CN212827227U - Radiating fin - Google Patents
Radiating fin Download PDFInfo
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- CN212827227U CN212827227U CN202020669182.2U CN202020669182U CN212827227U CN 212827227 U CN212827227 U CN 212827227U CN 202020669182 U CN202020669182 U CN 202020669182U CN 212827227 U CN212827227 U CN 212827227U
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Abstract
The utility model relates to the technical field of lithium battery connection, and discloses a radiating fin, which comprises a nickel layer and a copper layer which are sequentially arranged in a stacking manner from top to bottom; the nickel layer and the copper layer are combined in a surface compounding manner; the thickness ratio of the nickel layer to the radiating fin and the thickness ratio of the copper layer to the radiating fin are respectively 38-64% and 36-62%; the utility model provides a pair of cooling fin, because the heat conductivity of copper is superior to the copper alloy, the proportion of nickel moreover for this cooling fin has high intensity and toughness, very suitable smart mobile phone's heat dissipation demand.
Description
Technical Field
The utility model belongs to the technical field of radiating technique and specifically relates to a fin.
Background
With the application of the mobile phone function intellectualization, the life quality is greatly improved, the function requirements of the mobile phone are continuously pursued to be more intellectualized, and the mobile phone chip is required to provide excellent operational capability. Certainly, high-speed operation and processing generate heat, the higher the operation speed is, the longer the operation time is, the higher the calorific value is, if the heat cannot be dissipated in time, the temperature of the mobile phone will gradually rise, and the safety of the battery and the damage of the chip can be endangered in serious cases, so that the heat dissipation function of the mobile phone is not negligible.
At present, the best heat dissipation material in the mobile phone is mainly copper alloy, and the copper alloy has good welding performance, good heat dissipation performance and certain strength and toughness, but with the improvement of the high-speed operation capacity of the 5G mobile phone, a better heat dissipation material is needed. On the other hand, the mobile phone is also required to be thinner, so that the heat dissipation material is required to have good strength and toughness, and the mobile phone is ensured not to deform in the using process. The copper alloy can not meet the development requirement of mobile phone intellectualization in the aspects of strength and heat dissipation efficiency.
The fin of this patent adopts pure copper and pure nickel, and the heat conductivity of copper is superior to the copper alloy, because the ratio of nickel has high intensity and toughness, very suitable smart mobile phone's user demand.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fin aims at solving the poor problem of fin electric conductive property among the prior art.
The utility model is realized in such a way that the radiating fin comprises a nickel layer and a copper layer which are sequentially arranged in a stacking way from top to bottom; the nickel layer and the copper layer are combined in a surface recombination mode; the thickness ratio of the nickel layer to the heat sink and the thickness ratio of the copper layer to the heat sink are respectively 38% -64% and 36% -62%.
Further, the thickness ratio of the nickel layer to the heat sink is 38%, and the thickness ratio of the copper layer to the heat sink is 62%.
Further, the thickness ratio of the nickel layer to the heat sink is 42%, and the thickness ratio of the copper layer to the heat sink is 58%.
Further, the thickness ratio of the nickel layer to the heat sink is 64%, and the thickness ratio of the copper layer to the heat sink is 36%.
Further, the thickness of the nickel layer ranges from 0.114 mm to 0.192 mm.
Further, the nickel layer has a hardness in the range of 80 to 100HV 0.2.
Further, the copper layer has a hardness in the range of 70-100HV 0.2.
Compared with the prior art, the utility model provides a pair of radiating fin, because the heat conductivity of copper is superior to the copper alloy, the proportion of nickel moreover for this radiating fin has high intensity and toughness, very suitable smart mobile phone's heat dissipation demand.
Drawings
Fig. 1 is a schematic structural diagram of a heat sink according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
Referring to fig. 1, a preferred embodiment of the present invention is provided.
A heat sink comprises a nickel layer 11 and a copper layer 12 which are sequentially stacked from top to bottom; the nickel layer 11 and the copper layer 12 are combined in a surface recombination mode; the thickness ratio of the nickel layer 11 to the heat sink and the thickness ratio of the copper layer 12 to the heat sink are 38-64% and 36-62%, respectively.
The nickel layer 11 and the copper layer 12 are combined in a surface recombination manner, wherein the surface recombination means that different material layers are combined into a whole through certain mechanical occlusion by fully utilizing the principle of plastic deformation of metal and atomic diffusion between metals, and the process technology is a conventional process and is generally realized by a pressure compound machine.
According to the radiating fin, the heat conductivity of copper is superior to that of copper alloy, and the proportion of nickel is high, so that the radiating fin has high strength and toughness, and is very suitable for the radiating requirement of a smart phone.
In one embodiment, the ratio of the thickness of the nickel layer to the thickness of the heat sink is 38% and the ratio of the thickness of the copper layer to the thickness of the heat sink is 62%.
In another embodiment, the ratio of the thickness of the nickel layer to the thickness of the heat sink is 42% and the ratio of the thickness of the copper layer to the thickness of the heat sink is 58%.
