CN214294833U - Mobile phone radiating fin - Google Patents

Abstract

The utility model relates to the technical field of heat dissipation materials, and discloses a mobile phone cooling fin, which comprises a first copper strip layer, a titanium strip layer and a second copper strip layer which are sequentially arranged in a stacking manner from top to bottom; the first copper strip layer, the titanium strip layer and the second copper strip layer are combined in a surface compounding mode; the thickness ratio of the first copper tape layer to the radiating fin, the thickness ratio of the titanium tape layer to the radiating fin and the thickness ratio of the second copper tape layer to the radiating fin are respectively 10% -30%, 40% -60% and 10% -30%. The utility model provides a pair of mobile phone cooling fin is as an organic whole with copper strips and titanium strip complex through certain mechanical interlock, and this makes above-mentioned fin synthesize the performance characteristics of titanium and copper, has not only kept fine intensity and toughness, still has fine heat conductivity to can the fully provided heat dissipation demand of cell-phone.

Description

Mobile phone radiating fin

Technical Field

The utility model relates to a heat sink material technical field, more specifically say, relate to a cell phone cooling fin.

Background

With the application of the mobile phone function intellectualization, the life quality is greatly improved, the function requirements of the mobile phone also pursue more application intellectualization continuously, and the mobile phone chip is required to provide excellent computing capability. Certainly, high-speed operation and processing generate heat, the higher the operation speed is, the longer the operation time is, the higher the calorific value is, if the heat cannot be dissipated in time, the temperature of the mobile phone will gradually rise, and the safety of the battery and the damage of the chip can be endangered in serious cases, so that the heat dissipation function of the mobile phone is not negligible.

The heat dissipation material that present cell-phone adopted is mainly copper alloy, and copper alloy has that welding performance is good, better heat dissipation and certain intensity and toughness, but with the promotion of the high-speed operating ability of 5G cell-phone, needs better heat dissipation material. On the other hand, the mobile phone is also required to be thinner, so that the heat dissipation material is required to have better strength and toughness, and the mobile phone is ensured not to deform in the using process. The copper alloy cannot meet the development requirements of the smart phone in strength and heat dissipation efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cell phone cooling fin aims at solving prior art, and the heat radiation material in the cell-phone can't satisfy the problem of smart mobile phone's development demand on the radiating efficiency.

The utility model is realized in this way, the utility model provides a mobile phone radiating fin, which comprises a first copper strip layer, a titanium strip layer and a second copper strip layer which are sequentially arranged in a stacking way from top to bottom; the first copper strip layer, the titanium strip layer and the second copper strip layer are combined in a surface recombination mode; the thickness ratio of the first copper tape layer to the radiating fin, the thickness ratio of the titanium tape layer to the radiating fin and the thickness ratio of the second copper tape layer to the radiating fin are respectively 10% -30%, 40% -60% and 10% -30%.

Further, the thickness of the radiating fin ranges from 0.05mm to 0.30 mm.

Further, the thickness of the heat sink is 0.08mm, the thickness of the first copper tape layer is in the range of 0.008-0.024mm, the thickness of the titanium tape layer is in the range of 0.032-0.048mm, and the thickness of the second copper tape layer is in the range of 0.008-0.024 mm.

Further, the thickness of the first copper strip layer is the same as the thickness of the second copper strip layer.

Further, the hardness of the heat sink is in the range of 50 to 70HV 1.0.

Compared with the prior art, the mobile phone radiating fin provided by the utility model combines the copper strip and the titanium strip into a whole through certain mechanical occlusion, so that the radiating fin integrates the performance characteristics of the titanium and the copper, not only keeps good strength and toughness, but also has good thermal conductivity, thereby being capable of fully meeting the radiating requirement of a mobile phone; meanwhile, the heat dissipation and heat conduction performance of the heat dissipation material is adjusted by adjusting the thickness ratio of the copper belt to the titanium belt, the adjustment is flexible in process, and only the thickness of the metal before compounding is required to be changed, so that the production cost is greatly reduced.

Drawings

Fig. 1 is a schematic structural diagram of a mobile phone heat sink provided by an embodiment of the present invention

FIG. 2 is a schematic flow chart of a first embodiment of a process for manufacturing a heat sink material;

FIG. 3 is a schematic flow chart of a second embodiment of a process for forming a heat sink material;

FIG. 4 is a schematic flow chart of a third embodiment of a process for forming a heat sink material;

FIG. 5 is a flow chart illustrating a fourth exemplary embodiment of a process for forming a heat sink material.

Reference numerals: 1-first copper tape layer, 2-titanium tape layer, 3-second copper tape layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.

