CN214271023U - A coating by vaporization device for coating film - Google Patents
A coating by vaporization device for coating film Download PDFInfo
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- CN214271023U CN214271023U CN202120149790.5U CN202120149790U CN214271023U CN 214271023 U CN214271023 U CN 214271023U CN 202120149790 U CN202120149790 U CN 202120149790U CN 214271023 U CN214271023 U CN 214271023U
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- crucible
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- coating film
- evaporation
- eddy current
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Abstract
The utility model discloses an evaporation plating device for coating film, including crucible body, eddy current coil and induction heating power, the crucible body includes square crucible and circular crucible, and it is integrated to have circular crucible in square crucible bottom intercommunication the parcel has eddy current coil on the circular crucible, eddy current coil connects the induction heating power. The utility model discloses can enough guarantee face cladding material homogeneity when the coating by vaporization, can improve the productivity of production product again.
Description
Technical Field
The utility model belongs to the technical field of the coating film, especially, relate to an evaporation plating device for coating film.
Background
At present, with the development of new energy sources such as national electric vehicles, energy storage and the like, the application of the film metal-plated conductive base material to replace copper foil and aluminum foil is more and more extensive. Along with the continuous improvement of safety performance of the lithium battery industry, the performance of the base material film is higher and higher, including the uniformity of the whole base material coating and the size of base material pinholes. The commonly adopted PVD vacuum coating technology mainly comprises ion plating, magnetron sputtering plating and evaporation plating, wherein the evaporation plating mainly comprises a resistance heating type (evaporation boat), a medium-frequency heating type (crucible) and an electron gun.
The crucible evaporation equipment used for coating film at present mainly has the following problems: the crucible bearing capacity is limited, and the production capacity of the produced product is limited; the uniformity of the product coating is poor; the low integral heating speed leads to low production efficiency, limited productivity in unit time and high waste of time cost.
The existing crucible is heated and evaporated, an evaporation source is point-shaped evaporation, molecules of an evaporated micro material are scattered in a point shape and finally deposited on the surface of a base material, a plating layer at a position close to a scattering center is thick, and a plating layer far away from the scattering center is thin, so that the thickness uniformity of a layer thickness plating layer is poor, and the thickness uniformity is generally about +/-7%.
The existing crucible evaporation only depends on electron beams to bombard the upper surface of a material to be plated at high speed to heat the material to be plated, the heating area is small, the material to be plated usually needs 1 hour or even several hours to be heated from room temperature to an evaporation state, the material heating time is long, and the time cost is high.
The volume of the existing crucible is limited, the single filling amount of the material to be plated is small, the material needs to be cooled and refilled and heated again after being evaporated, and the required time is long.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide an evaporation device for coating, which can ensure the uniformity of the coating on the coating surface during evaporation and improve the productivity of the product.
In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides an evaporation plating device for coating film, includes crucible body, eddy current coil and induction heating power, the crucible body includes square crucible and circular crucible, and it is integrated to have a circular crucible in square crucible bottom intercommunication the parcel has eddy current coil on the circular crucible, eddy current coil connects the induction heating power.
Furthermore, a plurality of circular crucibles are arranged at the bottom of the square crucible, and the tops of the circular crucibles are communicated with the square crucible.
Further, the plurality of circular crucibles are arranged at the bottom of the square crucible in a staggered mode.
Further, the plurality of circular crucibles are divided into 2 rows in front and back, and the 2 rows are uniformly staggered.
Furthermore, the circular crucibles in each row are distributed equidistantly. Setting the center distance between the circular crucibles according to the diameter d of the crucibles; the number of circular crucibles is set according to the length L of the square crucible.
Further, the diameter of the circular crucible is 50-200mm, and the height is 100-300 mm; the optimal value is 80-140mm in diameter and 160mm in height, and the design size can be adjusted correspondingly according to different process requirements.
Further, the length of the square crucible is 800-. The optimal values are 900-1200mm in length, 240-340mm in width and 180-220mm in height, and the design size can be adjusted accordingly according to different process requirements.
Furthermore, the eddy current coil adopts a hollow copper tube, and cooling water can be introduced into the hollow eddy current coil for cooling.
Further, the crucible body is of a graphite structure.
