CN214505454U - SIC wafer surface machining dicing saw - Google Patents
SIC wafer surface machining dicing saw Download PDFInfo
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- CN214505454U CN214505454U CN202121135980.8U CN202121135980U CN214505454U CN 214505454 U CN214505454 U CN 214505454U CN 202121135980 U CN202121135980 U CN 202121135980U CN 214505454 U CN214505454 U CN 214505454U
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- 238000003754 machining Methods 0.000 title claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 70
- 235000012431 wafers Nutrition 0.000 claims description 83
- 239000011248 coating agent Substances 0.000 claims description 29
- 238000000576 coating method Methods 0.000 claims description 29
- 238000004140 cleaning Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 23
- 238000003698 laser cutting Methods 0.000 claims description 20
- 230000003993 interaction Effects 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 27
- 238000000034 method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000011084 recovery Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Abstract
The utility model relates to a wafer processing technology field discloses a SIC wafer surface machining scribing machine, and this wafer surface machining scribing machine is provided with the multilayer and stores the magazine of the number of piles and has scanning function's scanning platform, scans the magazine through scanning platform to confirm the number of piles that need carry out processing, still be provided with location camera and transparent processing platform in this wafer surface machining scribing machine simultaneously, this location camera is located transparent processing platform's below, see through transparent processing platform and take a candid photograph positive cutting path and cut the location. The utility model discloses an accurate perfect cutting also can be realized to narrower cutting way wafer to accurate locate mode and the functional configuration of optimizing, simultaneously the simple easy control of this invention process and operation, with low costs, weak point consuming time, machining efficiency is high, is applicable to very much in the actual production processing.
Description
Technical Field
The utility model relates to a wafer processing technology field especially relates to a SIC wafer surface machining scribing machine.
Background
With the advent of the information-oriented era, the industries such as electronic information, communication and semiconductor integrated circuits in China are rapidly developed, and China has become a world in which various semiconductor wafers of integrated circuits such as diode wafers, controllable wafers and the like are manufactured.
The conventional SIC wafer is usually diced by using a mechanical blade, which requires a wider dicing track and is prone to damage and loss of material, so that it is urgent to develop a high-precision dicing saw to solve the existing problems.
SUMMERY OF THE UTILITY MODEL
The invention of the utility model aims to: aiming at the existing problems, the invention provides the SIC wafer surface processing dicing saw which adopts an accurate positioning system and optimized functional configuration to realize accurate and perfect cutting on the wafer with the cutting channel.
The utility model discloses a technical scheme be like:
the utility model provides a SIC wafer surface machining wafer scriber, includes quick-witted case, quick-witted incasement portion is provided with the frame, still includes: the device comprises a material box, a scanning platform, a first clamping unit, a coating and cleaning unit, a second clamping unit, a third clamping unit, a transparent processing platform deck, a laser cutting system, a panoramic camera and a positioning camera;
the material box is placed on the scanning platform and is scanned by the scanning platform;
the scanning platform is movably arranged on the rack, so that the scanning platform can move up and down on the rack;
the first clamping unit, the second clamping unit and the third clamping unit are movably arranged on the rack;
the first clamping unit is used for taking the wafer out of the material box and conveying the wafer to the second clamping unit;
the second clamping unit is used for conveying the wafer taken out by the first clamping unit to the coating and cleaning unit for coating;
the third clamping unit is used for taking out the coated wafer from the coating and cleaning unit and conveying the coated wafer to the processing carrying platform for processing;
the machine frame is provided with a supporting platform, the supporting platform is formed by overlapping an upper supporting plate and a lower supporting plate, the transparent processing platform deck and the positioning camera are arranged on the lower supporting plate, and the laser cutting system and the panoramic camera are arranged on the upper supporting plate;
the laser cutting system and the panoramic camera are positioned on the front surface of the transparent processing carrying platform and are used for cutting the wafer;
the positioning camera is positioned on the back of the transparent processing carrying platform, and is used for accurately positioning the cutting position of the wafer when the wafer is processed.
Furthermore, a plurality of storage layers for placing the wafers are arranged in the material box.
Furthermore, the first clamping unit comprises a movable clamping jaw and a positioning track, the movable clamping jaw is movably mounted on the rack through a Y-direction linear moving module so as to move on the rack along the Y direction, and the positioning track is mounted on the rack and located below the second clamping unit; the movable clamping jaw clamps the wafer from the material box through the Y-direction linear moving module, then places the wafer on the positioning rail, and the positioning rail is matched with the movable clamping jaw to position the wafer so that the second clamping unit can accurately place the wafer into the coating and cleaning unit.