The following describes the implementation of the present invention in detail with reference to specific embodiments.

Referring to fig. 1, fig. 1 shows a schematic structural diagram of a mobile phone heat sink provided by an embodiment of the present invention, which includes a first copper tape layer 1, a titanium tape layer 2, and a second copper tape layer 3, which are sequentially stacked from top to bottom; the first copper belt layer 1, the titanium belt layer 2 and the second copper belt layer 3 are combined in a surface compounding mode; the thickness ratio of the first copper strap layer 1 to the heat sink, the thickness ratio of the titanium strap layer 2 to the heat sink, and the thickness ratio of the second copper strap layer 3 to the heat sink are 10% to 30% (e.g., 10%, 20%, or 30%), 40% to 60% (e.g., 40%, 50%, or 60%), and 10% to 30% (e.g., 10%, 20%, or 30%), respectively.

According to the mobile phone radiating fin, the copper strip and the titanium strip are compounded into a whole through certain mechanical occlusion, so that the radiating fin integrates the performance characteristics of titanium and copper, not only maintains good strength and toughness, but also has good thermal conductivity, and the radiating requirement of a mobile phone can be fully met; meanwhile, the heat dissipation and heat conduction performance of the heat dissipation material is adjusted by adjusting the thickness ratio of the copper belt to the titanium belt, the adjustment is flexible in process, and only the thickness of the metal before compounding is required to be changed, so that the production cost is greatly reduced.

The first copper belt layer 1, the titanium belt layer 2 and the second copper belt layer 3 are combined in a surface compounding mode; the surface recombination here means that the principle of plastic deformation of metal and atomic diffusion between metals is fully utilized, different material layers are combined into a whole through certain mechanical occlusion, the process technology is a conventional process, and the surface recombination is usually realized by a pressure compound machine.

Of course, the heat sink may be used in other products, and the present invention is not limited thereto.

Optionally, the thickness of the fins is in the range of 0.05-0.30mm (e.g., 0.05mm, 0.08mm, or 0.30 mm). Wherein, when the thickness of fin is 0.08mm, the fin has fine comprehensive properties. Preferably, the thickness of the first copper tape layer 1 is in the range of 0.008-0.024mm (e.g. 0.008mm, 0.015mm or 0.024mm), the thickness of the titanium tape layer 2 is in the range of 0.032-0.048mm (e.g. 0.032mm, 0.040mm or 0.048mm) and the thickness of the second copper tape layer 3 is in the range of 0.008-0.024mm (e.g. 0.008mm, 0.015mm or 0.024 mm).

Preferably, the thickness of the first copper tape layer 1 is the same as the thickness of the second copper tape layer 3, so that the heat dissipation effect of the heat sink is more uniform.

Preferably, the hardness of the heat sink is in the range of 50-70HV1.0 (e.g., 50HV1.0, 60HV1.0, or 70HV 1.0).

Referring to fig. 2, fig. 2 shows a schematic flow chart of a first embodiment of a process for manufacturing a heat dissipation material, the process for manufacturing a heat dissipation material includes the following steps:

step S10, selecting raw materials: selecting two copper strips with the thickness of 0.5-1.0mm (such as 0.5mm, 0.8mm or 1.0mm) and the width of 100-150mm (such as 100mm, 125mm or 150mm), and selecting a titanium strip with the thickness of 1.5-3.0mm (such as 1.5mm, 2.0mm or 3.0mm) and the width of 100-150mm (such as 100mm, 125mm or 150 mm); wherein the hardness of the titanium strip is 150-180HV1.0 (such as 150HV1.0, 160HV1.0 or 180HV1.0), and the hardness of the copper strip is 70-80HV1.0 (such as 70HV1.0, 75HV1.0 or 80HV 1.0).

Step S20, composite processing: calendering and compounding the selected copper belt and the selected titanium belt, respectively providing certain heat energy for the copper belt and the titanium belt, so that the temperature of the titanium belt is controlled to be 200-plus-300 ℃ (for example, 200 ℃, 250 ℃ or 300 ℃), the temperature of the copper belt is controlled to be 150-plus-200 ℃ (for example, 150 ℃, 175 ℃ or 200 ℃), and one copper belt, the other copper belt and the titanium belt are compounded into a whole in sequence according to an arrangement mode from top to bottom to obtain a composite belt material; the composite strip obtained after compounding is broken back and forth at 90 degrees, and the end face is not separated to serve as the qualified standard of compounding.

