CN112895623A - Functional material for heat dissipation of mobile phone chip and processing technology thereof - Google Patents
Functional material for heat dissipation of mobile phone chip and processing technology thereof Download PDFInfo
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 45
- 239000002131 composite material Substances 0.000 claims abstract description 80
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- 239000010935 stainless steel Substances 0.000 claims abstract description 63
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- C—CHEMISTRY; METALLURGY
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- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/52—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for wires; for strips ; for rods of unlimited length
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- C—CHEMISTRY; METALLURGY
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- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Abstract
The invention relates to the technical field of material rolling, and discloses a functional material for heat dissipation of a mobile phone chip and a processing technology thereof, wherein the processing technology of the functional material comprises the following steps: selecting raw materials, carrying out composite treatment, polishing treatment, carrying out first diffusion annealing treatment and calendaring treatment. According to the processing technology of the functional material for the heat dissipation of the mobile phone chip, the copper strip and the stainless steel strip are compounded into a whole through certain mechanical engagement, and the functional material produced through the processing technology integrates the performance characteristics of the stainless steel and the copper, so that the functional material not only maintains good strength and toughness, but also has good heat conductivity, and the heat dissipation requirement of the mobile phone chip can be fully met; meanwhile, the heat dissipation and heat conduction performance of the heat dissipation material is adjusted by adjusting the thickness ratio of the copper strip to the stainless steel strip, the adjustment is flexible in process, and only the thickness of the metal before compounding is required to be changed.
Description
Technical Field
The invention relates to the technical field of material rolling, in particular to a functional material for heat dissipation of a mobile phone chip and a processing technology thereof.
Background
At present, the new energy industry and the mobile phone industry belong to hot industries, but have the same point, and a high-performance battery power supply and a control system are needed to ensure the normal operation of a product.
The mobile phone can keep normal operation at high speed under the existing volume, the chip is better than the high and new chip technology, the chip just like the human brain controls all functions of the mobile phone, and once the chip is abnormal, the functions of the mobile phone are greatly weakened or even scrapped. In order to maintain the normal operation of the chip, it is necessary to provide a favorable operating environment for the chip, in which the temperature control is very important, and the excessive temperature can delay the reaction of the chip and even stop the operation. The material for radiating the chip on the market is a radiating material taking copper alloy as a main material, the copper alloy has good welding performance, good radiating performance and certain strength and toughness, but along with the improvement of the high-speed operation capacity of the 5G mobile phone, the heat productivity of the chip is gradually improved, the radiating function of the copper alloy can not follow the steps gradually, and a material with better radiating material needs to be found for better adapting to the radiating of the high-performance mobile phone, wherein the heat-conducting performance cost performance of pure copper is highest. Secondly, the 5G mobile phone is developed to be thin, so that the space for radiating the heat of the chip is smaller and smaller, the heat radiating capacity must be exerted in a limited space, a liquid cooling technology is appeared on the market, and a graphite heat absorption technology, a metal back plate heat radiating technology and the like are combined, so that the 5G mobile phone is expected to be more intelligent, have higher heat productivity and have smaller heat radiating space, but under the condition of only the thickness space of the mobile phone, the heat radiating material made of copper alloy is poor in rigidity and easy to deform, and is not beneficial to the production and processing of cooling parts.
The functional material for radiating the mobile phone chip comprehensively utilizes the heat conduction capability of copper and the rigidity and welding performance of stainless steel, has higher strength and toughness and high cost performance, and is very suitable for the heat conduction requirement of a smart phone.
Disclosure of Invention
The invention aims to provide a functional material for heat dissipation of a mobile phone chip and a processing technology thereof, and aims to solve the problems that a heat dissipation material made of copper alloy is poor in rigidity and easy to deform in the prior art.
