CN214481485U - Heat-conducting single-sided adhesive-free copper-clad plate - Google Patents
Heat-conducting single-sided adhesive-free copper-clad plate Download PDFInfo
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- CN214481485U CN214481485U CN202022346288.1U CN202022346288U CN214481485U CN 214481485 U CN214481485 U CN 214481485U CN 202022346288 U CN202022346288 U CN 202022346288U CN 214481485 U CN214481485 U CN 214481485U
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Abstract
The utility model discloses a heat conduction type single face does not have gluey copper-clad plate relates to copper-clad plate technical field. The copper foil reinforced plastic composite material comprises a copper foil, a reinforced layer, a base material layer and a binder, wherein the reinforced layer is fixedly arranged at the bottom of the copper foil, the binder is fixedly arranged at the bottom of the reinforced layer, and the base material layer is fixedly arranged at the bottom of the binder. Through setting up the copper foil, make its in use effectively electrically conduct, and then connect each component in the device through epoxy glue system adhesive, and dispel the heat through the heat that produces to its electric current, and then the effect through the enhancement layer, carry out effectual enhancement effect to the device, and through heat-conducting layer and the packing layer of its setting, heat conduction is carried out to the heat that the device used the production, effectively improve the heat conduction effect of the device, the device's the use through artifical graphite layer simultaneously, make its stability of effectively guaranteeing the device electrically conductive effect, and then stabilize the normal output of the device, effectively improve the device's result of use, strengthen its practicality.
Description
Technical Field
The utility model relates to a copper-clad plate technical field specifically is a heat conduction type single face does not have copper-clad plate of gluing.
Background
The copper clad laminate is a plate material prepared by soaking electronic glass fiber cloth or other reinforcing materials with resin, covering one side or two sides with copper foil and hot pressing, which is called copper clad laminate for short, and various printed circuit boards with different forms and different functions are all prepared by selectively processing, etching, drilling, copper plating and other procedures on the copper clad laminate to prepare different printed circuits, mainly play the roles of interconnection, insulation and support for the printed circuit boards, and have great influence on the transmission speed, energy loss, characteristic impedance and the like of signals in the circuits, therefore, the performance, quality, processability, manufacturing level, manufacturing cost, long-term reliability and stability of the printed circuit boards are greatly dependent on the copper clad laminate.
The copper-clad plate that has now on the market, the heat conduction effect is relatively poor in its use, make its heat form the gathering in electronic equipment, can not in time discharge, and make the heat pile up and produce the high temperature, and then stability to electronic equipment, the reliability, life produces adverse effect, the inside filler of current copper-clad plate selects unreasonablely simultaneously, make it easily take place the chemical physics reaction, and then influence its characteristic, it is relatively poor to lead to the stability of heat dissipation electric conduction use, and the inner structure setting of current copper-clad plate is comparatively simple and easy, it is unobvious to make its result of use, the practicality is relatively weak, for this reason, a heat conduction type single face does not have gluey copper-clad plate and solves above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat conduction type single face does not have and glues copper-clad plate possesses that the heat conduction effect is good, the practicality is strong and stable good advantage to solve general copper-clad plate and do not possess the problem that the heat conduction effect is good, the practicality is strong and stability is good.
For the purpose that the realization possesses that the heat conduction effect is good, the practicality is strong and stability is good, the utility model provides a following technical scheme: a heat-conducting single-sided non-adhesive copper-clad plate comprises a copper foil, an enhancement layer, a substrate layer and an adhesive, wherein the enhancement layer is fixedly arranged at the bottom of the copper foil, the adhesive is fixedly arranged at the bottom of the enhancement layer, and the substrate layer is fixedly arranged at the bottom of the adhesive;
the reinforced layer comprises a heat conduction layer, a packing layer, a graphite layer and an insulating layer, wherein the heat conduction layer is fixedly arranged at the top of the reinforced layer, the packing layer is fixedly arranged at the bottom of the heat conduction layer, the graphite layer is fixedly arranged at the bottom of the packing layer, and the insulating layer is fixedly arranged at the bottom of the graphite layer.
As an optimized technical scheme of the utility model, the top of copper foil sets up the substrate membrane, and the substrate membrane is polyimide substrate membrane, and polyimide substrate membrane's thickness is 5 ~ 10 mu m.
As an optimized technical scheme of the utility model, the adhesive is epoxy glue system adhesive, and the thickness of adhesive is 5 ~ 20 mu m, and the adhesive sets up respectively in the device each interlaminar junction.
As an optimized technical scheme of the utility model, the heat-conducting layer is the polyamide heat-conducting layer, and the thickness of heat-conducting layer is 10 ~ 50 mu m, and the carbomorphism temperature of heat-conducting layer is 900 ~ 1500 ℃.