Further, the second clamping unit comprises a first manipulator and a first YZ-direction linear movement module, and the first manipulator is movably mounted on the frame through the first YZ-direction linear movement module and can move on the frame in the Y direction and the Z direction.
Further, the third clamping unit comprises a second manipulator and a second YZ-direction linear moving module, and the second manipulator is movably mounted on the rack through the second YZ-direction linear moving module and can move on the rack along the Y direction and the Z direction.
The first mechanical arm and the second mechanical arm are arranged on the branches of the rack in a staggered mode, coating and cleaning recovery are guaranteed to be conducted separately, and mutual interference is avoided, so that the working efficiency is improved.
Further, the transparent processing carrying platform is movably mounted on the supporting platform through an XY direction linear motor module, so that the transparent processing carrying platform can move on the supporting platform along the X direction and the Y direction, and a rotating motor which can rotate the transparent processing carrying platform is further mounted below the transparent processing carrying platform.
Furthermore, the system also comprises an industrial personal computer unit and a human-computer interaction unit; the scanning platform, the first clamping unit, the coating and cleaning unit, the second clamping unit, the third clamping unit, the processing carrier, the laser cutting system and the positioning camera are all electrically connected to the industrial personal computer unit, and the industrial personal computer unit controls the scanning platform, the first clamping unit, the coating and cleaning unit, the second clamping unit, the third clamping unit, the processing carrier, the laser cutting system and the positioning camera to operate; and the man-machine interaction unit is connected with the industrial personal computer unit to realize man-machine interaction.
Further, the laser cutting system comprises a laser, a light path box and a cutting head consisting of a lens, wherein the laser and the light path box are arranged above the upper support plate, and the cutting head is arranged below the upper support plate.
Furthermore, the Z direction linear movement module is provided with a relay, and the relay controls an enabling switch of a Z direction linear movement module motor.
To sum up, owing to adopted above-mentioned technical scheme, the beneficial effects of the utility model are that:
a. the intelligent scanning platform can accurately scan out materials on each layer of the material box or no materials, and the system can store and memorize the materials and selectively process the materials; the scanning speed is not lower than 5 mm/s;
b. a relay is arranged to ensure that the scanning platform does not drop at the moment of power-on;
c. the double manipulators realize that coating and feeding cleaning recovery are mutually separated before processing without interference, thereby improving the processing efficiency;
d. the equipment can be compatible with 4-inch and 6-inch wafer processing at the same time;
e. the positioning camera can shoot the front cutting channel through the transparent processing carrying platform to perform cutting positioning.
Drawings
Fig. 1 is a right side view of a SIC wafer surface processing dicing saw provided in this embodiment.
Fig. 2 is a front view of a SIC wafer surface processing dicing saw provided in this embodiment.
Fig. 3 is a left test chart of a SIC wafer surface processing dicing saw provided in this embodiment.
Fig. 4 is a top view of a SIC wafer surface processing dicing saw provided in this embodiment.
Fig. 5 is a top view of the first clamping unit of the SIC wafer surface processing dicing saw provided in this embodiment.
Description of the drawings: 1 is a frame, 2 is a magazine, 3 is a scanning platform, 4 is a movable clamping jaw, 5 is a coating and cleaning unit, 6 is a first manipulator, 7 is a second manipulator, 8 is a transparent processing platform, 9 is a cutting head, 10 is a panoramic camera, 11 is a positioning camera, 12 is a lower layer supporting plate, 13 is an upper layer supporting plate, 14 is an optical path box, 15 is a laser, 16 is a Z-direction linear moving module of the scanning platform, 17 is a Y-direction linear moving module of the movable clamping jaw, 18 is an X-direction linear motor of the transparent processing platform, 19 is a Y-direction linear motor of the transparent processing platform, 20 is a rotating motor, and 21 is a positioning track.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
It should be noted that, in the present invention, the embodiments and features of the embodiments may be combined with each other without conflict.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that the indication of the position or the positional relationship is based on the position or the positional relationship shown in the drawings, or the position or the positional relationship that the utility model is usually placed when using, or the position or the positional relationship that the skilled person conventionally understands, or the position or the positional relationship that the utility model is usually placed when using, and is only for the convenience of describing the present invention and simplifying the description, but does not indicate or suggest that the indicated device or element must have a specific position, be constructed and operated in a specific position, and thus, cannot be understood as limiting the present invention. Furthermore, the terms "first" and "second" are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be further noted that unless otherwise explicitly stated or limited, the terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases for a person of ordinary skill in the art; the drawings in the embodiments are provided to clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Example 1
As shown in fig. 1-4, the present embodiment provides a SIC wafer surface processing dicing saw, which includes a chassis, a frame, a magazine, a scanning platform, a first clamping unit, a coating and cleaning unit, a second clamping unit, a third clamping unit, a transparent processing stage, a laser cutting system, a panoramic camera, a positioning camera, an industrial personal computer unit, and a human-computer interaction unit.
