CN102680878B - Experiment method of junction temperature of LED (light emitting diode) - Google Patents
Experiment method of junction temperature of LED (light emitting diode) Download PDFInfo
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- CN102680878B CN102680878B CN201210170658.8A CN201210170658A CN102680878B CN 102680878 B CN102680878 B CN 102680878B CN 201210170658 A CN201210170658 A CN 201210170658A CN 102680878 B CN102680878 B CN 102680878B
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Abstract
The invention provides an experiment method of junction temperature of LED (light emitting diode). The characteristic that an integrated packaged LED is fast in heat conduction is mainly utilized; after the LED, an integrating sphere in contact with the LED and a connecting bracket are at a constant temperature and under the condition that the LED is refrigerated effectively in a lightening test, the temperature of a substrate is controlled to be at fluctuation within a small range during the measuring time by utilizing the characteristic of dynamic balance of the junction temperature of the integrated packaged substrate and the LED within the time section, so that the temperature of the integrated packaged substrate is used for taking the place of the junction temperature of the LED; the temperature of the substrate is measured using a temperature measuring device, and the temperature is approximate to the junction temperature; and the lighting effect, the luminous flux and the color coordinate of an LED light source under the junction temperature are obtained using a spectrum analyzer. According to the experiment method provided by the invention, as the temperature of the integrated packaged substrate is used for taking the place of the junction temperature of the LED, both the difficulty in testing the junction temperature directly is avoided, and a larger error in existing junction temperature testing is prevented; such approximate testing under the conditions is accurate, reliable, convenient and simple; and a set of simple and practical scheme for research in solving the junction temperature is provided; and the experiment method is used in research, development, production and other institutions of the LED.
Description
Technical field
The present invention relates to LED photovoltaic parameter study method field, particularly relate to a kind of experimental technique of LED junction temperature.
Background technology
LED(Light Emitting Diode) be that the English of light emitting diode is write a Chinese character in simplified form, be a kind of luminescent device of spontaneous radiation.Principle of luminosity is electroluminescence.It has that volume is little, the life-span is grown, be swift in response, power consumption is little, the feature such as safe and reliable, has been commonly used on the equipment such as backlight, illumination, instruction.The forth generation light source replacing conventional incandescent, fluorescent light, high-voltage gas discharging light will be become.
Conventional LED photovoltaic research method is placed in integrating sphere by packaged LED, after setting constant current source size, lights LED, spectroanalysis instrument is used to obtain its photoelectric parameter at PC end, through repetitive measurement, draw one group of data, carry out drawing or do table to analyze contrast.
LED junction temperature to decline etc. to the light efficiency of LED, light decay, look significant impact, and being the key problem of LED development, is foothold, the starting point of LED performance study and development to the research of LED junction temperature.Because the inner PN junction temperature of LED chip is difficult to test, external temperature acquisition approximate junction temperature is measured so usually adopt, there is the large thermal resistance heat radiation bottleneck of support and aluminium base formation in conventional LED, causes LED junction temperature and external testing temperature deviation comparatively large, make experimental result there is comparatively big error.
Summary of the invention
The object of the present invention is to provide a kind of experimental technique of LED junction temperature, be difficult to test to solve in traditional junction temperature research method and control junction temperature, there is the comparatively defect such as big error; Experimental technique of the present invention accurately and reliably, conveniently succinctly, for the research solving junction temperature provides a set of simple and practical scheme, can be widely used in the mechanisms such as LED research and development, production.
To achieve these goals, present invention employs following technical scheme:
1) by LED chip die bond on integrative packaging substrate, then by beat gold thread, some powder and some glue integrated LED light source is encapsulated to obtain to LED chip;
2) carry out temperature to the integrating sphere of integrated LED light source, spectroanalysis instrument and test bracket to control to reach identical steady temperature;
3) through step 2) after, integrated LED light source is put into test bracket;
4) opening power, makes integrated LED light source work, then opens spectroanalysis instrument and carries out spectrum test, uses cooling installation to lower the temperature to integrative packaging substrate, integrating sphere and test bracket in spectrum test;
5) thermometric facility is utilized to detect the temperature of integrative packaging substrate before and after spectrum test, and record, preserve the spectrum test data of spectroanalysis instrument;
6) step 2 is repeated)-5), obtain the spectrum test data of integrated LED light source under different integrative packaging substrate temperatures.
