the pyroelectric infrared sensor structure has the bottom plate 180 or the base 170, the step is selected to be executed: if the pyroelectric infrared sensor has the structure of the base plate 180 or the pedestal 170, mounting the base plate 180 or the pedestal 170 on the substrate 120, otherwise, performing step S4;

s4, placing a tin net, and putting the BGA balls 190 on the substrate 120;

s5, taking down the tin net, putting the substrate 120 with the good BGA balls 190 into a reflow oven or special BGA ball welding equipment, and carrying out tin melting welding or solidifying and fixing an adhesive;

the packaging method further comprises the following steps:

s61, brushing or coating the steel mesh on the position of the cap 110 or the base plate 120 or the base plate 180 or the base plate 170 where the annular packaging part 111 of the cap 110 is overlapped with the substrate 120 or the base plate 180 or the base plate 170;

s71, brushing or coating conductive adhesive on the protrusion 112 of the cap 110 and the substrate 120 or the bottom plate 180 or the base 170, or dispensing the conductive adhesive, or directly proceeding without executing the step S71;

s81, covering the cap 110 with the base plate 120 or the bottom plate 180 or the base 170;

s91, baking and curing the sensors covered together, wherein the baking and curing can be performed by adopting an oven or a tunnel furnace tool;

s101, if the step S71 is not performed, performing the step: the protruding portion 112 of the cap 110 is subjected to energy storage resistance butt welding, laser welding, etc. to electrically connect the cap 110 and the substrate 120.

Or, the packaging method further comprises the following steps:

s62, brushing or coating a steel mesh on the position of the tube cap 110 or the substrate 120 or the bottom plate 180 or the base 170, which is overlapped with the substrate 120 or the bottom plate 180 or the base 170 by the annular packaging part 111 of the tube cap 110;

s72, adopting a step steel mesh brush or coating the above fixed adhesive or adopting a glue dispensing process point above fixed adhesive at the position of the tube cap 110 or the substrate 120 or the bottom plate 180 or the base 170 which is overlapped by the overlapping of the convex part 112 of the tube cap 110 and the substrate 120 or the bottom plate 180 or the base 170; or directly operates downward without performing step S72;

s82, covering the cap 110 with the base plate 120 or the bottom plate 180 or the base 170;

s92, baking and curing the sensors covered together, wherein the baking and curing can be performed by adopting an oven or a tunnel furnace tool;

s102, if the step S72 is not performed, then the step is performed: the protruding portion 112 of the cap 110 is processed by energy storage resistance butt welding, laser welding, etc. to enhance the mechanical connection strength between the cap 110 and the substrate 120.

Example 2:

the present embodiment is different from embodiment 1 in that, as shown in fig. 6, in the present embodiment, the base 170 is replaced with a bottom plate 180, and the bottom plate 180 is fixedly mounted on the lower end surface of the substrate 120. The base plate 180 is provided with openings in which BGA balls 190 are received.

Example 3:

the present embodiment is different from embodiment 1 mainly in that, as shown in fig. 7, the pyroelectric infrared sensor is not provided with the base 170 or the bottom plate 180. The cap 110 and the substrate 120 form a closed space, and the substrate 120 has a rectangular shape. The signal processing component 160 and the infrared sensitive element 140 are both packaged in a closed space.

Example 4:

the present embodiment is different from embodiment 3 mainly in that, as shown in fig. 8, in the present embodiment, the cap 110 and the substrate 120 form a closed space, and the signal processing component 160 and the infrared sensitive element 140 are both enclosed in the closed space. The substrate 120 is rectangular, and a bottom plate 180 is fixedly mounted on a lower end surface of the substrate 120, and the shape of the bottom plate 180 is the same as that of the substrate 120.

