CN214473766U - Device for testing LIV curve of LED chip - Google Patents
Device for testing LIV curve of LED chip Download PDFInfo
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- CN214473766U CN214473766U CN202120411043.4U CN202120411043U CN214473766U CN 214473766 U CN214473766 U CN 214473766U CN 202120411043 U CN202120411043 U CN 202120411043U CN 214473766 U CN214473766 U CN 214473766U
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Abstract
The utility model provides a device for testing LIV curve of LED chip, which comprises a circuit board, an optical flat plate, a connecting piece, a data acquisition device, a processor, a temperature changing device and an LED chip fixing device; the temperature changing device comprises a semiconductor refrigerator and a copper plate; the copper plate covers the semiconductor refrigerator, the circuit board, the semiconductor refrigerator and the copper plate are sequentially connected, and one side of the circuit board, which is far away from the semiconductor refrigerator, is fixed on the optical flat plate; the LED chip fixing device is arranged on the copper plate and is electrically connected with the circuit board; the data acquisition device is fixed on the optical flat plate through the connecting piece; the data acquisition device is connected with the processor, and the processor can generate an LIV curve; the temperature of the LED chip is changed through the temperature changing device, so that the LIV curve at different temperatures is measured.
Description
Technical Field
The utility model relates to a chip detection area especially relates to a device of test LED chip LIV curve.
Background
Gallium nitride based Light Emitting Diodes (LEDs) have the advantages of low loss of function, long life, good reliability, etc., and are therefore widely used in the fields of signal lamps, backlight displays, automotive lighting, indoor lighting, etc. With the popularization and application of high-power and high-luminous-efficiency LEDs, the driving current of an LED chip is larger and larger, and even reaches more than 1 ampere, the increase of the driving current inevitably causes the increase of the heat of the chip, and further the light-emitting efficiency is reduced; the heat dissipation of the chip is difficult, the detection of the light emitting efficiency of the chip at high temperature becomes an important dimension for evaluating the performance of the LED chip under large driving current, the test of the light emitting efficiency of the LED chip becomes necessary test content, and the light emitting efficiency can be easily monitored by testing an LIV (light intensity-current-voltage) curve of the chip.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the device for testing the LIV curve of the LED chip is provided, and the LIV curve of the LED chip at different temperatures can be detected.
In order to solve the technical problem, the utility model discloses a technical scheme be:
a device for testing an LIV curve of an LED chip comprises a circuit board, an optical flat plate, a connecting piece, a data acquisition device, a processor, a temperature changing device and an LED chip fixing device;
the temperature changing device comprises a semiconductor refrigerator and a copper plate;
the copper plate covers the semiconductor refrigerator, the circuit board, the semiconductor refrigerator and the copper plate are sequentially connected, and one side of the circuit board, which is far away from the semiconductor refrigerator, is fixed on the optical flat plate;
the LED chip fixing device is arranged on the copper plate and is electrically connected with the circuit board;
the data acquisition device is fixed on the optical flat plate through the connecting piece;
the data acquisition device is connected with the processor, and the processor can generate an LIV curve.
Further, the system also comprises a console;
the control console is respectively connected with the connecting piece and the semiconductor refrigerator.
Further, the connecting piece comprises a first sub-piece, a second sub-piece and a third sub-piece;
the first sub-piece is fixed on the optical flat plate, and the second sub-piece is movably connected with the first sub-piece and forms a preset angle with the first sub-piece;
the third sub-part is movably connected with the second sub-part;
the third sub-part is connected with the data acquisition device.
Further, the data acquisition device is an integrating sphere.
Further, still include the electric current source, the circuit board is connected with the electric current source.
Further, the LED chip fixing device comprises a plurality of LED chip brackets.
