CN214482056U - Power electronic power unit radiator - Google Patents
Power electronic power unit radiator Download PDFInfo
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- CN214482056U CN214482056U CN202120720476.8U CN202120720476U CN214482056U CN 214482056 U CN214482056 U CN 214482056U CN 202120720476 U CN202120720476 U CN 202120720476U CN 214482056 U CN214482056 U CN 214482056U
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Abstract
The utility model relates to a power electronic power unit radiator, which comprises a frame, an air-flow type heat dissipation mechanism, a contact heat dissipation mechanism and a fixing mechanism, wherein the air-flow type heat dissipation mechanism, the contact heat dissipation mechanism and the fixing mechanism are arranged on the frame, the frame comprises a transverse frame plate and a longitudinal frame plate hinged on two sides of the transverse frame plate, the air-flow type heat dissipation mechanism is arranged in a central opening of the transverse frame plate, and the contact heat dissipation mechanism is arranged on the inner side of the longitudinal frame plate; the airflow type heat dissipation mechanism comprises an exhaust fan, and the heat contact dissipation mechanism comprises a plurality of serially connected refrigeration sheets. The power electronic power unit radiator overcomes the defects of complex structure and high installation difficulty of radiating equipment used on the conventional power device, has the advantages of simple structure, convenience in disassembly and assembly and the like, also has high-efficiency and comprehensive radiating effect, and is widely suitable for matching and installing the power devices on various power electronic equipment.
Description
Technical Field
The utility model relates to a power electronics technical field, concretely relates to power electronic power unit radiator.
Background
Power devices are a widely used component in power electronics. When the power device works, the temperature of the chip of the power device is increased due to heat generated by loss, so that the efficiency is reduced and the service life is shortened, and the failure of the power device and the explosion of the chip are caused, so that the heat must be timely and effectively dissipated to ensure the normal work of the power device. The heat dissipation equipment matched with the power device of the existing power electronic equipment is complex in structure, high in installation difficulty and low in operation efficiency of daily dismounting and maintenance when being specifically applied to the power device.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: the power electronic power unit radiator overcomes the defects of complex structure and high installation difficulty of radiating equipment used on the conventional power device, has a simple structure, is convenient to disassemble and assemble, and has a high-efficiency and comprehensive radiating effect.
The power electronic power unit radiator comprises a rack, an airflow type heat dissipation mechanism, a contact heat dissipation mechanism and a fixing mechanism, wherein the airflow type heat dissipation mechanism, the contact heat dissipation mechanism and the fixing mechanism are arranged on the rack; the airflow type heat dissipation mechanism comprises an exhaust fan, and the heat contact dissipation mechanism comprises a plurality of serially connected refrigeration sheets.
In order to realize that the hot air exhaust mechanism uniformly pumps and exhausts hot air in an inner area, the airflow type heat dissipation mechanism further comprises an air distribution disc arranged on the lower surface of the transverse frame plate, the air distribution disc is hollow, and a plurality of air inlets are uniformly distributed at the bottom of the air distribution disc; specifically to the arrangement of fan and drive arrangement, exhaust fan axostylus axostyle and driving motor thereof are installed in the air distributor, and the exhaust fan flabellum is fixed on the axostylus axostyle of horizontal frame plate central authorities trompil position. The hot air is uniformly pumped into the sub-sealing disc from each air inlet and is discharged through the central opening of the transverse frame plate under the action of the fan blades.
In order to play a dustproof role and simultaneously enable the hot air in the air distribution plate to be further uniformly pumped into the air distribution plate, a double-layer protective net is arranged below the air distribution plate on the lower surface of the transverse frame plate.
For realizing power supply control and low-power consumption operation of the semiconductor refrigerating sheet, the contact heat dissipation mechanism further comprises a frequency conversion adapter plate, wherein the frequency conversion adapter plate is respectively arranged on the upper part of the outer side of the longitudinal frame plate, and the frequency conversion adapter plate is electrically connected with the refrigerating sheet on the corresponding longitudinal frame plate.
For the protection setting refrigeration piece structure of concatenating at vertical frame plate inboard, horizontal frame plate both sides are equipped with the elasticity stopper in refrigeration piece top region, refrigeration piece inboard is pasted and is had silica gel guard plate
In order to realize the quick fixation and disassembly of the radiator and the power device, the fixing mechanism comprises a right-angle frame arranged at the lower part of the outer side of the longitudinal frame plate, and a tightening bolt penetrating on the longitudinal surface of the right-angle frame, wherein the tightening bolt is screwed in a threaded hole formed in the center of the longitudinal surface of the right-angle frame, and the inner side end of the tightening bolt is fixedly connected with a top plate.