Furthermore, an electron gun is arranged above the crucible body, and the installation position and the direction of the electron gun enable the electron beam scanning range of the electron gun to cover the crucible body. The evaporation can be performed by heating simultaneously in a coil eddy current method and an electron gun method. Can ensure the uniformity of the film surface plating layer during evaporation and can also improve the productivity of single-time product production.
The beneficial effects of the technical scheme are as follows:
the utility model discloses at the integrated circular crucible in square crucible bottom, winding eddy current coil on circular crucible can be through coil vortex mode, perhaps coil vortex mode and electron gun mode carry out the concurrent heating coating by vaporization. Can ensure the uniformity of the film surface plating layer during evaporation and can also improve the productivity of the produced product.
The utility model discloses the evaporation source is linear/face form evaporation, and the small material molecule after the evaporation is the final deposit of face form on the substrate surface, and evaporation zone molecule concentration homogeneity is better, and cladding material thickness homogeneity control is steerable within 3%, very big improvement thickness homogeneity promptly the product quality.
The utility model discloses a square crucible is integrated with circular crucible, treats in the square crucible to plate material upper surface heating and circular crucible in the material heating go on simultaneously, only need 40 minutes can with plate the material and heat up to evaporation state.
The utility model discloses the loading of waiting to plate the material can increase 50 ~ 80% on current crucible basis, need not frequent dress and pack, so the single packs and can continuous production time also corresponding extension.
Drawings
Fig. 1 is a schematic structural view of an evaporation device for coating according to the present invention;
FIG. 2 is a schematic structural view of a crucible body in an embodiment of the present invention;
FIG. 3 is a layout view of a circular crucible in an embodiment of the present invention;
wherein 1 is a square crucible, 2 is a circular crucible, and 3 is an eddy current coil.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention is further explained below with reference to the accompanying drawings.
In the present embodiment, referring to fig. 1-2, an evaporation plating apparatus for coating comprises a crucible body, an eddy current coil 3 and an induction heating power supply, wherein the crucible body comprises a square crucible 1 and a circular crucible 2, the circular crucible 2 is integrated at the bottom of the square crucible 1 in a communicating manner, the circular crucible 2 is wrapped by the eddy current coil 3, and the eddy current coil 3 is connected with the induction heating power supply.
As the optimization scheme 1 of the embodiment, a plurality of circular crucibles 2 are arranged at the bottom of the square crucible 1, and the tops of the circular crucibles 2 are communicated with the square crucible 1.
Preferably, the plurality of circular crucibles 2 are arranged at the bottom of the square crucible 1 in a staggered manner.
Preferably, as shown in fig. 3, the plurality of circular crucibles 2 are divided into 2 rows in front and rear and the 2 rows are uniformly staggered.
Preferably, the circular crucibles 2 of each row are equally spaced. Setting the center distance between the circular crucibles 2 according to the diameter d of the crucible; the number of the circular crucibles 2 is set according to the length L of the square crucible 1.
As the optimization scheme 2 of the embodiment, the diameter of the circular crucible 2 is 50-200mm, and the height is 100-300 mm; the optimal value is 80-140mm in diameter and 160mm in height, and the design size can be adjusted correspondingly according to different process requirements.
The length of the square crucible 1 is 800-2500mm, the width is 200-400mm, and the height is 100-300 mm. The optimal values are 900-1200mm in length, 240-340mm in width and 180-220mm in height, and the design size can be adjusted accordingly according to different process requirements.
As an optimized proposal 3 of the above embodiment, the eddy current coil 3 adopts a hollow copper tube, and cooling water can be introduced into the hollow copper tube for cooling.
The crucible body is of a graphite structure.
As an optimized proposal 4 of the above embodiment, an electron gun is further installed above the crucible body, and the installation position and direction of the electron gun enable the electron beam scanning range of the electron gun to cover the crucible body. The evaporation can be performed by heating simultaneously in a coil eddy current method and an electron gun method. Can ensure the uniformity of the film surface plating layer during evaporation and can also improve the productivity of single-time product production.