In yet another embodiment, the ratio of the thickness of the nickel layer to the heat sink is 64% and the ratio of the thickness of the copper layer to the heat sink is 36%.
Preferably, the nickel layer has a thickness in the range of 0.114-0.192 mm.
Preferably, the nickel layer has a hardness in the range of 80-100HV 0.2.
Preferably, the copper layer has a hardness in the range of 70-100HV 0.2.
Example 1
A heat sink comprises a nickel layer 11 and a copper layer 12 which are sequentially stacked from top to bottom; the nickel layer 11 and the copper layer 12 are combined in a surface recombination mode; the thickness ratio of the nickel layer 11 to the heat sink and the thickness ratio of the copper layer 12 to the heat sink were 38% and 62%, respectively.
The specific preparation process comprises the following steps:
s1, selecting raw materials: selecting a pure nickel strip with the thickness of 1.14mm, and selecting a pure copper strip with the thickness of 1.8 mm; the hardness of the pure nickel strip is 90HV0.2, and the hardness of the pure copper strip is 90HV 0.2.
S2, compounding: the pure nickel strips and the pure copper strips are sequentially arranged in a stacked mode, certain heat energy is provided for the pure nickel strips and the pure copper strips, the temperature of the pure nickel strips is controlled to be 500 ℃, the temperature of the pure copper strips is controlled to be 350 ℃, and then the pure nickel strips and the pure copper strips which are sequentially arranged in the stacked mode are rolled and compounded through a pressure compounding machine to obtain the composite strip.
Specifically, in the compounding step, the composite strip is broken back and forth by 90 degrees, and the end face is not separated as a qualified standard of the first compounding.
In the compounding step, inert gas (N2) or ammonia decomposition gas (N2, H2) is introduced into the pressure compounding machine to ensure the reduction environment when the pure nickel strip, the stainless steel strip and the pure copper strip are subjected to rolling compounding; therefore, impurities/oxides among the pure nickel strips, the stainless steel strips and the pure copper strips can be prevented, the cleanliness among materials is ensured, and substances with poor plasticity are not generated, so that the bonding strength of the materials is not influenced.
S3, polishing treatment: and (4) carrying out surface polishing treatment on the composite strip to remove impurities on the surface of the composite strip.
Specifically, the composite strip obtained by the compounding in step S2 is subjected to a surface polishing treatment in a polishing treatment machine to remove impurities generated on the surface of the strip during the compounding process, so as to eliminate surface defects (such as scratches, indentations, pits, etc.) of the product during the subsequent processing.
S4, annealing treatment: and annealing the polished composite strip at the annealing temperature range of 850 ℃.
S5, rolling and secondary annealing treatment: and performing multiple rolling treatments on the annealed composite strip by using a multi-roll rolling mill, and annealing the composite strip at the annealing temperature of 850 ℃.
Example 2
A heat sink comprises a nickel layer 11 and a copper layer 12 which are sequentially stacked from top to bottom; the nickel layer 11 and the copper layer 12 are combined in a surface recombination mode; the thickness ratio of the nickel layer 11 to the heat sink and the thickness ratio of the copper layer 12 to the heat sink are 42% and 58%, respectively.
The specific preparation process comprises the following steps:
s1, selecting raw materials: selecting a pure nickel strip with the thickness of 1.26mm, and selecting a pure copper strip with the thickness of 1.74 mm; the hardness of the pure nickel strip is 90HV0.2, and the hardness of the pure copper strip is 90HV 0.2.
S2, compounding: the pure nickel strips and the pure copper strips are sequentially arranged in a stacked mode, certain heat energy is provided for the pure nickel strips and the pure copper strips, the temperature of the pure nickel strips is controlled to be 500 ℃, the temperature of the pure copper strips is controlled to be 350 ℃, and then the pure nickel strips and the pure copper strips which are sequentially arranged in the stacked mode are rolled and compounded through a pressure compounding machine to obtain the composite strip.
Specifically, in the compounding step, the composite strip is broken back and forth by 90 degrees, and the end face is not separated as a qualified standard of the first compounding.
In the compounding step, inert gas (N2) or ammonia decomposition gas (N2, H2) is introduced into the pressure compounding machine to ensure the reduction environment when the pure nickel strip, the stainless steel strip and the pure copper strip are subjected to rolling compounding; therefore, impurities/oxides among the pure nickel strips, the stainless steel strips and the pure copper strips can be prevented, the cleanliness among materials is ensured, and substances with poor plasticity are not generated, so that the bonding strength of the materials is not influenced.
S3, polishing treatment: and (4) carrying out surface polishing treatment on the composite strip to remove impurities on the surface of the composite strip.
Specifically, the composite strip obtained by the compounding in step S2 is subjected to a surface polishing treatment in a polishing treatment machine to remove impurities generated on the surface of the strip during the compounding process, so as to eliminate surface defects (such as scratches, indentations, pits, etc.) of the product during the subsequent processing.
S4, annealing treatment: and annealing the polished composite strip at the annealing temperature range of 850 ℃.