The utility model relates to a power electronic power unit radiator has overcome the complicated, the great defect of the installation degree of difficulty of the heat dissipation equipment structure that uses on the current power device, and it still has high-efficient, comprehensive heat dissipation efficiency outside possessing advantages such as simple structure, easy dismounting, extensively is applicable to the power device matching installation on all kinds of power electronic equipment.
Drawings
The power electronic power unit radiator of the present invention is further described with reference to the accompanying drawings:
fig. 1 is a schematic diagram of a longitudinal sectional structure of the heat sink of the power electronic power unit.
In the figure:
1-a frame; 11-transverse frame plate 12-longitudinal frame plate; 111-an elastic limiting block;
2-airflow type heat dissipation mechanism; 21-an exhaust fan, 22-an air distribution disc, 23-an air inlet and 24-a double-layer protective net;
3-a contact heat dissipation mechanism; 31-refrigerating piece, 32-frequency conversion adapter plate; 321-a silica gel protection plate;
4-a fixing mechanism; 41-right angle frame, 42-fastening bolt and 43-top plate.
Detailed Description
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present invention, it is to be understood that the terms "left", "right", "front", "back", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, and are used merely for convenience of description and simplification of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Embodiment 1: as shown in fig. 1, the power electronic power unit heat sink includes a frame 1, an airflow type heat dissipation mechanism 2, a contact heat dissipation mechanism 3 and a fixing mechanism 4, wherein the airflow type heat dissipation mechanism 2, the contact heat dissipation mechanism 3 and the fixing mechanism 4 are arranged on the frame 1, the frame 1 includes a transverse frame plate 11 and a longitudinal frame plate 12 hinged on two sides of the transverse frame plate 11, the airflow type heat dissipation mechanism 2 is installed in a central opening of the transverse frame plate 11, and the contact heat dissipation mechanism 3 is installed inside the longitudinal frame plate 12; the airflow type heat dissipation mechanism 2 comprises an exhaust fan 21, and the heat contact dissipation mechanism 3 comprises a plurality of serially connected refrigeration sheets 31. The fixing mechanism 4 comprises a right-angle frame 41 arranged at the lower part of the outer side of the longitudinal frame plate 12 and a tightening bolt 42 penetrating the longitudinal surface of the right-angle frame 41, the tightening bolt 42 is screwed in a threaded hole formed in the center of the longitudinal surface of the right-angle frame 41, and a top plate 43 is fixedly connected to the inner side of the tightening bolt 42. So as to realize the quick fixing and dismounting of the radiator and the power device.
Embodiment 2: the airflow type heat dissipation mechanism 2 of the power electronic power unit radiator further comprises an air distribution disc 22 arranged on the lower surface of the transverse frame plate 11, the air distribution disc 22 is hollow, and a plurality of air inlets 23 are uniformly distributed at the bottom of the air distribution disc 22; particularly, the arrangement of the fan and the driving device, the shaft lever of the exhaust fan 21 and the driving motor thereof are arranged in the air distributing disc 22, and the fan blades of the exhaust fan 21 are fixed on the shaft lever at the central opening position of the transverse frame plate 11. The hot air exhaust mechanism is used for uniformly exhausting hot air in an inner area, the hot air is uniformly pumped into the sub-sealing disc from each air inlet, and the hot air is exhausted from the central opening of the transverse frame plate under the action of the fan blades. A double-layer protective net 24 is arranged below the air distributing disc 22 on the lower surface of the transverse frame plate 11. The air distributor is used for further and uniformly pumping the hot air in the air distributor into the air distributor while playing a dustproof role. The remaining structure and components are as described in embodiment 1, and the description will not be repeated.
Embodiment 3: this power electronic power unit radiator contact heat dissipation mechanism 3 still includes frequency conversion keysets 32, frequency conversion keysets 32 are installed respectively on vertical frame plate 12 outside upper portion, frequency conversion keysets 32 and the corresponding refrigeration piece 31 electric connection on vertical frame plate 12. The semiconductor refrigeration chip is used for realizing power supply control and low-power-consumption operation of the semiconductor refrigeration chip. The elastic limiting blocks 111 are arranged on the two sides of the transverse frame plate 11 in the area above the refrigerating sheet 31, and silica gel protection plates 321 are attached to the inner side of the refrigerating sheet 31. The refrigerating sheet structure is used for protecting the tandem connection refrigerating sheet structure arranged on the inner side of the longitudinal frame plate. The remaining structure and components are as described in embodiment 1, and the description will not be repeated.