For convenience of understanding, in the present embodiment, an XYZ coordinate axis is defined, a surface on which a wafer is processed is used as a reference surface, an XY axis coordinate system is established on the surface, and a direction perpendicular to the surface is used as a Z axis of the coordinate system.
The rack is arranged in the case, and the case wraps the rack completely; the material box is placed on the scanning platform, so that the scanning platform can scan the material box conveniently; the scanning platform is arranged on the frame through the Z-direction linear moving module, so that the scanning platform can move up and down on the frame.
The first clamping unit, the second clamping unit and the third clamping unit are movably mounted on the frame, transmission in the wafer machining process is achieved through the first clamping unit, the second clamping unit and the third clamping unit, and the coating cleaning unit is arranged below the second clamping unit and the third clamping unit and used for coating and cleaning the wafer.
A support platform is arranged on the frame and formed by lapping an upper support plate and a lower support plate, a transparent processing platform deck and a positioning camera are arranged on the lower support plate, and a laser cutting system and a panoramic camera are arranged on the upper support plate; the laser cutting system and the panoramic camera are positioned on the front side of the transparent processing platform deck and are used for cutting the wafer; and the positioning camera is positioned on the back of the transparent processing carrying platform, and is used for accurately positioning the cutting position of the wafer during wafer processing.
The scanning platform, first press from both sides the unit, the coating cleaning unit, the unit is got to the second clamp, the unit is got to the third clamp, transparent processing microscope carrier, the laser cutting system, panoramic camera and location camera etc. all connect on industrial computer unit through the mode of electricity connection, press from both sides the unit by industrial computer unit control scanning platform, first clamp is got the unit, the coating cleaning unit, the unit is got to the second clamp, the unit is got to the third clamp, transparent processing microscope carrier, the laser cutting system, units such as panoramic camera and location camera operate, and human-computer interaction unit is connected with industrial computer unit, control personnel's accessible human-computer interaction unit realizes the operation to whole scribing machine.
Specifically, in this embodiment, the inside multilayer that is provided with of magazine stores the layer, and scanning platform can accurately scan the storage condition of each layer of ejection of compact box when scanning the magazine to information record storage, and scanning platform's scanning speed is not less than 5 mm/second, and when processing, industrial computer unit can be according to the information selectivity processing under the scanning record, and the number of piles that does not store the wafer will be skipped automatically.
Specifically, in this embodiment, as shown in fig. 5, the first clamping unit includes a movable clamping jaw and a positioning rail, the movable clamping jaw is movably mounted on the frame through the Y-direction linear moving module so as to be movable on the frame along the Y-direction, and the positioning rail is mounted on the frame and located below the second clamping unit; when the magazine finishes scanning and the number of magazine layers where wafers to be processed are located is determined, the scanning platform moves up and down through the Z-direction linear moving module of the scanning platform, so that the magazine layers to be processed and the movable clamping jaws are located on the same horizontal plane, and the movable clamping jaws are convenient to clamp the wafers; the movable clamping jaws take the wafer out of the material box under the coordination of the Y-direction linear moving module and place the wafer on the positioning rail, and the wafer is clamped and positioned by the positioning rail.
The positioning rail in the embodiment has the functions of opening and tightening, and mainly comprises two rails which are movably arranged on the frame, so that the two rails can be close to or far away from each other.
Specifically, in this embodiment, the second clamping unit includes a first manipulator and a first YZ-direction linear movement module, and the first manipulator is movably mounted on the frame through the first YZ-direction linear movement module; the first manipulator moves to the upper side of the positioning rail through the first YZ direction linear moving module, grabs the wafer placed on the positioning rail, and then the wafer is placed in the coating and cleaning unit for coating.
Specifically, in this embodiment, the third clamping unit includes a second manipulator and a second YZ-direction linear movement module, and the second manipulator is mounted on the frame through the second YZ-direction linear movement module; and the second manipulator grabs the coated wafer from the coating and cleaning unit through the second YZ direction linear moving module and conveys the coated wafer to the moved transparent processing carrying platform for processing.
