CN216413023U - Non-contact wafer marking device - Google Patents
Non-contact wafer marking device Download PDFInfo
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- CN216413023U CN216413023U CN202123102588.6U CN202123102588U CN216413023U CN 216413023 U CN216413023 U CN 216413023U CN 202123102588 U CN202123102588 U CN 202123102588U CN 216413023 U CN216413023 U CN 216413023U
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Abstract
The utility model discloses a non-contact wafer marking device, which comprises: the device comprises a first support frame, a second support frame, a truss, a vacuum chuck, a positioning mechanism and a laser; the first support frame and the second support frame are arranged in parallel; a wafer box placing area is formed between the first support frame and the second support frame; the truss is arranged above the first support frame and the second support frame in a sliding mode; the vacuum chuck is positioned above the wafer box placing area and is connected with the truss; the positioning mechanism is arranged on one side of the truss along the sliding direction of the first support frame and the second support frame; the laser is arranged above the first support frame and the second support frame and close to one side of the positioning mechanism.
Description
Technical Field
The utility model relates to the technical field of semiconductor workpiece processing, in particular to a non-contact wafer marking device.
Background
Wafers are basic materials for manufacturing semiconductor chips, and the wafers are usually marked during use and processing, so that different wafers can be identified conveniently. The wafer marking is to directly mark the surface of the whole wafer by adopting etching or laser and other modes. The upper and lower surfaces of the wafer are typically divided into a process side and a back side. The marking is usually performed with the process side of the wafer facing down, and the back surface of the wafer is identified.
In the prior art, when marking the back surface of a wafer, the marking wafer is usually placed on a support table or a support frame for marking. The marking method can lead the process surface of the wafer to be downwards contacted with the supporting table or the supporting frame, and the process surface of the wafer is easily scratched or polluted.
SUMMERY OF THE UTILITY MODEL
The utility model provides a non-contact wafer marking device, which aims to solve the problems that in the prior art, a wafer is required to be taken out of a wafer box through a mechanical arm or a manual work and is placed on a supporting table of a marking machine in a marking mode, so that the technical surface of the wafer is scratched/polluted, the marking working time is long, the efficiency is low, and the production cost is increased.
The utility model provides a non-contact wafer marking device, which comprises: the device comprises a first support frame, a second support frame, a truss, a vacuum chuck, a positioning mechanism and a laser; wherein the content of the first and second substances,
the first support frame and the second support frame are arranged in parallel;
a wafer box placing area is formed between the first support frame and the second support frame;
the truss is arranged above the first support frame and the second support frame in a sliding mode;
the vacuum chuck is positioned above the wafer box placing area and is connected with the truss;
the positioning mechanism is arranged on one side of the truss along the sliding direction of the first support frame and the second support frame;
the laser is arranged above the first support frame and the second support frame and close to one side of the positioning mechanism.
In one implementation, the vacuum chuck is disposed on a centerline of the truss;
in one implementation mode, a wafer box for placing a wafer to be marked is embedded between the first support frame and the second support frame;
in one implementation mode, the marking position of the wafer to be marked is close to the positioning structure of the wafer to be marked;
in one implementation, when the wafer cassette is placed in the wafer cassette placement area, the diameter direction of the wafer cassette perpendicular to the first support frame and the second support frame is located right below the truss.
In one implementation manner, when the wafer cassette is placed in the wafer cassette placement area, the positioning structure of the wafer to be marked in the wafer cassette is placed towards the direction of the positioning mechanism, the process surface of the wafer to be marked in the wafer cassette is placed downwards, and the back surface of the wafer to be marked is placed upwards;
in one implementation, the positioning structure of the wafer to be marked is a positioning edge or a positioning groove;
in one implementation mode, when the positioning structure of the wafer to be marked is a positioning edge, the positioning mechanism is provided with a positioning side surface; when the positioning structure of the wafer to be marked is a positioning groove, the positioning mechanism is correspondingly set to have a positioning angle;
in one implementation, the thickness of the wafer to be marked is greater than 0.1 mm.
The non-contact wafer marking device provided by the utility model has the following beneficial effects:
firstly, the utility model realizes non-contact marking on the front surface of the wafer through the vacuum chuck, so that the wafer is in a suspended state during marking, and the conditions of damage, scratch, pollution and the like to the process surface of the wafer caused by placing the wafer on the supporting table in the traditional marking process are avoided.
The wafer is directly moved to a suspension state from the wafer box through the vacuum chuck for marking, the process of taking the wafer out of the wafer box through a mechanical arm or manpower and then placing the wafer on the supporting platform is not involved, the operation process is simplified, the working efficiency is improved, and the production cost is reduced.
