CN214477392U

CN214477392U - Semiconductor device stacking and packaging structure

Info

Publication number: CN214477392U
Application number: CN202120524189.XU
Authority: CN
Inventors: 曹孙根
Original assignee: Anhui Micro Semiconductor Technology Co ltd
Current assignee: Anhui Micro Semiconductor Technology Co ltd
Priority date: 2021-03-12
Filing date: 2021-03-12
Publication date: 2021-10-22
Anticipated expiration: 2031-03-12

Abstract

The utility model discloses a semiconductor device stacking and packaging structure, which comprises a substrate, a metal elastic sheet, a first component, a second component, a third component and a lead, wherein the third component is elastically clamped on the inner side of a third frame through the metal elastic sheet, and the metal elastic sheet is electrically connected with the substrate through the lead; the utility model discloses a metal shrapnel is with first component, second component and third component are installed in proper order at first frame, second frame and third frame are inboard, then respectively with first component through the wire, second component and third component and base plate electric connection, can be to first component respectively before the encapsulation like this, second component and third component test alone, thereby the validity of product has been guaranteed, must encapsulate the back with three semiconductor device completely among the prior art and just can test, the yield loss that probably leads to and the extravagant problem of material have been avoided.

Description

Semiconductor device stacking and packaging structure

Technical Field

The utility model relates to a semiconductor package technical field specifically is a semiconductor device piles up packaging structure.

Background

In the current semiconductor industry, electronic packaging has become an important aspect of industry development; decades of development of packaging technology make the requirements of high-density and small-size packaging become the mainstream direction of packaging; at present, the main development trend of semiconductor component packaging is multi-pin, narrow-pitch, small-sized, multifunctional and the like, so that the requirements for system integration are more and more urgent, the industrial requirements can not be met gradually by adopting a single chip packaging technology, and the realization of the function of WSI (wireless sensor interface) is one of the main approaches for realizing the system integration technology through the technology from a two-dimensional chip assembly to a three-dimensional chip assembly.

In another known three-chip three-dimensional packaging process, three components or chips are sequentially stacked on a substrate or packaged into a whole in other forms, and although the stacking technology can satisfy the packaging of a plurality of chips or components, certain problems still exist:

the packaged semiconductor device can enter the market after being tested, so that the performance of a final product can be tested only after the whole circuit is packaged, and at the moment, once one or more of three components are found to be defective or unqualified in the test, the whole circuit is scrapped, so that the waste of the components or chips and other materials without problems is caused, and huge loss is caused to the production and the manufacturing of enterprises.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor device piles up packaging structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor device piles up packaging structure, includes base plate, metal shrapnel, first component, second component, third component and wire, there is first frame one side of base plate upper surface through bolt fixed mounting, there is the second frame first frame top through bolt fixed mounting, there is the third frame second frame top through bolt fixed mounting, first frame, second frame and third frame inboard all have the metal shrapnel through bolt symmetry fixed mounting, first frame inboard is passed through metal shrapnel elastic joint has first component, second frame inboard is passed through metal shrapnel elastic joint has the second component, third frame inboard is passed through metal shrapnel elastic joint has the third component, the metal shrapnel with pass through wire electric connection between the base plate.

The metal elastic sheet is of a U-shaped structure, one side of the metal elastic sheet is electrically connected with the first component, the second component and the third component, and the other side of the metal elastic sheet is electrically connected with the lead.

One end of the lead is connected with the control circuit of the substrate in a soldering mode, and the other end of the lead is connected with the metal elastic sheet in a soldering mode.

And a plastic package is bonded on one side of the surface of the substrate, which surrounds the first frame, the second frame and the third frame.

And the positive and negative electrode ends of the first component, the second component and the third component are all in contact with the metal elastic sheet.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a metal shrapnel installs first component, second component and third component in proper order in first frame, second frame and third frame inboard, then through the wire respectively with first component, second component and third component and base plate electric connection, can test first component, second component and third component separately before the encapsulation like this respectively, thereby guaranteed the validity of product, avoided among the prior art must can test after encapsulating three semiconductor device totally, the yield loss that probably leads to and the extravagant problem of material; meanwhile, in the process of independently testing the first component, the second component and the third component, if some of the first component, the second component and the third component has a problem, the components with the problems are conveniently detached and replaced through the metal elastic pieces, and the components are conveniently replaced.

Drawings

FIG. 1 is a schematic view of a front view of a partial cross-sectional structure of the present invention;

fig. 2 is a schematic bottom view of the third frame of the present invention.

