CN214322119U - Special tin cream brushing device for power electronic semiconductor module - Google Patents
Special tin cream brushing device for power electronic semiconductor module Download PDFInfo
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- CN214322119U CN214322119U CN202022675096.5U CN202022675096U CN214322119U CN 214322119 U CN214322119 U CN 214322119U CN 202022675096 U CN202022675096 U CN 202022675096U CN 214322119 U CN214322119 U CN 214322119U
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- solder paste
- sliding
- tray
- sliding block
- positioning plate
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Abstract
The utility model discloses a special tin cream brushing device for a power electronic semiconductor module, which comprises a box body, a tray, a sliding assembly and a brush head assembly; the tray is arranged above the box body; the sliding assembly comprises 2 brackets, a sliding rod welded on the brackets and a sliding block in sliding fit with the sliding rod; the sliding block is also provided with a longitudinal sliding rail, and the sliding rail is provided with a longitudinal sliding block matched with the sliding rail; the brush head assembly comprises tube-packed solder paste and a flat mouth; the tube-mounted solder paste is inserted at the bottom of the longitudinal sliding block; the flat mouth is arranged at the opening of the tube-packed solder paste; an industrial controller and a power supply are arranged in the case; the industrial control machine controls the motor, and the motor drives the tray, the sliding block and the longitudinal sliding block to move. The utility model discloses a to the full-automatic tin cream that brushes of power electronic semiconductor module, improved the efficiency of work, reduced the human cost, and the tin cream dispersion of brushing out is even, has the same thickness.
Description
Technical Field
The utility model relates to a brush tin cream device specifically is a special brush tin cream device of power electronics semiconductor module.
Background
When welding power electronic semiconductor module, the multiple processes need to smear the tin cream, and the prior art usually uses manual smearing, and this kind of mode is not only inefficient, still can not guarantee to smear the tin cream and have the same thickness and degree of consistency.
Disclosure of Invention
The utility model aims at providing a special brush tin cream device of power electronics semiconductor module, the device can realize the full-automatic brush tin cream of power electronics semiconductor module, and is efficient, with low costs, and the tin cream dispersion of brushing out is even, has the same thickness.
The utility model adopts the technical proposal that: a special solder paste brushing device for a power electronic semiconductor module comprises a box body, a tray, a sliding assembly and a brush head assembly;
the tray is arranged above the box body; the sliding assembly comprises 2 brackets, a sliding rod welded on the brackets and a sliding block in sliding fit with the sliding rod; the 2 supports are welded on the box body and are positioned at two sides of the tray; the sliding block is also provided with a longitudinal sliding rail, and the sliding rail is provided with a longitudinal sliding block matched with the sliding rail;
the brush head assembly comprises tube-packed solder paste and a flat mouth; the tube-mounted solder paste is inserted at the bottom of the longitudinal sliding block; the flat mouth is arranged at the opening of the tube-packed solder paste;
an industrial controller and a power supply are arranged in the case; the industrial control machine controls the motor, the motor drives the tray to move back and forth, the sliding block is driven to move left and right on the sliding rod, and the longitudinal sliding block is driven to move up and down on the sliding rail;
furthermore, a damper is arranged between the sliding rail and the longitudinal sliding block.
Furthermore, the solder paste brushing device also comprises a bottom plate positioning plate and a solder paste brushing positioning plate which are expected to be matched for use; the bottom plate positioning plate is provided with at least one through hole for positioning a copper plate to be brushed with solder paste, and the solder paste brushing positioning plate is provided with at least one through hole for regulating the shape of the solder paste; the bottom plate positioning plate and the tin paste brushing positioning plate are arranged on the tray when in use, the upper left corner of the bottom plate positioning plate and the positioning point on the upper left side of the tray are aligned to each other, and the lower end and the right end of the bottom plate positioning plate are fixed with the tray through the bolt positioner.