Preferably, the copper strip and the titanium strip are subjected to calendering and compounding through a pressure compounding machine, and in order to ensure the cleanliness between the selected titanium strip and the copper strip, an inert gas or an ammonia decomposition gas (N2, H2) is introduced into the pressure compounding machine, so that the titanium strip and the copper strip are subjected to calendering and compounding in an inert atmosphere or a reducing atmosphere; therefore, impurities (such as oxides) between the two materials can be prevented, the cleanliness between the materials is ensured, and substances with poor plasticity are not generated, so that the bonding strength between different materials is influenced.

Step S30, polishing: and polishing the surface of the composite strip obtained after the composite treatment by using a polishing machine, and removing impurities generated on the surface of the composite strip in the composite process so as to eliminate defects (such as scratches, indentations, pits and the like) generated on the surface of a product in the processing process.

Step S40, first diffusion annealing: performing first diffusion annealing treatment on the polished composite strip, wherein the annealing temperature is 700-900 ℃ (for example, 700 ℃, 800 ℃ or 900 ℃); different annealing temperatures can be selected through different deformation amounts, and the annealing mainly aims to enable the composite interface of the composite strip to be bonded more tightly through diffusion of atoms between materials, so that the composite strength of a product is enhanced.

Step S50, rolling: and rolling the composite strip subjected to diffusion annealing treatment for multiple times by using a multi-roll rolling mill until the composite strip is rolled to the thickness of 0.05-0.30 mm.

Preferably, the composite strip is subjected to one or more softening annealing treatments between any two rolling of the composite strip, the annealing temperature being 800-; the multi-roll rolling mill produces work hardening when the composite strip is rolled for multiple times, and the softening annealing treatment is used for eliminating the work hardening produced in the rolling treatment process of the composite strip.

According to the processing technology of the heat dissipation material for the mobile phone, the plastic deformation of metal and the atomic diffusion principle between metals are fully utilized, the copper belt and the titanium belt are compounded into a whole through certain mechanical occlusion, and the heat dissipation material produced through the processing technology integrates the performance characteristics of titanium and copper, so that the heat dissipation material not only keeps good strength and toughness, but also has good heat conductivity, and the heat dissipation requirement of the mobile phone can be fully met; meanwhile, the heat dissipation and heat conduction performance of the heat dissipation material is adjusted by adjusting the thickness ratio of the copper strip to the titanium strip, the adjustment is flexible in process, only the thickness of the metal before compounding is required to be changed, the content and influence of trace elements are required to be continuously adjusted during smelting, and the method is relatively complicated and high in development cost; moreover, the titanium belt is easy to generate corrosion even in the environment with raised temperature, the heat dissipation effect is not influenced, the long-term stable heat dissipation characteristic can be kept, and the heat dissipation effect cannot be changed along with the time.

Based on the first embodiment, a second embodiment is provided, fig. 3 is a flowchart illustrating a processing process of a heat dissipation material for a mobile phone according to the second embodiment of the present invention, please refer to fig. 3, before the step S20, the processing process further includes the following steps:

step S101, cleaning: and respectively cleaning the surfaces of the selected copper belt and the selected titanium belt.

After the cleaning treatment in the step S101, and then the step S2 is performed, the composite strength between the copper strip and the titanium strip can be greatly improved, and the composite effect of the composite strip can be improved.

It should be noted that step S101 specifically includes the following steps:

step S1011: polishing the surfaces of the selected copper belt and the titanium belt by using polishing equipment to remove impurities and oxidation; therefore, impurities and metal oxides on the surfaces of the copper belt and the titanium belt can be removed, and the composite effect between the copper belt and the titanium belt is improved.

Step S1012: carrying out surface drying treatment on the copper strips and the titanium strips which are subjected to polishing, impurity removal and deoxidization by drying equipment; therefore, the surfaces of the copper belt and the titanium belt can be kept dry, and potential quality hazards such as water stains/water spots are avoided.

Based on the first embodiment, a third embodiment is provided, fig. 4 is a schematic flow chart of a processing process of a heat dissipation material for a mobile phone according to the third embodiment of the present invention, please refer to fig. 4, after the step S50, the processing process further includes the following steps:

step S501, second diffusion annealing: and carrying out secondary diffusion annealing treatment on the finished strip subjected to the rolling treatment, wherein the annealing temperature is 700-900 ℃ (such as 700 ℃, 800 ℃ or 900 ℃) so as to enable the hardness of the finished strip to reach the required hardness requirement, and the hardness of the finished strip is the same at different annealing temperatures.

Based on the first embodiment, a fourth embodiment is provided, fig. 5 is a schematic flow chart of a processing process of a heat dissipation material for a mobile phone according to the fourth embodiment of the present invention, please refer to fig. 5, after the step S50, the processing process further includes the following steps:

step S502, surface treatment: and removing the rolling oil on the surface of the finished product strip and drying the rolling oil, thereby ensuring the smoothness of the surface of the finished product strip.

