CN214519535U

CN214519535U - Grinding equipment is used in silicon chip polishing convenient to maintain

Info

Publication number: CN214519535U
Application number: CN202120140670.9U
Authority: CN
Inventors: 陈锋; 沈国君; 陆勇; 汪国平
Original assignee: Zhejiang Zhongjing Electronic Co ltd
Current assignee: Zhejiang Zhongjing Electronic Co ltd
Priority date: 2021-01-19
Filing date: 2021-01-19
Publication date: 2021-10-29
Anticipated expiration: 2031-01-19

Abstract

The utility model relates to a silicon chip processing technology field just discloses a silicon chip polishing is with grinding equipment convenient to maintain, comprising a main body, the front side fixedly connected with fixed column of main part, the fixed slot has been seted up to the inside of fixed column, the interior diapire of fixed slot is connected with fixing bearing, fixing bearing is connected with first gear through fixed nozzle stub, the internal thread connection of first gear has the screw rod. This grinding device is used in silicon chip polishing convenient to maintain, through the fixed column, fixing bearing, fixed nozzle stub, first gear, the screw rod, the apparatus further comprises a rotating shaft, the second gear, spacing post, hold the platform, the apparatus further comprises a rotating shaft, the dead lever, the fixed disk, vacuum suction nozzle, fixation nut, mutually support between communicating pipe and the miniature vacuum diaphragm pump, can inhale the silicon chip in the wandering star wheel through vacuum suction nozzle, reached and be convenient for follow the effect that the wandering star wheel was taken out with the silicon chip, when having solved in the wandering star wheel was arranged in to the silicon chip, the silicon chip at this moment is not convenient for carry out the problem of artifical unloading.

Description

Grinding equipment is used in silicon chip polishing convenient to maintain

Technical Field

The utility model relates to a silicon chip processing technology field specifically is a silicon chip polishing is with grinding device convenient to maintain.

Background

The silicon wafer polishing and grinding equipment is also called a silicon wafer double-sided grinding machine, mainly carries out double-sided grinding on a silicon wafer, when in work, an upper grinding disc and a lower grinding disc rotate in opposite directions, and a workpiece does revolution and rotation planetary motion in a carrier.

The silicon chip can be arranged in the wandering star wheel all the time in the grinding process, and after the grinding is finished, the silicon chip needs to be taken out from the wandering star wheel manually, but the thickness of the silicon chip is thinner, the side surface of the silicon chip is attached to the inner wall of the wandering star wheel tightly, scratches are easily caused on the surface of the silicon chip when the silicon chip is taken manually, and the quality of the silicon chip is influenced.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The not enough to prior art, the utility model provides a silicon chip polishing is with grinding equipment convenient to maintain possesses the advantage of being convenient for take out the silicon chip from the wandering star wheel, has solved when the silicon chip is arranged in the wandering star wheel, the inconvenient problem of artifical unloading.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: a grinding device convenient to maintain for polishing a silicon wafer comprises a main body, wherein a fixed column is fixedly connected to the front side of the main body, a fixed groove is formed in the fixed column, a fixed bearing is connected to the inner bottom wall of the fixed groove, the fixed bearing is connected with a first gear through a short fixed pipe, a screw rod is connected to the inner thread of the first gear, the side surface of the screw rod is movably connected with the inner portion of the fixed column, a rotating shaft is movably connected to the inner portion of the fixed column, a second gear and a handle are fixedly sleeved on the side surface of the rotating shaft, the first gear is meshed with the second gear, a fixed plate is fixedly sleeved on the side surface of the screw rod, a limiting column is fixedly connected to the bottom of the fixed plate, a limiting hole is formed in the fixed column, the side surface of the limiting column is movably connected with the inner portion of the limiting hole, and a holding table is fixedly connected to the right side of the fixed column, the utility model discloses a vacuum pump, including screw rod, fixed disk, vacuum nozzle, first pipe connection, communicating pipe, second pipe connection, the side surface swing joint of screw rod has the bull stick, the inside swing joint of bull stick has the dead lever, the fixed disk has been cup jointed to the side surface of dead lever, the internal connection of fixed disk has vacuum nozzle, vacuum nozzle's side surface threaded connection has fixation nut, vacuum nozzle's top has communicating pipe through first pipe connection, the communicating pipe has miniature vacuum diaphragm pump through second pipe connection.

Preferably, the side surface of the fixed short pipe is fixedly connected with the inside of the fixed bearing, and the bottom of the first gear is fixedly connected with the top end of the fixed short pipe.

Preferably, a through groove is formed in the inner top wall of the fixing groove, and the side surface of the screw is movably connected with the inside of the through groove.

Preferably, a first through hole is formed in the fixed disc, and the side surface of the fixed bar is fixedly connected with the inside of the first through hole.