Example 5:

the present embodiment is different from embodiment 1 mainly in that, as shown in fig. 9, the base 170 is not provided, the cap 110 and the substrate 120 form a closed space, and the signal processing component 160 and the infrared sensitive element 140 are all enclosed in the closed space. The substrate 120 is further provided with a peripheral component 200, the peripheral component 200 is disposed in the inner and/or outer space of the cap 110, and the peripheral component 200 is used to form a highly integrated, multifunctional pyroelectric infrared sensor. Specifically, the peripheral component part 200 includes: any one or more of a power supply voltage stabilization chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode and a passive device. Wherein, output signal control components and parts include: any one or more of a triode, a field effect transistor, a thyristor and a relay. The passive device includes: any one or more of a resistor, a capacitor, and an inductor.

In this embodiment, the signal processing component 160 uses JFET, and adopts a structure with a support component 150, a cap 110 and a substrate 120 forming a closed space, the substrate 120 adopts a PCB, a resistance capacitor is added in the closed space of the cap 110, a power regulator, an analog signal processing chip, a photosensitive device and an output signal control device are added on the upper surface of the PCB outside the closed space of the cap 110, the power regulator, the analog signal processing chip, the photosensitive device and the output signal control device are selected from a field effect transistor and a resistance capacitor, and the resistance capacitor is added on the lower surface of the PCB outside the closed space of the cap 110.

Example 6:

the present embodiment is different from embodiment 1 mainly in that, as shown in fig. 10, in the present embodiment, the base 170 is replaced by a bottom plate 180, and the bottom plate 180 is fixedly mounted on the lower end surface of the substrate 120. The bottom plate 180 is a metal plate and is electrically connected to ground. The bottom plate 180 is a thickened plate with a thickness of at least 1 mm. The thickened metal plate is used for improving the integral hot melting of the sensor so as to improve the thermal stability of the sensor. An opening is formed in the bottom plate 180 for receiving the BGA balls 190.

Further, the substrate 120 is a PCB, and the top and the ground of the PCB are provided with grounding copper 230 except for the circuit.

Furthermore, the circuit board can also be provided with a metallized covered edge copper-clad layer 250 and a metallized open groove copper-clad layer 240, and the metal copper of the covered edge and the metal copper of the open groove are both grounded, so that the circuit board is prevented or reduced from being exposed in the space electromagnetic environment, and the anti-electromagnetic interference performance of the sensor is improved; the pyroelectric infrared sensor with high thermal stability and strong anti-electromagnetic interference performance is formed by the design.

Other examples are as follows:

the present embodiment is different from the above embodiments mainly in that, in the present embodiment, the above structure can also be used for other similar sensors such as thermopiles. Here, taking a thermopile as an example, as shown in fig. 11, the thermopile includes: cap 110, substrate 120, base plate 180 or mount 170, infrared filter 130, thermistor 220, thermopile chip 210, and BGA ball 190. Wherein the thermistor 220 and the thermopile chip 210 are mounted on the substrate 120 and electrically connected to the substrate 120.

The above description is only for the purpose of illustration and not limitation, and other modifications or equivalent replacements made by those skilled in the art to the technical solution of the present invention should be covered by the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims (11)

1. A novel SMD pyroelectric infrared sensor is characterized by comprising: the infrared light source comprises a tube cap (110) and a substrate (120), wherein a window (101) is arranged on the upper surface of the tube cap (110), and an infrared filter (130) is embedded in the window (101); the substrate (120) is assembled with the tube cap (110), and the tube cap (110) is provided with a containing space, and an infrared sensitive element (140) and a signal processing part (160) are packaged in the containing space; the infrared sensitive element (140) and the signal processing part (160) are both directly fixed on the substrate (120); be provided with BGA ball (190) on base plate (120), BGA ball (190) protrusion in base plate (120), and with base plate (120) electricity is connected, BGA ball (190) are used for realizing that the sensor is to outer electrical connection and SMT paster automated production.

2. The novel patch pyroelectric infrared sensor according to claim 1, wherein the cap (110) and the substrate (120) form a closed space, and the signal processing component (160) and the infrared sensitive element (140) are both encapsulated in the closed space.