Described integrative packaging substrate is that reeded low thermal resistance sheet metal is offered on surface, low thermal resistance metal sheet surface after oxide isolated process by LED chip die bond in groove.
Described low thermal resistance sheet metal is aluminium sheet or copper coin.
Described test bracket comprises the side plate offering round hole and the clamp be connected with side plate, and clamp is provided with draw-in groove, and integrated LED light source is arranged in draw-in groove, and the exiting surface of integrated LED light source is relative with round hole.
Described temperature controls to adopt Temperature drop in refrigerator or baking oven heating.
Described cooling installation is semiconductor cooler, controls its cooling-down effect by controlling its input voltage.
Described thermometric facility is thermopair or thermal resistance thermometer.
Described spectroanalysis instrument is PMS-80 or PMS-50 spectroanalysis instrument, and regulates spectrum test width to maximum.
The present invention has following technique effect: the present invention mainly make use of the fast feature of the heat conduction of integrated packaging LED, after the integrating sphere making LED and contact thereof and test bracket constant temperature, light in test under its condition of effectively freezing at LED, utilize the feature of integrative packaging substrate temperature and the mobile equilibrium of LED junction temperature in this period, substrate temperature can be controlled carrying out fluctuation within a narrow range in Measuring Time, LED junction temperature is replaced with integrative packaging substrate temperature, thermometric facility is used to draw substrate temperature, be approximately junction temperature, spectroanalysis instrument is used to draw the light efficiency of integrated LED light source under this junction temperature, luminous flux, chromaticity coordinates.The invention has the advantages that and use integrative packaging substrate temperature to replace LED junction temperature, both there is no the difficulty that direct junction temperature is tested also there is not the big error that tradition surveys junction temperature indirectly.This approximate measure is under these conditions, accurately and reliably, convenient succinct, and for the research solving junction temperature provides a set of simple and practical scheme, the present invention can be widely used in LED research and development, the mechanisms such as production.
Accompanying drawing explanation
Fig. 1 is the principle schematic of experimental technique of the present invention;
Fig. 2 is one of structural representation of test bracket;
Fig. 3 is the structural representation two of test bracket;
Fig. 4 is the connection diagram of test bracket and integrating sphere;
In figure: 1, integrated LED light source, 2, test bracket, 3, thermometric facility, 4, integrating sphere, 5, spectroanalysis instrument, 6, power supply, 7, PC, 8, cooling installation, 9, side plate, 10, clamp, 11, round hole.
Embodiment
Below in conjunction with accompanying drawing, the invention will be further described.
See Fig. 1,1) by LED chip die bond on integrative packaging substrate, then by beating gold thread (making LED chip be electrically connected with electrode), some powder and putting glue, integrated LED light source 1 is encapsulated to obtain to LED chip, described integrative packaging substrate is that reeded low thermal resistance sheet metal is offered on surface, low thermal resistance metal sheet surface after oxide isolated process by LED chip die bond in groove; Described low thermal resistance sheet metal is aluminium sheet or copper coin; 2) carry out temperature to the integrating sphere 4 of integrated LED light source 1, spectroanalysis instrument 5 and test bracket 2 to control to reach identical steady temperature; Described temperature controls to adopt Temperature drop in refrigerator or baking oven heating; 3) through step 2) after, integrated LED light source 1 is put into test bracket 2; 4) opening power 6, makes integrated LED light source 1 work, and then opens spectroanalysis instrument 5 and carries out spectrum test, uses cooling installation 8 pairs of integrative packaging substrates, integrating sphere 4 and test bracket 2 to lower the temperature in spectrum test; Described cooling installation 8 is semiconductor cooler, controls its cooling-down effect by controlling its input voltage; 5) thermometric facility 3 is utilized to detect the temperature of integrative packaging substrate before and after spectrum test, and record, preserve the spectrum test data of spectroanalysis instrument; Described thermometric facility 3 is thermopair or thermal resistance thermometer; 6) step 2 is repeated)-5), obtain the spectrum test data of integrated LED light source 1 under different integrative packaging substrate temperatures; Described spectroanalysis instrument 5 is PMS-80 or PMS-50 spectroanalysis instrument, and regulates spectrum test width to maximum.