The first mechanical arm and the second mechanical arm are provided with small suckers for adsorbing wafers; the first mechanical arm and the second mechanical arm are arranged on the rack in a staggered mode in space, so that coating and cleaning recovery can be carried out separately and are not interfered with each other, and the working efficiency is improved.
Specifically, in this embodiment, the transparent processing platform is movably mounted on the lower support plate of the support platform through an XY-direction linear motor module, so that the transparent processing platform can move on the support plate along the X direction and the Y direction, wherein the XY-direction linear motor module is formed by combining linear motors in the X direction and the Y direction; the transparent processing platform conveys the coated wafer to a position between a laser cutting system and a positioning camera through the XY direction linear motor module for positioning and cutting, and after the cutting is finished, the wafer is returned to be cleaned through the XY direction linear motor module; meanwhile, a rotating motor capable of rotating the transparent processing carrying platform is further installed below the transparent processing carrying platform, and the rotating motor can enable the transparent processing carrying platform to automatically rotate to carry out cutting positioning calibration.
Specifically, in this embodiment, the relay is installed to Z direction rectilinear movement module, through relay control the enable switch of Z direction rectilinear movement module motor.
Specifically, in this embodiment, the support platform is made of marble.
Specifically, the Z-direction linear moving module in this embodiment is a module that is composed of a common servo motor through a screw rod and a slider and can be lifted up and down in the Z direction; the Y-direction moving module is a module which is composed of a common servo motor through a screw rod and a sliding block and can move in the Y direction; the YZ direction moving module is formed by combining a Y direction moving module and a Z direction moving module, wherein the Y direction moving module in the YZ direction moving module is a movable module formed by an air cylinder, and the Z direction moving module in the YZ direction moving module is a module which is formed by a common servo motor through a screw rod and a sliding block and can be lifted up and down in the Z direction.
The working process of the SIC wafer surface processing dicing saw provided by the embodiment is as follows:
step 1: opening a computer unit of an industrial personal computer, and initializing the whole SIC wafer surface scribing machine;
step 2: loading the wafer into a material box;
and step 3: placing the material box on a scanning platform, scanning the material box, confirming the number of layers of the material box to be cut, and recording and storing;
and 4, step 4: calling a corresponding product cutting parameter file through an industrial personal computer unit, and starting processing;
and 5: the scanning platform is lowered to the side of the movable clamping jaw, the movable clamping jaw clamps a wafer to be processed from the material box and conveys the wafer to the positioning rail, the positioning rail fixes and positions the wafer, and the first mechanical arm moves to the position above the positioning rail and grabs the wafer to the coating and cleaning unit for coating;
step 6: the coating cleaning unit coats the wafer, the wafer is taken out through the second mechanical arm after coating is finished, the wafer is conveyed to the moved transparent processing carrying platform, and the transparent processing carrying platform moves to the middle of the positioning camera and the laser cutting system to prepare for cutting after receiving the coated wafer;
and 7: the positioning camera automatically grabs a cutting channel of the wafer through the transparent processing platform deck, and then the laser cutting system starts cutting after confirming the cutting channel;
and 8: after the cutting is completed, the machining carrying platform moves to the position below the first mechanical arm, the cut wafer is conveyed to the coating cleaning unit through the first mechanical arm to be cleaned, and after the cleaning is completed, the wafer is taken out through the first mechanical arm and conveyed to the positioning rail, and finally the wafer is recovered to the material box through the movable clamping jaw.
In this embodiment, since the positioning camera is installed below the transparent processing stage and is not located at the same position as the cutting head of the laser cutting system, it is inconvenient for the laser cutting system to determine coordinates of the cutting head during debugging, so that a cross line can be formed on the same wafer during cutting, and coordinates of the cutting head can be indirectly obtained by using relative coordinates of a coordinate point of the cross line and a central coordinate point of the positioning camera.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a SIC wafer surface machining wafer scriber, includes quick-witted case, quick-witted incasement portion is provided with the frame, its characterized in that still includes: the device comprises a material box, a scanning platform, a first clamping unit, a coating and cleaning unit, a second clamping unit, a third clamping unit, a transparent processing platform deck, a laser cutting system, a panoramic camera and a positioning camera;
the material box is placed on the scanning platform and is scanned by the scanning platform;
the scanning platform is movably arranged on the rack, so that the scanning platform can move up and down on the rack;
the first clamping unit, the second clamping unit and the third clamping unit are movably arranged on the rack;
the first clamping unit is used for taking the wafer out of the material box and conveying the wafer to the second clamping unit;
the second clamping unit is used for conveying the wafer taken out by the first clamping unit to the coating and cleaning unit for coating;
the third clamping unit is used for taking out the coated wafer from the coating and cleaning unit and conveying the coated wafer to the transparent processing carrying platform for processing;
the machine frame is provided with a supporting platform, the supporting platform is formed by overlapping an upper supporting plate and a lower supporting plate, the transparent processing platform deck and the positioning camera are arranged on the lower supporting plate, and the laser cutting system and the panoramic camera are arranged on the upper supporting plate;
the laser cutting system and the panoramic camera are positioned on the front side of the transparent processing carrying platform, and the positioning camera is positioned on the back side of the transparent processing carrying platform.