Thirdly, the accurate positioning of the marking position can be realized by utilizing the design among the support frame, the positioning structure and the vacuum chuck.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a non-contact wafer marking apparatus;
FIG. 2 is a schematic view of a wafer with a positioning edge;
FIG. 3 is a schematic view of a wafer with a positioning groove;
FIG. 4 is a front view of a non-contact wafer marking apparatus during marking;
FIG. 5 is a top view of a wafer cassette with a wafer having a locating edge positioned in a marking apparatus prior to marking;
FIG. 6 is a top view of a wafer with a positioning edge positioned in a marking device during marking;
FIG. 7 is a top view of a wafer cassette with a wafer having a positioning slot positioned therein prior to marking;
fig. 8 is a top view of a wafer with a locating groove in the marking device during marking.
Detailed Description
Reference will now be made in detail to embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following examples do not represent all examples consistent with the present invention. But merely as exemplifications of devices consistent with certain aspects of the utility model, as recited in the claims.
It should be noted that the simple description of the terms in the present invention is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of the present invention. These terms should be understood in their ordinary and customary meaning unless otherwise indicated.
The terms "first," "second," "third," and the like in the description and in the claims, as well as in the drawings, are used for distinguishing between similar or analogous objects or entities and not necessarily for describing a particular sequential or chronological order, unless otherwise indicated. It is to be understood that the terms so used are interchangeable under appropriate circumstances. The terms "comprises" and "comprising," and any variations thereof, are intended to cover but not exclude other elements, for example, an article or device comprising a list of elements is not necessarily limited to those expressly listed or inherent to such article or device.
The utility model discloses a non-contact wafer marking device, which realizes non-contact marking on the front surface of a wafer through a vacuum chuck, so that the wafer is in a suspended state during marking, and the conditions of damage, scratch, pollution and the like to a process surface of the wafer caused by placing the wafer on a supporting table in the traditional marking process are avoided; meanwhile, the marking device provided by the utility model directly moves the wafer from the wafer box to a suspended state by the vacuum chuck for marking, and does not relate to the process of taking the wafer out of the wafer box by a mechanical arm or manpower and then placing the wafer on the supporting table, so that the operation process is simplified, the working efficiency is improved, and the production cost is reduced; the utility model can realize the accurate positioning of the marking position by utilizing the mutual design of the supporting frame, the positioning structure and the vacuum chuck.
Referring to fig. 1, a schematic diagram of a non-contact wafer marking apparatus according to the present invention is shown.
As shown in fig. 1, the present invention provides a non-contact wafer marking device, which includes a first support frame 2, a second support frame 3, a truss 4, a vacuum chuck 5, a positioning mechanism 6, and a laser 7.
The first support frame 2 and the second support frame 3 are arranged in parallel; a wafer box placing area 1 is formed between the first support frame 2 and the second support frame 3; the truss 4 is arranged above the first support frame 2 and the second support frame 3 in a sliding manner; the vacuum chuck 5 is positioned above the wafer box placing area 1 and is connected with the truss 4; the positioning mechanism 6 is arranged on one side of the truss 4 along the sliding direction of the first support frame 2 and the second support frame 3; the laser 7 is arranged above the first support frame 2 and the second support frame 3 and close to one side of the positioning mechanism 6.
Illustratively, the vacuum chuck 5 can be freely adjusted in a telescopic manner to adsorb the back surface of the wafer 9 to be marked during marking so as to realize suspended marking, and the vacuum chuck 5 is vertically connected with the truss 4 and synchronously moves along with the truss 4.
In some embodiments, the vacuum chuck 5 is disposed on the centerline of the truss 4.
In some embodiments, a wafer cassette 8 for placing a wafer 9 to be marked is embedded between the first support frame 2 and the second support frame 3.
Illustratively, a wafer box 8 for placing a wafer 9 to be marked is embedded between the first support frame 2 and the second support frame 3, and further, the wafer box 8 may be embedded between the first support frame 2 and the second support frame 3.
In some embodiments, the marking position of the wafer 9 to be marked is close to the positioning structure of the wafer 9 to be marked.
In some embodiments, when the wafer box 8 is placed in the wafer box placing region 1, the diameter direction of the wafer box 8 perpendicular to the first support frame and the second support frame is located right below the truss 4.
In some embodiments, when the wafer cassette 8 is placed in the wafer cassette placement area 1, the positioning structure of the wafer 9 to be marked in the wafer cassette 8 is placed toward the positioning mechanism 6, and the process surface and the back surface of the wafer 9 to be marked in the wafer cassette 8 are placed facing downward and facing upward.
Illustratively, the process surface is a surface of a wafer for further processing or manufacturing of active devices; the back surface is a surface corresponding to the process surface.
In some embodiments, the positioning structure of the wafer 9 to be marked is a positioning edge 91 or a positioning groove 92.
FIG. 2 is a schematic view of a wafer with a positioning edge; FIG. 3 is a schematic view of a wafer with positioning grooves.