For better understanding, the utility model discloses, following is to the theory of operation of the utility model make a complete description:
adding the material to be evaporated with the calculated weight into the crucible body, filling the circular crucible part with the sunk bottom with the material to be evaporated, and then filling the square crucible above; vacuumizing to process vacuum, and starting a crucible induction heating power supply at the bottom to heat the material to be plated in the circular crucible. And the equipment is provided with an electron gun, the electron gun can be started for heating while an induction heating power supply is started, and evaporation is carried out when the materials to be plated are completely melted to reach a stable evaporation state, so that a finished product is obtained.
The eddy current coil 3 is connected with an induction heating power supply, and the induction heating power supply is matched with the eddy current coil 3 to realize the purpose of rapid heating by utilizing the eddy current effect. The temperature and the evaporation rate of the material are controlled by adjusting the current of the induction heating power supply.
The electron beam emitted by the electron gun bombards the material to be plated, the kinetic energy of the high-energy electron beam is converted into the heat energy for melting the material to be plated, the material to be plated has better heat conversion efficiency, simultaneously, higher film plating speed can be obtained, and the evaporation speed can be precisely regulated and controlled by controlling the number of hot electrons by using the current.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The utility model provides an evaporation device for coating film, its characterized in that includes crucible body, eddy current coil (3) and induction heating power, the crucible body includes square crucible (1) and circular crucible (2), and it has circular crucible (2) to communicate to integrate in square crucible (1) bottom circular crucible (2) is gone up the parcel and has eddy current coil (3), induction heating power is connected in eddy current coil (3).
2. The evaporation plating device for coating film according to claim 1, wherein a plurality of circular crucibles (2) are arranged at the bottom of the square crucible (1), and the top of the circular crucible (2) is communicated with the square crucible (1).
3. The evaporation plating device for coating film according to claim 2, wherein the plurality of circular crucibles (2) are arranged at the bottom of the square crucible (1) in a staggered manner.
4. The vapor deposition device for coating film according to claim 3, wherein the plurality of circular crucibles (2) are divided into 2 rows in front and back, and the 2 rows are uniformly staggered.
5. The evaporation plating device for coating film according to claim 4, wherein, the circular crucibles (2) in each row are distributed equidistantly.
6. The evaporation apparatus for coating film as defined in any one of claims 1 to 5, wherein the diameter of the circular crucible (2) is 50-200mm, and the height is 100-300 mm.
7. The evaporation device for coating film as claimed in any of claims 1-5, wherein the square crucible (1) has a length of 800-.
8. The vapor deposition device for coating according to claim 1, wherein the eddy current coil (3) is a hollow copper tube.
9. The evaporation device for coating film according to claim 1, wherein the crucible body is of graphite structure.
10. The evaporation plating apparatus for coating film according to claim 1, wherein an electron gun is further installed above the crucible body, and the electron gun is installed at a position and in a direction such that an electron beam scanning range of the electron gun covers the crucible body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120149790.5U CN214271023U (en) | 2021-01-20 | 2021-01-20 | A coating by vaporization device for coating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120149790.5U CN214271023U (en) | 2021-01-20 | 2021-01-20 | A coating by vaporization device for coating film |
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| Publication Number | Publication Date |
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| CN214271023U true CN214271023U (en) | 2021-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202120149790.5U Active CN214271023U (en) | 2021-01-20 | 2021-01-20 | A coating by vaporization device for coating film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113913757A (en) * | 2021-10-12 | 2022-01-11 | 东莞旭和光电科技有限公司 | Electron gun evaporation coating machine |
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2021
- 2021-01-20 CN CN202120149790.5U patent/CN214271023U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113913757A (en) * | 2021-10-12 | 2022-01-11 | 东莞旭和光电科技有限公司 | Electron gun evaporation coating machine |
| CN113913757B (en) * | 2021-10-12 | 2023-09-29 | 东莞旭和光电科技有限公司 | Electron gun evaporation coating machine |
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Address after: 361100 201-1, complex building 5, No. 11, Butang Middle Road, torch high tech Zone (Tongxiang) industrial base, Xiamen, Fujian Province Patentee after: Xiamen Haichen Energy Storage Technology Co.,Ltd. Address before: 361000 201-1, complex building 5, No. 11, Butang Middle Road, torch high tech Zone (Tongxiang) industrial base, Xiamen, Fujian Patentee before: Xiamen Haichen New Energy Technology Co.,Ltd. |
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