The beneficial effects of the utility model reside in that: the copper covers the semiconductor cooler, and be provided with LED chip fixing device on the copper, can place the LED chip on the LED chip fixing device, the temperature of semiconductor cooler is conducted on the LED chip through the copper, can change the operating temperature of LED chip, the circuit board is connected with LED chip fixing device, for fixing LED chip power supply messenger LED on it gets into operating condition, data acquisition device is fixed in on the optics flat board through the connecting piece, can gather the data of LED chip and convey the treater, generate the LIV curve that the LED chip corresponds by the treater, realize the measurement to the LIV curve under the different temperatures of LED chip through the temperature that changes the semiconductor cooler.
Drawings
Fig. 1 is a schematic structural diagram of an apparatus for testing an LIV curve of an LED chip according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a power supply current, a circuit board, a connecting member and a data acquisition device according to an embodiment of the present invention;
fig. 3 is a schematic view of a connection structure of a circuit board, a semiconductor cooler, a copper plate and a LED chip fixing device according to an embodiment of the present invention;
description of reference numerals:
1. an optical flat plate; 2. a connecting member; 2.1, a first sub-part; 2.2 second, 2.3 third; 3. a circuit board; 4. a semiconductor refrigerator; 5. a copper plate; 6. an LED chip fixing device; 7. an LED chip; 8. an integrating sphere; 9. a current source; 10. a processor; 11. a console.
Detailed Description
In order to explain the technical content, the objects and the effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, a device for testing an LIV curve of an LED chip includes a circuit board, an optical flat, a connector, a data acquisition device, a processor, a temperature varying device, and an LED chip fixing device;
the temperature changing device comprises a semiconductor refrigerator and a copper plate;
the copper plate covers the semiconductor refrigerator, the circuit board, the semiconductor refrigerator and the copper plate are sequentially connected, and one side of the circuit board, which is far away from the semiconductor refrigerator, is fixed on the optical flat plate;
the LED chip fixing device is arranged on the copper plate and is electrically connected with the circuit board;
the data acquisition device is fixed on the optical flat plate through the connecting piece;
the data acquisition device is connected with the processor, and the processor can generate an LIV curve.
From the above description, the beneficial effects of the present invention are: the copper covers the semiconductor cooler, and be provided with LED chip fixing device on the copper, can place the LED chip on the LED chip fixing device, the temperature of semiconductor cooler is conducted on the LED chip through the copper, can change the operating temperature of LED chip, the circuit board is connected with LED chip fixing device, for fixing LED chip power supply messenger LED on it gets into operating condition, data acquisition device is fixed in on the optics flat board through the connecting piece, can gather the data of LED chip and convey the treater, generate the LIV curve that the LED chip corresponds by the treater, realize the measurement to the LIV curve under the different temperatures of LED chip through the temperature that changes the semiconductor cooler.
Further, the system also comprises a console;
the control console is respectively connected with the connecting piece and the semiconductor refrigerator.
As can be seen from the above description, the console is connected to the connecting member and the semiconductor refrigerator, and can control the movement of the connecting member so that the data acquisition device on the connecting member can more comprehensively acquire the relevant data of the LED chip on the LED chip fixing device; and the temperature of the semiconductor refrigerator can be further adjusted through the control console to realize the test of the LED chip data at different temperatures.
Further, the connecting piece comprises a first sub-piece, a second sub-piece and a third sub-piece;
the first sub-piece is fixed on the optical flat plate, and the second sub-piece is movably connected with the first sub-piece and forms a preset angle with the first sub-piece;
the third sub-part is movably connected with the second sub-part;
the third sub-part is connected with the data acquisition device.
According to the description, the connecting piece is composed of the three movably connected components, the data acquisition device is driven to move, the two-dimensional coverage area is wide, and the data of the LED chips arranged on the LED chip fixing devices at different positions on the copper plate can be acquired.
Further, the data acquisition device is an integrating sphere.
As can be seen from the above description, the integrating sphere is used as an acquisition device, and the integrating sphere can realize the measurement of light, so as to obtain the required data to calculate the LIV curve of the LED chip.
