CN214381602U

CN214381602U - Encapsulation capacitor structure for electronic detonator

Info

Publication number: CN214381602U
Application number: CN202120117478.8U
Authority: CN
Inventors: 杨永亮; 代正华
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-15
Filing date: 2021-01-15
Publication date: 2021-10-08
Anticipated expiration: 2031-01-15

Abstract

The utility model discloses a encapsulation electric capacity structure that electron thunder was used, include: the encapsulation module comprises an encapsulation module, two pin-line terminals arranged in the encapsulation module and a capacitor arranged on the two pin-line terminals; one end of the rubber coating module is provided with a groove for improving the binding force when the whole rubber coating module is sealed. The capacitor structure provided by the utility model is provided with the leg wire input terminal, and the packaging assembly is only required to be welded to the tail end of the PCB when the electronic detonator control module is produced; after the packaging is finished, the capacitance parameters can be tested in batches, unqualified assemblies can be screened out in advance, and the problem found only when the whole control module is finished is avoided; the PIN wire terminal and the capacitor PIN are arranged side by side, and the process which needs two times in the past can be finished only by one-time welding; the sealing glue adopts a low-pressure low-temperature injection molding process, is firm and durable, and can be repeatedly recycled in each link; the rectangular groove and the two crescent grooves are used for fixing the two foot line terminals and are convenient to mold with the capacitor.

Description

Encapsulation capacitor structure for electronic detonator

Technical Field

The utility model relates to an electron detonator technical field, in particular to encapsulation electric capacity structure that electron detonator was used.

Background

With the development of society and the progress of science and technology, the popularization of electronic detonators in the civil explosion industry is gradually increased in China, the electronic detonator industry is in a key period of high-speed development and quick alternation, the key part of the electronic detonator is a control module, one of key parts of the control module is a capacitor, how to make the electronic detonator control module extremely, and how to set the capacitor is a very important ring.

The most commonly used structure of the existing electronic detonator control module generally adopts a support matched with a cylinder aluminum shell capacitor to be welded on a PCB, the tail part of the support extending out of the control module is used as a wiring terminal of a leg wire, the capacitor and the support terminal of the structure are two parts which are mutually independent and need to be separately welded on the PCB, the support material is thin, the span is large and easy to deform, the welding process is complex, the difficulty is large, the consistency cannot be guaranteed, and the reliability of the product is influenced.

Because the control module is required to be placed in a mold for sealing after the PCB is welded, the precision requirement of the process on the position of the capacitor and the bracket is very high, the phenomenon that the capacitor is crushed by the mold easily occurs after sealing, the leakage current is increased slightly, and the whole control module is scrapped seriously. Because the tail end process of the whole control module is performed at the moment, the outside is wrapped by plastic, and once abnormal reworking cost is high, a lot of hidden dangers are brought to the production and the manufacture of the electronic detonator control module.

SUMMERY OF THE UTILITY MODEL

To the problem that prior art exists, the utility model provides a packaging capacitor structure that electron thunder was used.

In order to achieve the above purpose, the utility model discloses technical scheme as follows:

a packaged capacitor structure for an electronic detonator, comprising: the encapsulation module comprises an encapsulation module, two pin-line terminals arranged in the encapsulation module and a capacitor arranged on the two pin-line terminals; one end of the rubber coating module is provided with a groove for improving the binding force when the whole rubber coating module is sealed.

Preferably, the middle part of the rubber coating module is further provided with a rectangular groove and two crescent grooves for fixing the two pin wire terminals and facilitating injection molding with the capacitor.

Preferably, the rectangular groove is opposite to the crescent groove, the rectangular groove is arranged on the encapsulation module, and correspondingly, the crescent groove is arranged on the bottom surface of the encapsulation module.

Preferably, one end of each of the leg wire terminals is a PIN of the leg wire terminal, and the other end of each of the leg wire terminals is a leg wire riveting/welding port.

Preferably, one end of the capacitor is provided with two capacitor PIN legs, and the capacitor PIN leg and the PIN line terminal PIN leg are arranged on the same plane side by side and between the two PIN line terminal PIN legs.

Preferably, the encapsulation module is cylindrical and has an outer diameter of less than 6 mm.

Adopt the technical scheme of the utility model, following beneficial effect has:

1. the utility model provides a capacitor structure has taken the foot line input terminal certainly, only need when producing electronic detonator control module with this encapsulation subassembly weld PCB board tail end can.

2. After the packaging is completed, the capacitor parameters can be tested in batches, unqualified assemblies can be screened out in advance, and the problem found by the completion of the whole control module is avoided.

3. The PIN line terminal and the capacitor PIN are arranged side by side, and the process which needs two times in the past can be finished only by one-time welding.