2. The SIC wafer surface processing dicing saw of claim 1, wherein a plurality of storage layers for storing wafers are provided inside the magazine.
3. The SIC wafer surface processing dicing saw of claim 1, wherein the first clamping unit comprises a movable clamping jaw movably mounted on the frame by a Y-direction linear movement module, and a positioning rail mounted on the frame below the second clamping unit.
4. The SIC wafer surface processing dicing saw of claim 1, wherein the second clamping unit comprises a first robot and a first YZ direction linear movement module, and the first robot is movably mounted on the frame through the first YZ direction linear movement module.
5. The SIC wafer surface processing dicing saw of claim 1, wherein the third clamping unit comprises a second robot and a second YZ direction linear movement module, and the second robot is movably mounted on the frame through the second YZ direction linear movement module.
6. The SIC wafer surface machining dicing saw of claim 1, wherein the transparent machining stage is movably mounted on the support platform by an XY direction linear motor module, and a rotating motor for rotating the transparent machining stage is further mounted below the transparent machining stage.
7. The SIC wafer surface processing dicing saw of claim 1, further comprising an industrial personal computer unit and a human-computer interaction unit; the scanning platform, the first clamping unit, the coating cleaning unit, the second clamping unit, the third clamping unit, the transparent processing carrying platform, the laser cutting system, the panoramic camera and the positioning camera are all connected to the industrial personal computer unit in an electrically connected mode, and the human-computer interaction unit is connected with the industrial personal computer unit to achieve human-computer interaction.
8. The SIC wafer surface machining dicing saw of claim 1, wherein the laser dicing system comprises a laser, an optical path box, and a dicing head consisting of a lens, the laser and optical path box being mounted above the upper support plate, the dicing head being mounted below the upper support plate.
9. The SIC wafer surface processing dicing saw of claim 1, wherein the scanning platform is movably mounted on the frame by a Z-direction linear motion module.
10. The SIC wafer surface processing dicing saw of claim 9, wherein the Z-direction linear movement module is mounted with a relay, and an enable switch of a motor of the Z-direction linear movement module is controlled by the relay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121135980.8U CN214505454U (en) | 2021-05-25 | 2021-05-25 | SIC wafer surface machining dicing saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121135980.8U CN214505454U (en) | 2021-05-25 | 2021-05-25 | SIC wafer surface machining dicing saw |
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| CN214505454U true CN214505454U (en) | 2021-10-26 |
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| CN202121135980.8U Active CN214505454U (en) | 2021-05-25 | 2021-05-25 | SIC wafer surface machining dicing saw |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116117237A (en) * | 2022-12-20 | 2023-05-16 | 苏州镁伽科技有限公司 | Chip unloading method, chip unloading device, dicing saw, readable storage medium and electronic apparatus |
-
2021
- 2021-05-25 CN CN202121135980.8U patent/CN214505454U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116117237A (en) * | 2022-12-20 | 2023-05-16 | 苏州镁伽科技有限公司 | Chip unloading method, chip unloading device, dicing saw, readable storage medium and electronic apparatus |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 610000 floors 1-3, plant 9, No. 66, Antai seventh Road, high tech Zone, Chengdu, Sichuan Patentee after: Chengdu Laipu Technology Co.,Ltd. Address before: No. 11 high tech Zone Gaopeng road in Chengdu city of Sichuan Province in 610041 Patentee before: CHENGDU LAIPU TECHNOLOGY Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A SIC wafer surface processing dicing machine Effective date of registration: 20220804 Granted publication date: 20211026 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: Chengdu Laipu Technology Co.,Ltd. Registration number: Y2022980011980 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230704 Granted publication date: 20211026 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: Chengdu Laipu Technology Co.,Ltd. Registration number: Y2022980011980 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A SIC wafer surface processing and dicing machine Effective date of registration: 20231215 Granted publication date: 20211026 Pledgee: Chengdu SME financing Company Limited by Guarantee Pledgor: Chengdu Laipu Technology Co.,Ltd. Registration number: Y2023980071656 |