CN102680878A - Experiment method of junction temperature of LED (light emitting diode) - Google Patents
Experiment method of junction temperature of LED (light emitting diode) Download PDFInfo
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- CN102680878A CN102680878A CN2012101706588A CN201210170658A CN102680878A CN 102680878 A CN102680878 A CN 102680878A CN 2012101706588 A CN2012101706588 A CN 2012101706588A CN 201210170658 A CN201210170658 A CN 201210170658A CN 102680878 A CN102680878 A CN 102680878A
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Abstract
The invention provides an experiment method of junction temperature of LED (light emitting diode). The characteristic that an integrated packaged LED is fast in heat conduction is mainly utilized; after the LED, an integrating sphere in contact with the LED and a connecting bracket are at a constant temperature and under the condition that the LED is refrigerated effectively in a lightening test, the temperature of a substrate is controlled to be at fluctuation within a small range during the measuring time by utilizing the characteristic of dynamic balance of the junction temperature of the integrated packaged substrate and the LED within the time section, so that the temperature of the integrated packaged substrate is used for taking the place of the junction temperature of the LED; the temperature of the substrate is measured using a temperature measuring device, and the temperature is approximate to the junction temperature; and the lighting effect, the luminous flux and the color coordinate of an LED light source under the junction temperature are obtained using a spectrum analyzer. According to the experiment method provided by the invention, as the temperature of the integrated packaged substrate is used for taking the place of the junction temperature of the LED, both the difficulty in testing the junction temperature directly is avoided, and a larger error in existing junction temperature testing is prevented; such approximate testing under the conditions is accurate, reliable, convenient and simple; and a set of simple and practical scheme for research in solving the junction temperature is provided; and the experiment method is used in research, development, production and other institutions of the LED.
Description
Technical field
The present invention relates to LED photoelectric parameter research method field, relate in particular to a kind of experimental technique of LED junction temperature.
Background technology
LED (Light Emitting Diode) is that the English of light emitting diode is write a Chinese character in simplified form, and is a kind of luminescent device of spontaneous radiation.Principle of luminosity is an electroluminescence.It has that volume is little, the life-span is grown, be swift in response, power consumption is little, characteristics such as safe and reliable, generally uses on equipment such as backlight, illumination, indication.To become replace conventional incandescent, fluorescent light, high-voltage gas discharging light the 4th generation light source.
LED photoelectricity research method commonly used is that packaged LED is placed in the integrating sphere, set the constant current source size after, light LED; Use spectroanalysis instrument to obtain its photoelectric parameter at the PC end; Through repeatedly measuring, draw one group of data, draw or make table and analyze contrast.
The LED junction temperature declines etc. to light efficiency, light decay, the look of LED has significant impact, is the key problem of LED development, is foothold, the starting point of LED performance study and development to the research of LED junction temperature.Because the inner PN junction temperature of led chip is difficult to test; Measure external temperature acquisition approximate junction temperature so adopt usually; The big thermal resistance heat radiation bottleneck that conventional LED exists support and aluminium base to form causes LED junction temperature and external testing temperature deviation bigger, and experimental result is existed than mistake.
Summary of the invention
The object of the present invention is to provide a kind of experimental technique of LED junction temperature, be difficult to test and control junction temperature in traditional junction temperature research method, exist than defectives such as mistakes to solve; Experimental technique of the present invention accurately and reliably, conveniently succinctly for the research that solves junction temperature provides a cover simple and practical scheme, can be widely used in mechanisms such as LED research and development, production.
To achieve these goals, the present invention has adopted following technical scheme:
1) led chip is solid brilliant on integrated base plate for packaging, then through beat gold thread, some powder and put glue to led chip encapsulate the integral LED light source;
2) integrating sphere and the test bracket to integral LED light source, spectroanalysis instrument carries out temperature control to reach identical steady temperature;
3) through step 2) after, the integral LED light source is put into test bracket;
4) opening power makes the integral LED light source works, opens spectroanalysis instrument then and carries out spectrum test, uses cooling installation that integrated base plate for packaging, integrating sphere and test bracket are lowered the temperature in the spectrum test;
5) utilize the thermometric facility to detect the temperature of integrated base plate for packaging before and after the spectrum test, and record, the spectrum test data of preserving spectroanalysis instrument;
6) repeating step 2)-5), obtain the spectrum test data of integrated led light source under the different integrated base plate for packaging temperature.