See Fig. 2, Fig. 3 and Fig. 4, described test bracket 2 comprises the side plate 9 offering round hole 11 and the clamp 10 be connected with side plate 9, clamp 10 is provided with draw-in groove, and integrated LED light source 1 is arranged in draw-in groove, and the exiting surface of integrated LED light source 1 is relative with round hole 11; Integrated LED light source is 5 × 5 × 1cm
3square, described test bracket 2 is fixed by screw and integrating sphere 4.Be positioned at the irradiation of round hole 11 for integrated LED light source 1 at test bracket center, integrated LED light source is stuck in the draw-in groove of support, is reliably fixed by screw.
First research LED junction temperature needs to control junction temperature, and junction temperature is fluctuated among a small circle, just can be similar to optical parametric corresponding under obtaining this junction temperature, and then carries out next step research.First the present invention completes the integrated LED light source based on integrative packaging substrate, uses test bracket to be connected with integrating sphere by integrated LED light source; Integrated LED light source under using power supply to light constant temperature; Use cooling installation to lower the temperature, and use spectrometer to test, in PC 7 end recording optically parameter after testing; Use the temperature of the test integrated base plate for packaging of thermometric facility, take multiple measurements the optical parametric under the different junction temperature of acquisition, and then carry out data analysis.
Because there is the large thermal resistance that support and substrate formed in conventional LED causes heat radiation bottleneck, cause LED junction temperature and external testing temperature deviation larger.So the breach of problem is just that control junction temperature is constant, then during measuring, its temperature of Measurement accuracy.The present invention be by direct for LED chip die bond on integrative packaging substrate, there is not the heat radiation bottleneck that support etc. is formed in the LED due to integrative packaging, so its thermal resistance is low, add the substrate of the large substrate such as the specific heat capacity that uses pure aluminum plate as integrative packaging, and with LED chip by the straight surfaces brought into contact of heat conduction elargol, use cooling installation to lower the temperature to surrounding enviroment simultaneously, the heat that LED chip is produced derives at a high speed and is absorbed by cooling installation, once LED junction temperature is higher than aluminium sheet temperature, will be reduced to rapidly identical with aluminium sheet temperature, under this mobile equilibrium, within the scope of certain hour, the plate temperature of integrative packaging substrate is approximately the junction temperature of LED chip.
Here is the one group of data surveyed by the present invention;
The foregoing is only one embodiment of the present invention, it not whole or unique embodiment, the conversion of those of ordinary skill in the art by reading instructions of the present invention to any equivalence that technical solution of the present invention is taked, is claim of the present invention and contains.