The invention is realized in such a way that in a first aspect, the invention provides a processing technology of a functional material for heat dissipation of a mobile phone chip, which comprises the following steps:
selecting raw materials: selecting a copper strip with the thickness of 0.5-3.0mm and the width of 100-; wherein the hardness of the copper strip is 70-80HV1.0, and the hardness of the stainless steel strip is 140-160HV 1.0;
performing composite treatment: rolling and compounding the selected copper strip and the selected stainless steel strip; respectively providing certain heat energy for the copper strip and the stainless steel strip so as to control the temperature of the stainless steel strip to be 500 ℃ in 300-;
polishing treatment: polishing the surface of the composite strip obtained after the composite treatment to remove impurities generated on the surface of the composite strip in the composite process;
first diffusion annealing treatment: performing primary diffusion annealing treatment on the polished composite strip at the annealing temperature of 700-900 ℃;
rolling treatment: and rolling the composite strip subjected to diffusion annealing treatment for multiple times by using a multi-roll rolling mill until the composite strip is rolled to the thickness of 0.05-0.30 mm.
Further, before the step of the composite treatment, the processing technology further comprises the following steps:
cleaning treatment: and respectively cleaning the surfaces of the selected copper strips and the selected stainless steel strips.
Further, the cleaning process specifically includes the steps of:
performing surface polishing, impurity removal and oxidation removal on the selected copper strips and stainless steel strips through polishing equipment;
and carrying out surface drying treatment on the copper strips and the stainless steel strips which are subjected to polishing, impurity removal and oxidation removal through drying equipment.
Further, in the step of the composite processing:
and (2) rolling and compounding the stainless steel strip and the copper strip through a pressure compounding machine, wherein an inert gas or an ammonia decomposition gas (N2, H2) is introduced into the pressure compounding machine, so that the stainless steel strip and the copper strip are rolled and compounded in an inert atmosphere or a reducing atmosphere.
Further, the calendering process comprises the steps of:
rolling the composite strip subjected to diffusion annealing on a four-roller rolling mill repeatedly until the composite strip is rolled to the thickness of 0.30 mm;
leveling the rolled composite strip by adopting a multi-roll straightener;
performing second diffusion annealing treatment on the flattened composite strip, wherein the annealing temperature is 700-900 ℃, so that the hardness of the composite strip meets the required hardness requirement;
the strip after the second diffusion annealing was rolled on a twenty high mill to a thickness of 0.1 mm.
Furthermore, the composite strip has a stainless steel end face, and the hardness of the stainless steel end face of the composite strip after the second diffusion annealing treatment is 140-160HV 1.0.
Further, after the step of calendering, the method further comprises the following steps:
surface treatment: removing rolling oil on the surface of the finished product strip and drying;
punching and etching: and (4) stamping and etching the finished strip according to requirements, and cutting the finished strip into required sizes.
Further, in the step of the rolling treatment,
performing one or more times of softening annealing treatment on the composite strip between any two times of rolling the composite strip, wherein the annealing temperature is 800-; the multi-roll rolling mill produces work hardening when the composite strip is rolled for multiple times, and the softening annealing treatment is used for eliminating the work hardening produced in the rolling treatment process of the composite strip.
Further, the stainless steel band is 316 stainless steel.
In a second aspect, the invention further provides a functional material for heat dissipation of a mobile phone chip, wherein the functional material is processed by the processing technology.
Compared with the prior art, the processing technology of the functional material for the heat dissipation of the mobile phone chip provided by the invention fully utilizes the plastic deformation of metal and the atomic diffusion principle between metals, compounds the copper strip and the stainless steel strip into a whole through certain mechanical occlusion, and the functional material produced by the processing technology integrates the performance characteristics of the stainless steel and the copper, not only maintains good strength and toughness, but also has good heat conductivity, thereby being capable of fully meeting the heat dissipation requirement of the mobile phone chip; meanwhile, the heat dissipation and heat conduction performance of the functional material is adjusted by adjusting the thickness ratio of the copper strip to the stainless steel strip, the adjustment is flexible in process, only the thickness of the metal before compounding is required to be changed, the content and influence of trace elements are required to be continuously adjusted in the smelting process of the copper alloy adopted by the existing heat dissipation material, the development is complicated, and the development cost is high; and the stainless steel band can keep stable heat dissipation characteristic for a long time even in the environment with increased temperature, and the heat dissipation effect can not change along with the time.
Drawings
Fig. 1 is a schematic flow chart of a processing process of a functional material for heat dissipation of a mobile phone chip according to a first embodiment of the present invention;
fig. 2 is a schematic flow chart of a processing process of a functional material for heat dissipation of a mobile phone chip according to a second embodiment of the present invention;
fig. 3 is a schematic diagram illustrating a specific flow of step S50 in the processing process of a functional material for heat dissipation of a mobile phone chip according to a third embodiment of the present invention;
fig. 4 is a schematic flow chart of a processing process of a functional material for heat dissipation of a mobile phone chip according to a fourth embodiment of the present invention;
fig. 5 is a schematic structural diagram of a functional material for heat dissipation of a mobile phone chip according to an embodiment of the present invention.