Said integrated base plate for packaging is that reeded low thermal resistance sheet metal is offered on the surface, and is after the low thermal resistance metal sheet surface is handled through oxide isolated that led chip is solid brilliant in groove.
Said low thermal resistance sheet metal is aluminium sheet or copper coin.
Said test bracket comprises side plate that offers round hole and the clamp that links to each other with side plate, and clamp is provided with draw-in groove, and the integral LED light source is arranged in the draw-in groove, and the exiting surface and the round hole of integral LED light source are relative.
Refrigerator cooling or baking oven for heating are adopted in said temperature control.
Said cooling installation is a semiconductor cooler, through controlling its its cooling-down effect of input voltage control.
Said thermometric facility is thermopair or thermal resistance thermometer.
Said spectroanalysis instrument is PMS-80 or PMS-50 spectroanalysis instrument, and regulates the spectrum test width to maximum.
The present invention has following technique effect: the present invention has mainly utilized the fast characteristics of the heat conduction of integrated packaging LED, make the integrating sphere and test bracket constant temperature of LED and contact thereof after, light in the test it effectively under condition of refrigeration at LED; Utilize the characteristics of integrated base plate for packaging temperature and the mobile equilibrium of LED junction temperature in this period; The fluctuation within a narrow range in carrying out Measuring Time of may command substrate temperature replaces the LED junction temperature with integrated base plate for packaging temperature, uses the thermometric facility to draw substrate temperature; Be approximately junction temperature; The use spectroanalysis instrument draws the light efficiency of integrated led light source under this junction temperature, luminous flux, chromaticity coordinates.The invention has the advantages that and use integrated base plate for packaging temperature to replace the LED junction temperature, both do not had the difficulty of direct junction temperature test, also do not exist tradition to survey the mistake of junction temperature indirectly.This approximate measure under these conditions, and is convenient succinct accurately and reliably, and for the research that solves junction temperature provides a cover simple and practical scheme, the present invention can be widely used in LED research and development, mechanisms such as production.
Description of drawings
Fig. 1 is the principle schematic of experimental technique according to the invention;
Fig. 2 is one of structural representation of test bracket;
Fig. 3 be test bracket structural representation two;
Fig. 4 is a test bracket and the synoptic diagram that is connected of integrating sphere;
Among the figure: 1, integral LED light source, 2, test bracket, 3, the thermometric facility, 4, integrating sphere, 5, spectroanalysis instrument, 6, power supply, 7, PC, 8, cooling installation, 9, side plate, 10, clamp, 11, round hole.
Embodiment
Below in conjunction with accompanying drawing the present invention is described further.
Referring to Fig. 1; 1) led chip is solid brilliant on integrated base plate for packaging; Then through beat gold thread (led chip is connected with electrode electricity), the some powder and the some glue to led chip encapsulate integral LED light source 1; Said integrated base plate for packaging is that reeded low thermal resistance sheet metal is offered on the surface, and is after the low thermal resistance metal sheet surface is handled through oxide isolated that led chip is solid brilliant in groove; Said low thermal resistance sheet metal is aluminium sheet or copper coin; 2) integrating sphere 4 and the test bracket 2 to integral LED light source 1, spectroanalysis instrument 5 carries out temperature control to reach identical steady temperature; Refrigerator cooling or baking oven for heating are adopted in said temperature control; 3) through step 2) after, integral LED light source 1 is put into test bracket 2; 4) opening power 6, make 1 work of integral LED light source, open spectroanalysis instrument 5 then and carry out spectrum test, use 8 pairs of integrated base plate for packaging of cooling installation, integrating sphere 4 and test bracket 2 to lower the temperature in the spectrum test; Said cooling installation 8 is a semiconductor cooler, through controlling its its cooling-down effect of input voltage control; 5) utilize thermometric facility 3 to detect the temperature of integrated base plate for packaging before and after the spectrum tests, and record, the spectrum test data of preserving spectroanalysis instrument; Said thermometric facility 3 is thermopair or thermal resistance thermometer; 6) repeating step 2)-5), obtain the spectrum test data of integrated led light source 1 under the different integrated base plate for packaging temperature; Said spectroanalysis instrument 5 is PMS-80 or PMS-50 spectroanalysis instrument, and regulates the spectrum test width to maximum.