Step S503, press etching: stamping and etching the finished product strip according to requirements, and cutting into required sizes; specifically, the finished product strips are cut according to sizes of different specifications, and the cut finished product strips are subjected to vacuum packaging.

In one embodiment, the process for manufacturing the heat dissipating material includes the steps of,

step S10, selecting raw materials:

titanium strip: 3.0X 115mm, HV1.0:160,

two copper strips: 0.9X 115mm, HV1.0: 80;

step S101, cleaning: polishing the surfaces of the three strips by using a polishing machine, washing the surfaces by using hot water after polishing, and drying the surfaces by using hot air to ensure that the surfaces have no impurities, water spots and the like;

step S20, composite processing: compounding on a two-roller rolling compounding machine, wherein the middle layer is a titanium belt, the upper layer and the lower layer are respectively copper belts, and the three belts are compounded together; the temperature of the titanium strip at the roll mouth is controlled at 210 ℃, the temperature deviation is +/-5 ℃, the temperature of the copper strip at the roll mouth is controlled at 180 ℃, the temperature deviation is +/-5 ℃, ammonia decomposition gas (N2, H2) is introduced into a rolling mill for protecting the strip before the strip enters a roll, the gas flow is controlled at 7Nm3/H, the thickness of a rolling outlet of a compound machine is 1.6mm, so that the thickness of the compound strip after compounding is 1.6mm, the compound strip is broken at 90 degrees after compounding, the section has no separation phenomenon, and the compound strength is qualified;

step S30, polishing: cleaning black impurities, scraps, lines and the like on the surface of the compounded strip by using a polishing machine, and simultaneously drying by using hot water and a drying facility;

step S40, first diffusion annealing: after cleaning, carrying out heat treatment in a bright annealing furnace at 850 ℃ and 1m/min, after annealing, enabling the composite interface of the composite strip to be more tightly combined, enhancing the composite strength of the product, eliminating the processing hardness of the strip and facilitating the later cold processing;

step S50, rolling: carrying out back and forth rolling on a four-roller rolling machine after annealing for 15 passes, and carrying out softening annealing on the semi-finished product and then rolling until the thickness of the product is 0.08mm in the rolling process;

step S501, second diffusion annealing: annealing the rolled finished strip at 830 ℃, and keeping the hardness of the titanium strip controlled at HV1.0: 120;

step S502, surface treatment: carrying out surface degreasing and drying on the finished product strip on a cleaning machine to ensure that the surface of the finished product strip has no quality defect;

step S503, press etching: and (4) stamping and etching the finished strip according to requirements, and cutting the finished strip into required sizes.

The utility model also provides a heat radiation material, heat radiation material is obtained by above-mentioned processing technology processing.

According to the heat dissipation material, the copper belt and the titanium belt are compounded into a whole through certain mechanical occlusion, so that the heat dissipation material integrates the performance characteristics of titanium and copper, not only maintains good strength and toughness, but also has good heat conductivity, and the heat dissipation requirement of a mobile phone can be fully met; meanwhile, the heat dissipation and heat conduction performance of the heat dissipation material is adjusted by adjusting the thickness ratio of the copper belt to the titanium belt, the adjustment is flexible in process, and only the thickness of the metal before compounding is required to be changed, so that the production cost is greatly reduced.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (5)

1. A mobile phone radiating fin is characterized by comprising a first copper tape layer, a titanium tape layer and a second copper tape layer which are sequentially arranged in a stacking mode from top to bottom; the first copper strip layer, the titanium strip layer and the second copper strip layer are combined in a surface recombination mode; the thickness ratio of the first copper tape layer to the radiating fin, the thickness ratio of the titanium tape layer to the radiating fin and the thickness ratio of the second copper tape layer to the radiating fin are respectively 10% -30%, 40% -60% and 10% -30%.

2. The phone heat sink of claim 1, wherein the heat sink has a thickness in the range of 0.05-0.30 mm.

3. The phone heat sink of claim 2 wherein said heat sink has a thickness of 0.08mm, said first layer of copper tape has a thickness in the range of 0.008mm to 0.024mm, said layer of titanium tape has a thickness in the range of 0.032mm to 0.048mm, and said second layer of copper tape has a thickness in the range of 0.008mm to 0.024 mm.

4. The phone heat sink of claim 1 wherein the thickness of the first layer of copper tape is the same as the thickness of the second layer of copper tape.

5. The phone heat sink of claim 1, wherein the hardness of the heat sink is in the range of 50-70HV 1.0.

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