Further, still include the electric current source, the circuit board is connected with the electric current source.
According to the above description, the circuit board is electrically connected with the LED chip fixing device, the current source connected with the circuit board can provide a stable and adjustable power supply for the LED chip fixing device, power supply for LED chips of different models is realized, and the LED chips of different models can be tested.
Further, the LED chip fixing device comprises a plurality of LED chip brackets.
According to the description, the plurality of LED chip supports are arranged, so that data of the plurality of LED chips can be collected simultaneously, and the efficiency of testing the LED chips is improved.
Referring to fig. 1 to fig. 3, a first embodiment of the present invention is:
a device for testing an LIV curve of an LED chip comprises a circuit board 3, an optical flat plate 1, a connecting piece 2, a data acquisition device, a processor 10, a temperature changing device, an LED chip fixing device 6, a console 11 and a current source 9;
the temperature changing device comprises a semiconductor refrigerator 4 and a copper plate 5;
the copper plate 5 covers the semiconductor refrigerator 4, the circuit board 3, the semiconductor refrigerator 4 and the copper plate 5 are sequentially connected, and one side of the circuit board 3, which is far away from the semiconductor refrigerator 4, is fixed on the optical flat plate 1;
the circuit board 3 is connected with the current source 9;
in an alternative embodiment, the number of power supply streams 9 is 2;
the LED chip fixing device 6 is arranged on the copper plate 5, and the LED chip fixing device 6 is electrically connected with the circuit board 3;
the LED chip fixing device 6 includes a plurality of LED chip holders;
the data acquisition device passes through connecting piece 2 is fixed in on the optical flat plate, it is specific: the connecting piece comprises a first sub-piece 2.1, a second sub-piece 2.2 and a third sub-piece 2.3; the first sub-part 2.1 is fixed on the optical flat plate 1, and the second sub-part 2.2 is movably connected with the first sub-part 2.1 and forms a preset angle with the first sub-part 2.1; the third part 2.3 is movably connected with the second part 2.2; the third sub-part 2.3 is connected with the data acquisition device;
in an optional embodiment, an included angle between the first sub-piece and the second sub-piece is 90 degrees, an included angle between the second sub-piece and the third sub-piece is 90 degrees, the second sub-piece is provided with a first threaded hole, the first sub-piece is provided with a first threaded rod, and the first threaded hole and the first threaded rod are matched to realize movable connection between the first sub-piece and the second sub-piece; a second threaded hole is formed in the third sub-piece, a second threaded rod is arranged on the second sub-piece, and the second threaded hole is matched with the second threaded rod to realize movable connection between the second sub-piece and the third sub-piece;
the data acquisition device is connected with the processor 10, and the processor 10 can generate an LIV curve;
the console 11 is respectively connected with the connecting piece and the semiconductor refrigerator;
in an alternative embodiment, the console 11 includes a semiconductor refrigeration controller and a displacement stage controller;
in an alternative embodiment, the data acquisition device is an integrating sphere 8;
in an alternative embodiment, the LED chip mount is a TO mount;
in an alternative embodiment, the processor 10 is a computer;
when the device for testing the LIV curve of the LED chip works, the control console controls the semiconductor refrigerator to set the temperature, and the semiconductor refrigerator transmits the temperature to the LED chip on the LED chip bracket through the copper plate; meanwhile, the current source supplies power to the LED chips on the LED chip supports through the circuit board to enable the LED chips to emit light, the control console controls the sub-pieces of the connecting piece to move and adjust the positions of the integrating spheres connected on the connecting piece, so that the integrating spheres can collect the light intensity of different LED chips on the LED chip supports and light an LED chip on the LED chip fixing device each time to collect the light intensity, the situation that the collected light intensity precision is influenced by the fact that the multiple LEDs emit light simultaneously is avoided, the integrating spheres transmit data to the processor after photoelectric conversion to process the data to generate LIV curves corresponding to the LED chips, and particularly, the curves of the light intensity changing along with the current and the curves of the voltage changing along with the current are calculated simultaneously; the temperature of the semiconductor refrigerator is changed through the console, and the LIV curves of the LED chip at different temperatures can be tested.