3. The novel patch pyroelectric infrared sensor according to claim 2, wherein the pyroelectric infrared sensor further comprises a bottom plate (180), and the bottom plate (180) is fixedly mounted on the lower end surface of the substrate (120).

4. The novel patch pyroelectric infrared sensor according to claim 1, wherein the pyroelectric infrared sensor further comprises a bottom plate (180), the bottom plate (180) and the cap (110) form a closed space, and the signal processing component (160) and the infrared sensitive element (140) are both encapsulated in the closed space.

5. The novel patch pyroelectric infrared sensor according to claim 1, wherein the pyroelectric infrared sensor further comprises a base (170), the base (170) and the cap (110) form a closed space, and the signal processing component (160) and the infrared sensitive element (140) are both encapsulated in the closed space; a concave mounting groove (102) is formed in one side, close to the pipe cap (110), of the base (170), and the substrate (120) is mounted in the concave mounting groove (102).

6. The novel patch pyroelectric infrared sensor according to any one of claims 1 to 5, characterized in that the pyroelectric infrared sensor further comprises a support member (150), the support member (150) is disposed between the infrared sensitive element (140) and the substrate (120), the infrared sensitive element (140) is fixed on the support member (150) and electrically connected, and the support member (150) is fixed on the substrate (120) and electrically connected.

7. The novel patch pyroelectric infrared sensor according to claim 6, wherein the signal processing component (160) can be a JFET or intelligent integrated circuit or MCU or amplifier or ADC device; the substrate (120) is an epoxy resin PCB circuit board or a ceramic substrate (120); the substrate (120) is round or rectangular, and the epoxy resin PCB circuit board is a double-sided board or a multilayer board; the infrared sensitive elements (140) are unit or multi-element sensitive elements, and the number of the infrared sensitive elements (140) is single or multiple; the pipe cap (110) is circular or rectangular in shape, the number of the windows (101) on the upper surface of the pipe cap (110) can be one or more, and the shape of the windows (101) on the upper surface of the pipe cap (110) can be circular or rectangular; the infrared filter (130) is an infrared transmission filter, the filter base material can be silicon, germanium, gallium arsenide or infrared glass, and the filter can be silicon, germanium, gallium arsenide or infrared glass with light-gathering optical characteristics.

8. The novel patch pyroelectric infrared sensor according to claim 3 or 4, wherein the base plate (180) is a metal plate or a non-metal plate with a metal film layer on the surface; the bottom plate (180) is circular or rectangular in shape; the bottom plate (180) is provided with an opening, the BGA balls (190) are accommodated in the opening, and the number of the openings is one or more.

9. The novel patch pyroelectric infrared sensor according to claim 5, wherein the base (170) is a metal plate or a non-metal plate with a metal film layer on the surface; the base (170) is circular or rectangular in shape; the base (170) is provided with an opening, and the opening is positioned at the bottom of the concave mounting groove (102).

10. The novel patch pyroelectric infrared sensor as claimed in claim 6, wherein the BGA balls (190) can be solder balls, copper balls, steel balls or non-spherical blocks or columns, the surface of the BGA balls (190) is a solder which is easy to be soldered, the BGA balls (190) are metal conductors or non-conductors which are surface-plated with conductive layers, and the number of the BGA balls (190) is two or more.

11. The novel patch pyroelectric infrared sensor according to claim 7, wherein a peripheral component (200) is disposed on the substrate (120), the peripheral component (200) is located inside and/or outside the tube cap (110), and the peripheral component (200) at least comprises: any one or more of a power supply voltage stabilization chip, an output signal control component, a photosensitive component, an analog or digital signal processing chip, a diode, a triode and a passive device; wherein, output signal control components and parts include at least: any one or more of a triode, a field effect transistor, a thyristor and a relay, wherein the passive device at least comprises: any one or more of a resistor, a capacitor, and an inductor; the peripheral parts (200) are used for forming a high-integration and multifunctional integrated pyroelectric infrared sensor.

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