CN214428647U

CN214428647U - Novel SMD LED

Info

Publication number: CN214428647U
Application number: CN202120898138.3U
Authority: CN
Inventors: 索薪涛; 胡娅; 胡松
Original assignee: Dongguan Youshun Photoelectric Co ltd
Current assignee: Dongguan Youshun Photoelectric Co ltd
Priority date: 2021-04-28
Filing date: 2021-04-28
Publication date: 2021-10-19
Anticipated expiration: 2031-04-28

Abstract

The utility model provides a novel SMD LED, including LED support, LED chip and transparent packaging body, the LED support includes electrode foot and transparent base, and transparent base sets firmly on the electrode foot, is equipped with on the transparent base and holds the cup, and the LED chip is located and holds the cup and be connected with the electrode foot electricity, and transparent packaging body is filled in holding the cup, and transparent packaging body and transparent base's material is the same. The utility model discloses a set up the light that transparent base made the LED chip send and can penetrate transparent base and jet out the external world, reduced this light effectively and carried out the number of times that reflects in holding the cup, finally reduced the light loss, improved the light-emitting rate.

Description

Novel SMD LED

Technical Field

The utility model relates to a LED field specifically is a novel SMD LED.

Background

The surface-mounted LED belongs to a point light source, has the advantages of long service life, small volume, high brightness, low heat and the like, and is widely applied to the field of illumination. As shown in fig. 4, in the prior art, a chip-mount LED includes an LED support, an LED chip a2, and an encapsulant A3, where the LED support includes an electrode pin a11 and a base a12, the base a12 is generally made of non-transparent plastic, the electrode pin a11 is fixedly connected to the base a12, a reflective cup a121 is disposed on the base a12, the LED chip a2 is located in the reflective cup a121 and electrically connected to the electrode pin a11 through a gold wire a4, the encapsulant A3 is filled in the reflective cup a121, the encapsulant A3 generally includes glue and phosphor, after the chip-mount LED is powered on, the non-transparent base a12 makes light emitted from the LED chip a2 finally exit to the outside through the upper surface of the encapsulant A3, and this process has a disadvantage that the light may be reflected multiple times in the reflective cup a121, which increases light loss and reduces light emission rate.

Disclosure of Invention

An object of the utility model is to provide a novel SMD LED to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a novel SMD LED, includes LED support, LED chip and transparent packaging body, the LED support includes electrode foot and transparent base, transparent base sets firmly on the electrode foot, be equipped with on the transparent base and hold the cup, the LED chip is located and holds the cup and be connected with the electrode foot electricity, transparent packaging body is filled in holding the cup, transparent packaging body and transparent base's material is the same.

Furthermore, an anti-seepage structure is arranged between the electrode pin and the transparent base.

Further, seepage prevention structure includes recess and arch, the recess is seted up on the electrode foot, the arch is inlayed and is established in the recess, protruding and transparent base structure as an organic whole.

The utility model has the advantages that:

compared with the prior art, the utility model has the advantages that 1, the light emitted by the LED chip can be emitted to the outside through the transparent base by arranging the transparent base, thereby effectively reducing the times of reflection of the light in the accommodating cup, finally reducing the light loss and improving the light-emitting rate; 2. the transparent packaging body and the transparent base are made of the same material, so that the transparent packaging body and the transparent base are easy to combine, the sealing property between the transparent packaging body and the transparent base is improved, and sulfides in air are effectively prevented from entering the containing cup through the transparent packaging body and the transparent base to corrode the electric connection position of the LED chip and the electrode pin, so that the LED chip fails; 3. transparent packaging body and transparent base's refracting index is the same, has reduced the refraction and the reflection that produce when the light of LED chip passed transparent packaging body and transparent base's combination face effectively, makes the utility model discloses a light-emitting angle is rule relatively, and the lens of conveniently arranging is used.

Drawings

FIG. 1: a schematic plan view of a novel patch type LED.