Claims (6)
1. an experimental technique for LED junction temperature, is characterized in that: comprise the steps:
1) by LED chip die bond on integrative packaging substrate, then by beat gold thread, some powder and some glue integrated LED light source (1) is encapsulated to obtain to LED chip;
2) carry out temperature to the integrating sphere (4) of integrated LED light source (1), spectroanalysis instrument (5) and test bracket (2) to control to reach identical steady temperature;
3) through step 2) after, integrated LED light source (1) is put into test bracket (2);
4) opening power (6), integrated LED light source (1) is worked, then open spectroanalysis instrument (5) and carry out spectrum test, in spectrum test, use cooling installation (8) to lower the temperature to integrative packaging substrate, integrating sphere (4) and test bracket (2); Cooling installation is used to lower the temperature, the heat that LED chip is produced derives at a high speed and is absorbed by cooling installation, once LED junction temperature is higher than described substrate temperature, will be reduced to rapidly identical with described substrate temperature, under this mobile equilibrium, within the scope of certain hour, the plate temperature of integrative packaging substrate is approximately the junction temperature of LED chip;
5) thermometric facility (3) is utilized to detect the temperature of integrative packaging substrate before and after spectrum test, and record, preserve the spectrum test data of spectroanalysis instrument;
6) step 2 is repeated)-5), obtain the spectrum test data of integrated LED light source (1) under different integrative packaging substrate temperatures;
Described integrative packaging substrate is that reeded low thermal resistance sheet metal is offered on surface, low thermal resistance metal sheet surface after oxide isolated process by LED chip die bond in groove;
Described low thermal resistance sheet metal is aluminium sheet or copper coin.
2. the experimental technique of a kind of LED junction temperature according to claim 1, it is characterized in that: described test bracket (2) comprises the side plate (9) offering round hole (11) and the clamp (10) be connected with side plate (9), (10) are provided with draw-in groove to clamp, integrated LED light source (1) is arranged in draw-in groove, and the exiting surface of integrated LED light source (1) is relative with round hole (11).
3. the experimental technique of a kind of LED junction temperature according to claim 1, is characterized in that: described temperature controls to adopt Temperature drop in refrigerator or baking oven heating.
4. the experimental technique of a kind of LED junction temperature according to claim 1, is characterized in that: described cooling installation (8) is semiconductor cooler.
5. the experimental technique of a kind of LED junction temperature according to claim 1, is characterized in that: described thermometric facility (3) is thermopair or thermal resistance thermometer.
6. the experimental technique of a kind of LED junction temperature according to claim 1, is characterized in that: described spectroanalysis instrument (5) is PMS-80 or PMS-50 spectroanalysis instrument, and regulates spectrum test width to maximum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210170658.8A CN102680878B (en) | 2012-05-29 | 2012-05-29 | Experiment method of junction temperature of LED (light emitting diode) |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210170658.8A CN102680878B (en) | 2012-05-29 | 2012-05-29 | Experiment method of junction temperature of LED (light emitting diode) |
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| CN102680878A CN102680878A (en) | 2012-09-19 |
| CN102680878B true CN102680878B (en) | 2015-04-22 |
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| RU2521119C1 (en) * | 2012-12-26 | 2014-06-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" | Method of inspecting quality of led structure |
| CN103217229B (en) * | 2013-03-26 | 2017-03-01 | 广东工业大学 | A kind of junction temperature measurement method of light emitting diode and application |
| CN105101517B (en) * | 2014-05-21 | 2019-11-29 | 常州市武进区半导体照明应用技术研究院 | The configuration equipment and system of lamps and lanterns driving parameter |
| CN109060164B (en) * | 2018-09-25 | 2019-12-06 | 厦门大学 | Light-emitting device temperature distribution measuring device and method based on microscopic hyperspectrum |
| CN113670463B (en) * | 2021-08-03 | 2022-09-09 | 西华大学 | White light LED junction temperature and fluorescent glue temperature measuring device |
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| JP4287823B2 (en) * | 2005-01-27 | 2009-07-01 | シャープ株式会社 | LED pre-processing apparatus and LED pre-processing method |
| CN201212842Y (en) * | 2008-04-11 | 2009-03-25 | 中国科学院广州电子技术研究所 | Large power LED junction temperature measurement device |
| TWI404923B (en) * | 2008-07-07 | 2013-08-11 | Ind Tech Res Inst | Standard Test Method for PN Joint Temperature of Light Emitting Diodes |
| CN101614592A (en) * | 2009-07-24 | 2009-12-30 | 中国科学院上海技术物理研究所 | A kind of detection method of LED lighting chips junction temperature |
| CN102394266A (en) * | 2011-11-30 | 2012-03-28 | 陕西科技大学 | Curable adhesive type light emitting diode (LED) dispensing structure |
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