As an optimized technical scheme of the utility model, the packing layer is inorganic packing layer, and inorganic packing is the mixed filler of aluminium nitride and aluminium oxide, and the thickness of packing layer is 10 ~ 150 mu m.
As an optimized technical scheme of the utility model, graphite in the graphite layer is artifical graphite powder, and graphite powder is less than 20 μm for particle size distribution DN50, and DN90 is less than 50 μm's artifical graphite powder, and graphitization temperature is 2500 ℃ -3200 ℃.
Compared with the prior art, the utility model provides a heat conduction type single face does not have and glues copper-clad plate possesses following beneficial effect:
1. this heat conduction type single face does not have and glues copper-clad plate, through setting up the copper foil, make its in use carry out effective electrically conductive, and then glue each component through epoxy and connect in the adhesive is to the device, and dispel the heat through the heat that produces its electric current, and then the effect through the enhancement layer, carry out effectual additional strengthening to the device, and heat-conducting layer and packing layer through its setting, heat conduction is carried out to the heat that the device use produced, effectively improve the device's heat conduction effect, the device's the use through artifical graphite layer simultaneously, make its stability of effectively guaranteeing the device electric conduction effect, and then stabilize the device's normal output, effectively improve the device's result of use, strengthen its practicality.
2. This heat conduction type single face does not have and glues copper-clad plate, through setting up the packing layer, and the packing layer is the inorganic matter mixed packing layer of aluminium nitride and aluminium oxide, and through its special type that is difficult for taking place the chemical and physical reaction, and the characteristic that possesses electric conductivity, the device's of being convenient for follow-up use, and then it is long when effectively having prolonged the device and using, increase its life, reduce its use cost's input, the device passes through the use of polyamide heat-conducting layer simultaneously, effectively strengthen the heat resistance of device heat conduction, guarantee device heat conduction effect's stable implementation, and the reasonable setting of its thickness use, do not influence the normal operating of other components when making it use, and then promote the device's result of use, strengthen its usability.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of the enhancement layer of the present invention;
fig. 3 is a front view of the present invention.
In the figure: 1. copper foil; 2. an enhancement layer; 201. a heat conductive layer; 202. a filler layer; 203. a graphite layer; 204. an insulating layer; 3. a substrate layer; 4. and (3) an adhesive.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Please refer to fig. 1-3, the utility model discloses a heat conduction type single face does not have and glues copper-clad plate, including copper foil 1, enhancement layer 2, substrate layer 3 and adhesive 4, the fixed enhancement layer 2 that is provided with in bottom of copper foil 1, the fixed adhesive 4 that is provided with in bottom of enhancement layer 2, the fixed substrate layer 3 that is provided with in bottom of adhesive 4.
The reinforced layer 2 comprises a heat conduction layer 201, a packing layer 202, a graphite layer 203 and an insulating layer 204, the heat conduction layer 201 is fixedly arranged at the top of the reinforced layer 2, the packing layer 202 is fixedly arranged at the bottom of the heat conduction layer 201, the graphite layer 203 is fixedly arranged at the bottom of the packing layer 202, and the insulating layer 204 is fixedly arranged at the bottom of the graphite layer 203.
Specifically, a base material film is arranged on the top of the copper foil 1, the base material film is a polyimide base material film, and the thickness of the polyimide base material film is 5-10 μm.
In this embodiment, effectively improve the radiating effect of device, and its insulating effect has avoided the emergence of incident, has strengthened the device's practicality.
Specifically, the adhesive 4 is an epoxy resin adhesive, the thickness of the adhesive 4 is 5 to 20 μm, and the adhesive 4 is respectively disposed at the connection positions between the layers of the device.
In this embodiment, effectively strengthen the bonding effect of device, make its bonding firm, the subsequent processing of being convenient for is used, has ensured the result of use of device, the stability of hoisting device's use.
Specifically, the heat conduction layer 201 is a polyamide heat conduction layer, the thickness of the heat conduction layer 201 is 10-50 μm, and the carbonization temperature of the heat conduction layer 201 is 900-1500 ℃.
In this embodiment, the heat resistance of reinforcing device heat conduction, the stable implementation of guarantee device heat conduction effect to do not influence the normal operating of other components when making its use, and then promote the device's result of use.
Specifically, the filler layer 202 is an inorganic filler layer, the inorganic filler is a mixed filler of aluminum nitride and aluminum oxide, and the thickness of the filler layer 202 is 10 to 150 μm.