S5, rolling and secondary annealing treatment: and performing multiple rolling treatments on the annealed composite strip by using a multi-roll rolling mill, and annealing the composite strip at the annealing temperature of 850 ℃.
Example 3
A heat sink comprises a nickel layer 11 and a copper layer 12 which are sequentially stacked from top to bottom; the nickel layer 11 and the copper layer 12 are combined in a surface recombination mode; the thickness ratio of the nickel layer 11 to the heat sink and the thickness ratio of the copper layer 12 to the heat sink were 38% and 62%, respectively.
The specific preparation process comprises the following steps:
s1, selecting raw materials: selecting a pure nickel strip with the thickness of 1.92mm, and selecting a pure copper strip with the thickness of 1.08 mm; the hardness of the pure nickel strip is 90HV0.2, and the hardness of the pure copper strip is 90HV 0.2.
S2, compounding: the pure nickel strips and the pure copper strips are sequentially arranged in a stacked mode, certain heat energy is provided for the pure nickel strips and the pure copper strips, the temperature of the pure nickel strips is controlled to be 500 ℃, the temperature of the pure copper strips is controlled to be 350 ℃, and then the pure nickel strips and the pure copper strips which are sequentially arranged in the stacked mode are rolled and compounded through a pressure compounding machine to obtain the composite strip.
Specifically, in the compounding step, the composite strip is broken back and forth by 90 degrees, and the end face is not separated as a qualified standard of the first compounding.
In the compounding step, inert gas (N2) or ammonia decomposition gas (N2, H2) is introduced into the pressure compounding machine to ensure the reduction environment when the pure nickel strip, the stainless steel strip and the pure copper strip are subjected to rolling compounding; therefore, impurities/oxides among the pure nickel strips, the stainless steel strips and the pure copper strips can be prevented, the cleanliness among materials is ensured, and substances with poor plasticity are not generated, so that the bonding strength of the materials is not influenced.
S3, polishing treatment: and (4) carrying out surface polishing treatment on the composite strip to remove impurities on the surface of the composite strip.
Specifically, the composite strip obtained by the compounding in step S2 is subjected to a surface polishing treatment in a polishing treatment machine to remove impurities generated on the surface of the strip during the compounding process, so as to eliminate surface defects (such as scratches, indentations, pits, etc.) of the product during the subsequent processing.
S4, annealing treatment: and annealing the polished composite strip at the annealing temperature range of 850 ℃.
S5, rolling and secondary annealing treatment: and performing multiple rolling treatments on the annealed composite strip by using a multi-roll rolling mill, and annealing the composite strip at the annealing temperature of 850 ℃.
By testing the physical properties of the heat sink provided by the above 3 examples, the test results are as follows:
according to the above table, the embodiment of the utility model provides a pair of cooling fin, because the heat conductivity of copper is superior to the copper alloy, the ratio of nickel moreover for this cooling fin has high intensity and toughness, and very suitable smart mobile phone's heat dissipation demand.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A heat sink is characterized by comprising a nickel layer and a copper layer which are sequentially stacked from top to bottom; the nickel layer and the copper layer are combined in a surface recombination mode; the thickness ratio of the nickel layer to the heat sink and the thickness ratio of the copper layer to the heat sink are respectively 38% -64% and 36% -62%.
2. A heat sink as in claim 1 wherein the ratio of the thickness of said nickel layer to said heat sink is 38% and the ratio of the thickness of said copper layer to said heat sink is 62%.
3. A heat sink as in claim 1 wherein the ratio of the thickness of said nickel layer to said heat sink is 42% and the ratio of the thickness of said copper layer to said heat sink is 58%.
4. A heat sink as in claim 1 wherein the ratio of the thickness of said nickel layer to said heat sink is 64% and the ratio of the thickness of said copper layer to said heat sink is 36%.
5. A heat sink as claimed in claim 1, wherein said nickel layer has a thickness in the range of 0.114 to 0.192 mm.
6. A heat sink as claimed in claim 1, wherein said nickel layer has a hardness in the range of 80 to 100HV 0.2.
7. A heat sink as in claim 1, wherein said copper layer has a hardness in the range of 70 to 100HV 0.2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020669182.2U CN212827227U (en) | 2020-04-27 | 2020-04-27 | Radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020669182.2U CN212827227U (en) | 2020-04-27 | 2020-04-27 | Radiating fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212827227U true CN212827227U (en) | 2021-03-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020669182.2U Active CN212827227U (en) | 2020-04-27 | 2020-04-27 | Radiating fin |
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| CN (1) | CN212827227U (en) |
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- 2020-04-27 CN CN202020669182.2U patent/CN212827227U/en active Active
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Address after: 518000 workshop 103, No. 1, zhongjinling south, No. 2, Jinxiu Middle Road, Jinsha community, Kengzi street, Pingshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongjin Lingnan Xinyue New Material Co.,Ltd. Address before: Room 203.204.205, Zhongjin Lingnan advanced materials factory office building, No.2 Jinxiu West Road, Pingshan District, Pingshan District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN XINYUE NEW MATERIAL TECHNOLOGY CO.,LTD. |
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