Preferably, the fixed disk is internally provided with a second through hole, and the side surface of the vacuum suction nozzle is movably connected with the inside of the second through hole.

Preferably, the top of the communicating pipe is fixedly connected with a branch pipe, the inside of the branch pipe is fixedly connected with a sealing plate and a fixing frame, the inside of the fixing frame is in threaded connection with a threaded shaft, the bottom end of the threaded shaft is fixedly connected with a piston head, an exhaust groove is formed in the sealing plate, and the bottom of the piston head is abutted to the top of the sealing plate.

Compared with the prior art, the utility model provides a silicon chip polishing is with grinding device convenient to maintain possesses following beneficial effect:

1. this grinding device is used in silicon chip polishing convenient to maintain, through the fixed column, fixing bearing, fixed nozzle stub, first gear, the screw rod, the bull stick, the second gear, spacing post, hold the platform, the apparatus further comprises a rotating shaft, the dead lever, the fixed disk, vacuum suction nozzle, fixation nut, mutually support between communicating pipe and the miniature vacuum diaphragm pump, can inhale the silicon chip in the wandering star wheel through vacuum suction nozzle, reached and be convenient for follow the effect that takes out the silicon chip in the wandering star wheel, when having solved in the wandering star wheel is arranged in to the silicon chip, the silicon chip at this moment is not convenient for carry out the problem of artifical unloading.

2. This grinding device is used in silicon chip polishing convenient to maintain through mutually supporting between communicating pipe, branch pipe, closing plate, mount, threaded shaft and the piston head, can control the shaping and the dissipation of negative pressure in the communicating pipe through rotating the threaded shaft, has reached the effect of being convenient for control the shaping of vacuum negative pressure in the communicating pipe and dissipation, has solved if the vacuum negative pressure state in the communicating pipe is difficult to quick control and has adjusted, can influence the problem of vacuum suction nozzle normal operating.

Drawings

FIG. 1 is a partial cross-sectional view of the present invention;

FIG. 2 is an enlarged view of the point A in FIG. 1 according to the present invention;

FIG. 3 is an enlarged view of the point B in FIG. 1 according to the present invention;

fig. 4 is a schematic view of the structure of the fixing plate of the present invention.

Wherein: 1. a main body; 2. fixing a column; 3. fixing the bearing; 4. fixing the short pipe; 5. a first gear; 6. A screw; 7. a rotating shaft; 8. a second gear; 9. a limiting column; 10. a containing table; 11. a rotating rod; 12. fixing the rod; 13. fixing the disc; 14. a vacuum nozzle; 15. fixing a nut; 16. a communicating pipe; 17. a micro vacuum diaphragm pump; 18. pipe distribution; 19. a sealing plate; 20. a fixed mount; 21. a threaded shaft; 22. a piston head.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, a grinding apparatus for polishing a silicon wafer convenient for maintenance, includes a main body 1, the main body 1 is a double-sided grinder, and a grinding motion with four directions and speeds coordinated with each other is formed by an upper grinding disc, a lower grinding disc, a sun gear and a planetary gear during processing, thereby achieving a high-efficiency operation of simultaneously grinding the upper and lower surfaces of the silicon wafer, a fixed column 2 is fixedly connected to the front side of the main body 1, a fixed groove is formed inside the fixed column 2, a fixed bearing 3 is connected to the inner bottom wall of the fixed groove, a bearing groove is formed on the inner bottom wall of the fixed groove, the side surface of the fixed bearing 3 is fixedly connected to the inner wall of the bearing groove, the fixed bearing 3 is connected to a first gear 5 through a fixed short pipe 4, the side surface of the fixed short pipe 4 is fixedly connected to the inside of the fixed bearing 3, the bottom of the first gear 5 is fixedly connected to the top end of the fixed short pipe 4, the inside of the first gear 5 is communicated with the inside of the fixed short pipe 4, the inner thread of the first gear 5 is connected with a screw rod 6, the side surface of the screw rod 6 is movably connected with the inner wall of the fixed short pipe 4, the inner bottom wall of the bearing groove is provided with a rod groove, and the side surface of the screw rod 6 is movably connected with the inner wall of the rod groove.