In the embodiment, the aluminum nitride and the aluminum oxide filler are not easy to generate chemical and physical reaction, and have the characteristic of conductivity, so that the subsequent use of the device is facilitated, and the practicability of the device is effectively enhanced.
Specifically, the graphite in the graphite layer 203 is artificial graphite powder, the graphite powder is artificial graphite powder with particle size distribution DN50 smaller than 20 μm and DN90 smaller than 50 μm, and the graphitization temperature is 2500-3200 ℃.
In this embodiment, the electric conduction effect of artificial graphite is stable, and high temperature resistant is effectual, makes it can allow the stronger electric current of voltage to pass through, stabilising arrangement's normal output.
The utility model discloses a theory of operation and use flow: when using, connect each component in the device through epoxy glue system adhesive 4, and dispel the heat through the heat that produces to its electric current, and then through copper foil 1, make its in use carry out effective electrically conductive, and then the effect through enhancement layer 2, carry out effectual additional strengthening to the device, and through heat-conducting layer 201 and the packing layer 202 of its setting, heat conduction is carried out to the heat that the device used the production, effectively improve the device's heat conduction effect, the device's the use through artifical graphite layer 203 simultaneously, make its stability of effectively guaranteeing the device electric conduction effect, accomplish the operation to the device through the aforesaid.
To sum up, this heat conduction type single face does not have and glues copper-clad plate, through setting up packing layer 202, and packing layer 202 is the inorganic matter mixed packing layer 202 of aluminium nitride and aluminium oxide, and through its special type that is difficult for taking place the chemical and physical reaction, and the characteristic that possesses the electric conductivity, be convenient for the follow-up use of device, and then it is long effectively to have prolonged the device and used, increase its life, reduce its use cost's input, the device passes through the use of polyamide heat-conducting layer 201 simultaneously, effectively strengthen the heat resistance of device heat conduction, guarantee the stable implementation of device heat conduction effect, and the reasonable setting of its thickness use, do not influence the normal operating of other components when making it use, and then promote the device's result of use, strengthen its usability.
It should be noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a heat conduction type single face does not have gluey copper-clad plate, includes copper foil (1), enhancement layer (2), substrate layer (3) and adhesive (4), its characterized in that: the bottom of the copper foil (1) is fixedly provided with an enhancement layer (2), the bottom of the enhancement layer (2) is fixedly provided with a bonding agent (4), and the bottom of the bonding agent (4) is fixedly provided with a base material layer (3);
the reinforced layer (2) comprises a heat conduction layer (201), a packing layer (202), a graphite layer (203) and an insulating layer (204), wherein the heat conduction layer (201) is fixedly arranged at the top of the reinforced layer (2), the packing layer (202) is fixedly arranged at the bottom of the heat conduction layer (201), the graphite layer (203) is fixedly arranged at the bottom of the packing layer (202), and the insulating layer (204) is fixedly arranged at the bottom of the graphite layer (203).
2. The heat-conducting single-sided copper-clad plate without adhesive according to claim 1, characterized in that: the top of the copper foil (1) is provided with a base material film, the base material film is a polyimide base material film, and the thickness of the polyimide base material film is 5-10 mu m.
3. The heat-conducting single-sided copper-clad plate without adhesive according to claim 1, characterized in that: the adhesive (4) is an epoxy resin adhesive system adhesive, the thickness of the adhesive (4) is 5-20 mu m, and the adhesive (4) is respectively arranged at the connecting positions among the layers of the device.
4. The heat-conducting single-sided copper-clad plate without adhesive according to claim 1, characterized in that: the heat conduction layer (201) is a polyamide heat conduction layer, the thickness of the heat conduction layer (201) is 10-50 mu m, and the carbonization temperature of the heat conduction layer (201) is 900-1500 ℃.
5. The heat-conducting single-sided copper-clad plate without adhesive according to claim 1, characterized in that: the filler layers (202) are inorganic filler layers.
6. The heat-conducting single-sided copper-clad plate without adhesive according to claim 1, characterized in that: the graphite in the graphite layer (203) is artificial graphite powder, and the graphitization temperature is 2500-3200 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022346288.1U CN214481485U (en) | 2020-10-20 | 2020-10-20 | Heat-conducting single-sided adhesive-free copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022346288.1U CN214481485U (en) | 2020-10-20 | 2020-10-20 | Heat-conducting single-sided adhesive-free copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214481485U true CN214481485U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022346288.1U Active CN214481485U (en) | 2020-10-20 | 2020-10-20 | Heat-conducting single-sided adhesive-free copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214481485U (en) |
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- 2020-10-20 CN CN202022346288.1U patent/CN214481485U/en active Active
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