Reference numerals: 1-copper band layer, 2-stainless steel band layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of describing the present invention and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms may be understood by those skilled in the art according to specific circumstances.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
A processing process of a functional material for heat dissipation of a mobile phone chip according to a first embodiment of the present invention is shown in fig. 1, and referring to fig. 5, the processing process of the functional material for heat dissipation of a mobile phone chip includes the following steps:
step S10, selecting raw materials: selecting a copper strip with the thickness of 0.5-3.0mm (such as 0.5mm, 1.5mm or 3.0mm) and the width of 100-150mm (such as 100mm, 125mm or 150mm), and selecting a stainless steel strip with the thickness of 0.5-3.0mm (such as 0.5mm, 1.5mm or 3.0mm) and the width of 100-150mm (such as 100mm, 125mm or 150 mm); wherein the hardness of the stainless steel strip is 140-160HV1.0 (such as 140HV1.0, 150HV1.0 or 160HV1.0), and the hardness of the copper strip is 70-80HV1.0 (such as 70HV1.0, 75HV1.0 or 80HV 1.0).
Preferably, the stainless steel band is 316 stainless steel.
Step S20, composite processing: rolling and compounding the selected copper belt and the selected stainless steel belt, respectively providing certain heat energy for the copper belt and the stainless steel belt, so that the temperature of the stainless steel belt is controlled to be 500 ℃ (for example 300 ℃, 400 ℃ or 500 ℃), the temperature of the copper belt is controlled to be 200 ℃ (for example 150 ℃, 175 ℃ or 200 ℃), and the copper belt and the stainless steel belt are vertically overlapped and then compounded into a whole to obtain a composite belt material; the composite strip obtained after compounding is broken back and forth at 90 degrees, and the end face is not separated to serve as the qualified standard of compounding.
Preferably, the copper strip and the stainless steel strip are subjected to rolling compounding through a pressure compounding machine, and in order to ensure the cleanliness between the selected stainless steel strip and the copper strip, an inert gas or an ammonia decomposition gas (N2, H2) is introduced into the pressure compounding machine, so that the stainless steel strip and the copper strip are subjected to rolling compounding in an inert atmosphere or a reducing atmosphere; therefore, impurities (such as oxides) between the two materials can be prevented, the cleanliness between the materials is ensured, and substances with poor plasticity are not generated, so that the bonding strength between different materials is influenced.
Step S30, polishing: and polishing the surface of the composite strip obtained after the composite treatment by using a polishing machine, and removing impurities generated on the surface of the composite strip in the composite process so as to eliminate defects (such as scratches, indentations, pits and the like) generated on the surface of a product in the processing process.
Step S40, first diffusion annealing: performing first diffusion annealing treatment on the polished composite strip, wherein the annealing temperature is 700-900 ℃ (for example, 700 ℃, 800 ℃ or 900 ℃); different annealing temperatures can be selected through different deformation amounts, and the annealing mainly aims to enable the composite interface of the composite strip to be bonded more tightly through diffusion of atoms between materials, so that the composite strength of a product is enhanced.
Step S50, rolling: and rolling the composite strip subjected to diffusion annealing treatment for multiple times by using a multi-roll rolling mill until the composite strip is rolled to the thickness of 0.05-0.30 mm.
Preferably, the composite strip is subjected to one or more softening annealing treatments between any two rolling of the composite strip, the annealing temperature being 800-; the multi-roll rolling mill produces work hardening when the composite strip is rolled for multiple times, and the softening annealing treatment is used for eliminating the work hardening produced in the rolling treatment process of the composite strip.