The side surface of the screw rod 6 is movably connected with the inside of the fixed column 2, the inner top wall of the fixed groove is provided with a through groove, the side surface of the screw rod 6 is movably connected with the inside of the through groove, the inside of the fixed column 2 is movably connected with a rotating shaft 7, the side surface of the rotating shaft 7 is fixedly sleeved with a second gear 8 and a handle, the handle is positioned at the left side of the fixed column 2, the first gear 5 and the second gear 8 are bevel gears, the first gear 5 is meshed with the second gear 8, the side surface of the screw rod 6 is fixedly sleeved with a fixed plate, the bottom of the fixed plate is fixedly connected with a limit column 9, the inside of the fixed column 2 is provided with a limit hole, the side surface of the limit column 9 is movably connected with the inside of the limit hole, the right side of the fixed column 2 is fixedly connected with a containing platform 10, the side surface of the screw rod 6 is movably connected with a rotating rod 11, the rotating rod 11 can freely rotate but cannot move up and down, the inside of the rotating rod 11 is movably connected with a fixed rod 12, the side surface of the fixing rod 12 is in threaded connection with two locking nuts, the two locking nuts are respectively distributed on the upper side and the lower side of the fixing rod 12, the bottom of the upper locking nut abuts against the top of the fixing rod 12, the top of the lower locking nut abuts against the bottom of the fixing rod 12, the side surface of the fixing rod 12 is fixedly sleeved with the fixing disk 13, a first through hole is formed in the fixing disk 13, the side surface of the fixing rod 12 is fixedly connected with the inside of the first through hole, the inside of the fixing disk 13 is connected with the vacuum suction nozzle 14, and a second through hole is formed in the fixing disk 13.

The side surface of the vacuum suction nozzle 14 is movably connected with the inside of the second through hole, the number of the vacuum suction nozzles 14 is three, the vacuum suction nozzle is also called as a vacuum lifting appliance, the vacuum lifting appliance is one of vacuum equipment actuators, a vacuum suction cup is communicated with vacuum equipment through a connecting pipe during working, then is contacted with an object to be lifted, such as glass, paper and the like, the vacuum equipment is started to suck, negative air pressure is generated in the suction cup, the object to be lifted is firmly sucked, the object to be lifted can be conveyed, the side surface of the vacuum suction nozzle 14 is in threaded connection with two fixing nuts 15, the number of the fixing nuts 15 connected to each vacuum suction nozzle 14 is two, the fixing nuts 15 are respectively distributed on the upper side and the lower side of the fixed disk 13, the bottom of the upper fixing nut 15 is abutted against the top of the fixed disk 13, the top of the lower fixing nut 15 is abutted against the bottom of the fixed disk, the top of the vacuum suction nozzle 14 is connected with a communicating pipe 16 through a first conduit, the inside of the first conduit is communicated with the inside of the communicating pipe 16, the inside of first pipe and the inside intercommunication of vacuum suction nozzle 14, the inside of communicating pipe 16 and the inside intercommunication of second pipe, the top fixedly connected with of communicating pipe 16 is in charge of 18, the inside of in charge of 18 and the inside intercommunication of communicating pipe 16, the inside fixedly connected with closing plate 19 and the mount 20 of in charge of 18, the inside threaded connection of mount 20 has threaded shaft 21, the bottom fixedly connected with piston head 22 of threaded shaft 21, the exhaust duct has been seted up to the inside of closing plate 19.

The bottom of the piston head 22 is abutted against the top of the sealing plate 19, when the piston head 22 is abutted against the sealing plate 19, the piston head 22 can block the exhaust groove to prevent the air leakage of the communicating pipe 16, and through the mutual matching among the communicating pipe 16, the branch pipe 18, the sealing plate 19, the fixing frame 20, the threaded shaft 21 and the piston head 22, the forming and dissipation of the negative pressure in the communicating pipe 16 can be controlled by rotating the threaded shaft 21, so that the effect of conveniently controlling the forming and dissipation of the vacuum negative pressure in the communicating pipe 16 is achieved, the problem that the normal operation of the vacuum suction nozzle 14 is influenced if the vacuum negative pressure state in the communicating pipe 16 is difficult to control and adjust rapidly is solved, the communicating pipe 16 is connected with the micro vacuum diaphragm pump 17 through a second conduit, when the micro vacuum diaphragm pump 17 operates, the motor drives the machine to do circular motion, and the eccentric motion of the mechanical device drives the diaphragm in the pump to do reciprocating motion, thereby compressing the air in the pump cavity with fixed volume, forming positive pressure at the exhaust port during compression, forming negative pressure at the exhaust port during closing and stretching of the exhaust port, closing the exhaust port, pressure difference is generated between the position of the pumping air port and the external atmospheric pressure, and gas is pressed or sucked into the pump cavity under the action of the pressure difference and then is discharged from the air outlet, through the mutual matching among the fixed column 2, the fixed bearing 3, the fixed short pipe 4, the first gear 5, the screw 6, the rotating shaft 7, the second gear 8, the limit column 9, the containing platform 10, the rotating rod 11, the fixed rod 12, the fixed disk 13, the vacuum suction nozzle 14, the fixed nut 15, the communicating pipe 16 and the micro vacuum diaphragm pump 17, can inhale the silicon chip in the wandering star wheel through vacuum suction nozzle 14, reach the effect of being convenient for take out the silicon chip from the wandering star wheel, when having solved when the silicon chip was arranged in the wandering star wheel, the silicon chip at this moment was not convenient for carry out the problem of artifical unloading.