In the figure: 10. a substrate; 11. a first frame; 12. a second frame; 13. a third frame; 20. a metal spring sheet; 30. a first component; 40. a second component; 50. a third component; 60. a wire; 70. and (7) plastic packaging.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a semiconductor device piles up packaging structure, including base plate 10, metal shrapnel 20, first component 30, second component 40, third component 50 and wire 60, there is first frame 11 one side of base plate 10 upper surface through bolt fixed mounting, there is second frame 12 at first frame 11 top through bolt fixed mounting, there is third frame 13 at second frame 12 top through bolt fixed mounting, first frame 11, there is metal shrapnel 20 second frame 12 and third frame 13 inboard all through bolt symmetry fixed mounting, first frame 11 inboard has first component 30 through metal shrapnel 20 elastic clamping, there is second component 40 second frame 12 inboard through metal shrapnel 20 elastic clamping, third frame 13 inboard has third component 50 through metal shrapnel 20 elastic clamping, pass through wire 60 electric connection between metal shrapnel 20 and the base plate 10.

The metal elastic sheet 20 is of a U-shaped structure, one side of the metal elastic sheet 20 is electrically connected with the first component 30, the second component 40 and the third component 50, the other side of the metal elastic sheet 20 is electrically connected with the lead 60, and positive and negative electrode ends of the first component 30, the second component 40 and the third component 50 are all in contact with the metal elastic sheet 20.

The first component 30, the second component 40 and the third component 50 are conveniently clamped inside the first frame 11, the second frame 12 and the third frame 13 respectively through the U-shaped design of the metal elastic sheet 20.

One end of the lead 60 is soldered to the control circuit of the substrate 10, and the other end of the lead 60 is soldered to the metal dome 20.

Wherein, a plastic package 70 is adhered on the surface of the substrate 10 around one side of the first frame 11, the second frame 12 and the third frame 13.

The working principle is as follows: when the testing device is used, the first component 30, the second component 40 and the third component 50 are sequentially arranged on the inner sides of the first frame 11, the second frame 12 and the third frame 13 through the metal elastic sheet 20, and then the first component 30, the second component 40 and the third component 50 are respectively and electrically connected with the substrate 10 through the conducting wires 60, so that the first component 30, the second component 40 and the third component 50 can be separately tested before packaging, the effectiveness of a product is ensured, and the problems of yield loss and material waste which are possibly caused by the fact that three semiconductor devices can be tested only after being completely packaged in the prior art are solved; meanwhile, in the process of independently testing the first component 30, the second component 40 and the third component 50, if a certain one of the first component 30, the second component 40 and the third component 50 has a problem, the component with the problem is conveniently detached and replaced through the metal elastic piece 20, and the replacement of the component is convenient.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor device stacks packaging structure, includes base plate (10), metal shell fragment (20), first component (30), second component (40), third component (50) and wire (60), its characterized in that: a first frame (11) is fixedly arranged on one side of the upper surface of the base plate (10) through bolts, the top of the first frame (11) is fixedly provided with a second frame (12) through bolts, the top of the second frame (12) is fixedly provided with a third frame (13) through bolts, the inner sides of the first frame (11), the second frame (12) and the third frame (13) are symmetrically and fixedly provided with metal elastic sheets (20) through bolts, a first component (30) is elastically clamped at the inner side of the first frame (11) through the metal elastic sheet (20), the inner side of the second frame (12) is elastically clamped with a second component (40) through the metal elastic sheet (20), a third element (50) is elastically clamped at the inner side of the third frame (13) through the metal elastic sheet (20), the metal elastic sheet (20) is electrically connected with the substrate (10) through a lead (60).

2. The semiconductor device package on package structure of claim 1, wherein: the metal elastic sheet (20) is of a U-shaped structure, one side of the metal elastic sheet (20) is electrically connected with the first component (30), the second component (40) and the third component (50), and the other side of the metal elastic sheet (20) is electrically connected with the lead (60).

3. The semiconductor device package on package structure of claim 1, wherein: one end of the lead (60) is connected with the control circuit of the substrate (10) in a soldering mode, and the other end of the lead (60) is connected with the metal elastic sheet (20) in a soldering mode.

4. The semiconductor device package on package structure of claim 1, wherein: and a plastic package (70) is bonded on one side of the surface of the substrate (10) surrounding the first frame (11), the second frame (12) and the third frame (13).

5. The semiconductor device package on package structure of claim 1, wherein: the positive electrode end and the negative electrode end of the first component (30), the second component (40) and the third component (50) are all in contact with the metal elastic sheet (20).