In some embodiments, when the positioning structure of the wafer 9 to be marked is the positioning edge 91, the positioning mechanism 6 is configured to have a positioning side surface 61; when the positioning structure of the wafer 9 to be marked is the positioning groove 92, the positioning mechanism 6 is correspondingly set to have a positioning angle 62.
For example, as shown in fig. 2 and 3, the positioning structure of the wafer 9 to be marked may be a positioning edge 91 or a positioning groove 92. Furthermore, the wafer with smaller size is suitable for adopting a positioning edge as a positioning structure, further, the size of the wafer is 3-6 inches, and the positioning edge can refer to a plane, a large trimming edge, a main positioning edge and an auxiliary positioning edge. When the positioning structure is a positioning groove, the positioning groove can reduce the area of the cut wafer compared with the positioning structure on the positioning edge. Generally, a positioning groove is suitable for a wafer with a relatively large size as a positioning structure, and further, the size of the wafer is 8 inches or 12 inches. The positioning groove may also be referred to as a V-groove, notch (V-notch). Further, as shown in fig. 5 and 6, if the positioning structure of the wafer 9 to be marked is the positioning edge 91, the positioning edge 91 of the wafer 9 to be marked abuts against the positioning side surface 61 of the positioning mechanism 6 during laser marking; as shown in fig. 7 and 8, if the positioning structure of the wafer 9 to be marked is the positioning groove 92, the positioning groove 92 of the wafer 9 to be marked abuts against the positioning angle 62 of the positioning mechanism 6 during laser marking.
In some embodiments, the wafer 9 to be marked has a thickness greater than 0.1 mm.
In some embodiments, the non-contact wafer marking device provided by the utility model does not need to take the wafer out of the wafer box through a mechanical arm or a manual work and then place the wafer on the supporting platform of the marking machine. Therefore, the waiting time of marking the wafer is shortened, the efficiency is improved, and the production cost is reduced. Two specific examples are as follows.
In the first exemplary embodiment, the positioning structure of the wafer is taken as a positioning edge, and the positioning mechanism in the marking machine has a positioning surface. The specific embodiment comprises the following steps:
placing a wafer box 8 with a wafer 9 to be marked with an upward back face in a wafer box placing area 1, wherein the diameter direction of the wafer box 8 perpendicular to the first support frame 2 and the second support frame 3 is positioned right below the truss 4, and a positioning edge 91 of the wafer 9 to be marked in the wafer box 8 faces and is close to the positioning mechanism 6; wherein, a wafer 9 to be marked with a corresponding size is placed in the wafer box 8, for example, a 6-inch wafer is placed in a 6-inch wafer box, and the wafer has a positioning edge;
the vacuum chuck 5 moves downwards to adsorb the back surface of the wafer 9 to be marked, and then moves upwards to enable the wafer 9 to be marked to be in a suspended state;
the truss 4 moves towards a positioning mechanism 6 of the marking device along the first support frame 2 and the second support frame 3;
the truss 4 drives the vacuum chuck 5 to move so that the positioning edge 91 of the wafer 9 to be marked is abutted against the positioning surface 61 of the positioning mechanism 6, and the wafer 9 to be marked is positioned at the marking position;
and starting a laser 7 to mark one side of the wafer 9 to be marked, which is close to the positioning edge of the wafer 9 to be marked, and after marking is finished, putting the marked wafer back to the wafer box 8 according to the original path to finish marking.
In the second exemplary embodiment, the positioning structure of the wafer is taken as a positioning groove, and the positioning mechanism in the marking machine has a positioning angle. The specific embodiment comprises the following steps:
placing a wafer box 8 with a wafer 9 to be marked with an upward back face in a wafer box placing area 1, wherein the diameter direction of the wafer box 8 perpendicular to the first support frame 2 and the second support frame 3 is positioned right below the truss 4, and a positioning groove 92 of the wafer 9 to be marked in the wafer box 8 faces and is close to the positioning mechanism 6; wherein, a wafer 9 to be marked with a corresponding size is placed in the wafer box 8, for example, an 8-inch wafer is placed in an 8-inch wafer box, and the wafer has a positioning groove;
the vacuum chuck 5 moves downwards to adsorb the back surface of the wafer 9 to be marked, and then moves upwards to enable the wafer 9 to be marked to be in a suspended state;
the truss 4 moves towards a positioning mechanism 6 of the marking device along the first support frame 2 and the second support frame 3;
the truss 4 drives the vacuum chuck 5 to move so that the positioning groove 92 of the wafer 9 to be marked abuts against the positioning angle 62 of the positioning mechanism 6, and the wafer 9 to be marked is located at the marking position;
and starting a laser 7 to mark one side of the wafer 9 to be marked, which is close to the positioning edge of the wafer 9 to be marked, and after marking is finished, putting the marked wafer back to the wafer box 8 according to the original path to finish marking.