4. The sealing glue adopts a low-pressure low-temperature injection molding process, is firm and durable, and can be repeatedly recycled in each link.

5. The rectangular groove and the two crescent grooves are used for fixing the two foot line terminals and are convenient to mold with the capacitor.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an exploded view of the structure of the present invention;

FIG. 3 is a front view of the present invention;

FIG. 4 is a top view of the present invention;

fig. 5 is a bottom view of the structure of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present invention, unless expressly stated or limited otherwise, the first feature "on" or "is connected to" the second feature

"under" may include the first and second features being in direct contact, and may also include the first and second features not being in direct contact, but being in contact with each other through additional features between them. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1 to 5, the present invention provides a packaged capacitor structure for an electronic detonator, including: the encapsulation module 1, two pin terminals 2 arranged in the encapsulation module 1 and a capacitor 3 arranged on the two pin terminals 2; recess 101 has been seted up to rubber coating module 1 one end for the cohesion when wholly sealing glue is improved.

Rectangular groove 102 and two crescent grooves 103 are still seted up at rubber coating module 1 middle part for the position of fixed two leg wire terminals 2, with condenser 3 is conveniently moulded plastics.

The rectangular groove 103 and the crescent grooves 102 are oppositely arranged, the rectangular groove 103 is arranged on the encapsulation module 1, and correspondingly, the crescent grooves 102 are arranged on the bottom surface of the encapsulation module 1.

Each of the leg wire terminals 2 has one end provided with a PIN 201 of the leg wire terminal and the other end provided with a leg wire riveting/welding port 202 (for connecting leg wires).

One end of the capacitor 3 is provided with two capacitance PIN feet 301, and the capacitance PIN feet 301 and the PIN line terminal PIN feet 201 are arranged in parallel on the same plane (conveniently welded on a PCB) and between the two PIN line terminal PIN feet 201.

The encapsulation module 1 is cylindrical and has an outer diameter smaller than 6 mm; the leg wire terminal 2 is five metals stamping forming, the condenser 3 is the solid-state electric capacity of cylinder, the rubber coating module 1 adopts the low pressure injection molding technology to make.

Crescent 102 and rectangular groove 103 in the middle of module rubber coating 1 only demonstrate for the technology, as long as can reach fixed internals's effect, do not get rid of and use other shapes and position.

The utility model discloses the theory of operation as follows:

the module rubber coating 1 is made by adopting a low-pressure injection molding process, the PIN line terminal 2 can be fixed by the two middle crescent grooves 102 and the rectangular groove 103, the injection molding is convenient for the position of the capacitor 3, the capacitor PIN 301 and the PIN line terminal PIN 201 are welded on a PCB, and the PIN line riveting/welding port 202 is connected with a PIN line.

The capacitor structure provided by the utility model is provided with the leg wire input terminal, and the packaging assembly is only required to be welded to the tail end of the PCB when the electronic detonator control module is produced; after the packaging is finished, the capacitance parameters can be tested in batches, unqualified assemblies can be screened out in advance, and the problem found only when the whole control module is finished is avoided; the PIN wire terminal and the capacitor PIN are arranged side by side, and the process which needs two times in the past can be finished only by one-time welding; the sealing glue adopts a low-pressure low-temperature injection molding process, is firm and durable, and can be repeatedly recycled in each link.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. A packaged capacitor structure for an electronic detonator, comprising: the encapsulation module comprises an encapsulation module, two pin-line terminals arranged in the encapsulation module and a capacitor arranged on the two pin-line terminals; one end of the rubber coating module is provided with a groove for improving the binding force when the whole rubber coating module is sealed.

2. The packaged capacitor structure for an electronic detonator according to claim 1, wherein a rectangular groove and two crescent grooves are further formed in the middle of the rubber-coated module, and are used for fixing two pin wire terminals and facilitating injection molding with the position of the capacitor.

3. The packaged capacitor structure of claim 2, wherein the rectangular slot is disposed opposite to the crescent slot, and the rectangular slot is disposed on the encapsulation module, and correspondingly, the crescent slot is disposed on the bottom surface of the encapsulation module.

4. The packaged capacitor structure for an electronic detonator as claimed in claim 2, wherein each of said leg wire terminals is provided with a PIN leg as a leg wire terminal at one end and a leg wire rivet/solder joint at the other end.

5. The packaged capacitor structure for the electronic detonator of claim 4, wherein two capacitor PIN legs are provided at one end of the capacitor, and the capacitor PIN leg and the PIN terminal PIN leg are arranged side by side on the same plane and between the two PIN terminal PIN legs.

6. The encapsulated capacitor structure of claim 3, wherein said encapsulated modules are cylindrical and have an outer diameter of less than 6 mm.