And (3) running: the exhaust fan and the air distribution plate are used for uniformly pumping and discharging hot air outside the device generated by the power device, and meanwhile, the heat absorption and heat conduction of the metal protective net are used as a heat dissipation medium, and the semiconductor refrigeration sheet is used for carrying out heat exchange type cooling, so that the heat dissipation effect is obviously improved; the heat dissipation device is operated on the power element and is quickly disassembled in a tight fixing mode of the fixing mechanism.
The power electronic power unit radiator overcomes the defects of complex structure and high installation difficulty of radiating equipment used on the conventional power device, has the advantages of simple structure, convenience in disassembly and assembly and the like, also has high-efficiency and comprehensive radiating effect, and is widely suitable for matching and installing the power devices on various power electronic equipment.
The above description shows the main features, the basic principles, and the advantages of the invention. It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments or examples, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The foregoing embodiments or examples are therefore to be considered in all respects illustrative and not restrictive. The scope of the invention is indicated by the appended claims rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. A power electronic power unit radiator is characterized in that: comprises a frame (1), an airflow type heat dissipation mechanism (2) arranged on the frame (1), a contact heat dissipation mechanism (3) and a fixing mechanism (4), wherein,
the air-flow type heat dissipation device is characterized in that the rack (1) comprises a transverse rack plate (11) and longitudinal rack plates (12) hinged to two sides of the transverse rack plate (11), the air-flow type heat dissipation mechanism (2) is installed in a central opening of the transverse rack plate (11), and the contact heat dissipation mechanism (3) is installed on the inner side of the longitudinal rack plate (12); the airflow type heat dissipation mechanism (2) comprises an exhaust fan (21), and the heat touch dissipation mechanism (3) comprises a plurality of serially connected refrigerating sheets (31).
2. A power electronic power unit heat sink as claimed in claim 1, wherein: the airflow type heat dissipation mechanism (2) further comprises an air distribution disc (22) arranged on the lower surface of the transverse frame plate (11), the air distribution disc (22) is hollow, and a plurality of air inlets (23) are uniformly distributed at the bottom of the air distribution disc (22); the shaft lever of the exhaust fan (21) and the driving motor thereof are arranged in the air distribution disc (22), and the fan blades of the exhaust fan (21) are fixed on the shaft lever at the central opening position of the transverse frame plate (11).
3. A power electronic power unit heat sink as claimed in claim 2, wherein: and a double-layer protective net (24) is arranged below the lower surface of the transverse frame plate (11) and the air distribution disc (22).
4. A power electronic power unit heat sink as claimed in claim 1, wherein: the contact heat dissipation mechanism (3) further comprises a frequency conversion adapter plate (32), the frequency conversion adapter plate (32) is respectively installed on the upper portion of the outer side of the longitudinal frame plate (12), and the frequency conversion adapter plate (32) is electrically connected with the refrigerating sheet (31) on the corresponding longitudinal frame plate (12).
5. The power electronic power unit heat sink of claim 4, wherein: elastic limiting blocks (111) are arranged on the two sides of the transverse frame plate (11) in the area above the refrigerating sheet (31), and silica gel protecting plates (321) are pasted on the inner side of the refrigerating sheet (31).
6. A power electronic power unit heat sink according to any of claims 1 to 5, characterized by: the fixing mechanism (4) comprises a right-angle frame (41) arranged at the lower part of the outer side of the longitudinal frame plate (12), and a tightening bolt (42) penetrating on the longitudinal surface of the right-angle frame (41), wherein the tightening bolt (42) is screwed in a threaded hole formed in the center of the longitudinal surface of the right-angle frame (41), and a top plate (43) is fixedly connected with the inner side of the tightening bolt (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120720476.8U CN214482056U (en) | 2021-04-09 | 2021-04-09 | Power electronic power unit radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120720476.8U CN214482056U (en) | 2021-04-09 | 2021-04-09 | Power electronic power unit radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214482056U true CN214482056U (en) | 2021-10-22 |
Family
ID=78177964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120720476.8U Active CN214482056U (en) | 2021-04-09 | 2021-04-09 | Power electronic power unit radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214482056U (en) |
-
2021
- 2021-04-09 CN CN202120720476.8U patent/CN214482056U/en active Active
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