According to the processing technology of the functional material for the heat dissipation of the mobile phone chip, the plastic deformation of metal and the atomic diffusion principle between metals are fully utilized, the copper strip and the stainless steel strip are compounded into a whole through certain mechanical occlusion, and the functional material produced through the processing technology integrates the performance characteristics of the stainless steel and the copper, so that the high strength and toughness are maintained, and the heat dissipation requirement of the mobile phone chip can be fully met; meanwhile, the heat dissipation and heat conduction performance of the functional material is adjusted by adjusting the thickness ratio of the copper strip to the stainless steel strip, the adjustment is flexible in process, only the thickness of the metal before compounding is required to be changed, the content and influence of trace elements are required to be continuously adjusted in the smelting process of the copper alloy adopted by the existing heat dissipation material, the development is complicated, and the development cost is high; and the stainless steel band can keep stable heat dissipation characteristic for a long time even in the environment with increased temperature, and the heat dissipation effect can not change along with the time.
Based on the first embodiment of the present invention, a second embodiment of the present invention is provided, and fig. 2 is a schematic flow chart of a processing process of a functional material for heat dissipation of a mobile phone chip according to the second embodiment of the present invention, please refer to fig. 2, before the step S20, the processing process further includes the following steps:
step S101, cleaning: and respectively cleaning the surfaces of the selected copper strips and the selected stainless steel strips.
After the cleaning treatment in step S101, and then step S2 is performed, the composite strength between the copper strip and the stainless steel strip can be greatly improved, and the composite effect of the composite strip can be improved.
It should be noted that step S101 specifically includes the following steps:
step S1011: polishing and impurity removal and oxidation removal are carried out on the selected copper strips and stainless steel strips by adopting polishing equipment; therefore, impurities and metal oxides on the surfaces of the copper strip and the stainless steel strip can be removed, and the composite effect between the copper strip and the stainless steel strip is improved.
Step S1012: carrying out surface drying treatment on the copper strips and the stainless steel strips which are polished, decontaminated and deoxidized by drying equipment; therefore, the surfaces of the copper strip and the stainless steel strip can be kept dry, and potential quality hazards such as water stains/water spots are avoided.
Based on the first embodiment of the present invention, a third embodiment of the present invention is provided, fig. 3 is a schematic diagram illustrating a specific flow of step S50 in the processing process of a functional material for heat dissipation of a mobile phone chip according to the third embodiment of the present invention, please refer to fig. 3, where step S50 specifically includes the following steps:
step S501: rolling the composite strip subjected to diffusion annealing on a four-roller rolling mill repeatedly until the composite strip is rolled to the thickness of 0.30 mm;
preferably, the composite strip is subjected to one or more softening annealing treatments between any two rolling of the composite strip, the annealing temperature being 800-; the multi-roll rolling mill produces work hardening when the composite strip is rolled for multiple times, and the softening annealing treatment is used for eliminating the work hardening produced in the rolling treatment process of the composite strip.
Step S502: and (4) leveling the belt shape of the rolled composite strip by adopting a multi-roller straightener.
Step S503: performing second diffusion annealing treatment on the flattened composite strip, wherein the annealing temperature is 700-;
preferably, the composite strip has a stainless steel end face and a copper end face, and the hardness of the stainless steel end face of the composite strip after the second diffusion annealing treatment is 140-160HV 1.0.
Step S504: the strip after the second diffusion annealing was rolled on a twenty high mill to a thickness of 0.1 mm.
Based on the first embodiment of the present invention, a fourth embodiment of the present invention is provided, fig. 4 is a schematic flow chart of a processing process of a functional material for heat dissipation of a mobile phone chip according to the fourth embodiment of the present invention, please refer to fig. 4, after the step S50, the processing process further includes the following steps:
step S60, surface treatment: and removing the rolling oil on the surface of the finished product strip and drying the rolling oil, thereby ensuring the smoothness of the surface of the finished product strip.
Step S70, press etching: stamping and etching the finished product strip according to requirements, and cutting into required sizes; specifically, the finished product strips are cut according to sizes of different specifications, and the cut finished product strips are subjected to vacuum packaging.