Referring to Fig. 2, Fig. 3 and Fig. 4; Said test bracket 2 comprises side plate 9 that offers round hole 11 and the clamp 10 that links to each other with side plate 9; Clamp 10 is provided with draw-in groove, and integral LED light source 1 is arranged in the draw-in groove, and the exiting surface of integral LED light source 1 is relative with round hole 11; The integral LED light source is 5 * 5 * 1cm
3Square, said test bracket 2 is fixed through screw and integrating sphere 4.Be positioned at the irradiation that test bracket central circular perforate 11 is used for integral LED light source 1, the integral LED light source is stuck in the draw-in groove of support, through the screw secure fixation.
Research LED junction temperature at first need be controlled junction temperature, and junction temperature is fluctuateed among a small circle, just can be similar to and obtain optical parametric corresponding under this junction temperature, and then carry out next step research.The present invention at first accomplishes the integral LED light source based on integrated base plate for packaging, and the use test support is connected the integral LED light source with integrating sphere; Use power supply to light the integral LED light source under the constant temperature; Use cooling installation to lower the temperature, and use spectrometer to test, test the back in PC 7 end recording optically parameters; Use the temperature of the test integrated base plate for packaging of thermometric facility, take multiple measurements the optical parametric that obtains under the different junction temperatures, and then carry out data analysis.
Because the big thermal resistance that conventional LED exists support and substrate to form has caused the heat radiation bottleneck, cause LED junction temperature and external testing temperature deviation bigger.So it is constant that the breach of problem just is to control junction temperature, during measuring, accurately measure its temperature then.The present invention is that led chip is directly solid brilliant on integrated base plate for packaging, because the heat radiation bottleneck that integrated encapsulated LED does not exist support etc. to form, so its thermal resistance is low; Add the substrate of big substrate such as the specific heat capacity of using pure aluminum plate, and contact through the direct face of heat conduction elargol, use cooling installation to lower the temperature to surrounding enviroment simultaneously with led chip as integrated encapsulation; The heat that makes led chip produce derives at a high speed and is absorbed by cooling installation; In case the LED junction temperature is higher than the aluminium sheet temperature, will be reduced to rapidly identical with the aluminium sheet temperature, under this mobile equilibrium; In the certain hour scope, the plate temperature of integrated base plate for packaging is approximately the junction temperature of led chip.
Be one group of data surveying by the present invention below;
The above is merely one embodiment of the present invention; It or not whole or unique embodiment; The conversion of any equivalence that those of ordinary skills take technical scheme of the present invention through reading instructions of the present invention is claim of the present invention and contains.
Claims (8)
1. the experimental technique of a LED junction temperature is characterized in that: comprise the steps:
1) led chip is solid brilliant on integrated base plate for packaging, then through beat gold thread, some powder and put glue to led chip encapsulate integral LED light source (1);
2) integrating sphere (4) and the test bracket (2) to integral LED light source (1), spectroanalysis instrument (5) carries out temperature control to reach identical steady temperature;
3) through step 2) after, integral LED light source (1) is put into test bracket (2);
4) opening power (6); Make integral LED light source (1) work; Open spectroanalysis instrument (5) then and carry out spectrum test, use cooling installation (8) that integrated base plate for packaging, integrating sphere (4) and test bracket (2) are lowered the temperature in the spectrum test;
5) utilize thermometric facility (3) to detect the temperature of integrated base plate for packaging before and after the spectrum test, and record, the spectrum test data of preserving spectroanalysis instrument;
6) repeating step 2)-5), obtain the spectrum test data of integrated led light source (1) under the different integrated base plate for packaging temperature.