To sum up, the device for testing the LIV curve of the LED chip provided by the utility model is provided with a semiconductor refrigerator, a copper plate is covered on the semiconductor refrigerator, an LED chip fixing device is arranged on the copper plate for placing the LED chip, the LED chip device is connected with a circuit board, and the circuit board is connected with a current source; the circuit board is fixed on the optical flat plate, the integrating sphere is used as a data acquisition device and is fixed on the optical flat plate through a movable connecting piece, the integrating sphere is connected with the processor, and a control console is arranged to be connected with the connecting piece and the semiconductor refrigerator; the LED chip fixing device comprises a circuit board, a control console, a connecting piece, a processor and a plurality of LED chip supports, wherein the circuit board is used for supplying power to an LED chip on the LED chip fixing device through a current source, the control console can adjust the temperature of a semiconductor refrigerator and transmit the temperature to the LED chip on the LED chip fixing device through a copper plate, the connecting piece is adjusted to change the position of the integrating sphere to acquire the data of the LED chip, the processor calculates the LIV curve corresponding to the LED chip, and the LED chip fixing device is a plurality of LED chip supports and can measure the LIV curve of the LED chip in batches.
The above mentioned is only the embodiment of the present invention, and not the limitation of the patent scope of the present invention, all the equivalent transformations made by the contents of the specification and the drawings, or the direct or indirect application in the related technical field, are included in the patent protection scope of the present invention.
Claims (6)
1. A device for testing an LIV curve of an LED chip is characterized by comprising a circuit board, an optical flat plate, a connecting piece, a data acquisition device, a processor, a temperature changing device and an LED chip fixing device;
the temperature changing device comprises a semiconductor refrigerator and a copper plate;
the copper plate covers the semiconductor refrigerator, the circuit board, the semiconductor refrigerator and the copper plate are sequentially connected, and one side of the circuit board, which is far away from the semiconductor refrigerator, is fixed on the optical flat plate;
the LED chip fixing device is arranged on the copper plate and is electrically connected with the circuit board;
the data acquisition device is fixed on the optical flat plate through the connecting piece;
the data acquisition device is connected with the processor, and the processor can generate an LIV curve.
2. The apparatus of claim 1, further comprising a console;
the control console is respectively connected with the connecting piece and the semiconductor refrigerator.
3. The apparatus of claim 1, wherein the connecting member comprises a first sub-member, a second sub-member and a third sub-member;
the first sub-piece is fixed on the optical flat plate, and the second sub-piece is movably connected with the first sub-piece and forms a preset angle with the first sub-piece;
the third sub-part is movably connected with the second sub-part;
the third sub-part is connected with the data acquisition device.
4. The apparatus of claim 1, wherein the data collection device is an integrating sphere.
5. The apparatus of claim 1, further comprising a current source, wherein the circuit board is connected to the current source.
6. The apparatus of claim 1, wherein the LED chip holder comprises a plurality of LED chip holders.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202120411043.4U CN214473766U (en) | 2021-02-24 | 2021-02-24 | Device for testing LIV curve of LED chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202120411043.4U CN214473766U (en) | 2021-02-24 | 2021-02-24 | Device for testing LIV curve of LED chip |
Publications (1)
Publication Number | Publication Date |
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CN214473766U true CN214473766U (en) | 2021-10-22 |
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CN202120411043.4U Active CN214473766U (en) | 2021-02-24 | 2021-02-24 | Device for testing LIV curve of LED chip |
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CN (1) | CN214473766U (en) |
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2021
- 2021-02-24 CN CN202120411043.4U patent/CN214473766U/en active Active
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