FIG. 2: a schematic A-A section of a novel patch type LED.

FIG. 3: a schematic view-up diagram of a novel patch type LED.

FIG. 4: the overall structure of the prior art is schematic.

Detailed Description

The invention is further explained below with reference to the drawings:

referring to fig. 1 to 3, a novel surface mount LED includes an LED support 1, an LED chip 2 and a transparent package 3, the LED support 1 includes an electrode pin 11 and a transparent base 12, the transparent base 12 is fixed on the electrode pin 11 by injection molding, a receiving cup 121 is disposed on the transparent base 12, the electrode pin 11 includes a positive electrode region 111 and a negative electrode region 112, a partition strip 122 is disposed between the positive electrode region 111 and the negative electrode region 112, the partition strip 122 and the transparent base 12 are in an integral injection molding structure, the LED chip 2 is disposed in the receiving cup 121 and on the partition strip 122, when the LED chip 2 is a positive mounted chip, the positive electrode and the negative electrode of the LED chip 2 are respectively connected to the positive electrode region 111 and the negative electrode region 112 by gold threads, when the LED chip 2 is a positive mounted chip, the positive electrode and the negative electrode of the LED chip 2 are respectively connected to the positive electrode region 111 and the negative electrode region 112 by silver paste, the transparent package 3 is filled in the receiving cup 121, the transparent package 3 and the transparent base 12 are made of the same material, which is a high temperature resistant and transparent silicone or resin or plastic.

An anti-seepage structure is arranged between the electrode pin 11 and the transparent base 12 and is used for prolonging the path of sulfide in the air entering the containing cup 121, so that the probability that the sulfide enters the containing cup 121 to corrode the electric connection position of the LED chip 2 and the electrode pin 11 can be greatly reduced.

The anti-seepage structure comprises a groove and a protrusion 123, the groove is formed in the positive electrode region 111 and the negative electrode region 112, the protrusion 123 and the transparent base 12 are of an integral injection molding structure, and the protrusion is located below the transparent base 12 and embedded in the groove.

The utility model has the advantages that 1, the light emitted by the LED chip 2 can be emitted to the outside through the transparent base 12 by arranging the transparent base 12, thereby effectively reducing the times of reflection of the light in the accommodating cup 121, finally reducing the light loss and improving the light-emitting rate; 2. the transparent packaging body 3 and the transparent base 12 are made of the same material, so that the transparent packaging body and the transparent base are easy to combine, the sealing property between the transparent packaging body 3 and the transparent base 12 is improved, and sulfides in the air are effectively prevented from entering the accommodating cup 121 through the transparent packaging body 3 and the transparent base 12 to corrode the electric connection position of the LED chip 2 and the electrode pin 11, so that the LED chip 2 fails; 3. transparent packaging body 3 is the same with transparent base 12's refracting index, and the refraction and the reflection that produce when the light that has reduced LED chip 2 effectively passes transparent packaging body 3 and transparent base 12's combination face make the utility model discloses a light-emitting angle is rule relatively, and the lens of conveniently arranging uses.

The above is not intended to limit the technical scope of the present invention, and any modifications, equivalent changes and modifications made to the above embodiments according to the technical spirit of the present invention are all within the scope of the technical solution of the present invention.

Claims

1. A novel SMD LED is characterized in that: including LED support, LED chip and transparent packaging body, the LED support includes electrode foot and transparent base, transparent base sets firmly on the electrode foot, be equipped with on the transparent base and hold the cup, the LED chip is located and holds the cup and be connected with the electrode foot electricity, transparent packaging body fills in holding the cup, transparent packaging body and transparent base's material is the same.

2. The novel patch LED according to claim 1, wherein: and an anti-seepage structure is arranged between the electrode pin and the transparent base.

3. The novel patch LED according to claim 2, wherein: the anti-seepage structure comprises a groove and a protrusion, the groove is formed in the electrode pin, the protrusion is embedded in the groove, and the protrusion and the transparent base are of an integrated structure.