2. according to the experimental technique of the said a kind of LED junction temperature of claim 1, it is characterized in that: said integrated base plate for packaging is that reeded low thermal resistance sheet metal is offered on the surface, and is after the low thermal resistance metal sheet surface is handled through oxide isolated that led chip is solid brilliant in groove.
3. according to the experimental technique of the said a kind of LED junction temperature of claim 2, it is characterized in that: said low thermal resistance sheet metal is aluminium sheet or copper coin.
4. according to the experimental technique of the said a kind of LED junction temperature of claim 1; It is characterized in that: said test bracket (2) comprises side plate (9) that offers round hole (11) and the clamp (10) that links to each other with side plate (9); Clamp (10) is provided with draw-in groove; Integral LED light source (1) is arranged in the draw-in groove, and the exiting surface of integral LED light source (1) and round hole (11) are relative.
5. according to the experimental technique of the said a kind of LED junction temperature of claim 1, it is characterized in that: refrigerator cooling or baking oven for heating are adopted in said temperature control.
6. according to the experimental technique of the said a kind of LED junction temperature of claim 1, it is characterized in that: said cooling installation (8) is a semiconductor cooler.
7. according to the experimental technique of the said a kind of LED junction temperature of claim 1, it is characterized in that: said thermometric facility (3) is thermopair or thermal resistance thermometer.
8. according to the experimental technique of the said a kind of LED junction temperature of claim 1, it is characterized in that: said spectroanalysis instrument (5) is PMS-80 or PMS-50 spectroanalysis instrument, and regulates the spectrum test width to maximum.
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| CN201210170658.8A CN102680878B (en) | 2012-05-29 | 2012-05-29 | Experiment method of junction temperature of LED (light emitting diode) |
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| CN103217229A (en) * | 2013-03-26 | 2013-07-24 | 广东工业大学 | Method for measuring junction temperature of light-emitting diode and application thereof |
| RU2521119C1 (en) * | 2012-12-26 | 2014-06-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" | Method of inspecting quality of led structure |
| CN105101517A (en) * | 2014-05-21 | 2015-11-25 | 常州市武进区半导体照明应用技术研究院 | Configuration equipment and configuration system for lamp driving parameter |
| CN109060164A (en) * | 2018-09-25 | 2018-12-21 | 厦门大学 | Luminescent device temperature distribution measuring apparatus and measurement method based on micro- EO-1 hyperion |
| CN113670463A (en) * | 2021-08-03 | 2021-11-19 | 西华大学 | White light LED junction temperature and fluorescent glue temperature measuring device |
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| RU2521119C1 (en) * | 2012-12-26 | 2014-06-27 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" | Method of inspecting quality of led structure |
| CN103217229A (en) * | 2013-03-26 | 2013-07-24 | 广东工业大学 | Method for measuring junction temperature of light-emitting diode and application thereof |
| CN103217229B (en) * | 2013-03-26 | 2017-03-01 | 广东工业大学 | A kind of junction temperature measurement method of light emitting diode and application |
| CN105101517A (en) * | 2014-05-21 | 2015-11-25 | 常州市武进区半导体照明应用技术研究院 | Configuration equipment and configuration system for lamp driving parameter |
| CN109060164A (en) * | 2018-09-25 | 2018-12-21 | 厦门大学 | Luminescent device temperature distribution measuring apparatus and measurement method based on micro- EO-1 hyperion |
| CN113670463A (en) * | 2021-08-03 | 2021-11-19 | 西华大学 | White light LED junction temperature and fluorescent glue temperature measuring device |
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| CN102680878B (en) | 2015-04-22 |
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