According to the technical scheme, the front surface of the wafer is subjected to non-contact marking through the vacuum chuck, so that the wafer is in a suspended state during marking, and the conditions that the process surface of the wafer is damaged, scratched, polluted and the like when the wafer is placed on the supporting table in the traditional marking process are avoided; in the second aspect, the marking device is directly moved the wafer to unsettled state by vacuum chuck from the wafer box and is beaten the mark, does not relate to through arm or manual work take out the wafer from the wafer box then place the process on a supporting bench with the wafer again, has simplified operation process, has improved work efficiency, has reduced manufacturing cost. In the third aspect, the accurate positioning of the marking position can be realized by utilizing the mutual design of the supporting frame, the positioning structure and the vacuum chuck.
Reference throughout this specification to "embodiments," "some embodiments," "one embodiment," or "an embodiment," etc., means that a particular feature, component, or characteristic described in connection with the embodiment is included in at least one embodiment, and thus, appearances of the phrases "in various embodiments," "in some embodiments," "in at least one other embodiment," or "in an embodiment," etc., throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, components, or characteristics may be combined in any suitable manner in one or more embodiments. Thus, without limitation, a particular feature, component, or characteristic illustrated or described in connection with one embodiment may be combined, in whole or in part, with a feature, component, or characteristic of one or more other embodiments. Such modifications and variations are intended to be included within the scope of the present invention.
The embodiments of the present invention are described in detail, and the embodiments are only examples of the general inventive concept, and should not be construed as limiting the scope of the present invention. Any other embodiments extended by the solution according to the utility model without inventive step will be within the scope of protection of the utility model for a person skilled in the art.
Claims (9)
1. A non-contact wafer marking device, comprising: the device comprises a first support frame (2), a second support frame (3), a truss (4), a vacuum chuck (5), a positioning mechanism (6) and a laser (7); wherein the content of the first and second substances,
the first support frame (2) and the second support frame (3) are arranged in parallel;
a wafer box placing area (1) is formed between the first support frame (2) and the second support frame (3);
the truss (4) is arranged above the first support frame (2) and the second support frame (3) in a sliding manner;
the vacuum chuck (5) is positioned above the wafer box placing area (1) and is connected with the truss (4);
the positioning mechanism (6) is arranged on one side of the truss (4) along the sliding direction of the first support frame (2) and the second support frame (3);
the laser (7) is arranged above the first support frame (2) and the second support frame (3) and close to one side of the positioning mechanism (6).
2. A non-contact wafer marking device as claimed in claim 1, characterized in that the vacuum chuck (5) is arranged on the centre line of the truss (4).
3. A contactless wafer marking device according to claim 1, characterized in that a wafer cassette (8) for placing a wafer (9) to be marked is embedded between the first support frame (2) and the second support frame (3).
4. Non-contact wafer marking device according to claim 3, characterized in that the marking position of the wafer (9) to be marked is close to the positioning structure of the wafer (9) to be marked.
5. The non-contact wafer marking device as claimed in claim 1, wherein when the wafer box (8) is placed in the wafer box placing area (1), the diameter direction of the wafer box (8) perpendicular to the first support frame (2) and the second support frame (3) is located right below the truss (4).
6. The non-contact wafer marking device as claimed in claim 1, wherein when the wafer box (8) is placed in the wafer box placing area (1), the positioning structure of the wafer (9) to be marked in the wafer box (8) is placed towards the positioning mechanism (6), and the process surface and the back surface of the wafer (9) to be marked in the wafer box (8) are placed downwards and upwards.
7. The non-contact wafer marking device as claimed in claim 6, wherein the positioning structure of the wafer (9) to be marked is a positioning edge (91) or a positioning groove (92).
8. The non-contact wafer marking device as claimed in claim 7, wherein when the positioning structure of the wafer (9) to be marked is the positioning edge (91), the positioning mechanism (6) is configured to have a positioning side surface (61); when the positioning structure of the wafer (9) to be marked is a positioning groove (92), the positioning mechanism (6) is correspondingly set to have a positioning angle (62).
9. Non-contact wafer marking device according to claim 3, characterized in that the thickness of the wafer (9) to be marked is greater than 0.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123102588.6U CN216413023U (en) | 2021-12-07 | 2021-12-07 | Non-contact wafer marking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123102588.6U CN216413023U (en) | 2021-12-07 | 2021-12-07 | Non-contact wafer marking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216413023U true CN216413023U (en) | 2022-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123102588.6U Active CN216413023U (en) | 2021-12-07 | 2021-12-07 | Non-contact wafer marking device |
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|---|---|
| CN (1) | CN216413023U (en) |
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2021
- 2021-12-07 CN CN202123102588.6U patent/CN216413023U/en active Active
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