When the silicon wafer sucking device is used, the rotating rod 11 is rotated firstly, the vacuum suction nozzle 14 is placed right above a silicon wafer, then the handle is rotated anticlockwise, the screw rod 6 descends under the transmission of the first gear 5 and the second gear 8 until the bottom of the vacuum suction nozzle 14 is attached to the top of the silicon wafer, at the moment, the switch of the miniature vacuum diaphragm pump 17 is turned on, the diaphragm pump can completely pump out the air in the communicating pipe 16 and the vacuum suction nozzle 14, a negative pressure environment is formed in the communicating pipe 16 and the vacuum suction nozzle 14, so that the silicon wafer is sucked up by the vacuum suction nozzle 14, the handle is rotated clockwise, the vacuum suction nozzle 14 is driven to ascend together by the screw rod 6, then the rotating rod 11 is rotated, the silicon wafer is moved right above the containing platform 10, finally, the threaded shaft 21 is rotated anticlockwise, the threaded shaft is moved upwards, the piston head 22 is separated from the sealing plate 19, the negative pressure environment in the communicating pipe 16 and the vacuum suction nozzle 14 disappears, and the silicon wafer sucked up by the vacuum suction nozzle 14 falls on the containing platform under the action of gravity, so as to complete the unloading work of the silicon wafer.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A grinding device for polishing a silicon wafer convenient to maintain comprises a main body (1) and is characterized in that: the front side of the main body (1) is fixedly connected with a fixed column (2), a fixed groove is formed in the fixed column (2), a fixed bearing (3) is connected to the inner bottom wall of the fixed groove, the fixed bearing (3) is connected with a first gear (5) through a fixed short pipe (4), a screw rod (6) is connected to the inner thread of the first gear (5), the side surface of the screw rod (6) is movably connected with the inner part of the fixed column (2), a rotating shaft (7) is movably connected to the inner part of the fixed column (2), a second gear (8) and a handle are fixedly sleeved on the side surface of the rotating shaft (7), the first gear (5) is meshed with the second gear (8), a fixed plate is fixedly sleeved on the side surface of the screw rod (6), a limiting column (9) is fixedly connected to the bottom of the fixed plate, and a limiting hole is formed in the fixed column (2), the side surface of spacing post (9) and the inside swing joint in spacing hole, the right side fixedly connected with of fixed column (2) holds platform (10), the side surface swing joint of screw rod (6) has bull stick (11), the inside swing joint of bull stick (11) has dead lever (12), fixed disk (13) has been cup jointed to the side surface of dead lever (12) is fixed, the internal connection of fixed disk (13) has vacuum suction nozzle (14), the side surface threaded connection of vacuum suction nozzle (14) has fixation nut (15), the top of vacuum suction nozzle (14) has communicating pipe (16) through first pipe connection, communicating pipe (16) have miniature vacuum diaphragm pump (17) through second pipe connection.

2. The silicon wafer polishing grinding apparatus convenient to maintain as set forth in claim 1, wherein: the side surface of the fixed short pipe (4) is fixedly connected with the inside of the fixed bearing (3), and the bottom of the first gear (5) is fixedly connected with the top end of the fixed short pipe (4).

3. The silicon wafer polishing grinding apparatus convenient to maintain as set forth in claim 1, wherein: the inner top wall of the fixing groove is provided with a through groove, and the side surface of the screw rod (6) is movably connected with the inside of the through groove.

4. The silicon wafer polishing grinding apparatus convenient to maintain as set forth in claim 1, wherein: a first through hole is formed in the fixed disc (13), and the side surface of the fixed bar (12) is fixedly connected with the inside of the first through hole.

5. The silicon wafer polishing grinding apparatus convenient to maintain as set forth in claim 1, wherein: a second through hole is formed in the fixed disc (13), and the side surface of the vacuum suction nozzle (14) is movably connected with the inside of the second through hole.

6. The silicon wafer polishing grinding apparatus convenient to maintain as set forth in claim 1, wherein: the top of the communicating pipe (16) is fixedly connected with a branch pipe (18), the inside of the branch pipe (18) is fixedly connected with a sealing plate (19) and a fixing frame (20), the inside of the fixing frame (20) is in threaded connection with a threaded shaft (21), the bottom end of the threaded shaft (21) is fixedly connected with a piston head (22), an exhaust groove is formed in the sealing plate (19), and the bottom of the piston head (22) is abutted to the top of the sealing plate (19).