In one embodiment, the process for processing the functional material comprises the steps of,
step S10, selecting raw materials:
316 stainless steel band: 3.0X 115mm, HV1.0:160,
copper strip: 0.95X 115mm, HV1.0: 70;
step S101, cleaning: polishing the surfaces of the two strips by a polishing machine, washing the surfaces by hot water after polishing, and drying by hot air to ensure that the surfaces have no impurities, water spots and the like;
step S20, composite processing: compounding on a two-roller rolling compounding machine, wherein the upper layer is a copper strip, and the lower layer is a stainless steel strip, so that the two strips are compounded together; the temperature of the stainless steel strip at the roll gap is controlled at 450 ℃, the temperature deviation is +/-5 ℃, the temperature of the copper strip at the roll gap is controlled at 180 ℃, the temperature deviation is +/-5 ℃, ammonia decomposition gas (N2 and H2) is introduced into a rolling mill for protecting the strip before the strip enters a roll, the gas flow is controlled at 7Nm3/H, the thickness of a rolling outlet of a compound machine is 1.6mm, so that the thickness of the compound strip after compounding is 1.6mm, the compound strip is broken at 90 degrees after compounding, the section has no separation phenomenon, and the compound strength is qualified;
step S30, polishing: cleaning black impurities, scraps, lines and the like on the surface of the compounded strip by using a polishing machine, and simultaneously drying by using hot water and a drying facility;
step S40, first diffusion annealing: after cleaning, carrying out heat treatment in a bright annealing furnace at 850 ℃ and 1m/min, after annealing, enabling the composite interface of the composite strip to be more tightly combined, enhancing the composite strength of the product, eliminating the processing hardness of the strip and facilitating the later cold processing;
step S501, rolling: carrying out back and forth rolling on a four-roller rolling mill after annealing for 15 passes, and carrying out softening annealing on the semi-finished product and then rolling until the thickness of the product is 0.3mm in the rolling process;
step S502, a multi-roll straightener is adopted to flatten the belt shape of the rolled composite strip;
step S503, carrying out second diffusion annealing treatment on the flattened composite strip, wherein the annealing temperature is 830 ℃, so that the hardness of the stainless steel end face of the composite strip is controlled to be HV1.0: 140-160;
step S504: rolling the strip subjected to the second diffusion annealing on a twenty-high rolling mill to a thickness of 0.1 mm;
step S60, surface treatment: carrying out surface degreasing and drying on the finished product strip on a cleaning machine to ensure that the surface of the finished product strip has no quality defect;
step S70, press etching: and (4) stamping and etching the finished strip according to requirements, and cutting the finished strip into required sizes.
Referring to fig. 5, the invention further provides a functional material for heat dissipation of a mobile phone chip, the functional material is processed by the processing technology, and of course, the functional material can also be used in other products, and the functional material includes a copper tape layer 1 and a stainless steel tape layer 2 which are sequentially stacked from top to bottom.
According to the functional material for radiating the mobile phone chip, the copper strip and the stainless steel strip are compounded into a whole through certain mechanical occlusion, so that the functional material integrates the performance characteristics of stainless steel and copper, not only keeps good strength and toughness, but also has good thermal conductivity, and the radiating requirement of the mobile phone can be fully met; meanwhile, the heat dissipation and heat conduction performance of the functional material is adjusted by adjusting the thickness ratio of the copper strip to the stainless steel strip, the adjustment is flexible in process, and only the thickness of the metal before compounding is required to be changed, so that the production cost is greatly reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A processing technology of a functional material for heat dissipation of a mobile phone chip is characterized by comprising the following steps:
selecting raw materials: selecting a copper strip with the thickness of 0.5-3.0mm and the width of 100-; wherein the hardness of the copper strip is 70-80HV1.0, and the hardness of the stainless steel strip is 140-160HV 1.0;
performing composite treatment: rolling and compounding the selected copper strip and the selected stainless steel strip; respectively providing certain heat energy for the copper strip and the stainless steel strip so as to control the temperature of the stainless steel strip to be 500 ℃ in 300-;
polishing treatment: polishing the surface of the composite strip obtained after the composite treatment to remove impurities generated on the surface of the composite strip in the composite process;
first diffusion annealing treatment: performing primary diffusion annealing treatment on the polished composite strip at the annealing temperature of 700-900 ℃;
rolling treatment: and rolling the composite strip subjected to diffusion annealing treatment for multiple times by using a multi-roll rolling mill until the composite strip is rolled to the thickness of 0.05-0.30 mm.
2. The process for preparing a functional material for heat dissipation of mobile phone chips according to claim 1, wherein before the step of complex processing, the process further comprises the steps of:
cleaning treatment: and respectively cleaning the surfaces of the selected copper strips and the selected stainless steel strips.