The utility model discloses a special tin cream device that brushes of power electronics semiconductor module has realized having improved the efficiency of work to the full-automatic tin cream that brushes of power electronics semiconductor module, has reduced the human cost, and the tin cream dispersion of brushing out is even, has the same thickness.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
in the figure, 1, a box body, 2, a tray, 3, a bracket, 4, a slide rod, 5, a slide block, 6, a slide rail, 7, a longitudinal slide block, 8, a tube-filled solder paste and 9, a flat mouth are arranged.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, a special solder paste brushing device for a power electronic semiconductor module comprises a box body 1, a tray 2, a sliding assembly and a brush head assembly;
the tray 2 is arranged above the box body 1; the sliding assembly comprises 2 brackets 3, a sliding rod 4 welded on the brackets 3 and a sliding block 5 in sliding fit with the sliding rod 4; the 2 supports 3 are welded on the box body 1 and positioned at two sides of the tray 2; the sliding block 5 is also provided with a longitudinal sliding rail 6, and the sliding rail 6 is provided with a longitudinal sliding block 7 matched with the sliding rail 6;
the brush head assembly comprises a tube-packed solder paste 8 and a flat mouth 9; the tube-mounted solder paste 8 is inserted at the bottom of the longitudinal slide block 7; the flat mouth 9 is arranged at the opening of the tube-packed solder paste 8;
an industrial controller and a power supply are arranged in the case; the industrial control machine controls the motor, the motor drives the tray 2 to move back and forth, the sliding block 5 is driven to move left and right on the sliding rod 4, and the longitudinal sliding block 7 is driven to move up and down on the sliding rail 6;
and a damper is arranged between the slide rail 6 and the longitudinal slide block 7.
The solder paste brushing device also comprises a bottom plate positioning plate and a solder paste brushing positioning plate which are expected to be matched for use; the bottom plate positioning plate is provided with at least one through hole for positioning a copper plate to be brushed with solder paste, and the solder paste brushing positioning plate is provided with at least one through hole for regulating the shape of the solder paste; the bottom plate positioning plate and the tin paste brushing positioning plate are arranged on the tray 2 when in use, the upper left corner of the bottom plate positioning plate and the positioning point on the upper left side of the tray 2 are aligned with each other, and the lower end and the right end of the bottom plate positioning plate are fixed with the tray 2 through bolt positioners.
When the device is used, the designed CAD drawing is guided into an industrial controller, the shape of the solder paste to be smeared is set, the bottom plate is placed into the tray 2, the upper left corner of the bottom plate abuts against the upper left positioning point of the tray 2, then the copper plate is placed into the corresponding hole forming position, then the positioning plate is covered, 2 screw positioners are screwed down, then the movable device is firstly moved to the original point when the device is started, then the point is started, and the tin is automatically brushed.
Claims (3)
1. A special solder paste brushing device for a power electronic semiconductor module is characterized by comprising a box body (1), a tray (2), a sliding assembly and a brush head assembly;
the tray (2) is arranged above the box body (1); the sliding assembly comprises 2 brackets (3), a sliding rod (4) welded on the brackets (3), and a sliding block (5) in sliding fit with the sliding rod (4); the 2 supports (3) are welded on the box body (1) and positioned at two sides of the tray (2); the sliding block (5) is also provided with a longitudinal sliding rail (6), and the sliding rail (6) is provided with a longitudinal sliding block (7) matched with the sliding rail;
the brush head assembly comprises a tube-packed solder paste (8) and a flat mouth (9); the tube-mounted solder paste (8) is inserted at the bottom of the longitudinal slide block; the flat mouth (9) is arranged at the opening of the tube-packed solder paste (8);
an industrial controller and a power supply are arranged in the box body (1); the industrial control machine controls the motor, the motor drives the tray (2) to move back and forth, the sliding block (5) is driven to move left and right on the sliding rod (4), and the longitudinal sliding block (7) is driven to move up and down on the sliding rail (6).
2. The special solder paste brushing device for the power electronic semiconductor module according to claim 1, wherein a damper is arranged between the slide rail (6) and the longitudinal slide block (7).
3. The special solder paste brushing device for the power electronic semiconductor module according to claim 1, further comprising a bottom plate positioning plate and a solder paste positioning plate which are expected to be used in cooperation; the bottom plate positioning plate is provided with at least one through hole for positioning a copper plate to be brushed with solder paste, and the solder paste brushing positioning plate is provided with at least one through hole for regulating the shape of the solder paste; the bottom plate positioning plate and the tin paste brushing positioning plate are arranged on the tray (2) when in use, the upper left corner of the bottom plate positioning plate and the positioning point on the upper left side of the tray (2) are opposite to each other, and the lower end and the right end of the bottom plate positioning plate are fixed with the tray (2) through the bolt positioner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022675096.5U CN214322119U (en) | 2020-11-18 | 2020-11-18 | Special tin cream brushing device for power electronic semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022675096.5U CN214322119U (en) | 2020-11-18 | 2020-11-18 | Special tin cream brushing device for power electronic semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214322119U true CN214322119U (en) | 2021-10-01 |
Family
ID=77895656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022675096.5U Active CN214322119U (en) | 2020-11-18 | 2020-11-18 | Special tin cream brushing device for power electronic semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214322119U (en) |
-
2020
- 2020-11-18 CN CN202022675096.5U patent/CN214322119U/en active Active
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