3. The processing technology of the functional material for heat dissipation of the mobile phone chip as claimed in claim 2, wherein the cleaning treatment specifically comprises the following steps:
performing surface polishing, impurity removal and oxidation removal on the selected copper strips and stainless steel strips through polishing equipment;
and carrying out surface drying treatment on the copper strips and the stainless steel strips which are subjected to polishing, impurity removal and oxidation removal through drying equipment.
4. The process for preparing a functional material for heat dissipation of mobile phone chips according to claim 1, wherein in the step of composite treatment:
and (2) rolling and compounding the copper strip and the stainless steel strip by a pressure compounding machine, wherein an inert gas or an ammonia decomposition gas (N2, H2) is introduced into the pressure compounding machine so that the copper strip and the stainless steel strip are rolled and compounded in an inert atmosphere or a reducing atmosphere.
5. The process for preparing a functional material for heat dissipation of mobile phone chips as defined in claim 1, wherein the calendering process comprises the following steps:
rolling the composite strip subjected to diffusion annealing on a four-roller rolling mill repeatedly until the composite strip is rolled to the thickness of 0.30 mm;
leveling the rolled composite strip by adopting a multi-roll straightener;
performing second diffusion annealing treatment on the flattened composite strip, wherein the annealing temperature is 700-900 ℃, so that the hardness of the composite strip meets the required hardness requirement;
the strip after the second diffusion annealing was rolled on a twenty high mill to a thickness of 0.1 mm.
6. The processing technology of the functional material for heat dissipation of mobile phone chips as defined in claim 5, wherein the composite strip has a stainless steel end surface, and the hardness of the stainless steel end surface of the composite strip after the second diffusion annealing treatment is 140-160HV 1.0.
7. The process for preparing a functional material for heat dissipation of mobile phone chips as defined in claim 1, further comprising the following steps after the step of calendering:
surface treatment: removing rolling oil on the surface of the finished product strip and drying;
punching and etching: and (4) stamping and etching the finished strip according to requirements, and cutting the finished strip into required sizes.
8. The process for preparing a functional material for heat dissipation of mobile phone chips as defined in any one of claims 1 to 7, wherein, in the step of rolling treatment,
performing one or more times of softening annealing treatment on the composite strip between any two times of rolling the composite strip, wherein the annealing temperature is 800-; the multi-roll rolling mill produces work hardening when the composite strip is rolled for multiple times, and the softening annealing treatment is used for eliminating the work hardening produced in the rolling treatment process of the composite strip.
9. The process according to any one of claims 1 to 7, wherein the stainless steel strip is 316 stainless steel.
10. A functional material for heat dissipation of a mobile phone chip, wherein the functional material is processed by the processing technology of any one of claims 1 to 9.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114570767A (en) * | 2022-02-24 | 2022-06-03 | 江西江锐新材料科技有限公司 | Preparation method of functional material for VC heat dissipation of smart phone |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157822A (en) * | 2014-08-25 | 2014-11-19 | 深圳市中金岭南科技有限公司 | Electric conductive connecting piece used for secondary battery, preparation method thereof and laminatedly compounded metal strip material |
| CN110653258A (en) * | 2019-09-24 | 2020-01-07 | 江苏中色复合材料有限公司 | Production method of stainless steel and copper composite coiled material |
| CN111128929A (en) * | 2019-12-30 | 2020-05-08 | 深圳市鑫越新材料科技有限公司 | Heat dissipation material and processing technology thereof |
-
2021
- 2021-02-04 CN CN202110154561.7A patent/CN112895623A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104157822A (en) * | 2014-08-25 | 2014-11-19 | 深圳市中金岭南科技有限公司 | Electric conductive connecting piece used for secondary battery, preparation method thereof and laminatedly compounded metal strip material |
| CN110653258A (en) * | 2019-09-24 | 2020-01-07 | 江苏中色复合材料有限公司 | Production method of stainless steel and copper composite coiled material |
| CN111128929A (en) * | 2019-12-30 | 2020-05-08 | 深圳市鑫越新材料科技有限公司 | Heat dissipation material and processing technology thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114570767A (en) * | 2022-02-24 | 2022-06-03 | 江西江锐新材料科技有限公司 | Preparation method of functional material for VC heat dissipation of smart phone |
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Application publication date: 20210604 |